lecture 1. technology trend

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Lecture 1. Technology Trend Prof. Taeweon Suh Computer Science Education Korea University COM503 Parallel Computer Architecture & Programming

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COM503 Parallel Computer Architecture & Programming. Lecture 1. Technology Trend. Prof. Taeweon Suh Computer Science Education Korea University. Transistor Basics. Digital chips are designed with transistors Transistor is a three-ported voltage-controlled switch - PowerPoint PPT Presentation

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Page 1: Lecture 1. Technology Trend

Lecture 1. Technology Trend

Prof. Taeweon SuhComputer Science Education

Korea University

COM503 Parallel Computer Architecture & Programming

Page 2: Lecture 1. Technology Trend

Korea Univ

Transistor Basics

• Digital chips are designed with transistors

• Transistor is a three-ported voltage-controlled switch Two of the ports are connected depending on the voltage on

the third port For example, in the switch below the two terminals (d and s)

are connected (ON) only when the third terminal (g) is 1

2

g

s

d

g = 0

s

d

g = 1

s

d

OFF ON

Page 3: Lecture 1. Technology Trend

Korea Univ

Silicon

3

• Transistors are built out of silicon, a semiconductor

• Silicon is not a conductor• Doped silicon is a conductor

– n-type (free negative charges, electrons)– p-type (free positive charges, holes)

Silicon Lattice

Si SiSi

Si SiSi

Si SiSi

As SiSi

Si SiSi

Si SiSi

B SiSi

Si SiSi

Si SiSi

-

+

+

-

Free electron Free hole

n-Type p-Type

wafer

Majority: ElectronsMinority: Holes

Majority: HolesMinority: Electrons

Page 4: Lecture 1. Technology Trend

Korea Univ

Periodic Table of the Elements

4

Page 5: Lecture 1. Technology Trend

Korea Univ5

MOS Transistors

• Metal oxide silicon (MOS) transistors: – Polysilicon (used to be Metal) gate– Oxide (silicon dioxide) insulator– Doped Silicon substrate and wells

n

p

gatesource drain

substrate

SiO2

n

gatesource drain

nMOS

Polysilicon

n p p

pMOS

gate

source drain

gate

source drain

substrate

Page 6: Lecture 1. Technology Trend

Korea Univ6

MOS Transistors• The MOS sandwich acts as a capacitor (two conductors

with insulator between them)• When voltage is applied to the gate, the opposite charge

is attracted to the semiconductor on the other side of the insulator, which could form a channel of charge

n

p

gatesource drain

substrate

SiO2

n

gatesource drain

nMOS

Polysilicon

n p p

pMOS

gate

source drain

gate

source drain

substrate

Page 7: Lecture 1. Technology Trend

Korea Univ7

nMOS Transistor

n

p

gatesource drain

substrate

n n

p

gatesource drain

substrate

n

GND

GND

VDD

GND

+++++++- - - - - - -

channel

Gate = 0 (OFF) (no connection between source and

drain)

Gate = 1 (ON) (connection between source and

drain)

Page 8: Lecture 1. Technology Trend

Korea Univ8

Transistor Function

gs

d

g = 0

s

d

g = 1

s

d

gd

s

d

s

d

s

nMOS

pMOS

OFF ON

ON OFF

Page 9: Lecture 1. Technology Trend

Korea Univ9

CMOS (Complementary MOS)• CMOS is used to build the vast majority of all

transistors fabricated today nMOS transistors pass good 0’s, so connect source to GND pMOS transistors pass good 1’s, so connect source to VDD

pMOSpull-upnetwork

outputinputs

nMOSpull-downnetwork

Page 10: Lecture 1. Technology Trend

Korea Univ10

• Top view

• Cross-section

CMOS Layout

Page 11: Lecture 1. Technology Trend

Korea Univ11

NOT Gate

VDD

A Y

GND

N1

P1

NOT

Y = A

A Y0 11 0

A Y

A P1 N1 Y0 ON OFF 11 OFF ON 0

Layout (top view)

Page 12: Lecture 1. Technology Trend

Korea Univ12

NAND Gate

A

B

Y

N2

N1

P2 P1NAND

Y = AB

A B Y0 0 10 1 11 0 11 1 0

AB Y

A B P1 P2 N1 N2 Y

0 0 ON ON OFF OFF 1

0 1 ON OFF OFF ON 1

1 0 OFF ON ON OFF 1

1 1 OFF OFF ON ON 0

Layout

Page 13: Lecture 1. Technology Trend

Korea Univ13

Now, Let’s Make an Inverter Chip

Core 2 Duo

Your Inverte

rchip

• Yield means how many dies are working correctly after fabrication

die

Page 14: Lecture 1. Technology Trend

Korea Univ

(Semiconductor) Technology• IC (Integrated Circuit) combined dozens to hundreds of transistors into a

single chip• VLSI (Very Large Scale Integration) is used to describe the tremendous

increase in the number of transistors in a chip• (Semiconductor) Technology: How small can you make a transistor

0.1 µm (100nm), 90nm, 65nm, 45nm, 32nm, 22nm technologies

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n

p

gatesource drain

substrate

SiO2

n

gatesource drain

nMOS

Polysilicon

n p p

pMOS

gate

source drain

gate

source drain

substrate

Page 15: Lecture 1. Technology Trend

Korea Univ

x86?

• What is x86? Generic term referring to processors from Intel, AMD and VIA Derived from the model numbers of the first few generations of processors:

• 8086, 80286, 80386, 80486 x86 Now it generally refers to processors from Intel, AMD, and VIA

• x86-16: 16-bit processor• x86-32 (aka IA32): 32-bit processor * IA: Intel Architecture• x86-64: 64-bit processor

• Intel takes about 80% of the PC market and AMD takes about 20% Apple also have been introducing Intel-based Mac from Nov. 2006

15* aka: also known as

Page 16: Lecture 1. Technology Trend

Korea Univ

x86 History (as of 2008)

16

Page 17: Lecture 1. Technology Trend

Korea Univ

x86 History (Cont.)

17

32-bit (i386)

32-bit (i586) 64-bit (x86_64)32-bit (i686)

8-bit 16-bit 4-bit

2009 20111st Gen. Core i7

(Nehalem)2nd Gen. Core i7(Sandy Bridge)

20123rd Gen. Core i7

(Ivy Bridge)

20134th Gen. Core i7

(Haswell)

Page 18: Lecture 1. Technology Trend

Korea Univ18

Moore’s Law

• Transistor count will be doubled every 18 months

Exponential growth2,250

42millions

1.7 billions

Montecito

Page 19: Lecture 1. Technology Trend

Korea Univ

Feature Size (Technology) Trend

19

Page 20: Lecture 1. Technology Trend

Korea Univ

Power Dissipation

20

• By early 2000, Intel and AMD made every effort to increase clock frequency to enhance the performance of their CPUs

• But, the power consumption is the problem

P ≈ CVDD2f

C: CapacitanceVDD: Voltagef: Frequency

Page 21: Lecture 1. Technology Trend

Korea Univ

Power Density Trend

21Source: Intel Corp.

Page 22: Lecture 1. Technology Trend

Korea Univ

Watch this!

22

Click the chip

Slide from Prof H.H. Lee in Georgia Tech

Page 23: Lecture 1. Technology Trend

Korea Univ

How to Reduce Power Consumption?

• Reduce supply voltage with new technologies i.e., reducing transistor size

• Keep the clock frequency in modest range No longer increase the clock frequency

• Then… what would be the problem?

• So, the strategy is to integrate simple many CPUs in a chip

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Performance

Dual Core, Quad Core….

Page 24: Lecture 1. Technology Trend

Korea Univ

Reality Check, circa 200x• Conventional processor designs run out of steam

Power wall (thermal) Complexity (verification) Physics (CMOS scaling)

• Unanimous direction Multi-core Simple cores (massive number) Keep

• Wire communication on leash • Gordon Moore happy (Moore’s Law)

Architects’ menace: kick the ball to the other side of the court?

24Modified from Prof. Sean Lee in Georgia Tech

Page 25: Lecture 1. Technology Trend

Korea Univ25

Multi-core Processor Gala

Prof. Sean Lee’s Slide in Georgia Tech

Page 26: Lecture 1. Technology Trend

Korea Univ

Intel’s Core 2 Duo

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• 2 cores on one chip• Two levels of caches

(L1, L2) on chip• 291 million

transistors in 143 mm2 with 65nm technology

L2 Cache

Core0 Core1

Source: http://www.sandpile.org

DL1 DL1

IL1 IL1

Page 27: Lecture 1. Technology Trend

Korea Univ

Intel’s Core i7 (Nehalem)

27

• 4 cores on one chip• Three levels of

caches (L1, L2, L3) on chip

• 731 million transistors in 263 mm2 with 45nm technology

Page 28: Lecture 1. Technology Trend

Korea Univ

Intel’s Core i7 (Sandy Bridge)

28

2nd Generation Core i7

995 million transistors in 216 mm2 with 32nm

technology

L1 32 KB

L2 256 KB

L3 8MB

Page 29: Lecture 1. Technology Trend

Korea Univ

Intel’s Core i7 (Ivy Bridge)

29

3rd Generation Core i7

L1 64 KB

L2 256 KB

L3 8MB

1.4 billion transistors in 160 mm2 with 22nm

technology

http://blog.mytechhelp.com/laptop-repair/the-ivy-bridge/

Page 30: Lecture 1. Technology Trend

Korea Univ

Intel’s Core i7 (Haswell)

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4th Generation Core i7

L1 64 KB

L2 256 KB

L3 8MB

1.6 billion transistors in 177 mm2 with 22nm

technology2x Graphics performance

over Ivy Bridge

Page 31: Lecture 1. Technology Trend

Korea Univ

AMD’s Opteron – Barcelona (2007)

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• 4 cores on one chip• 1.9GHz clock• 65nm technology• Three levels of caches (L1, L2, L3) on chip• Integrated North Bridge

Page 32: Lecture 1. Technology Trend

Korea Univ

Intel Teraflops Research Chip

• 80 CPU cores• Deliver more than 1 trillion

floating-point operations per second (1 Teraflops) of performance

32

Introduced in September 2006

Page 33: Lecture 1. Technology Trend

Korea Univ

Intel’s 48 Core Processor

• 48 x86 cores manufactured with 45nm technology• Nicknamed “single-chip cloud computer”

33

Debuted in December 2009

Page 34: Lecture 1. Technology Trend

Korea Univ

Tilera’s 100 cores (June 2011)• Tilera has introduced a range of processors (64-bit Gx family:

36 cores, 64 cores and 100 cores), aiming to take on Intel in servers that handle high-throughput web applications 64-bit cores running up to 1.5GHz Manufactured in 40nm technology

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TILE Gx 3000 Series Overview

Page 35: Lecture 1. Technology Trend

Korea Univ

IBM Bluegene/Q Processor• The Bluegene/Q processors power the

world #3 Sequoia supercomputer, boasting 16.32 petaflops in Lawrence Livermore National Labs 1,572,864 cores

• Bluegene/Q has 18 cores First processor supporting hardware

transactional memory Each core is a 64-bit 4-way multithreaded

PowerPC A2 16 cores are used for running actual

computations; one will be used for running the operating system; the other is used to improve chip reliability

1.47 billion transistors 1.6 GHz

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http://www.top500.org

IBM’s Bluegene/Q Processor (2011)

Page 36: Lecture 1. Technology Trend

Korea Univ

#1 Supercomputer (2013)• Tianhe-2 (MilkyWay-2) in

National University of Defense Technology, China Xeon Phi 3,120,000 cores 1,024 TB Memory 17,808 MW power

consumption 33 petaflops

36

http://www.top500.org

Page 37: Lecture 1. Technology Trend

Korea Univ

Performance

• If you edit your ms-word document on dual core, would it be running twice faster?

• The problem now is how to parallelize applications and efficiently use hardware resources (available cores)…

• If you were plowing a field, which would you rather use: Two strong oxen or 1024 chickens? - Seymour Cray (the father of supercomputing)

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No!

Well, it is hard to say in Computing World

Page 38: Lecture 1. Technology Trend

Korea Univ

Parallel Programming Models

• Most widely adopted parallel programming models OpenMP

• Shared-memory programming model• Parallel constructs are added to a sequential program written in

Fortran, C or C++• Comparably simple to use since the burden of working out the

details of the parallel program is up to the compiler

Pthread: POSIX (Portable Operating System Interface) Threads• Shared-memory programming model• Pthreads are defined as a set of C and C++ programming types and

procedure calls A collection of routines for creating, managing, and coordinating a

collection of threads – So, it is a library• Programming with Pthreads is much more complex than with

OpenMP38

Page 39: Lecture 1. Technology Trend

Korea Univ

Parallel Programming Models

MPI: Message Passing Interface• Developed for distributed-memory architectures, where

multiple processes execute independently and communicate data as needed by exchanging messages

• Most widely used in the high-end technical computing community, where clusters are common

• Most vendors of shared memory systems also provide MPI implementations that leverage the shared address space

• Most MPI implementations consist of a specific set of APIs callable from C, C++ ,Fortran or Java --Wiki

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