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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP81K
MODEL : 22LF15R 22LF15R-TA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL41394483 (0904-REV00)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ..........................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................13
BLOCK DIAGRAM...................................................................................18
EXPLODED VIEW .................................................................................. 19
SVC. SHEET ...............................................................................................
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. Application rangeThis specification is applied to LCD TV used LP81K chassis.
2. Requirement for TestEach part is tested as below without special appointment.
(1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC(2) Relative Humidity : 65±10%(3) Power : Standard input voltage (100-240V~, 50/60Hz)
* Standard Voltage of each products is marked by models.(4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
3. Module Specification
Item Specification Measurement Result Remark
Display Screen Device 22” wide Color Display Module
Aspect Ratio 16 : 10
LCD Module 22” TFT WSXGA LCD
Operating Environment Temp : 0 ~ 40 deg LGE SPEC
Humidity : 0 ~ 85%
Storage Environment Temp : -20 ~ 60 deg
Humidity : 0 ~ 85%
Input Voltage 100-240V~, 50/60Hz
Power Consumption Power on(Blue) : ≤ 48W Volume : 1/8 volume of sound distortion point
St-By(Red) ≤ 1.0W
LCD Module Maker Inch unit (H) x (V) x (D)
LPL Outline Dimension 22” 494.7x320.1x16.5 mm
Pixel Pitch 0282x0.282 mm
Back Light 4CCFL mm
Display Colors 16.7M(16,777,216)
R/T 5 mm
1 Luminance(CR≥10) 190 250 cd/m2 LPL PSM:Vivid, CSM:Medium, WHITE(100IRE)
2 View angle (R/L, U/D) 160/160 degree CR >10
3 Color Coordinate White X Typ. 0.285 Typ. PSM:Vivid, CSM:Medium, WHITE(85IRE)
Y -0.015 0.293 +0.015
Red X 0.635 Module entrance basis
Y Typ. 0.342 Typ.
Green X -0.03 0.292 +0.03
Y 0.611
Blue X 0.147
Y 0.070
4 Contrast ratio 500 800 All white/All black
5 Luminance Variation 75
5. Chroma & Brightness(Optical)
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4. Model Specifications
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
1 Market NON EU
2 Broadcasting system PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M
3 Available Channel BAND PAL NTSC
VHF/UHF C1~C69 2~78
CATV S1~S47 1~71
4 Receiving system Upper Heterodyne
5 Video Input (1EA) PAL, SECAM, NTSC Rear
6 Component Input (1EA) Y/Cb/Cr, Y/ Pb/Pr Rear
7 HDMI/DVI Input (1EA) HDMI-DTV Rear
8 Audio Input (2EA) Component, AV L/R Input
9 Headphone Output (1EA) Rear
No. Item Typ.Min. Max. Unit Maker Remark
RemarkSpecificationItemNo.
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6. Component Video Input (Y, PB, PR)No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 720*480 31.50 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11. 1920*1080 33.72 59.94 74.176 HDTV 1080I
12. 1920*1080 33.75 60.00 74.25 HDTV 1080I
13. 1920*1080 56.25 50 148.5 HDTV 1080P
14. 1920*1080 67.432 59.94 148.350 HDTV 1080P
15. 1920*1080 67.5 60.00 148.5 HDTV 1080P
7. HDMI/DVI input (DTV)No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1 720*480 31.47 59.94 27.000 SDTV 480P
2 720*480 31.50 60.00 27.027 SDTV 480P
3 720*576 31.25 50.00 27.000 SDTV 576P
4 1280*720 37.5 50.00 74.250 HDTV 720P 50Hz
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.250 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.250 HDTV 1080I
9 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz
10 1920*1080 56.25 50 148.5 HDTV 1080P 50Hz
11 1920*1080 67.432 59.94 148.350 HDTV 1080P
12 1920*1080 67.5 60.00 148.5 HDTV 1080P
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ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to 22” LCD TV which ismanufactured in TV Factory or is produced on the basis of thisdata.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25±5ºC of temperature and 65±10% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100-220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal
3. PCB assembly adjustment method(Using MSTAR Download program)
3-1. S/W program download(1) Preliminary steps
** Connect the download jig to D-sub jack
(2) Download steps1) Execute ‘ISP Tool’ program in PC, then a main window
will be opened
2) Click the connect button and confirm “Dialog Box”.
3) Click the Config button and Change speed.E2PROM Device setting : over the 350Khz
4) Read and write bin fileClick “(1)Read” tab, and then load download file(XXXX.bin)by clicking “Read”.
5) Click “Auto(2)” tab and set as below6) click “Run(3)”.7) After downloading, check “OK(4)” message.
Double click
(1)
filexxx.bin
(4) ......... OK
(3)
(2)
f i l ex x x .bin
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3-2. Component input ADC1) Component Gain/Offset Adjustment7
- Convert to Component in Input-source- Input the Component (Which has 720p@60Hz YPbPr
signal : 100% Color Bar (MSPG-925F Model : 217/Pattern: 65 ) into Component.
- Adjust by commanding AUTO_COLOR_ADJUST (0xF1)0x00 0x02 instruction
2) Confirmation- We confirm whether “0xF3 (offset), 0xF4 (gain)” address
of EEPROM “0xBC” is “0xAA” or not. - If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t “0xAA”,
we adjust once more- We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”* Manual ADC process using Service Remocon. After
enter Service Mode by pushing “ADC” key, execute“Auto-RGB” by pushing “G” key at “Auto-RGB”.
* After Tool option/Area option change, you have to AC power offBefore PCBA check, you have to change the Tool option, Areaoption and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
3-3. TOOL Option, Area Option change(1) Profile : Must be changed the option value because being
different with some setting value depend on module maker,inch and market
(2) Equipment : adjustment remote control.(3) Adjustment method
The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ fromthe model spec.)
* Refer to Job Expression of each main chassis ass’y(EBUxxxxxxxx) for Option value
* Never push the IN-STOP KEY after completing the functioninspection.
4. EDID (The Extended Display Identification Data)
* Caution- Use the proper signal cable for EDID Download
<EDID DOWNLOAD>
4-1. 22LF15R-TA EDID DATA<HDMI : 256bytes>
1) All Data : HEXA Value2) Changeable Data
* Serial No : Controlled/ Data : 01** Month : Controlled/ Data : 00*** Year : Controlled**** Check sum
4-2. HDCP SETTING(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.2) Input HDCP key with HDCP-key- in-program.3) HDCP Key value is stored on EEPROM(AT24C64) which is
from “0x80” address of 0xA0 page.4) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925.5) HDCP Key value is different among the sets.
* Before HDCP Download, you have to Set the Configurationthat CMD delay.-> Configuration -> Option-> I2C delay(Write Byte : 0.5 ms,Read Byte : 0.5ms, Read CMD Byte : 0.5ms)
[Fig. 2]
For HDMI EDID
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5. Adjustment of White Balance5-1. Purpose and Principle for adjustment
of the color temperature- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to C0 and decrease theothers.
Adjustment mode : Two modes of Cool and Warm(Medium data is automatically calibrated by the Cool data)
5-2. Required Equipment(1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product
- LCD TV( ch : 9 ),(3) Auto W/B adjustment instrument(only for Auto adjustment)
5-3. Connecting diagram of equipment formeasuring(For Automatic Adjustment)
(1) Enter the adjustment mode of DDC1) Set command delay time : 50ms2) Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key3) Maintain the DDC adjustment mode with same condition
of Heat-run ->Maintain after AC off/on in status of Heat-run pattern display
(2) Release the DDC adjustment mode1) Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode2) Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment3) Need to transmit the aging off command to TV set after
finishing the adjustment.4) Check DDC adjust mode release by exit key and release
DDC adjust mode
(3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 190cd/m2 in the cool mode (For LCD)
5-4. Adjustment of White Balance(for Manual adjustment)
(1) Adjustment mode : Two modes (Cool and Warm)(Medium data is automatically calibrated by the Cool data)
(2) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000 (LCD : CH9)
(3) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(4) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.(Push front-
AV or Input key)4) Input external pattern(85% white pattern)5) Push the ADJ key two times (entering White Balance
mode)6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C.
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust two modes (Cool and Warm)
(Fix the one of R/G/B and change the others)9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASE- First adjust the coordinate far away from the target value(x, y).
(1) x, y > target1) Decrease the R, G.
(2) x, y < target1) First decrease the B gain, 2) Decrease the one of the others.
- In case of decreasing the x, decreasing the R : fix G- In case of decreasing the y , decreasing the G : fix R
(3) x > target, y < target1) First decrease B, so make y a little more than the target.2) Adjust x value by decreasing the R
(4) x < target , y > target1) First decrease B, so make x a little more than the target.2) Adjust x value by decreasing the G
A Standard color coordinate and temperature when using theCA100+ or CA210 equipment)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Mode Color coordinate Temp ∆uvX Y
Cool 0.285±0.002 0.293±0.002 9,300K 0.000Warm 0.313±0.002 0.329±0.002 6,500K 0.003
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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6. DDC Adjustment Command
6-1. DDC command protocol(1) Signal Table
6-2. E2PROM Data Write(1) Signal Table
LEN : 84h+BytesCMD : E8hADH : E2PROM Slave Address(A0,A2,A4,A6,A8), Not 00h
(Reserved by BufferToEEPROM)ADL : E2PROM Sub Address(00~FF)Data : Write data
(2) Command Set
* Purpose1) EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 – 7F” of “EEPROM Page A6”).2) FOS Default write
<14-mode data>writeSyncFlags,HPeriodH, HPeriodL, VtotalH,VtotalL,SrcHTotalH, SrcHTotalL, SrcHStartH, SrcHStartL,SrcVStartH,SrcVStartL, HsyncPhase
3) Random Data write : write to the appointment Address ofE2PROM.
6-3. E2PROM Data Read(1) Signal Table
(2) Command Set
* Purpose : To read(84h) the appointment Address ofE2PROM by 128(80h)-byte
7. Function Check7-1. Check display and sound
- Check Input and Signal items. (cf. work instructions)1.TV2.AV (CVBS/ S-Video)3.COMPONENT (480P)4.RGB (PC : 1024 x 768 @ 60hz)5.HDMI6.PC Audio In and H/P Out* Display and sound check is executed by Remote controller.
Aging On/Off F3 00 FF/00 FF : ON / OO : OFF
Input select F4 00 0x10 : TV
0x20 : AV
0x40 : Component
0x60 : RGB
0x90 : HDMI
R GAIN 16 00 00 - C0 Adjustment Gain
G GAIN 18 00 - C0 CSM COOL
B GAIN 1A 00 - C0
R GAIN 16 01 00 - C0 Adjustment Gain
G GAIN 18 00 - C0 CSM NORMAL
B GAIN 1A 00 - C0
R GAIN 16 02 00 - C0 Adjustment Gain
G GAIN 18 00 - C0 CSM WARM
B GAIN 1A 00 - C0
CSM mode F2 00 00 COOL
01 NORMAL
02 WARM
AUTO ADC F1 00 0, 1, 2 0:Adjustment Offset
1:Adjustment Gain
2:Adjustment Offset and Gain
EEPROM Read E7 00 00 EEPROM read
EEPROM Write E8 00 data EEPROM write
ADR VAL DescriptionCMD(hex)
Adjustment Contents
CMD ADR VAL
Delay 20m
EEPROM READ E7 A0 0 0-Page 0~7F Read
80 0-Page 80~FF Read
A2 0 1-Page 0~7F Read
80 1-Page 80~FF Read
A4 0 2-Page 0~7F Read
80 2-Page 80~FF Read
A6 0 3-Page 0~7F Read
80 3-Page 80~FF Read
Adjustment item CMD(hex) ADH(hex) ADL(hex) Details
EEPROM WRITE E8 94 16-Byte Write
(84+n)h n-byte Write
Adjustment item CMD(hex) LEN Remark
128 Bytes
Delay 100ms
1. No Power (LED indicator off) : [A] Process
- 13 -
TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check 15V orST_5V of Power B/D.
Fail
Pass
Check short of Main B/Dor Change Power B/D.
Check Output ofIC1000, IC1006.
Fail Check short ofIC100, Q307.
Pass
Pass
Fail Re-soldering or Changedefect part of IC100, Q307.
Change IC1000, IC1006.
Pass
Change IC1102, IC1103.
Check Output ofIC1002.
Fail Check short ofQ307, TU600, IC500.
Fail Re-soldering or Changedefect part of Q307,TU600, IC500.
Pass
Pass
Change IC1003.
Change LED Assy.
Check Output ofIC1003.
Pass
Check LED Assy.
Pass
Check P307 Connector.
Fail Check short ofIC100, IC400.
Fail
Fail Re-soldering or Changedefect part of IC100, IC400.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
2. No RASTER : [B] Process
Check LED statusOn Display Unit.
Fail
Pass
Repeat A PROCESS.
Check Panel LinkCable or Module.
Pass
FailChange Panel Link Cable or Module.
Check InverterConnector or
inverter.
FailChange Inverter Connector or Inverter.
Pass
Change IC100
Check Output ofL300.
Pass
Check the LVDSOutput of IC100.
Pass
Check Input source Cable and Jack.
Fail
Change Module.Fail
FailChange L300.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
3. No Raster on Component Signal
Repeat [A, B]process.
Pass
Check the input/output of R801.
FailCheck the JK800.
Pass
Re-soldering or change thedefect part. Check the X100.
Checkthe input/output
of R109.
Pass
Check theinput/output of IC100.
Pass
Check input source cable and jack.
Fail
FailRe-soldering or Change the defect part.
5. No Raster on AV(Scart inVideo, S-Video) Signal
6. No Raster on TV(RF) Signal
- 16 -
4. No Raster on HDMI Signal
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Repeat [A, B]process.
Pass
Check the input/output of IC100.
Fail Re-soldering or change the defect part. Check the X100.
Pass
Check input source cable and jack.
Check input source cable and jack.
Repeat [A, B]process.
FailCheck the output
of TU600.
Pass
Pass
Fail Check 5V of TU600.Re-Soldering or changethe defect part.
Checkthe input/outputof R193, R114.
FailChange R193, R114.
Pass
Check input/outputof IC100.
Pass
Fail Re-soldering of Change defect part.Check the X100.
Pass Pass
- 17 -
7. No sound
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check the inputSource.
Fail
Pass
Change the source input.
Check input/Outputof IC100.
Fail
Pass
Re-soldering of Change the defect part.Check the X100
Check the input/output of IC500
Fail Re-soldering or Changethe defect part.
Pass
Check the Speaker
Pass
Check the Speaker wire.
FailChange Speaker.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 18 -
LV
DS
MO
DU
LE
TT
L M
OD
UL
E
MX
25
L1
60
5A
M2
C(S
eri
al F
las
h)
Co
ntr
ol B
oa
rd(T
ac
t S
wit
ch
)L
ED
Sp
ea
ker
Le
ft
Sp
ea
ker
Rig
ht
St
15
VS
t 5
V
St
15
V1
2V
St
5V
St
3.3
V/S
t 1
.2V
LIP
S
Co
ntr
ol i
n/o
ut
EE
PR
OM
(24
C0
2)
EE
PR
OM
(24
C6
4)
CV
BS
Jac
kS
-Vid
eo
Jac
kS
tere
o-In
H/P
Ou
tpu
t
LED/IR/Control
Po
we
r
Vid
eo
Au
dio
Da
ta
HD
MI
Ad
dre
ss
Da
ta
CL
K,D
QM
,W
EZ
,CA
SZ
,RA
SZ
EE
PR
OM
(24
C0
2)
HY
5D
U2
81
62
2E
TP
(DD
R S
DR
AM
12
8M
)
TV
Tu
ne
r(T
AF
T-Z
70
3D
)T
V T
un
er
(TA
FT-
Z7
03
D)
SC
L/S
DA
LG
E6
99
1D
D(S
ca
ler
+ V
ide
o D
ec
od
er)
CO
MP
ON
EN
TJa
ck
D-S
ub
Rx
/Tx
CS
43
52
(DA
C)
5V
DC-
DC
DC-
DC
FE
TS
t 5
V
LE
D/I
R B
oa
rd
Co
ntr
ol
ST
32
32
CD
R(R
S-2
32
C)
PW
M_D
IMD
IM_C
TL
YD
A1
38
(Au
dio
am
p)
Rx
/Tx
SC
AR
T J
ac
k(O
pti
on
)
CVBSout
Audioout
Audioin
CVBSin
RGBin
ComponentY,Pb,Pr
AudioInL,R
Videoin
Audioin
SCL/SDA
SC
L/S
DA
SC
L/S
DA
SIF
_OU
T
CV
BS
OU
T
Yin
Cin
5V
RS
-23
2C
R,G,B,TXCLK
R,G,B,H,V
PCAudioIn
Re
gu
lato
r5
V
IR d
ete
cto
r
Re
gu
lato
r5
V
2.5
V
Op
tio
n
BLOCK DIAGRAM
- 19 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
200
120
122
123
501
500
900
910
920
540
530
511
510
400
410
820
LV1
A2
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
12V_PANEL
0.1uF50V
C1018
12V_AMP
22uF16V
C1020
10KR1014
DIMMING_CTL
6.8KR1018
10KR1017
MP1583DN-ZIC1002
3SW
2IN
4GND
1BS
5FB
6COMP
7EN
8SS
5V_G
RL_ON
5V_TUNER
15V
PWM_DIM
1/16W
59KR1020
INV_CTL
10KR1019
2700pF50V
C1019
5V_G
1KR1010
100R1006
15V
10K
READY
R1013
2.5V_MST
AZ1117H-2.5TR/E1IC1003
1
ADJ/GND
2 OUTPUT3INPUT
2.5V_DDR
WAFER-STRAIGHT
P1000
115V(18v)
215V(18v)
3GND
4GND
55V
65V
7ACD
8PWR-ON
9INV_CTL
10DIM
11INV_BR
470uF25V
C1023
0.47uF25V
C1012
0.01uF50V
C1013
1uF25V
C1004
0R1001
0R1002
30uHL1003
READYR1003
10KR1012
1uF25V
C1006
READY
1uF25V
C1007
5V
0R1000
READY
KA78M05-RIC1005
2
2
3 311
100uF16V
C1014 100uF25V
C1022
100R1007
1.1KR1008
220uF16V
C1026
2SC3052Q1000
E
B
C
330uF25V
C1002
470uF16V
C1005470uF16V
C1003
1uF25V
C10161uF25V
C1024
2W43 5%R1022
2W43 5%R1021
MBW3216-501TFL1004
MBW3216-501TFL1005
MBW3216-501TFL1002
BG2012B080TFL1001
BG2012B080TF
L1000
0R1011
ST_3.3V
100uF16V
C1008
0R100918K
R1004
0.1uFC1001
10uFC1009
5.6KR1005
SC4215ISTRTIC1000
3VIN
2EN
4NC_2
1NC_1
5 NC_3
6 VO
7 ADJ
8 GND
4.7uFC1000
ST_5V
ST_5V
0R1023
READY
0.1uF50V
C1027
READY
0.1uF50V
C1028
READY
0.1uF50V
C1029
READY
RT1C3904-T112Q1001
READYE
B
C4.7KR1024
READY
5V_G
100KR1029
1KR1028 READY1N4148WREADY
D1003
0.1uF50V
C1037
22uHL1007
3225
22uF16V
C1032
RL_ON
5600pF50V
C1036
0.1uF
50V
C1034
0.1uF50V
C1035
9.1KR1027
ST_1.2V
MBW3216-501TFL1006
MP2305DSIC1006
3SW
2IN
4GND
1BS
5FB
6COMP
7EN
8SS
ST_5V
0.47uF25V
C1030
470uF16V
C1033
2.4K1%
R10256.8K5%
R1026
1N4148W
READY
D1004
MBRS340T3GD1002
0.1uF50V
C1031
ST_5V
STAND_BY VOLTAGE
FROM LIPS
POWER 9 9
2007/11/19LP81K
GENERAL VOLTAGE
V0 = 0 .8(R1+R2) / R2
ST5V->ST3.3V->ST1.2V
R2
(OUT:1.27V)
R1
15V,ST5V
FROM SI4925
15V==>12_AMP
5V==>5V_G
12_PANEL5V_TUNER
3.3V_MST2.5V_MST2.5V_DDR
PStoPDF trial version. http://www.oakdoc.com
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
0.47uF16V
C914
RS232C
560pF50V
C908
330pF50V
C900
READY
330pF50V
C903
PC_SOUND_L
S_VIDEO_Y
24VZD917
RS232C
V_CVBS
S_VIDEO_C
15KR906
HEADPHONE_OUT_L
24VZD919
RS232C
4.7KR923
RS232C
560pF50V
C911
S_VIDEO_DET
RS232C_RXD
330pF50V
C910
100R918
RS232C
330pF50V
C904
10KR914
V_AUDIO_R
4.7KR922
RS232C
V_AUDIO_L
PC_SOUND_R
330pF50V
C909
RS232C_TXD
PSJ014-01JK902
GND6
1
C-LUG1
2C-LUG2
30-SPRING
4C-LUG3
5 C-LUG4
SHIELD7
0.47uF16V
C916
RS232C
560pF50V
C905
0.47uF16V
C915
RS232C
15KR907
10KR915
330pF50V
C901
PEJ024-01
JK903
6B T_TERMINAL2
8 SHIELD_PLATE
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
24VZD918
RS232C
0.47uF16V
C917
RS232C
100R919
RS232C
5.6BZD902
10uF
16V
C919
RS232C
560pF50V
C906
330pF50V
C902
HP_DET
24VZD920
RS232C
HEADPHONE_OUT_R
470KR908
470KR903
470KR904
470KR905
330pF50V
C907
READY
75R901
75R902
75R900
5.6BZD911
5.6BZD907
5.6BZD912
5.6BZD901
5.6BZD900
5.6BZD903
5.6BZD904
5.6B
ZD908
5.6BZD906
5.6BZD910
5.6BZD909
5.6BZD905
5.6BZD913
5.6BZD915
5.6BZD916
5.6BZD914
12R9218ohm speaker
12R920
8ohm speaker
0.47uFC918
READY
9.1KR911
8ohm speaker
9.1K
R912
8ohm speaker
1uF 10VC912
1uF 10VC913
10KR917
8ohm speaker
10KR9168ohm speaker
8OHML901
8OHML900
8OHML905
8OHML906
8OHML907
READYR924
MBW3216-501TFL908 RS232C
IR_OUT
PPJ148-07
JK900
2 [YL]O-SPRING
1 [YL]GND
3 [YL]CONTACT
4 [WH]GND
5 [WH]C-LUG-L
6 [RD]GND
7 [RD]O-SPRING
8 [RD]CONTACT
ST_5V
ST_3.3V
ST_3.3V
PEJ024-01
JK901
6B T_TERMINAL2
8 SHIELD_PLATE
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
ST3232CDRIC900
RS232C
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7T2OUT
8R2IN
9R2OUT
10T2IN
11T1IN
12R1OUT
13R1IN
14T1OUT
15GND
16VCC
0R925
0R926
0R913
KCN-DS-1-0088
P900
RS232C
1
2
3
4
5
6
7
8
9
10
CVBS
S_Video
PC SOUND INPUT
Headphone
8 9
RS232C_RX
RS232C_TX
RS_232C
2007/11/19LP81K
OUTER JACK
PStoPDF trial version. http://www.oakdoc.com
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
470K
R806
22
R805
470KR809
CO
MP_Y
+
CO
MP_S
OU
ND
_L
CO
MP_S
OU
ND
_R
10KR810
PP
J2
09
-01
JK8
00 4A
[GN
]CO
NT
AC
T
2A[G
N]1
P_C
AN
3A[G
N]O
_S
PR
ING
2B
[BL
]1P
_C
AN
5B
[BL
]C_L
UG
_L
2C
[RD
]1P
_C
AN
1
5C
[RD
]C_L
UG
_L
2D[W
H]1
P_C
AN
5D[W
H]C
_L
UG
_L
2E
[RD
]1P
_C
AN
2
4E
[RD
]CO
NT
AC
T
3E
[RD
]O_S
PR
ING
10K
R807
1000pF
50V
C800
CO
MP
_P
r+
22
R801
CO
MP_P
b+
22R803
1000pF
50V
C801
75
R800 75
R802
75
R8045.6BZD800
5.6BZD801
5.6BZD802
5.6BZD803
5.6BZD804
5.6BZD805
5.6BZD806
5.6BZD807
10KR808
8ohm speaker
10KR811
8ohm speaker
BG2012B080TF
8OHM
L800
BG2012B080TF
8OHM
L801
COMPONENT
LP81K 2007/11/19
7 9COMPONENT
PStoPDF trial version. http://www.oakdoc.com
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
100R702
DSUB_SDA
100R703
PC_B+
PC_VSYNC
DSUB_SCL
PC_R+
100R713
HD_5V
DDC_CTL
4.7KR723
DSUB_SDA
0.1uF50V
C706
4.7KR722
HDMI_SCL
DDC_CTL
HDMI_SDA
PC_HSYNC
PC_G+
DSUB_SCL
0.1uF50V
C703
75
R72575R724
75R726
5.6
BZ
D701
5.6
BZ
D705
5.6
BZ
D702
5.6
BZ
D703
RE
AD
Y
5.6
BZ
D704
10KR719
MMBD301LT1G30VD702
68R736
68R735
0R741
0R738
READY
33R737
68
pF
50V
C7
10
68
pF
50V
C7
11
4.7
KR
73
9
4.7
KR
74
0
100R717
68
pF
50V
C7
12
68
pF
50V
C7
13
0 .1uF 50VC714
0.1uF50V
C7160.1uF
50V
C7170.1uF
50V
C718
33R742
AT24C02BN-10SU-1.8IC702
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
AT24C02BN-10SU-1.8IC701
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
HDMI_SCL
HPDCTL
G_TX1-
TXCLK-
HD_5V
10KR733
0.1uF50V
C702
100R743
CM2021-00TRIC700
26NC4
27TMDS_D0-
28TMDS_GND6
29NC5
30TMDS_D1-
31TMDS_GND5
32NC6
33TMDS_D2-
34TMDS_GND4
35NC7
36GND1
17DDC_CLK_IN
3GND0
6NC0
16CE_REMOTE_IN
15NC3
14TMDS_GND3
13TMDS_CK+
12NC2
11TMDS_GND2
10TMDS_D0+
9NC1
8TMDS_GND1
7TMDS_D1+
4TMDS_D2+
5TMDS_GND0
23.3V_SUPPLY
21DDC_DAT_OUT
15V_SUPPLY
20HOTPLUG_DET_OUT
19HOTPLUG_DET_IN
18DDC_DAT_IN
23CE_REMOTE_OUT
24TMDS_CK-
25TMDS_GND7
22DDC_CLK_OUT
37TMDS_VDD
38NC8
0 R730
B_TX0+
HDMI_SDA
G_TX1+
B_TX0-
TXCLK+
ST_3.3V
R_TX2-
0 R731
1K
R700
0.1uF50V
C700
10KR734
5V_G
R_TX2+
0.1uF50V
C701
0 R732
4.7KR704
4.7KR714
2SC3052Q700
E
B
C
ENKMC2838-T112D700
A1
C
A2
ENKMC2838-T112D701
A1
C
A2
EN
KM
C2837-T
112
D7
06 A
AC
C
EN
KM
C2837-T
112
D7
05 A
AC
C
EN
KM
C2837-T
112
D7
04 A
AC
C
KCN-DS-1-0089
J701
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MMBD301LT1G30V
D708
CEC
A C
0READY
R747
CEC
CEC_C
BSS83Q701 CEC
SBD
G200R746
CEC
0.01uF50V
READY
C719
ST_3.3V
51KR744
CEC
ST_3.3V
30K READYR748
0READY
R745
CDS3C30GTH
30VREADY
D707
ST_5V ST_5V
ST_5V
CEC
10KR750
10KR751
10KR749
HDMI_5V_DET
HD_5V
MMBD301LT1G30VD709
10KR752
0R753
READY
0R710
0R711
0R712
0R708
0R709
0R706
0R707
0R705
QJ41193-FEE2-7FJ700
1
2
3
4
5
6
7
8
9
10
11CLK_SHIELD
12CLK-
13CEC
14NC
15SCL
16SDA
17DDC/CEC_GND
18+5V_POWER
19HPD
20
21
22
VGA
6 9HDMI&VGA
5V_DSUB
2007/11/19LP81K
HDMIÿÿÿ¸
PStoPDF trial version. http://www.oakdoc.com
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
330R609
0.027uFC610
27pFC601
0R615
IF_AUDIO_OUT
0R616
4.7KR611
2SA1530A-T112-1RQ601
E
BC
220R619
0.1uFC607
0R606
SCL_Part
100R605READY
0R612
2SA1530A-T112-1RQ600E
BC
IF_VIDEO_OUT
SIF_OUT
4.7KR602
5V_TUNER
220R620
TAFT-Z703D
NON EU TUNER
TU600
14 AFT
13 V-OUT
5 RF_AGC
12 NC_4
11 AS
2 GND_1
19 NC_7
18 NC_6
10 CLOCK
4 NC_2
1 NC_1
17 NC_5
9 DATA
8 GND_2
3 +B[5V]
16 SIF-OUT
7 NC_3
6 TP[33V_OPTION]
15 A-OUT
21
SHIELD
20 NC_8
0R600
330R608
0
READY
R617
5V_TUNER
5V_TUNER
4.7KR603
5V_TUNER
82 READYR610
1KR621
SDA_TUNER4.7KR614
4.7KR604
0READY
R618SDA_Part
5V_TUNER
4700pFC609
270pFREADY
C608
ST_3.3V
SCL_TUNER
1KR622
0.01uFC602
0READY
R613
27pFC603
0.01uFC605
READY
100pFREADY
C600
0.01uFC604
4.7uF35V
READY
C606
5V_TUNER
RT1C3904-T112Q602
E
BC
470R607
0R601
READY
100uF16V
C611
BLM18BD102SN1DL600READY
TAFT-H703F
TU600-*1
NTSC TUNER
14AFT
13V-OUT
5RF_AGC
12NC_4
11AS
2GND_1
19NC_7
18NC_6
10CLOCK
4NC_2
1NC_1
17NC_5
9DATA
8GND_2
3+B[5V]
16SIF-OUT
7NC_3
6TP[33V_OPTION]
15A-OUT
21
SHIELD
20NC_8
120-ohmL601
5 9TUNER2007/11/19LP81K
TUNER
PStoPDF trial version. http://www.oakdoc.com
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R_SOUND_N
12V_AMP
HEADPHONE_OUT_R
1KR515
100R513
30uHL500
1KR516
30uHL504L_SOUND_P
150R504
100KR500
0R510
L_SOUND_N
R_SOUND_P
AUDIO_L0.1uF 50V
C515
100R511
30uHL503
HEADPHONE_OUT_L
AUDIO_R
AMP_MUTE
0R518
HP_DET
KDS181D501
0R502
30uHL501
KDS181D500
R_SOUND_N
L_SOUND_P
R_SOUND_P
L_SOUND_N
1000pF50V
C524
1000pF50V
C5261000pF
50V
C527
1KR501
4.7KR505
1000pF50V
C525
100uF16V
C506
47uF25V
C501
330uF25V
C513
100KR509
100KR514
330uF25V
C510
4.7uF16V
C511
4.7uF 16V
C514
3216
4.7uF16V
C507
4.7uF 16V
C508
0.01uFC522
50V
0.01uFC523
50V
0.01uFC502
50V0.01uFC503
50V
1uF10V
C505
1uF10VC509 1uF10VC517
10uF16V
C516
0.1uF50V
C519
KDS181D502 YDA138-EZ(D-3)
IC500
26VOL0
27VOL1
28PVDDML
29OUTML
30PVSSL_1
31PVSSL_2
32PVSSL_3
33PVSSL_4
34PVSSL_5
35OUTPL
36PVDDPL
37HP
38INL
39VREFL
40PVDDREG
41REFA
42HPOL
17SLEEPN
3VSSBGR
6MUTEN
16PROTN
15PVDDMR
14OUTMR
13PVSSR_5
12PVSSR_4
11PVSSR_3
10PVSSR_2
9PVSSR_1
8OUTPR
7PVDDPR
4VREFR
5INR
2AVSS
21XI
1HPOR
20XO
19CKIO
18DVSS
23MODE0
24MODE1
25MODE2
22DVDD
READYR506
READYR512
READYR517
1uF25V
C512
10KR508
1uF10V
C520
1uF10V
C518
5.1KR507
READY
2.2uF25V
C500
0.47uFC504
50V
0.47uFC521
50V
2SC3052Q501
E
B
C
2SA1530A-T112-1R
Q500E
B
C
SMAW250-04
P500
1
2
3
4
500-ohmL508
500-ohmL506
500-ohmL507
500-ohmL505
500-ohmL512
500-ohmL510
500-ohmL511
500-ohmL509
ST_5V
SPK LSPK R
Headphone
4 9AMP
MUTEN
HP
Output
H H
L H
Speaker Headphone Mute
L
X
<Option>
2007/11/19LP81K
AUDIO AMP
PStoPDF trial version. http://www.oakdoc.com
MADR[9]
MDATA[0-15]
MADR[2]
MCLK
MADR[4]MADR[4]
0.1uF50V
C400
MADR[11]MADR[10]
RASZ
MADR[7]
MADR[6]
MADR[8]
MADR[1]
CKE
MADR[11]
MADR[0-11]
0.1uF50V
C409
1KR408
0.1uF50V
C403
MADR[3]
MADR[5]
1KR407
0.1uF50V
C401
MADR[0]
MADR[5]
150R406
MADR[9]
MADR[7]
MADR[1]
MADR[2]
0.1uF50V
C406
CASZ
MADR[0]
0.1uF50V
C408
0.1uF50V
C402
LDQM
0.1uF50V
C405
0.1uF50V
C404
MADR[3]
MADR[10]
DQS1
WEZ
MCLKZ
MADR[6]
2.5V_DDR
1000pF50V
C4072.5V_DDR
MADR[8]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SBA0
DQS0
SBA1
2.5V_DDR
UDQM
HY5DU281622FTP-5IC400
26BA0
27BA1
28A10/AP
29A0
30A1
31A2
32A3
33VDD_3
34VSS_1
35A4
36A5
37A6
38A7
39A8
40A9
41A11
42NC_4
43NC_5
44CKE
45CK
46/CK
47UDM
48VSS_2
49VREF
50NC_6
17NC_2
3VDDQ_1
6VSSQ_1
16LDQS
15VDDQ_3
14NC_1
13DQ7
12VSSQ_2
11DQ6
10DQ5
9VDDQ_2
8DQ4
7DQ3
4DQ1
5DQ2
25NC_3
24/CS
23/RAS
2DQ0
22/CAS
21/WE
1VDD_1
20LDM
19NC
18VDD_2
51UDQS
52VSSQ_3
53NC_7
54DQ8
55VDDQ_4
56DQ9
57DQ10
58VSSQ_4
59DQ11
60DQ12
61VDDQ_5
62DQ13
63DQ14
64VSSQ_5
65DQ15
66VSS_31/16W
100AR400
1/16W100AR401
1/16W100AR411
1/16W100AR410
0R405
0R409
MADR[6]
MD
AT
A[0
-15]
MDATA[0-15]
MDATA[0]
MADR[0-11]
MADR[4]
MDATA[1]
MDATA[8]
MDATA[10]
MDATA[9]
MDATA[7]
MDATA[11]
MDATA[12]
MDATA[6]
MDATA[2]MDATA[13]
MADR[7]
MDATA[15]
MDATA[14]
MADR[8]
MADR[9]
MDATA[5]
MADR[11]
MDATA[4]
MDATA[3]
MADR[5]
3 9DDR2007/11/19LP81K
DDR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
KST3906-MTFQ302
E
B
C
100pF50V
C308
12V_PANEL
4.7KR311
LED_GR1
IR
PANEL_ON
100pF50V
C307
LED_AM
KEY2
0.1uF50V
C300
LED_AM1
LED_AM
4.7KR313
LED_GR
4.7KR312
KEY1
47pF50V
C306
KST3906-MTFQ303
E
B
C
100pF50V
C305
100pF50V
C303
4.7KR310
LED_GR
100pF50V
C304
RXE0+,RXE0-,RXE1+,RXE1-,RXE2+,RXE2-,RXE3+,RXE3-,RXEC+,RXEC-,RXO0+,RXO0-,RXO1+,RXO1-,RXO2+,RXO2-,RXO3+,RXO3-,RXOC+,RXOC-
1000pF50V
C302
SMW200-28CP300
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
10KR300
22KR302
READY
SMAW200-03
P306
1
2
3
RL_ON 10KR314
22KR315
22KR316
5V
R317READY
22uF16V
C309
100uF16V
C311
1/4W0
5%
R323
SI4925BDYQ307
3S2
2G1
4G2
1S1
5 D2_1
6 D2_2
7 D1_1
8 D1_2
1uF 25VC310
2.2KR324
C312READY
0R325
100uF35V
C301
1/10W1.3KR319
1/10W1.3KR320
1/10W1.3KR321
1/10W1.3KR322
2SC3052Q304
E
B
C
2SC3052Q300
READY
E
B
C
2SC3052Q305
E
B
C
12505WR-08A00
P307
1
2
3
4
5
6
7
8
9
KEY1100R326
100pF50V
C313
0.1uF50V
C314
MBW3216-501TFL300
(5V_PANEL)MBW3216-501TF
L304
BG2012B080TFL305
BG2012B080TFL306
BG2012B080TFL307
BG2012B080TFL308
BG2012B080TFL310
BG2012B080TFL309
ST_5V
10KIR_OUTR330
2SC3052Q308
IR_OUTE
B
C
10KR329
IR_OUT
22 IR_OUTR332
ST_5V
2SC3052IR_OUT
Q309
E
B
C
47KIR_OUT
R328
10KIR_OUT
R331
0.1uF50V
C315
IR_OUT
IR_OUT
ST_3.3V
ST_3.3V
ST_5V
ST_5V
0R333READY
0READYR334
MBW3216-501TF
(12V_PANEL)
L301
0R327
5.6BZD300
READY
5.6BZD301
READY
5.6BZD302
READY
5.6BZD303
READY
5.6BZD304
READY0.1uF
READY
C318
0.1uFREADY
C317
0.1uFC316
READY
RXE3+
RXE3-
RXEC+
RXEC-
RXE2+
RXE2-
RXE1+
RXE1-
RXE0+
RXE0-
RXO3+
RXO3-
RXOC+
RXOC-
RXO2+
RXO2-
RXO1+
RXO1-
RXO0+
RXO0-
2 9
CONTROL
IR & LED
PANEL & Connector
2007/11/19
( 1 )
( 1 )
( 1 )
( 1 )
( 1 )
LG81K
[19"CMO LPL/22"LPL]
<Panel option>
LVDS
PStoPDF trial version. http://www.oakdoc.com
CO
MP_S
OU
ND
_L
PC_VSYNC
MCLK
10KR220
390R140
ST_5V
LED_GR1
KIA7442FIC101
2
GND
3 OUT1VCC
HD
MI_
5V_D
ET
4.7K10BIT
R233
2.2
uF
C1
49
10uF 16VC102
S_VIDEO_C
10
0R
EA
DY
R1
80
2.2
uFR
EA
DY
C1
45
ST_3.3V
0.01uF50V
C157
READYR232
2.2
uF
C1
50
2.2
KR
EA
DY
R1
54
RXE0+,RXE0-,RXE1+,RXE1-,RXE2+,RXE2-,RXE3+,RXE3-,RXEC+,RXEC-,RXO0+,RXO0-,RXO1+,RXO1-,RXO2+,RXO2-,RXO3+,RXO3-,RXOC+,RXOC-
CKE
DSUB_SCL
100R205
0.47uF25V
C178
0.1uFC110
V_CVBS
100READY
R107
ST_3.3V
ST
_3
.3V
0 .1uFC153
MADR[0-11]
READYR245
0.1uFC109
33KR105
UDQM
S_V
IDE
O_D
ET
HPDCTL
KEY2
0R194 READY
INV_CTL
0R104
0.22uF50V
C100
RL_ON
ST_1.2V
1KR214
ST
_3
.3V
0R
EA
DY
R1
73
SPI_DO
0READYR100
0.1uFC106
PWM1
KDS181D101
SDA_Part
S_VIDEO_Y
10
0R
EA
DY
R1
51
SPI_DO
0.1uFC107
SCL_Part
0 .1uFC159
V_A
UD
IO_R
0 .1uFC168
IF_VIDEO_OUT
10K
R1
56
TXCLK-
TXCLK+
ST_3.3V
20pFC144
LGE6891DDHD
IC100-*1
1RXB1N
2RXB1P
3GND_3
4RXB2N
5RXB2P
6HPLUGB
7DDCDB_DA
8DDCDB_CK
9RXACKN
10RXACKP
11GND_11
12RXA0N
13RXA0P
14AVDD_33_14
15RXA1N
16RXA1P
17GND_17
18RXA2N
19RXA2P
20HPLUGA
21REXT
22DDCDA_DA
23DDCDA_CK
24HSYNC1
25VSYNC1
26VCLAMP
27REFP
28REFM
29BIN1P
30SOGIN1
31GIN1P
32RIN1P
33VCOM3
34BIN0P
35VCOM2
36GIN0P
37SOGIN0
38RIN0P
39AVDD_33_39
40GND_40
41HSYNC0
42VSYNC0
43VSYNC2
44BIN2P
45SOGIN2
46GIN2P
47RIN2P
48C1
49Y1
50C0
51Y0
52CVBS3
53CVBS2
54CVBS1
55VCOM1
56CVBS0
57VCOM0
58AVDD_33_58
59CVBSOUT1
60CVBSOUT0
61GND_61
62SIP0P
63AVDD_SIF
64SIF1P
65
SIF
M
66
GN
D_6
6
67
AU
VR
AD
N
68
AU
VR
AD
P
69
AU
VR
EF
70
AV
DD
_AU
71
AU
L0
72
AU
R0
73
AU
L1
74
AU
R1
75
AU
CO
M
76
AU
L2
77
AU
R2
78
AU
L3
79
AU
R3
80
AU
MO
NO
81
AU
OU
TL
3
82
AU
OU
TR
3
83
AU
OU
TL
2
84
AU
OU
TR
2
85
AU
OU
TL
1
86
AU
OU
TR
1
87
AU
OU
TL
0
88
AU
OU
TR
0
89
GP
IOF
[0]
90
GP
IOF
[1]
91
GP
IOF
[2]
92
GP
IOF
[3]
93
GP
IOF
[4]
94
GP
IOF
[5]
95
GP
IOF
[6]
96
GP
IOF
[7]
97
GP
IOF
[8]
98
GP
IOF
[9]
99
VD
DP
_99
10
0G
ND
_100
10
1V
DD
C_101
10
2D
QS
[1]
10
3M
DA
TA
[15]
10
4M
DA
TA
[14]
10
5G
ND
_105
10
6M
DA
TA
[13]
10
7M
DA
TA
[12]
10
8V
DD
M_1
08
10
9M
DA
TA
[11]
11
0M
DA
TA
[10]
11
1M
DA
TA
[9]
11
2M
DA
TA
[8]
11
3G
ND
_113
11
4V
DD
M_1
14
11
5M
DA
TA
[7]
11
6M
DA
TA
[6]
11
7M
DA
TA
[5]
11
8M
DA
TA
[4]
11
9V
DD
M_1
19
12
0M
DA
TA
[3]
12
1M
DA
TA
[2]
12
2M
DA
TA
[1]
12
3M
DA
TA
[0]
12
4D
QS
[0]
12
5LD
QM
12
6U
DQ
M
12
7M
VR
EF
12
8M
CLK
E
129 MCLKZ130 MCLK131 BADR[1]132 BADR[0]133 RASZ134 GND_134135 VDDM_135136 AVDD_MEMPLL137 CASZ138 WEZ139 MADR[0]140 MADR[1]141 MADR[2]142 MADR[3]143 MADR[4]144 MADR[5]145 MADR[6]146 MADR[7]147 VDDM_147148 GND_148149 VDDC_149150 MADR[8]151 MADR[9]152 MADR[10]153 MADR[11]154 AD[0]155 AD[1]156 AD[2]157 AD[3]158 AD[4]159 AD[5]160 AD[6]161 AD[7]162 WRZ163 RDZ164 ALE165 VDDP_165166 GND_166167 SCK168 SDI169 CSZ170 SDO171 SAR0172 SAR1173 SAR2174 SAR3175 PWM0176 PWM1177 DDCR_DA178 DDCR_CK179 DDCA_DA180 DDCA_CK181 INT182 IRIN183 VDDP_183184 GND_184185 VDDC_185186 GPIOB[4]187 GPIOB[5]188 GPIOB[6]189 NC_189190 NC_190191 PWM2192 PWM31
93
VD
DC
_193
19
4V
DD
P_194
19
5N
C_195
19
6N
C_196
19
7L
VA
3P1
98
LV
A3M
19
9L
VA
CK
P2
00
LVA
CK
M2
01
LV
A2P
20
2LV
A2M
20
3L
VA
1P2
04
LV
A1M
20
5L
VA
0P2
06
LV
A0M
20
7V
DD
P_207
20
8G
ND
_208
20
9N
C_209
21
0N
C_210
21
1L
VB
3P2
12
LV
B3M
21
3L
VB
CK
P2
14
LV
BC
KM
21
5L
VB
2P2
16
LV
B2M
21
7L
VB
1P2
18
LV
B1M
21
9L
VB
0P2
20
LV
B0M
22
1V
DD
P_221
22
2G
ND
_222
22
3G
PIO
E[3
]2
24
GP
IOE
[2]
22
5G
PIO
E[1
]2
26
GP
IOE
[0]
22
7IC
LK
22
8ID
E2
29
IHSY
NC
23
0IV
SY
NC
23
1D
I[0
]2
32
DI[
1]
23
3D
I[2
]2
34
DI[
3]
23
5V
DD
P_235
23
6D
I[4
]2
37
DI[
5]
23
8D
I[6
]2
39
DI[
7]
24
0V
DD
C_240
24
1G
ND
_241
24
2D
I[8
]2
43
DI[
9]
24
4D
I[1
0]
24
5D
I[1
1]
24
6D
I[1
2]
24
7D
I[1
3]
24
8H
WR
ESE
T2
49
XO
UT
25
0X
IN2
51
AV
DD
_MPL
L2
52
RX
BC
KN
25
3R
XB
CK
P2
54
AV
DD
_33_254
25
5R
XB
0N2
56
RX
B0P
10
0R
15
7
1KR231
0.1uFC172
3.3KR242
PWM0
MCLKZ
100 READYR192
AT24C64AN-10SU-2.724C64_normal
IC102
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
1MR148
MDATA[0-15]
ST_3.3V
AU
DIO
_L
4.7KR219
TMUE312GABSW100
1
2 4
3
5
RT1C3904-T112Q100
E
B
C
4.7KHD
R222
0.1uFC160
PWM_DIM
10K READYR215
0.1uFC108
SCL_Part
CO
MP_S
OU
ND
_R
100R202
10KR216
100R224
0READYR227
READYR241
DIMMING_CTL
MBW3216-501TFL100
22KR167
SCL_EEPROM
100R209
ST_3.3V
ST_5V
PC_B+
0.1
uF
C1
61
PC
_SO
UN
D_R
0 .1uFC169
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
4.7KR139
PC_G+
0R239
G_TX1+
2.2
uF
C1
42
IR
10
0R
15
5
PWM2
ST_3.3V
PWM3
SPI_CZ
2.2
uF
C1
51
0R
EA
DY
R1
77
3.3KR225
LDQM
PWM1
ST
_3
.3V
ST
_3
.3V
100R203
ST_3.3V
0.1uFC164
SC
L_T
UN
ER
SD
A_T
UN
ER
WEZ
0R237
22KR170
100R204
10uF16V
C173
0.1uFC139
READYR235
1N4148W100V
READY
D100
ST_3.3V
0.1uF16V
C138
0R240
ST_3.3V
0.1uFC170
FLASH_WP
0R101
ST_3.3V
PC_R+
3.3KR236
0.1uF50V
C105
4.7KR103
0R
EA
DY
R1
79
SD
A_E
EPR
OM
ST_3.3V
G_TX1-
B_TX0-
SIF_OUT
100R193 CEC
MX25L1605AM2C-15GIC803
3WP#
2SO
4GND
1CS#
5SI
6SCLK
7HOLD#
8VCC
2.5V_MST
SBA0
4.7uFC135
HWRESET
COMP_Y+
CEC_C
CASZ
0.1uFC165
100R106
SC
L_E
EPR
OM
LGE6991DD
FHD
IC100
1RXB1N
2RXB1P
3GND_3
4RXB2N
5RXB2P
6HPLUGB
7DDCDB_DA
8DDCDB_CK
9RXACKN
10RXACKP
11GND_11
12RXA0N
13RXA0P
14AVDD_33_14
15RXA1N
16RXA1P
17GND_17
18RXA2N
19RXA2P
20HPLUGA
21REXT
22DDCDA_DA
23DDCDA_CK
24HSYNC1
25VSYNC1
26VCLAMP
27REFP
28REFM
29BIN1P
30SOGIN1
31GIN1P
32RIN1P
33VCOM3
34BIN0P
35VCOM2
36GIN0P
37SOGIN0
38RIN0P
39AVDD_33_39
40GND_40
41HSYNC0
42VSYNC0
43VSYNC2
44BIN2P
45SOGIN2
46GIN2P
47RIN2P
48C1
49Y1
50C0
51Y0
52CVBS3
53CVBS2
54CVBS1
55VCOM1
56CVBS0
57VCOM0
58AVDD_33_58
59CVBSOUT1
60CVBSOUT0
61GND_61
62SIP0P
63AVDD_SIF
64SIF1P
65
SIF
M
66
GN
D_6
6
67
AU
VR
AD
N
68
AU
VR
AD
P
69
AU
VR
EF
70
AV
DD
_AU
71
AU
L0
72
AU
R0
73
AU
L1
74
AU
R1
75
AU
CO
M
76
AU
L2
77
AU
R2
78
AU
L3
79
AU
R3
80
AU
MO
NO
81
AU
OU
TL
3
82
AU
OU
TR
3
83
AU
OU
TL
2
84
AU
OU
TR
2
85
AU
OU
TL
1
86
AU
OU
TR
1
87
AU
OU
TL
0
88
AU
OU
TR
0
89
GP
IOF
[0]
90
GP
IOF
[1]
91
GP
IOF
[2]
92
GP
IOF
[3]
93
GP
IOF
[4]
94
GP
IOF
[5]
95
GP
IOF
[6]
96
GP
IOF
[7]
97
GP
IOF
[8]
98
GP
IOF
[9]
99
VD
DP
_99
10
0G
ND
_100
10
1V
DD
C_101
10
2D
QS
[1]
10
3M
DA
TA
[15]
10
4M
DA
TA
[14]
10
5G
ND
_105
10
6M
DA
TA
[13]
10
7M
DA
TA
[12]
10
8V
DD
M_1
08
10
9M
DA
TA
[11]
11
0M
DA
TA
[10]
11
1M
DA
TA
[9]
11
2M
DA
TA
[8]
11
3G
ND
_113
11
4V
DD
M_1
14
11
5M
DA
TA
[7]
11
6M
DA
TA
[6]
11
7M
DA
TA
[5]
11
8M
DA
TA
[4]
11
9V
DD
M_1
19
12
0M
DA
TA
[3]
12
1M
DA
TA
[2]
12
2M
DA
TA
[1]
12
3M
DA
TA
[0]
12
4D
QS
[0]
12
5L
DQ
M
12
6U
DQ
M
12
7M
VR
EF
12
8M
CL
KE
129 MCLKZ130 MCLK131 BADR[1]132 BADR[0]133 RASZ134 GND_134135 VDDM_135136 AVDD_MEMPLL137 CASZ138 WEZ139 MADR[0]140 MADR[1]141 MADR[2]142 MADR[3]143 MADR[4]144 MADR[5]145 MADR[6]146 MADR[7]147 VDDM_147148 GND_148149 VDDC_149150 MADR[8]151 MADR[9]152 MADR[10]153 MADR[11]154 AD[0]155 AD[1]156 AD[2]157 AD[3]158 AD[4]159 AD[5]160 AD[6]161 AD[7]162 WRZ163 RDZ164 ALE165 VDDP_165166 GND_166167 SCK168 SDI169 CSZ170 SDO171 SAR0172 SAR1173 SAR2174 SAR3175 PWM0176 PWM1177 DDCR_DA178 DDCR_CK179 DDCA_DA180 DDCA_CK181 INT182 IRIN183 VDDP_183184 GND_184185 VDDC_185186 GPIOB[4]187 GPIOB[5]188 GPIOB[6]189 NC_189190 NC_190191 PWM2192 PWM31
93
VD
DC
_193
19
4V
DD
P_194
19
5N
C_195
19
6N
C_196
19
7L
VA
3P1
98
LV
A3M
19
9L
VA
CK
P2
00
LV
AC
KM
20
1L
VA
2P2
02
LV
A2M
20
3L
VA
1P2
04
LV
A1M
20
5L
VA
0P2
06
LV
A0M
20
7V
DD
P_207
20
8G
ND
_208
20
9N
C_209
21
0N
C_210
21
1L
VB
3P2
12
LV
B3M
21
3L
VB
CK
P2
14
LV
BC
KM
21
5L
VB
2P2
16
LV
B2M
21
7L
VB
1P2
18
LV
B1M
21
9L
VB
0P2
20
LV
B0M
22
1V
DD
P_221
22
2G
ND
_222
22
3G
PIO
E[3
]2
24
GP
IOE
[2]
22
5G
PIO
E[1
]2
26
GP
IOE
[0]
22
7IC
LK
22
8ID
E2
29
IHSY
NC
23
0IV
SY
NC
23
1D
I[0
]2
32
DI[
1]
23
3D
I[2
]2
34
DI[
3]
23
5V
DD
P_235
23
6D
I[4
]2
37
DI[
5]
23
8D
I[6
]2
39
DI[
7]
24
0V
DD
C_240
24
1G
ND
_241
24
2D
I[8
]2
43
DI[
9]
24
4D
I[1
0]
24
5D
I[1
1]
24
6D
I[1
2]
24
7D
I[1
3]
24
8H
WR
ESE
T2
49
XO
UT
25
0X
IN2
51
AV
DD
_MPL
L2
52
RX
BC
KN
25
3R
XB
CK
P2
54
AV
DD
_33_254
25
5R
XB
0N2
56
RX
B0P
10
00
pF
C1
54
100R206
20pFC141
10
0R
EA
DY
R1
52
V_A
UD
IO_L
COMP_Pr+
DQS1
RS
232C
_R
XD
14.31818MHzX100
2.2
uF
C1
52
IF_A
UD
IO_O
UT
1KR218
4.7uF10V
C104
0.1uFC162
ST_3.3V
0.1uFC111
SPI_DI
SPI_DI
10KR217
AU
DIO
_R
RS
232C
_T
XD
ST_3.3V
0R238
10uF16V
C177
0.1uFC171
ST
_3
.3V
KEY1
RASZ
PA
NE
L_O
N
0 .01uF50V
C156
FL
ASH
_WP
ST_3.3V
CAT24C64WI-GT3
24C64_revis ion
IC102-*1
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
PC
_SO
UN
D_L
SDA_Part
0 READYR143
0.1uFC101
0.1
uF
C1
55
ST_3.3V
PC_HSYNC
PWM2
HW
RE
SET
2.2
uF
C1
43
10KR226
DSUB_SDA
0.1
uF
C1
58
0 .1uFC163
AMP_MUTE
SPI_CZ
0.1uFC167
DQS0
SDA_EEPROM
2.2
uF
RE
AD
YC
14
6
4.7K8BIT
R234
B_TX0+
0R
EA
DY
R1
68
2.5V_MST
SPI_CLK
PWM0
SPI_CLK
SBA1
0.1uFC166
0R
EA
DY
R1
78
0 .1uFC175
4.7KFHD
R223
4.7KPDP
R163
ST_3.3V
2.2
uF
C1
48
0 .1uFC174
4.7KR160
LCD
100R190
3.3KR244
COMP_Pb+
1000pFC176
PWM3
LED_AM1
HDMI_SCL
HDMI_SDA
R_TX2-
R_TX2+
10KREADYR249
10uF16V
C134
100R102
47R108
47R109
47R110
47R111
47R112
47READYR113
47R114
47R115
47R116
47R117
47 READYR118
47READYR119
47READYR120
47READYR121
47R122
47R123
47R124
47R125
47R126
47R127
47R128
47 READYR129
47 READYR130
22R141
22R142
10
0R
EA
DY
R1
49
10
0R
EA
DY
R1
50
10
0R
EA
DY
R1
58
10
0 RE
AD
YR
15
91
00
RE
AD
YR
16
11
00
RE
AD
YR
16
2
10
0R
EA
DY
R1
64
10
0R
EA
DY
R1
65
10
0R
EA
DY
R1
66
10
0R
EA
DY
R1
69
0R
17
1
0R
17
21
00
R1
74
10
0R
17
5
10
0R
17
6
10KR181
100 READYR182
100READYR183
100 READYR184
100R185
0R186
0R187
0R188
0R189
100 READYR191
100R195 READY
100R196
100R197
1KR198
100R199100R200
1KR201
100R229
100R230
100R243
100R246
0.047uFREADYC112
0.047uFREADYC114
0.047uF READYC115
0.047uFC116
0.047uFC117
0.047uFC118
0.047uFC119
0.047uFC120
0.047uFC121
0.047uFC122
0.047uFC124
0.047uFC125
0.047uFC126
0.047uFC127
0.047uF READYC128
0.047uFC129
0.047uFC130
0.047uFC131
0.047uFC132
1000pFREADYC113
1000pFC123
0.1uFC133
0.1uFC136
1u
FC
14
0
0.1
uF
C1
47
RE
AD
YR
25
0
RE
AD
YR
25
1
RE
AD
YR
25
2
RE
AD
YR
25
3
ST
_3
.3V
4.7K100Hz
R254
4.7Ksmall LCD
R255
4.7KREADY
R256
4.7KREADY
R257
ST_3.3V
0R258 READY
10KR259
4.7KR260
RT1C3904-T112Q101
E
B
C
ST_3.3V
DDC_CTL
0.1
uF
C1
37
4.7KR2474.7KR248
56AR100
56AR101
56AR102
0R261
0R262
33R207
33R208
10
0R
15
3
56R210
56R211
56R212
56R213
2.2uF 16VC103
MD
AT
A[1
4]
MADR[5]
MD
AT
A[4
]
MADR[3]
MADR[1]
MD
AT
A[3
]
MADR[11]
MD
AT
A[8
]
MD
AT
A[7
]
MD
AT
A[1
]
MADR[8]
MD
AT
A[9
]
MADR[7]
MD
AT
A[1
2]
MADR[2]
MADR[0]
MD
AT
A[1
0]
MD
AT
A[1
1]
MD
AT
A[6
]
MADR[10]
MD
AT
A[0
]
MD
AT
A[1
3]
MA
DR
[0-1
1]
MD
AT
A[1
5]
MADR[9]
MD
AT
A[2
]
MADR[4]
MD
AT
A[5
]
MADR[6]
RX
E3+
RX
E3-
RX
EC
+
RX
EC
-
RX
E2+
RX
E2-
RX
E1+
RX
E1-
RX
E0+
RX
E0-
RX
O3+
RX
O3-
RX
OC
+
RX
OC
-
RX
O2+
RX
O2-
RX
O1+
RX
O1-
RX
O0+
RX
O0-
BB3+H5
IF
H/W OPTION #2
CVBS
MSTAR LP81K
SWITCH & H/W RESET
LP81K
HDMI
1 9
<Mode Selection>
VGA
MSTAR
S_Video
COMP
2007/11/19
DDR SDRAM
<FLASH MEMORY>
DON’T USE(156,157)
H/W OPTION #1
H/W OPTION #3
H/W OPTION #4
H/W OPTION #5
(CONNECTED MPEG UART)
PStoPDF trial version. http://www.oakdoc.com