Laser Cleaner

eco Friendly / Non contact / Dry Cleaning

Cell : +82-31-8047-3400 E-mail : sales_imt@imt-c.co.kr

IMT Co. Ltd.

• Company Name : IMT Co., Ltd., Korea

• History : Established in 2000

• Capital : 2M USD

• Major Products: Dry Cleaning System & Module

• Core Competence : Laser & CO2 jet cleaning

• Engineering M/P : 2 Ph.D, 5 MS, total 30 Engineers

• Customers : Semiconductor and FPD industry

Organization

3

CEO

PlanningAccounting

R&D Lab.

ManufacturingCustomer

ServiceCO2

GroupLaserGroup

Over Sea Agents

• USA: Semiconductor Consultants• Japan: Samac• Taiwan: IMT Taiwan, TheLee, Scientech• China/HongKong: Quranus, EPIL, NTC • Philippine: OEM, Sungwoo• Singapore/Malaysia/Thailand: CTS, DigilogTech• Vietnam: IMT VINA, YSCM Global• Europe: EP Ants(DE)

Competence more than 40 Patents

Title Country Date Registered No.

Dry surface cleaning using laser induced shock wave Korea 2005-01-14 10-0467977

Method and Apparatus of dry surface cleaning Korea 2004-12-14 10-0463212

Dry surface cleaning method Korea 2002-03-04 10-0328620

Dry cleaning apparatus Korea 2002-07-31 10-0348701

Dry surface cleaning method and apparatus Korea 2003-03-05 10-0376398

Apparatus of plasma surface treatment Korea 2003-11-18 10-0407600

Method and apparatus of plasma cleaning Korea 2005-05-04 10-0489596

Dry surface cleaning apparatus using laser induced shock wave Korea 2004-08-13 10-0445607

Dry surface cleaning apparatus using laser Korea 2004-10-21 10-0455059

Remote cleaning apparatus using laser beam Korea 2005-01-04 10-0466138

Method and apparatus of patterned mask cleaning using laser Korea 2005-04-27 10-0487834

Laser articulated arm system Korea 2005-05-03 10-0489306

Apparatus of laser cleaning using scanning method Korea 2005-06-22 10-0498582

Method and apparatus of dry cleaning of image sensor Korea 2006-10-20 10-0639402

Laser induced shock wave cleaning apparatus Korea 2005-05-06 10-0489853

Laser patterning apparatus for laser patterning for OLED fabrication Korea 2007-01-09 10-0669080

Dry cleaning system using laser Korea 2008-01-18 10-0797787

Mobile dry cleaning apparatus Korea 2007-04-10 10-0708230

Method and apparatus of dry cleaning Korea 2009-01-13 10-0879616

Dry surface cleaning apparatus Korea 2009-02-11 10-0884253

Surface protection apparatus for laser shock cleaning Korea 2009-07-03 10-0907276

Dry surface cleaning method and apparatus using laser USA 2003-10-21 U S6,635,845 B2

Dry surface cleaning method and apparatus using laser Japan 2006-03-03 3776820

Dry surface cleaning method and apparatus using laser Taiwan 2003-11-24 182690

Apparatus of dry cleaning USA 2004-05-11 US 6,734,388 B2

Business Area

• FAB: Wafer backside, Probe card …

• PKG: Ring-framed wafer, Test socket …Semicon

• OLED: RGB mask, Acryl mask, Transfer film, Contact pad …Display

• Mobile Phone: Glass, FPCB…

• Mold: Injection/rubber/glass/roll molds …Etc

1. Direct Laser Cleaning (DLC)

Shoot suitable laserTo target

Surface contaminants areRemoved by laser

Reflection at metal layerAfter removing contaminants

Dry cleaning technique which removes contaminants selectively from

the surface by inducing a proper laser-contaminants interactions.

Video Clip – Laser Cleaning

Advantage of Laser cleaning

1. Precise cleaning

: Selective removal of contamination only

2. Dry and Safe Cleaning

: No chemical agent, Environment friendly

3. Remote & Non Contact Cleaning

: Flexible & No mechanical load

4. Fast & Simple Cleaning

: No post-cleaning process and simple system

Dry cleaning technique to remove the contaminants on the surfaces using laser-induced

plasma shock waves (multi-photon ionization)

Applications: Tiny particle removal (< 1 um)

2. Laser Shock Cleaning (LSC)

Cleaning condition:

Shock wave force > Adhesion force

* IMT patent process

Particles Wafer

Working Table

Pulsed Laser

BeamShock Wave Front

Particles

Gap

Laser irradiation 1 mm

1.5 ~ 4.7 s

Moving Picture

Shockwave propagation onto wafer

Laser Cleaner

11

600MV 800MV 200T 400S 400PM

20P 100P Semi AutoDe capsulation PKG mold Auto

Mobile Laser Cleaner Specification

12

Model Name 20P 100P 600MV 800MV

M/C Type Mobile & Manual cleaning

Cleaning Target Metal Tray / Mold / Rust Final Test Sockets (BGA & TSOP & Rubber & RF etc)

Cleaning Laser IMT made DLC laser

Laser Beam Max. 20W Max. 100W Max. 300mJ/pulse, Max. 5Hz Max. 400mJ/pulse, Max. 10Hz

Dimension 400L x 500W x 600H mm 610L x 530D x 890H mm 650L x 320W x 680H mm 1200L x 320W x 1050H mm

Weight Approx. 30 Kg Approx. 70 Kg Approx. 110 Kg Approx. 170 Kg

Utilities 220VAC, 50/60Hz, 1 Phase, 20A

Consumables Protect window Lamp / Water filter / Window

Application - Test Socket

13

BGA type

TSOP type

Application - Probe Card

14

Application

15

OLED Mask Semiconductor Parts

De-capsulation De-flashing

16

Application – PKG Mold

PKG mold Cavity

Before Cleaning After Cleaning

Metal Tray

Before Cleaning After Cleaning

Application – PKG Mold Auto

17

Application – Rust / Metal Mold

18

Rust (녹) Rubber mold

Application – Automotive / Boiler Parts

19

Application – Heavy Industry / High power Laser 1KW

20

Major Customer

21

22