l2 moto g (3rd generation) global service and repair manual v2.0

8/17/2019 L2 Moto G (3rd Generation) Global Service and Repair Manual V2.0

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Moto G

(3rd Generation)

Moto G (3rd Generation)

Level 2 – Service and Repair Manual


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Moto G (3rd Generation)Level 2 – Service and Repair Manual

REVISION HISTORY

Revision Date Notes

1 06/02/2015 Initial release.

2 06/19/2015

• Removed Callisto Lens Adhesive Heating Plate (4-00-Y8-10000) and 7”x7” HotPlate (4-00-Z2-10000 / 4-00-Z3-10000) from Tools Required for Disassembly.

• Removed Pre-Heat Option A from Display Removal (With Display RemovalFixture).

• Revised title of Pre-Heat Method B to “Display Pre-Heat Option” in DisplayRemoval (With Display Removal Fixture).

• Changed Generic Lens Removal Fixture (4-00-X2-10000 / 4-00-X7-10000) settemperature from 100 °C to 110 °C.

• Revised Final Press Pre-Heat Method A to use the Generic Lens RemovalFixture (4-00-X2-10000 / 4-00-X7-10000) and bottom plate of Callisto Lens

Removal Fixture (4-00-Y2-10000).• Added Option Pre-Heat Method C to Final Press.

• Added Callisto Pre-Heat Fixture (4-00-Y8-10000) to Tools Required for Assembly.

Motorola Mobility Confidential Restricted:

PAGE 2 Do not share without consent from Motorola


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TABLE OF CONTENTS Revision History ............................................................................................................................................................ 2

Table of Contents .......................................................................................................................................................... 3

List of Tables ................................................................................................................................................................. 6

Table of Figures ............................................................................................................................................................ 6

Safety Information ........................................................................................................................................................ 7

Cautions and Warnings ................................................................................................................................................. 7

Electrostatic Discharge ........................................................................................................................................................................................... 7

Battery Safety Guidelines .............................................................................................................................................. 7

Introduction ................................................................................................................................................................... 8

External Views .............................................................................................................................................................. 8

PSCD Gaps.................................................................................................................................................................. 10

Exploded Views ........................................................................................................................................................... 15

Disassembly and Recovery ........................................................................................................................................ 19

Disassembly and Recovery Map .................................................................................................................................. 19

Tools Required for Disassembly .................................................................................................................................. 20

Rear Cover Removal .................................................................................................................................................... 22

Water Detection Label Inspection ................................................................................................................................ 23

Display Removal (With Display Removal Fixture) .......................................................................................................... 24

Lens Removal Fixture Setup ................................................................................................................................................................................. 24

Pre-Heat Option ...................................... ..................................... ..................................... ...................................... ..................................... ......... 25

Display Removal ................................................................................................................................................................................................... 26

Display Removal (Damaged Display Lens Only) ........................................................................................................... 29

Speaker Bezel Removal ............................................................................................................................................... 31

Front-Facing Imager Gasket Removal .......................................................................................................................... 32

PCB Removal .............................................................................................................................................................. 33

Jumper Flex Removal .................................................................................................................................................. 35

Daughter Board Removal ............................................................................................................................................ 36

Front-Facing Imager Removal ..................................................................................................................................... 38

Rear-Facing Imager Removal ...................................................................................................................................... 39

Earpiece Speaker Removal .......................................................................................................................................... 40

Main-Microphone Gasket Removal .............................................................................................................................. 41

Top Frame Removal .................................................................................................................................................... 42

Bottom Frame Removal ............................................................................................................................................... 43

Loudspeaker Removal ................................................................................................................................................. 44

Loudspeaker Pad Removal .......................................................................................................................................... 45

USB Module Removal .................................................................................................................................................. 46

Battery Removal .......................................................................................................................................................... 48

Headset Jack Removal ................................................................................................................................................ 50




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Rear-Facing Imager Bezel Removal ............................................................................................................................. 51

Rear-Facing Imager Gasket Removal........................................................................................................................... 52

Rear-Facing Imager Lens Removal .............................................................................................................................. 53

Rear-Facing Imager Deco Ring Removal ..................................................................................................................... 54

Secondary-Microphone Gasket Removal ..................................................................................................................... 55

Snap Seal Removal ..................................................................................................................................................... 56

Vent Hole Pad Removal ............................................................................................................................................... 57

Jumper-Flex Pad Removal .......................................................................................................................................... 58

Speaker Pad Removal ................................................................................................................................................. 59

Side-Key Button Seal Removal .................................................................................................................................... 60

Side Key Removal ....................................................................................................................................................... 61

Parts Refresh .............................................................................................................................................................. 62

Tools Required for Parts Refresh ................................................................................................................................. 62

Housing Cleaning ........................................................................................................................................................ 63

PCB Cleaning .............................................................................................................................................................. 64

Battery Cleaning.......................................................................................................................................................... 67

Daughter Board Cleaning ............................................................................................................................................ 68

USB Module Cleaning .................................................................................................................................................. 69

Assembly ..................................................................................................................................................................... 71

Assembly Map ............................................................................................................................................................ 71

Tools Required for Assembly ....................................................................................................................................... 72

Rear-Facing Imager Deco Ring Assembly .................................................................................................................... 76

Rear-Facing Imager Lens Assembly ............................................................................................................................ 77

Rear-Facing Imager Bezel Assembly ........................................................................................................................... 78

Housing Seal Assembly ............................................................................................................................................... 79

Rear-Facing Imager Gasket Assembly ......................................................................................................................... 82

Secondary-Microphone Gasket Assembly .................................................................................................................... 83

Jumper-Flex Pad Assembly ......................................................................................................................................... 84

Speaker Pad Assembly ................................................................................................................................................ 85

USB Module Assembly ................................................................................................................................................ 86

Headset Jack Assembly .............................................................................................................................................. 89

Battery Assembly ........................................................................................................................................................ 91

Loudspeaker Pad Assembly ........................................................................................................................................ 95

Loudspeaker Assembly ............................................................................................................................................... 97

Top Frame and Bottom Frame Assembly ..................................................................................................................... 99

Front-Facing Imager Assembly .................................................................................................................................. 105

Front-Facing Imager Gasket Assembly ...................................................................................................................... 106

Rear-Facing Imager Assembly ................................................................................................................................... 107

Light Diffuser Assembly ............................................................................................................................................ 108




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Main-Microphone Gasket Assembly .......................................................................................................................... 109

Daughter Board Assembly ......................................................................................................................................... 110

Jumper Flex Assembly .............................................................................................................................................. 112

Water Detection Label Assembly ............................................................................................................................... 113

PCB Assembly ........................................................................................................................................................... 114

Speaker Bezel Assembly ........................................................................................................................................... 117

Final Press ................................................................................................................................................................ 126

Press Setup ........................................................................................................................................................................................................ 126

Pre-Heat Method A ............................................................................................................................................................................................. 127

Pre-Heat Method B ............................................................................................................................................................................................. 128

Optional Pre-Heat Method C ............................................................................................................................................................................... 129

Phone Press ....................................................................................................................................................................................................... 130

USB Module Cover Assembly .................................................................................................................................... 131

Side Key Assembly .................................................................................................................................................... 132

Rear Cover Assembly ................................................................................................................................................ 134




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LIST OF TABLES Table 1. External Views Parts List ................................................................................................................................... 9

Table 2. PSCD Gap Measurements ................................................................................................................................ 14

Table 3. Exploded View Parts List .................................................................................................................................. 15

Table 4. Subassembly Exploded View Parts List ............................................................................................................ 17

TABLE OF FIGURES Figure 1. External Views.................................................................................................................................................. 8

Figure 2. PSCD Front View ............................................................................................................................................ 10

Figure 3. PSCD Rear View ............................................................................................................................................. 11

Figure 4. PSCD Side View ............................................................................................................................................. 12

Figure 5. Display Alignment .......................................................................................................................................... 13

Figure 6. Assembly Exploded View ................................................................................................................................ 15

Figure 7. Subassembly Exploded View .......................................................................................................................... 17




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SAFETY INFORMATION

Cautions and Warnings

Electrostatic Discharge

The phone components may be damaged by electrostatic discharge (ESD). Always use an ESD mat and ground strapwhen working with internal components.

Battery Safety Guidelines

Handle Battery with care. Ensure Battery edges and surfaces are not dented or deformed. If the Battery Pack is droppedto the floor, it may be internally damaged and must be scrapped.

Ensure all surfaces, fixtures, and phone components contacting the Battery are smooth and clean.

• Ensure Battery and its insulation are not damaged (e.g. scratched, dented, punctured) prior to and throughoutassembly.

• Prior to assembly, ensure Battery edges and surfaces are not dented or deformed, and that fixtures and parts that

will contact the Battery are free of foreign material.

• Ensure screws and screwdrivers do not contact the Battery.

• Failure to adhere to Safety Critical Note(s) may increase risk of rupture, burning, or failure to function safely whenused by the customer.




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INTRODUCTION

External Views

Figure 1. External Views




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Table 1. External Views Parts List

Reference # Description

1 Earpiece Speaker

2 Front-Facing Imager

3 Main Display

4 Display Bezel

5 Loudspeaker

6 Power Key

7 Volume Key

8 Housing

9 Rear-Facing Imager

10 Rear-Facing Imager Deco Ring

11 Flash

12 Rear-Facing Imager Bezel

13 Motorola Logo

14 Rear Cover

15 Headset Jack

16 Secondary Microphone

17 USB Port




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PSCD Gaps

All dimensions are in millimeters (mm). The following gaps are considered maximum allowable without further approvalfrom a supervisor. Measure gaps at an angle perpendicular to the surface/area being measured. Feeler Gauges mustnot be used at an angle as they will give false-positive results.

Figure 2. PSCD Front View




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Figure 3. PSCD Rear View




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Figure 4. PSCD Side View




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Figure 5. Display Alignment




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Table 2. PSCD Gap Measurements

Reference # Description

1 Earpiece Bezel to Main Lens Perimeter

2 Earpiece Bezel to Main Lens (Recess) Perimeter

3 Front-Facing Imager Eye to Main Lens Artwork Concentricity

4 Main Lens to Front Housing Perimeter

5 Main Lens to Front Housing Recess (Left and Right)

6 Loudspeaker Bezel to Main Lens (Recess) Perimeter

7 Loudspeaker Bezel to Main Lens Perimeter

8 Main Lens to Front Housing Recess (Top and Bottom)

9 Rear-Facing Imager Eye to Camera Lens Artwork Concentricity

10 Trim Ring to Camera Bezel Perimeter

11 Camera Lens to Trim Ring Perimeter

12 Flash Lens to Camera Bezel Perimeter

13 Camera Bezel to Rear Cover Perimeter

14 Camera Bezel to Rear Cover Step

15 Motorola Logo (tips of “M”) to Side of Rear Cover Rotation

16 Power Key to Front Housing Perimeter

17 Volume Key to Front Housing Perimeter

18

Rear Cover to Front Housing (Top, Bottom, and Sides)

Rear Cover to Front Housing (In radius of 4 Corners)

19 Rear Cover to Front Housing Step

20 Lens Viewing Area Alignment (Horizontal)

21 Lens Viewing Area Alignment (Vertical)




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Exploded Views

Figure 6. Assembly Exploded View

Table 3. Exploded View Parts List

Reference # Description Recovery Part

1 ASSY,DISP,DISPLAY-LENS,BLACK PRODN ASSY,DISP,DISPLAY-LENS,WHITE PRODN

YES

2

ASSY,PCB,MN XCVR APAC UMTS DS 16GB ASSY,PCB,MN XCVR LATAM UMTS DS 16GB (Brazil, Mexico) ASSY,PCB,MN XCVR LATAM DS DTV (Brazil) ASSY,PCB,MN XCVR LATAM UMTS DS (Brazil, Colombia) ASSY,PCB,MN XCVR APAC UMTS DS ASSY,PCB,MN XCVR LATAM DS DTV 16GB (Brazil) ASSY,PCB,MN XCVR NORTH AMERICA UMTS SS 16GB ASSY,PCB,MN XCVR NORTH AMERICA UMTS SS

ASSY,PCB,MN XCVR TMOB (TMO) UMTS SS ASSY,PCB,MN XCVR EUROPE UMTS SS ASSY,PCB,MN XCVR LATAM UMTS SS (Brazil, Chile) ASSY,PCB,MN XCVR VZW CDMA SS ASSY,PCB,MN XCVR VZW CDMA SS 16GB ASSY,PCB,MN XCVR LATAM UMTS SS 16GB (Brazil)

YES

2.1 PAD,SPEAKER, BOT NO




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3

ASSY,HSG,ASSEMBLY, BCK HSG BLACK ASSY,HSG,ASSEMBLY, BCK HSG WHITE ASSY,HSG,ASSEMBLY, BCK HSG SS BLACK ASSY,HSG,ASSEMBLY, BCK HSG SS WHITE

YES

4 ASSY,HSG,BATTERY COVER LIC ASSY,HSG,BATTERY COVER CHALK

YES

5 DIE CUT,ADHESIVE, LENS NO

6BZL,EARPIECE, DARKBZL,EARPIECE, BRIGHT

NO

7BZL,SPEAKER, DARKBZL,SPEAKER, BRIGHT

NO

8 SCREW,THREAD FORMING (M1.2 L=4.2) NO

9 SCREW (YELLOW ZINC PLATING) NO

10 SUPPORT,FRAME,TOP AUDIO YES

11 DIE CUT,ADHES,FRAME, TOP AUDIO NO

12 SUPPORT,FRAME,BOTTOM AUDIO YES

13 DIE CUT,ADHES,FRAME, BOTTOM AUDIO NO

14 SEAL,MIC 1 NO

15 ASSY,HSG,CAMERA, 5M, KT LENS YES

16 TRANSDUCER,OTHR,.566V,W/ ADHES AND LINER NO

17 ASSY,HSG,CAMERA, 13MP YES

18 ASSY,HSG,FLEX, JMPR YES

19TRANSDUCER,OTHR,2V,LOUDSPEAKER, 8OHM, 3.65 X 12 X 17MM, IP67,IN"

NO

20 DIE CUT,ADHESIVE, DAUGHTER PCB NO

21 ASSY,PWA,DEV DAUGHTER BRD 2 SIM ASSY,PWA,DAUGHTER BRD 1 SIM

YES

22 SCR,SCREW, MACHINE, DAUG PCB (GREEN ZINC PLATING) NO

23BZL,BEZEL, CAMERABZL,BEZEL, CAMERA

NO

24 LBL,IMEI NO

25 ASSY,BAT,LI POLY,FC40,SONY 2600MAH YES

26 DIE CUT,ADHES,USB PCB 1 NO

27 ASSY,PWA,USB PCB MN BRD YES

28 DIE CUT,ADHES,USB PCB 2 NO

29 SPRT,FRM,METAL, USB PCB YES




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Figure 7. Subassembly Exploded View

Table 4. Subassembly Exploded View Parts List


3.1 PAD,PORON,JUMPER FLX BUCKET NO

3.2 PAD,SNAP HSG SEAL NO

3.3 PAD,PRESSURE VENT WHT PE8-0306 NO

3.4 SEAL,MIC 2 NO

3.5 DIE CUT,ADHES,BAT NO

3.6 SEAL, BUTTON NO

NA PLATE, BUTTON BACKER NO

NA SCREW, MACHINE 4IP NO

3.7 MAG, FRNT HOUSING,DVX NO

3.8 CONT,SPKR NO

3.9 PAD,PAD, SPKR BACKER NO

3.10 BZL,CAMR RING NO

3.11 LENS,CAMR ADHES NO

3.12BTN,PWR, DARKBTN,PWR BRT CHRM

YES

3.13BTN,VOLUME, DARKBTN,VOLUME,BRIGHT CHRM

YES




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4.1SEAL, SIM #1SEAL, SIM #1

NO

4.2SEAL, SIM #2SEAL, SIM #2

NO




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DISASSEMBLY AND RECOVERY

Disassembly and Recovery Map

Rear-FacingImager Bezel

Rear Cover

Battery

Main-

Microphone

Gasket

Lousdpeaker

BezelDisplayEarpiece Bezel

Headset Jack

Gasket

LoudspeakerPad

USB Module

Cover

PCB

Side Keys

Secondary-

Microphone

Gasket

Rear-Facing

Imager Gasket

Rear-Facing

Imager Lens

Rear-Facing

Imager Deco

Ring

BottomFrame Loudspeaker

DaughterBoard

Adhesives

Earpiece

Speaker Top Frame

Front-Facing

Imager

Rear-Facing

Imager

Side-Key

Button SealsSpeaker Pad

Jumper-Flex

PadSnap Seals

Jumper Flex

Front-Facing

Imager Gasket

Light Diffuser

Headset JackBattery

Adhesive

Daughter

Board

Top Frame

Adhesive

BottomFrame

Adhesive

Side-Key

Button-Seal

RetentionBracket

USB Module

PCB

USB Module

Adhesive

USB Module

Frame

USB Module

Frame Adhesive

Display

AdhesiveVent-Hole Pad

*Shaded parts may be eligible for parts recovery.




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Tools Required for Disassembly

The following tools are required to disassemble the Moto G (3rd Generation) phone.

Description Part # Picture / Drawing

Generic Lens Removal Fixture*

4-00-X2-10000(220V) /4-00-X7-10000(115V)

Vacuum O-Ring**4-00-A2-10000

(19506580)

Callisto Lens Removal Fixture 4-00-Y2-10000

Oven(optional - for reduction of process time)

--

Heat Gun (optional) --




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Blackstick --

4IP Torx Bit --

Thin Plastic Spudger 0-00-00-40826

Stainless Steel Dental Pick --

Tweezers (Plastic or Plastic-Tipped) -- --

Tweezers (Metal) -- --

ESD Mat and Wrist Strap -- --

Gloves or Finger Collets -- --

Isopropyl (ISP) Alcohol -- --

*Generic Lens Removal Fixtures 4-00-X2-10000 and 4-00-X7-10000 are identical tools. The only difference is thevoltage rating. Either the 220V 4-00-X2-10000 or the 115V 4-00-X7-10000 can be used with the Callisto Lens RemovalFixture (4-00-Y2-10000).

**Sets of 5 Vacuum O-Rings (19506580) are available under the package part number 4-00-A2-10000.




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Rear Cover Removal

NOTE

The Rear Cover can be recoveredand reused after removal.

1. Starting at the cutout near the USB Connector,use a fingernail to release the Rear Cover snapsfrom the Housing.

2. Continue to release the Rear Cover snapsaround the edges of the phone.

3. After the Rear Cover snaps have been released,lift the Rear Cover towards the top of theassembly to remove it from the Housing.




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Water Detection Label Inspection

Inspect the Water Detection Label (WDL) visiblethrough the opening next to the SIM slot, to verifyit is correctly placed and inspect it for signs ofactivation.




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Display Removal (With Display Removal Fixture)

Lens Removal Fixture Setup

NOTE

If the controller on the Generic Lens RemovalFixture must be adjusted, see the user manual onpage 137.

// CAUTION //

If the Display Lens is damaged, continue toDisplay Removal (Damaged Display Lens Only)

on page 29. Do not use the Display Removal(With Display Removal Fixture) procedure if theDisplay Lens is damaged.

NOTE

Pre-Heat Option A and Pre-Heat Option B areoptional procedures that may be used to reduce

the Display Removal process time.

1. Verify that the Vacuum O-ring (4-00-A2-10000) ispositioned in the Generic Lens Removal Fixture(4-00-X2-10000/4-00-X7-10000) as shown.

NOTE

The Generic Lens Removal Fixture vacuum willnot perform correctly if the Vacuum O-ring is not inposition.

2. Place the Callisto Lens Removal Fixture(4-00-Y2-10000) into the Generic Lens RemovalFixture.

3.

Press the black power switch (not shown) on theback of the Generic Lens Removal Fixture to turnthe fixture ON.

4. Turn the vacuum knob (circled) clockwise until itstops.

5.

Wait 5-10 minutes for the Generic Lens RemovalFixture to warm up to 110 °C (230 °F).

// CAUTION //

Damage to the assembly may occur if the GenericLens Removal Fixture is not warmed up to

operating temperature before use.




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Pre-Heat Option

1.

Pre-heat the Oven to 70 °C (158 °F).

// CAUTION //

If the Oven is not available or not appropriate, skipto Display Removal on page 26.

2. Place the phone in the Oven.

// CAUTION //

Do not set the Oven temperature higher than70 °C (158 °F). Damage to the phone may occur.

3. Wait 25 minutes for the Display to warm up.

4. Remove the phone from the Oven.

// CAUTION //

Wear protective gloves when handling heatedphones.

5. Continue to Display Removal on page 26.

NOTE

For phones with a damaged Display Lens,continue to Display Removal (Damaged DisplayLens Only)on page 29.




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Display Removal

NOTE

The Display can be recovered andreused after removal.

1. Place the phone in the Callisto Lens RemovalFixture with the Display facing down and theHeadset Jack facing the front of the fixture.

2. Press down on the Callisto Lens RemovalFixture and press the red button to turn on thevacuum pump.

3. Hold the Callisto Lens Removal Fixture downuntil the gauge (circled) reaches -60 kPa. Whenthe gauge reaches -60 kPa, remove your handfrom the Callisto Lens Removal Fixture.




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4. Wait for the Callisto Lens Removal Fixture tospring up.

NOTE

The lid on the Generic Lens Removal Fixture is

spring loaded, and will automatically open whenthe Display is separated from the Housing.

5. Press the red button to turn off the vacuumpump.

6. Turn the vacuum knob counter-clockwise torelease the vacuum.

7. Remove the phone from the Callisto Lens

Removal Fixture.

// CAUTION //

Wear protective gloves when handling heatedparts.

8. Use the Thin Plastic Spudger to separate theremaining adhesive from the USB side of thephone.

// CAUTION //

Do not insert the Thin Plastic Spudger deeperthan 1 mm. Deeper insertion may separate theDisplay and Lens and cause damage.




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9. Use the Tweezers to remove the Kapton® Tapefrom the Display Flex ZIF Connector Door.

NOTE

After you remove the Kapton Tape, you

cannot reuse it.

10. Use the Blackstick to open the Display Flex ZIFConnector Door.

11. Slide the Display Flex free from the ZIFConnector.

// CAUTION //

Do not damage the Display Flex.

12.

Verify that the Display Flex is disconnected andthat no other connection exists between theDisplay and the phone assembly.

13. Lift the Display out of the Housing.




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Display Removal (Damaged Display Lens Only)

NOTE

The phone may be pre-heated before Display

removal. See Optional Pre-Heat on page 25 forpre-heating instructions.

1. Slide the Thin Plastic Spudger into the gapbetween the Display and the Housing.

// CAUTION //

This procedure should only be performed if theDisplay Lens is damaged.

2. Move the Thin Plastic Spudger around the edgeof the Display to free the adhesive.

// CAUTION //

Do not insert the Thin Plastic Spudger deeperthan 1 mm. Deeper insertion may separate theDisplay and Lens and cause damage.

NOTE

While moving the Thin Plastic Spudger around theDisplay, insert a shim or Thin Plastic Spudgerbetween the separated edges to prevent theDisplay from re-adhering to the Housing.

3.

When the adhesive has been freed, slightly liftthe Display from the Housing.

// CAUTION //

To avoid damage to the Display Flex, do not liftthe Display any higher than necessary todisconnect the Display Flex.




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4. Use the Tweezers to remove the Kapton® Tapefrom the Display Flex ZIF Connector Door.

NOTE

After you remove the Kapton Tape, you

cannot reuse it.

5. Use the Blackstick to open the Display Flex ZIFConnector Door.

6. Slide the Display Flex free from the ZIFConnector.

// CAUTION //

Do not damage the Display Flex.

7.

Verify that the Display Flex is disconnected andthat no other connection exists between theDisplay and the phone assembly.

8. Lift the Display out of the Housing.




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Speaker Bezel Removal

1. Use the flat end of the Blackstick and ISP Alcohol to remove the Earpiece Speaker Bezel(1) from the Display.

NOTE

After you remove the Earpiece SpeakerBezel, you cannot reuse it.

2. Use the flat end of the Blackstick and ISP Alcohol to remove the Loudspeaker Bezel (2)from the Display.

NOTE

After you remove the Loudspeaker Bezel,you cannot reuse it.

1

2




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Front-Facing Imager Gasket Removal

Use the Tweezers to remove the Front-FacingImager Gasket.

NOTE

After you remove the Front-FacingImager Gasket, you cannot reuse it.

NOTE

Remove the Front-Facing Imager Gasket only ifthe Front-Facing Imager will be reused. If theFront-Facing Imager will be replaced, skip thisstep.




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PCB Removal

NOTE

The PCB can be recovered andreused after removal.

1. Remove the 10 4IP Machine Screws from thePCB.

NOTE

After you remove the 4IP MachineScrews, you cannot reuse them.

NOTE

Use the Tweezers or Blackstick to remove anyDisplay Adhesive covering the screws andpreventing removal.

2. Remove the 4 4IP Thread-Forming Screws fromthe PCB.

NOTE

After you remove the 4IP Thread-FormingScrews, you cannot reuse them.

NOTE

Use the Tweezers or Blackstick to remove anyDisplay Adhesive covering the screws andpreventing removal.

3. Verify that all screws are removed from the PCB.




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4. Use the flat end of the Blackstick to lift the keyside of the PCB from the location shown.

5.

Lift the key side of the PCB and rotate the PCBto the Display Flex side of the assembly.

// CAUTION //

Do not lift the Display Flex side of the PCB. Liftingthe Display Flex side of the PCB may damage theBattery Connector.

6. Use the Plastic Tweezers to disconnect theBattery.




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Jumper Flex Removal

NOTE

The Jumper Flex can be recoveredand reused after removal.

1. Use the Tweezers to remove the Kapton tapefrom the Jumper Flex ZIF Connector.

NOTE

After you remove the Kapton Tape, youcannot reuse it.

2. Use the flat end of the Blackstick to open theJumper Flex ZIF Connector door.

3. Remove the Jumper Flex from the connector.




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Daughter Board Removal

NOTE

The Daughter Board can berecovered and reused after removal.

1. Remove the 3 4IP Machine Screws from theDaughter Board.

NOTE

After you remove the 4IP MachineScrews, you cannot reuse them.

2. Verify that all 4IP Machine Screws are removedfrom the Daughter Board.

3.

Insert the flat end of the Blackstick between theDaughter Board and the PCB shield in thelocation shown.

4. Rotate the Blackstick to disengage the DaughterBoard BtB Connector and Daughter Board Adhesive.

// CAUTION //

Do not rotate the Blackstick any farther thannecessary to disconnect the Daughter Board BTBConnector. The Daughter Board may flex

excessively and become damaged.

5. Insert the flat end of the Blackstick between theDaughter Board and the PCB shield in thelocation shown.

6. Rotate the Blackstick to separate the DaughterBoard Adhesive from the PCB.

// CAUTION //

Do not rotate the Blackstick any farther than

necessary to separate the Daughter Board Adhesive. The Daughter Board may flexexcessively and become damaged.




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7. Lift the Daughter Board from the PCB.




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Front-Facing Imager Removal

NOTE

The Front-Facing Imager can berecovered and reused after removal.

1. Use the flat end of the Blackstick to disengagethe Front-Facing Imager BtB Connector.

// CAUTION //

When lifting the Front-Facing Imager BtBConnector, leverage the Blackstick against thePCB at the location shown. Damage to the Front-Facing Imager or PCB may occur if the Blackstickis leveraged against any other area.

2.

Remove the Front-Facing Imager from the TopFrame.




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Rear-Facing Imager Removal

NOTE

The Rear-Facing Imager can berecovered and reused after removal.

1. Use the Tweezers to remove the Kapton tapefrom the Rear-Facing Imager ZIF Connector.

NOTE

After you remove the Kapton Tape, youcannot reuse it.

2. Use the flat end of the Blackstick to open theRear-Facing Imager ZIF Connector door.

// CAUTION //When opening the Rear-Facing Imager ZIFConnector door, leverage the Blackstick againstthe PCB at the location shown. Damage to theRear-Facing Imager or PCB may occur if theBlackstick is leveraged against any other area.

3. Lift the Rear-Facing Imager from the retainingtabs and remove it from the connector.




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Earpiece Speaker Removal

Use the Thin Plastic Spudger to pry the EarpieceSpeaker out of the Top Frame.

NOTE

After you remove the EarpieceSpeaker, you cannot reuse it.




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Main-Microphone Gasket Removal

Use the Tweezers to remove the Main-MicrophoneGasket from the Bottom Frame.

NOTE

After you remove the Main-MicrophoneGasket, you cannot reuse it.




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Top Frame Removal

NOTE

The Top Frame can be recovered andreused after removal.

1. Use the Thin Plastic Spudger to separate theTop Frame Adhesive from the PCB at thelocations shown.

// CAUTION //

Do not damage the Top Frame when removing itfrom the PCB.

2. After the Top Frame Adhesive is separated, liftthe Top Frame from the PCB.




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Bottom Frame Removal

NOTE

The Bottom Frame can be recoveredand reused after removal.

1. Use the Thin Plastic Spudger to separate theBottom Frame Adhesive from the PCB at thelocations shown.

// CAUTION //

Do not damage the Bottom Frame when removingit from the PCB.

2. After the Bottom Frame Adhesive is separated,lift the Bottom Frame from the PCB.




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Loudspeaker Removal

Use the flat end of the Blackstick to pry theLoudspeaker from the PCB at the contact side ofthe Loudspeaker.

NOTE

After you remove the Loudspeaker, youcannot reuse it.




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Loudspeaker Pad Removal

Use the Tweezers and ISP Alcohol to removethe Loudspeaker Pad from the PCB.

NOTE

After you remove the Loudspeaker Pad,you cannot reuse it.




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USB Module Removal

NOTE

The USB Module and USB ModuleCover can be recovered and reused

after removal.

1. Remove the 3 4IP Screws from the USB ModuleCover.

NOTE

After you remove the 4IP Screws, youcannot reuse them.

=

2. Remove the USB Module Cover from theHousing.

3.

Use the Heat Gun to heat the USB Module to amaximum temperature of 49 degrees Celsius(120 degrees Fahrenheit) for 2 minutes. TheHeat Gun must be held approximately 4 in. (10cm) from the USB Module and Housing.




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4. From the inside of the Housing, use the pointedend of the Blackstick to push the USB Moduleout of the Housing.

// CAUTION //

Do not damage the USB Module pins.




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Battery Removal

/// WARNING ///

Failure to adhere to Safety Critical Note(s) may increaserisk of rupture, burning, or failure to function safely when

used by the customer. Refer to the Battery SafetyGuidelines.

// CAUTION //

Handle the Battery Pack with care. If dropped to thefloor, it may be internally damaged and must be

scrapped.

Ensure Battery and its insulation are not damaged (e.g.scratched, dented, punctured) prior to and throughoutassembly.

Prior to assembly, ensure Battery edges and surfacesare not dented or deformed, and that fixtures and partsthat will contact the Battery are free of foreign material.

Ensure screws and screwdrivers do not contact theBattery.

NOTE

The Battery can be recovered andreused after removal.

1.

Insert the Thin Plastic Spudger between theBattery and Housing to separate the Battery Adhesive.




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2. Lift the Battery out of the Housing.

3. Slide the Battery Connector tail out of theHousing.

// CAUTION //

Do not damage the Battery Connector.




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Headset Jack Removal

NOTE

The Headset Jack and Headset JackGasket can be recovered and reused

after removal.

1. Use the Tweezers to remove the Headset JackGasket.

2.

Turn the Housing over until the Headset Jackfalls out of the Housing.

NOTE

For parts recovery, do notdisassemble any additional parts fromthe Housing after the Headset Jack.Continue to Housing Cleaning to completeHousing recovery.




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Rear-Facing Imager Bezel Removal

Use the flat end of the Blackstick to pry the Rear-Facing Imager Bezel from the Housing.

NOTE

After you remove the Rear-FacingImager Bezel, you cannot reuse it.




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Rear-Facing Imager Gasket Removal

Use the Tweezers to remove the Rear-Facing ImagerGasket.

NOTE

After you remove the Rear-Facing ImagerGasket, you cannot reuse it.




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Rear-Facing Imager Lens Removal

From the inside of the Housing, use the pointed endof the Blackstick to push the Rear-Facing ImagerLens out of the Housing.

NOTE

After you remove the Rear-Facing ImagerLens, you cannot reuse it.




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Rear-Facing Imager Deco Ring Removal

Use the Tweezers to remove the Rear-Facing ImagerDeco Ring from the Housing.

NOTE

After you remove the Rear-FacingImager Deco Ring, you cannot reuse it.




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Secondary-Microphone Gasket Removal

Use the Tweezers to remove the Secondary-Microphone Gasket from the Housing.

NOTE

After you remove the Secondary-Microphone Gasket, you cannot reuse it.




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Snap Seal Removal

Use the Tweezers to remove the 2 Snap Sealsfrom the Housing.

NOTE

After you remove the Snap Seals, youcannot reuse them.




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Vent Hole Pad Removal

Use the Tweezers to remove the Vent Hole Padfrom the Housing.

NOTE

After you remove the Vent Hole Pad,you cannot reuse it.




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Jumper-Flex Pad Removal

Use the Tweezers to remove the Jumper-FlexPad from the Housing.

NOTE

After you remove the Jumper-FlexPad, you cannot reuse it.




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Speaker Pad Removal

Use the Tweezers to remove the Speaker Padfrom the Housing.

NOTE

After you remove the Speaker Pad,you cannot reuse it.




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Side-Key Button Seal Removal

1. Remove the 2 4IP Screws from the Side-KeyButton Seal Retention Bracket.

NOTE

After you remove the 4IP Screws, youcannot reuse them.

2. Use the Tweezers to remove the Side-KeyButton Seal Retention Bracket.

3. Use the Tweezers to remove the 3 Side-KeyButton Seals.

NOTE

After you remove the Side-Key ButtonSeals, you cannot reuse them.




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Side Key Removal

NOTE

The Side Keys can be recovered andreused after removal.

1. Through the openings in the back of theHousing, use Stainless Steel Dental Pick to pushthe Volume Key out of the Housing.

2. Through the openings in the back of theHousing, use Stainless Steel Dental Pick to pushthe Power Key out of the Housing.




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PARTS REFRESH

Tools Required for Parts Refresh

The following tools are required for parts refresh of the Moto G (3rd Generation) phone.

Description Part # Image

Blackstick --

Tweezers (Plastic or Plastic-Tipped) -- --

ESD Mat and Wrist Strap -- --


Isopropyl (ISP) Alcohol -- --




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Housing Cleaning

1. Use the Blackstick and ISP Alcohol to removeany remaining adhesive in the Battery pocket.

2. Use the Blackstick and ISP Alcohol to clean anyremaining adhesive from the Display ledge.

NOTE

For parts recovery, assemble theBattery Adhesive using steps 5through 7of Battery Assembly onpage 92 to complete the Housingsubassembly.




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PCB Cleaning

1. Use the Blackstick and ISP Alcohol to removeany remaining adhesive from where the TopFrame attaches to the PCB.

2.

Use the Blackstick and ISP Alcohol to removeany remaining adhesive from where the BottomSpacer attaches to the PCB.

3. Use the Blackstick and ISP Alcohol to removeany remaining adhesive from where theLoudspeaker and Loudspeaker Pad attach to the

PCB.

4.

Verify that the Jumper-Flex ZIF Connector Dooris open.




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Top Frame Cleaning

1. Use the Blackstick and ISP Alcohol to removethe Top Frame Adhesive and any remainingDisplay Adhesive from the Top Frame.

2. Use the Tweezers to remove the Light Diffuserfrom the Top Frame.

3. Use the Blackstick and ISP Alcohol to removeany remaining Light Diffuser adhesive from theTop Frame.




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Bottom Frame Cleaning

1. Use the Blackstick and ISP Alcohol to removethe Bottom Frame Adhesive and any remainingDisplay Adhesive from the Bottom Frame.

2. Use the Blackstick and ISP Alcohol to removeany remaining Main-Microphone Gasketadhesive from the Bottom Frame.




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Battery Cleaning

/// WARNING ///



// CAUTION //


scrapped.




1. Use the Blackstick and ISP Alcohol to removeany adhesive residue from the Battery.

// CAUTION //

To prevent damage, do not allow sharp tools orscrews to come in contact with the Battery.

2. Remove the Battery Insulator Tape from theBattery.

// CAUTION //

To prevent damage, do not allow sharp tools orscrews to come in contact with the Battery.

3. Use the Blackstick and ISP Alcohol to removeany adhesive residue from the Battery.

4. Inspect the Battery to verify it is not creased,crushed, or punctured.

5. If the Battery foil pack is wrinkled, slide the flatedge of the Blackstick against the foil pack tosmooth out all wrinkles.




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Daughter Board Cleaning

Use the Blackstick and ISP Alcohol to removeany remaining adhesive from the DaughterBoard.

// CAUTION //

Do not bend the Daughter Board when removingthe adhesive. Damage to the Daughter Board mayoccur.




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USB Module Cleaning

Use the Blackstick and ISP Alcohol to removeany remaining adhesive from the USB Module.




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ASSEMBLY

Assembly Map

Display

Side Keys

Light Diffuser Jumper FlexRear-Facing

Imager

Rear-Facing

Imager Deco

Ring

Headset Jack

Earpiece

Speaker

Rear-Facing

Imager Lens

Main-

Microphone

Gasket

PCB

Secondary-

Microphone

Gasket

Top Frame

and Bottom

Frame

Loudspeaker

Pad

Speaker Pad BatteryBattery

Adhesive

Front-Facing

Imager

Rear Cover

HousingRear-Facing

Imager Gasket

Display

Adhesive

Housing SealsJumper-Flex

Pad

Daughter

BoardLoudspeaker

Rear-Facing

Imager Bezel

BatteryInsulator Tape

USB Module




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Tools Required for Assembly

The following tools are required to assemble the Moto G (3rd Generation) phone.


Callisto Lens and Battery Press Fixture 4-00-Y4-10000

Battery Press Head

Lens Press Head

Lens and Battery Press Fixture

Callisto Lens Adhesive Fixture 4-00-Y5-10000

Callisto Daughter Board Assembly Fixture 4-00-Y6-10000

Callisto PCB Fixture 4-00-Y7-10000

PCB Fixture

Alignment Lid




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Callisto PCB Fixture (continued) 4-00-Y7-10000

PCB Press Head

Callisto Rear Housing Assembly Fixture(optional)

4-00-Y9-10000Housing Assembly Fixture

Housing Seal Press Head

Oven

(optional - if Hot Plate and Callisto Lens AdhesiveHeating Plate are not available)

--

Generic Lens Removal Fixture*4-00-X2-10000(220V) /4-00-X7-10000(115V)




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Callisto Lens Removal Fixture (bottom plate only) 4-00-Y2-10000

Callisto Pre-Heat Fixture 4-00-Y8-10000 --

Press 19501980

Blackstick --

3IP Torx Bit --

Torque Driver (Adjustable) --

Tweezers (Plastic or Plastic-Tipped) -- -- ESD Mat and Wrist Strap -- --


Isopropyl (ISP) Alcohol -- -- Cotton Swabs -- --




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3M AP-111 Adhesion Promoter --

*Generic Lens Removal Fixtures 4-00-X2-10000 and 4-00-X7-10000 are identical tools. The only difference is thevoltage rating. Either the 220V 4-00-X2-10000 or the 115V 4-00-X7-10000 can be used with the Callisto Lens RemovalFixture (4-00-Y2-10000).




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Rear-Facing Imager Deco Ring Assembly

Description Reference #

ASSY,HSG,ASSEMBLY, BCK HSG BLACK ASSY,HSG,ASSEMBLY, BCK HSG WHITE ASSY,HSG,ASSEMBLY, BCK HSG SS BLACK ASSY,HSG,ASSEMBLY, BCK HSG SS WHITE

1

ADH, CAMERA RING, OSPREY 2

BZL,CAMR RING 3

1. Remove the Rear-Facing Imager Deco-Ring Adhesive liner.

2. Use the Tweezers to place the Rear-FacingImager Deco Ring onto the Rear-Facing ImagerDeco Ring Adhesive.

3. Press down on the Rear-Facing Imager DecoRing for 5 seconds to secure the adhesive.

4. Lift the Rear-Facing Imager Deco Ring from thecarrier, making sure the adhesive is adhered tothe ring.

5.

Place the Rear-Facing Imager Deco Ring intothe pocket in the Housing.

6. Press down on the Rear-Facing Imager DecoRing for 5 seconds to secure it to the Housing.




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Rear-Facing Imager Lens Assembly


LENS,CAMR ADHES 1

1. Remove the Rear-Facing Imager Lens from thecarrier.

2. Use the Tweezers to place the Rear-FacingImager Lens into the pocket of the Rear-Facing

Imager Deco Ring on the Housing.

3. Press down on the Rear-Facing Imager Lens for5 seconds to secure it to the Housing.

4. Verify the Rear-Facing Imager outer liner is inposition.




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Rear-Facing Imager Bezel Assembly


BZL,BEZEL, CAMERABZL,BEZEL, CAMERA

1

1. Remove the Rear-Facing Imager Bezel adhesiveliner.

2.

Place the Rear-Facing Imager Bezel onto theHousing.

3. Press down on the Rear-Facing Imager Bezel for5 seconds to secure it to the Housing.

NOTE

The Rear-Facing Imager Bezel will be pressed inFinal Press after assembly of the phone iscomplete.




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Housing Seal Assembly


PAD,PRESSURE VENT WHT PE8-0306 1

PAD, SNAP HSG SEAL 2

SEAL,BUTTON 3

PLATE, BUTTON BACKER 4

SCREW, MACHINE 4IP 5(x2)

1. Remove the Vent Hole Pad from the carrier.

2. Place the Vent Hole Pad in the pocket of theHousing.




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3. Remove a Snap Seal from the carrier.

4. Place the Snap Seal into the pocket of theHousing.

5. Repeat steps 3 through 4 for the remaining SnapSeal.

6. Remove the adhesive liner from the Side-KeyButton Seal.

7. Place the Side-Key Button Seal in the pocket ofthe Housing.

8. Repeat steps 6and 7for the 2 remaining Side-Key Button Seals.




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9. Place the Housing into the Callisto Rear Housing Assembly Fixture (4-00-Y9-10000).

10. Place the Callisto Rear Housing AssemblyFixture into the Press (19501980).

11. Place the Housing Seal Press Head (4-00-Y9-

10000) into the Press.

12. Press the Housing for 5 seconds to secure theVent Hole Pad, Snap Seals, and Side-KeyButton Seals to the Housing.

13. Remove the Housing from the fixture.

14. Place the Side-Key Button Seal RetentionBracket into the Housing. Align the tabs in thebracket first, then roll the bracket into position,using the holes in the bracket to align it to thescrew bosses.

15. Place the 2 4IP Screws in the Side-Key ButtonSeal Retention Bracket and Housing.

16. Tighten the 4IP Screws to 1.10 in-lbs.(0.12 N·m).




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Rear-Facing Imager Gasket Assembly


PAD, CAMERA, 13MP 1

1. Remove the Rear-Facing Imager Gasket fromthe carrier.

2. Place the Rear-Facing Imager Gasket in the

Rear-Facing Imager Lens pocket.

3. Press down on the Rear-Facing Imager Gasketfor 5 seconds to secure it to the pocket of theHousing.

4. Remove the liner from the Rear-Facing ImagerGasket.




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Secondary-Microphone Gasket Assembly


SEAL,MIC 2 1

1. Remove the Secondary-Microphone Gasket fromthe carrier.

2. Place the Secondary-Microphone Gasket into the

pocket of the Housing.

3. Press down on the Secondary-MicrophoneGasket for 5 seconds to secure it to the Housing.




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Speaker Pad Assembly


PAD,PAD, SPKR BACKER 1

1. Remove the Speaker Pad from the carrier.

2. Place the Speaker Pad into the pocket of theHousing using the raised outline to align it.

3. Press down on the Speaker Pad for 5 seconds tosecure it in the Housing.




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USB Module Assembly


DIE CUT,ADHES,USB PCB 1 1

ASSY,PWA,USB PCB MN BRD 2

DIE CUT,ADHES,USB PCB 2 3

SPRT,FRM,METAL, USB PCB 4

1. Remove the USB-Module Frame Adhesive from

the carrier.2. Place the USB-Module Frame Adhesive in the

Daughter Board Assembly Fixture (4-00-Y6-10000), using the pins on side 1 side to align it.




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3. Place the USB Module Frame in the fixture overthe USB-Module Frame Adhesive.

4. Press down on the USB Module Frame for 5seconds to secure the USB-Module Frame Adhesive.

5.

Remove the USB Module Frame from the fixture.

6. Remove the USB Module Adhesive from thecarrier.

7. Place the USB Module Adhesive in the fixture,using the pins on side 2 side to align it.

8. Place the USB Module PCB in the fixture overthe USB Module Adhesive.

9. Remove the adhesive liner from the USB-ModuleFrame Adhesive.

10.

Place the USB Module Frame into the fixtureover the USB Module PCB.

11.

Press down on the USB Module Frame for 5seconds to secure the USB Module Frame andUSB Module Adhesive to the USB Module PCB.

12. Remove the USB Module from the fixture.




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13. Remove the USB Module Adhesive liner.

14. Starting at the connector side of the module,lower the USB Module into the pocket of theHousing.

15. Press down on the USB Module for 5 seconds to

secure it in the Housing.

NOTE

The USB Module will be pressed in the FinalPress procedure after assembly of the phone iscomplete.

// CAUTION //

Do not assemble the USB Module Cover at thistime. The USB Module must be press fit using the

Final Press procedure after assembly of the phoneis complete.

16.

Verify that the USB Module connector is alignedto the opening in the Housing. Make sure themale connector pin is visible in the opening.




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Headset Jack Assembly


SEAL, HSJ, CALLISTO 1

HSJ, CALLISTO 2

1.

Place the Headset Jack into the pocket of theHousing, angling the top of the jack into thepocket first.




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2. Place the Headset-Jack Gasket into the pocketof the Housing.

3. Verify that the Headset-Jack Gasket is fullyseated in the pocket.




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Battery Assembly


DIE CUT,ADHES,BAT 1

ASSY,BAT,LI POLY,FC40,SONY 2600MAH 2

TAPE,ADHES,KAPTON, CALLISTO BAT INSLTR 3

/// WARNING ///



// CAUTION //


scrapped.







92/138


1. Remove the Battery Insulator tape from thecarrier.

2. Place the Battery Insulator Tape on the Battery,aligning the long edge of the tape to the longedge of the Battery.

3. Lower the Battery Insulator Tape onto theBattery.

4. Wipe the Battery Insulator Tape with a card tosmooth out any wrinkles and remove any airbubbles.

5. Remove the Battery Adhesive from the carrier.

6.

Place the Battery Adhesive into the Housing

pocket, aligning the long edge of the adhesive tothe long edge of the pocket.

7.

Press down on the Battery Adhesive to secure itin the Housing.




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8. Remove the Battery Adhesive Liner.

9. Place the Battery into the Battery pocket in theHousing, aligning the top edge of the Battery tothe top edge of the pocket.

10. Place the Housing into the Callisto Lens andBattery Press Fixture (4-00-Y4-10000).

11. Place the Callisto Lens and Battery Press Fixtureinto the Press (19501980).

12. Place the Battery Press Head (4-00-Y4-10000)

into the Press.

13.

Verify that the Battery Connector is not betweenthe Housing and press head. Hold the BatteryConnector out and away from the press head.

// CAUTION //

Keep hands away from the press head duringoperation. Injury and/or damage to equipment mayoccur.




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14. Press the Battery for 10 seconds to secure it tothe Housing.

// CAUTION //

Do not damage the Battery Connector.

15. Remove the Housing from the fixture.

16. Feed the Battery Connector under and throughthe Housing overpass.




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Loudspeaker Pad Assembly


PAD,SPEAKER, BOT 1

1. Position the Callisto PCB Fixture (4-00-Y7-10000) with the cutout side facing up.

2.

Remove the Loudspeaker Pad from the carrier.

3.

Place the Loudspeaker Pad into the Callisto PCBFixture, using the pins in the fixture to align it.




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4. Place the PCB in the fixture over theLoudspeaker Pad.

5. Press down on the PCB for 5 seconds to securethe Loudspeaker Pad to the PCB.




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Loudspeaker Assembly


TRANSDUCER,OTHR,2V,LOUDSPEAKER, 8OHM, 3.65 X 12 X 17MM, IP67, IN" 1

1. Position the Callisto PCB Fixture (4-00-Y7-10000) with the Bottom/Top side facing up.

2. Place the PCB into the Callisto PCB Fixture (4-

00-Y7-10000) with the shields facing up.




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3. Place the Alignment Lid (4-00-Y7-10000) on thefixture using the pins in the fixture to align it.

4. Place the Loudspeaker into the pocket of the Alignment Lid.

5. Press down on the Loudspeaker to secure it tothe PCB.

6. Remove the Alignment Lid from the fixture.

7. Place the Callisto PCB Fixture into the Press(19501980).

8. Place the Callisto PCB Press Head (4-00-Y7-10000) into the Press.

9. Press the Loudspeaker for 5 seconds to secure it

to the PCB.



l2 moto g (3rd generation) global service and repair manual v2.0

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