kx-tg2556lbs

© 2001 Kyushu Matsushita Electric Co., Ltd. Allrights reserved. Unauthorized copying anddistribution is a violation of law.

KX-TG2559LBS2.4GHz Cordless SystemSilver Version

(for Brazil)

Telephone Equipment

ORDER NO. KM40107826C3

1 LOCATION OF CONTROLS 4

1.1. Base Unit 4

1.2. Handset 5

2 DISPLAY 6

3 SETTINGS 8

3.1. Connections 8

3.2. Adding Another Phone 9

3.3. STANDARD BATTERY LIFE 10

3.4. Selecting the Dialing Mode 12

3.5. Selecting the Line Mode 13

4 OPERATION 14

4.1. Making Calls 14

4.2. Answering Calls 16

4.3. Flash Button 17

4.4. Caller ID Service 18

5 DISASSEMBLY INSTRUCTIONS 26

6 ASSEMBLY INSTRUCTIONS 28

6.1. Assembly the LCD to P.C. Board (Handset) 28

6.2. How To Check Splash Resistance 29

6.3. Replace the RF unit 30

7 TROUBLESHOOTING GUIDE 31

7.1. Check Power 32

7.2. Check Battery Charge 33

7.3. Check Link 34

7.4. Check the RF Unit 35

7.5. Check Handset Voice Transmission 42

7.6. Check Handset Voice Reception 42

7.7. Check Call ID 43

8 TEST MODE AND ADJUSTMENT 44

8.1. Test Mode Flow Chart for Base Unit 44

8.2. Test Mode Flow Chart for Handset 45

8.3. Adjustment Battery Low Detector Voltage 46

8.4. Base Unit Reference Drawing 1 47

8.5. Base Unit Reference Drawing 2 48

8.6. Handset Reference Drawing 49

8.7. Frequency Table 50

9 DESCRIPTION 51

9.1. Frequency 51

9.2. Time Division Duplex (TDD) operation 51

9.3. Spread Spectrum 52

9.4. Signal Flowchart in the Whole System 53

9.5. EXPLANATION OF DSP DATA COMMUNICATION 54

10 TERMINAL GUIDE OF IC´S, TRANSISTORS AND DIODES 55

10.1. Base Unit 55

10.2. Handset 55

11 BLOCK DIAGRAM (Base Unit) 56

12 CIRCUIT OPERATION (Base Unit) 57

12.1. Power Supply Circuit 57

12.2. DTMF Signal 57

12.3. Line Sending Signal 58

12.4. Line Receiving Signal 58

12.5. Calling Line Identification Circuit (Caller ID) 59

12.6. Parallel Connection Detection Circuit 61

12.7. Telephone Line Interface 62

12.8. Initializing Circuit 63

12.9. Antenna Diversity 63

13 BLOCK DIAGRAM (Handset) 64

14 CIRCUIT OPERATION (Handset) 65

14.1. Power Supply Circuit 65

14.2. Charge Circuit 65

14.3. Ringer Circuit 66

14.4. Sending Signal 66

14.5. Reception Signal Circuit 67

15 CPU DATA (Base Unit) 68

15.1. IC501 68

16 CPU DATA (Handset) 69

CONTENTS Page Page

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16.1. IC201 69

17 EXPLANATION OF IC TERMINALS (RF Unit, Base Unit) 70

17.1. IC101 70

18 HOW TO REPLACE FLAT PACKAGE IC 71

18.1. Preparation 71

18.2. Procedure 71

18.3. Modification Procedure of Bridge 71

19 CABINET AND ELECTRICAL PARTS (Base Unit) 72

20 CABINET AND ELECTRICAL PARTS (Handset) 73

21 ACCESSORIES AND PACKING MATERIALS 74

22 REPLACEMENT PARTS LIST 75

22.1. Base Unit 75

22.2. Handset 77

22.3. ACCESSORIES AND PACKING MATERIALS 78

23 FOR SCHEMATIC DIAGRAM 79

23.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) 79

23.2. Handset (SCHEMATIC DIAGRAM (Handset)) 79

23.3. MEMO 80

24 SCHMATIC DIAGRAM (RF UNIT) 81

24.1. Base Unit and Handset 81

25 SCHEMATIC DIAGRAM (Base Unit) 82

26 SCHEMATIC DIAGRAM (Handset) 84

27 CIRCUIT BOARD (RF Unit) 86

27.1. RF Unit Reference Drawing (Base Unit and Handset) 86

28 CIRCUIT BOARD (Base Unit) 87

28.1. Component View 87

28.2. Flow Solder Side View 88

29 CIRCUIT BOARD (Handset) 89

29.1. Component View 89

29.2. Flow Solder Side View 90

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1 LOCATION OF CONTROLS

1.1. Base Unit

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1.2. Handset

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2 DISPLAYThe handset shows you instructions and information on the display.

These display prompts are shown below.

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3 SETTINGS

3.1. Connections

• USE ONLY WITH Panasonic AC ADAPTOR PQLV17LBZ

• The AC adaptor must remain connected at all times. (It is normal for the adaptor to feel warm during use.)

• If you unit is connected to a PBX which does not support Caller ID services, you cannot access those services.

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3.2. Adding Another Phone

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3.3. STANDARD BATTERY LIFE

3.3.1. Battery Charge

3.3.2. Battery strength

3.3.3. Recharge

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3.3.4. Battery information

3.3.5. Standby mode ( The handset is off the base Unit)

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3.4. Selecting the Dialing Mode

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3.5. Selecting the Line Mode

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4 OPERATION4.1. Making Calls

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4.2. Answering Calls

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4.3. Flash Button

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4.4. Caller ID ServiceThis unit is compatible with a Caller ID service offered by your telephone company. If you subscribe to a Caller ID service, thecalling party´s information will be displayed after the first ring.

The unit can record information of up to 50 different callers in the Caller List. The Caller List information is sorted by the mostrecent to the oldest call. When the 51st call is received, the first call is deleted.

Using the list, you can automatically call back a caller. You can store the caller´s names and numbers from the Caller List intothe directory.

The information at the handset display depends on the information sent by the telephone company. Most of time the telephone

company can send only the telephone numbers and it will not be able to send others information. If you have any doubt, please

contact your telephone company.

4.4.1. How caller information is displayed when a call is received

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4.4.2. To check the number of new calls

When new calls have been received, the CALLER ID indicator flashes slowly on the base unit.

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4.4.3. Viewing the caller list

You can view the caller list with the handset. Caller List information includes the caller´s phone number, and the number oftimes that caller called.

Make sure the handset is in the standby mode initially.

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4.4.4. Calling back from the caller list

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4.4.5. Editing the caller’s phone number

You can edit a phone number in the Caller List. After editing the number, you can continue with calling back or directory storing

procedures.

Make sure the handset is in the standby mode initially.

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4.4.6. Storing caller list information in the directory

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4.4.7. Erasing caller list information

4.4.8. To erase all entries in the Caller List

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5 DISASSEMBLY INSTRUCTIONS

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Ref. No. Procedure Shown in Fig -. To remove -. Remove -.1 1 1 Lower Cabinet Screws (2.6 × 14)........(A) × 52 1, 2 2 Main P.C. Board Remove the Main P.C. Board3 3 3 Battery Cover Remove the Battery Cover4 3, 4 4 Rear Cabinet Screws (2.6 × 12).....(B) × 2

Screws (2 × 8)..........(C) × 2Screw (2.6 × 12).......(D) × 1

5 3 ~ 5 5 Antenna Screw (2.6 × 12).......(E) × 1Main P.C. Board Screws (2 × 8).....(F) × 4

6 3 ~ 6 6 Main P.C. Board Pull the Charge Terminals outsideRemove the Main P.C. Board

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6 ASSEMBLY INSTRUCTIONS6.1. Assembly the LCD to P.C. Board (Handset)

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6.2. How To Check Splash Resistance

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6.3. Replace the RF unitFor HS

Follow this procedure below when replacing HS RF unit.

1. Remove speaker cables of LCD unit on HS main board.

And remove LCD unit.

2. Remove solder on six legs of RF unit.

3. Remove solder on all pads of RF unit.

4. Replace defective RF unit with new HS RF unit.

NOTE:

Do not use BU RF unit for HS one.

HS RF unit is different from BU one.

5. Solder all pads of RF unit.

6. Solder six RF legs.

7. Put LCD unit and solder speaker wire.

NOTE:

Speaker wire has polarity.

(Component View)

(Solder Side View)

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7 TROUBLESHOOTING GUIDE

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7.1. Check Power

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7.2. Check Battery Charge

NOTE:

• CP/CM: Refer to Base Unit Reference Drawing 1.

• TP-BL: Refer to Handset Reference Drawing.

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7.3. Check Link

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7.4. Check the RF Unit

7.4.1. Finding out the Defective Unit

Prepare HS Test Fixture and BU Test Fixture. Place the HS Test Fixture on the cradle of the base unit for checking, then confirmthat they are linked. Place the handset for checking on the cradle of the BU Test Fixture, then confirm that they are linked. Howto confirm the link is as follows; press the TALK button and confirm Handset in use is displayed on BU LCD.

7.4.2. Handset Test Fixture for Base Unit

Test Fixture has two modes.

1. TEST mode: (RF Power Low mode)

The switch of Test Fixture changed with TEST mode side.

Then Test Fixture is in TEST mode.

2. Normal mode: (RF Power Normal mode)

The switch of Test Fixture changed with Normal mode side.

Then Test Fixture is in Normal mode.

NOTE:

Audio is coming from Receiver whether switch is TEST mode or Normal mode.

This test simulates the handset is at very large distance from the base unit and the TX signal from handset to base is very small.

Procedure: First place handset Test Fixture on base under test to charge (exchange security code); then remove handset frombase after you hear a beep; then press TALK to operate. The LCD will show TALK. This means that the base unit sensitivityis OK. If a beep is not heard, Replace the RF unit.

NOTE:

1) Only KX-TG2583/2563/2553/2403 with marks HS Test Fixture can be used for troubleshooting. Regular KX-TG2583/2563/2553/2403 production samples do not have the switches needed for troubleshooting.

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7.4.2.1. Handset Test Fixture Reference Drawing

As for TEST fixture, only the switch as shown in figure is connected to mass production set.

B EC

RF

UN

IT

SW OFF Normal Mode

SW ON TEST Mode

(Handset)

GND

SW

S_LOW

NOTE:

SW: ON (Base Unit: Normal)

10 m more: No Link

5 m less: Link

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7.4.3. Base Unit Test Fixture for Handset

Switch to control normal mode and test mode on this BU Test Fixture.

Test Fixture has two modes.

1. TEST mode: (RF Power Low mode)


Then Test Fixture is in TEST mode.

2. Normal mode: (RF Power Normal mode)


Then Test Fixture is in Normal mode.

NOTE:

Audio is coming from Receiver whether switch is inserted or not.

This test simulates the handset is at very large distance from the base unit and the TX signal from base to handset is very small.

Procedure: First, place handset under test to charge (exchange security code), then remove handset from base after you heara beep. Press TALK button on handset and if it links with the base, then this handset sensitivity is OK. If a beep is not heard,Replace the RF unit.

NOTE:

1) Only KX-TG2583/2563/2553/2403 with marks BU Test Fixture can be used for troubleshooting. Regular KX-TG2583/2563/2553/2403 production samples do not have the software needed for troubleshooting.

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7.4.3.1. Base Unit Test Fixture Reference Drawing

As for TEST fixture, only the switch as shown in a figure is connected to the mass-production set.

RF

UN

IT

G60

1G

602

G60

3

G60

4G

605

G60

6

BCE

BCE

BCE

SW OFF Normal Mode

SW ON TEST Mode

(Base Unit)

GND

SW

S_LOW

Note:

SW : ON (Portable Unit : Normal)

10m more : No Link

5m less : Link

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7.4.4. RF Check Flowchart

Each item (1a ~ 6) of RF Check Flowchart is corresponded to Check Table for RF Block. Please refer each item one by one.

(*1) See RF Unit Reference Drawing (Base Unit and Handset).

(*2) Base unit RF only, refer to Check Table for RF Block.

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7.4.5. Check Table for RF Block

No. Item BU (Base unit) (*1) HS (Handset) (*1)1a Link confirmation Normal 1. The switch of “HS Test Fixture” is changed to

normal mode side, and is charge of "HS TestFixture".2. Press [TALK] key of "HS Test Fixture" toestablish link about one foot (30cm) away from"Base unit".3. Confirm to link.

1. The swich of “BU TEST Fixture” is changed to“Normal mode side”, and is charge of "BU TestFixture".2. Press [TALK] key of "Handset" to establish linkabout one foot (30cm) away from "BU Test Fixture".3. Confirm to link.

1b Link confirmation Test 1. The switch of “HS Test Fixture” is changed toTEST mode side, and is charge of "HS TestFixture".2. Press [TALK] key of "HS Test Fixture" toestablish link about one foot (30cm) away from"Base unit".3. Confirm to link.

1. The swich of “BU TEST Fixture” is changed to“TEST mode side”, and is charge of "BU TestFixture".2. Press [TALK] key of "Handset" to establish linkabout one foot (30cm) away from "BU Test Fixture".3. Confirm to link

1c Check Antenna connection 1. Check ANT1(*2) and ANT2(*2) soldering.2. Check ANT1(*2) and ANT2(*2) points are notshorted to GND.

1. Check Antenna(*3) on HS mainboard soldering.

2 24MHz Adjustment 1. Set BU to [Test STANDBY] mode (*5)2. Confirm X101 frequency within 24MHz ± 720Hzat TP_FREQ(*4) of RF Unit.If X101 frequency is spec out than adjust frequencywithin 24 MHz ±100 Hz by VC101.

1. Set HS to [Test STANDBY] mode (*5)2. Confirm X101 frequency within 24MHz ± 720Hzat TP_FREQ(*4) of RF Unit.If X101 frequency is spec out than adjust frequencywithin 24 MHz ±100 Hz by VC101.

3 TX Pow_Low confirmation 1. Put low loss high frequency wire to ANT1(*2) andGND(*2)2. Connect this wire to Spectrum analyzer.3. Set BU to [Low Power] mode (*5)4. Confirm TX power level within -5 ~ +10dBm

1. Remove Antenna on HS main board. Put lowloss high frequency wire to ANT(*3) and GND (*3)2. Connect this wire to Spectrum analyzer.3. Set HS to [Low Power] mode (*5)4. Confirm TX power level within -5 ~ +10dBm

4 TX Pow_High confirmation 5. Set BU to [High Power] mode (*5)6. Confirm TX power level within +20±4dBm

5. Set HS to [High Power] mode (*5)6. Confirm TX power level within +20±4dBm

5 Antenna Diversity confirmation 7. Set BU to [Test STANDBY] mode (*5)8. Put low loss high frequency wire to ANT2 (*2)and GND (*2)9. Connect this wire to Spectrum analyzer10. Press [1] key to activate the ANT2.11. Set BU to [High Power] mode (*5)12. Confirm TX power level within +20±4dBm

6 Receiver confirmation Same as Item 1b. Same as Item 1b.

(*1) BU: Base Unit, HS: Handset.

(*2) See Base Unit Reference Drawing 1.

(*3) See Handset Reference Drawing.

(*4) See RF Unit Reference Drawing (Base Unit and Handset).

(*5) See TEST MODE AND ADJUSTMENT.

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7.4.6. RF-DSP Interface Signal Wave Form

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7.5. Check Handset VoiceTransmission

7.6. Check Handset VoiceReception

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7.7. Check Call ID

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8 TEST MODE AND ADJUSTMENT

8.1. Test Mode Flow Chart for Base Unit

(*1) See Base Unit Reference Drawing 1.

(*2) Special check method for Base Unit individually.

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8.2. Test Mode Flow Chart for Handset

(*1) See Handset Reference Drawing.

(*2) Special check method for Handset individually.

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8.3. Adjustment Battery Low Detector VoltageAfter replacing handset’s DSP (IC201) and EEPROM, Re-writing Battery Low voltage to EEPROM is required.

Following Test mode flow chart (Refer to Test Mode Flow Chart for Handset),

DC power supply and Battery connector are required in this adjustment.

1. Set 3.9V for DC power supply.

2. Place handset in test mode.

3. Press “TALK” key 4 times to TX-Low mode. (CW Tx Low is displayed on LCD)

4. Set 3.51V for DC power supply.

* Check voltage at battery connector, because some voltage drop is happened, using long or thin cable.

5. Press “#” key to write voltage value in EEPROM.

6. Turn power off. Then this value is available.

NOTE

Refer to Handset Reference Drawing for connection of DC power source and voltmeter.

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8.4. Base Unit Reference Drawing 1

IC551B E

C

B E

C

DC9V

ANT 2

ANT 1

SA

FREQUENCY_COUNTER

24MHz ±720Hz

TP_FREQ

RF_UNIT

LOCATOR

CDL

TESTMODE SW

BellSIMULATOR

AFVOLT METER

LOOPSIMULATOR

Call-IDSIMULATOR

400Ω

600Ω

LB

OSCCM CP

AFOSC

-25dBm1.1kHz

KX

-TG

2559L

BS

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8.5. Base Unit Reference Drawing 2

RF UNIT

G601G602G603

G604 G605 G606

IC571

IC501

E C

B

E C

BE

C B

E C

B

BCE

BCE BCE

IC301

KX

-TG

2559L

BS

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8.6. Handset Reference Drawing

IC20

1

E B

CE B

C

E BC

E BC

E BC

E BC

B EC

B EC

IC202

E BCB E

C

10µ

10µ

OSC1.1kHz

600Ω / 45dBmf = 1.1 kHz

MIC_M

MIC_P

TP_VBAT

TP_VSS3.9V

OSCILLOSCOPE

AC VOLT METER

150W

50WCABLE

150W

OSC1.1kHz

OPEN

SPM

SPP

TEST TP_VCC

TP_BL

MIC1SP1

AC VOLT METER

10m OSCILLOSCOPE

HAND SET

HEAD SET

ANTG

ANT

Spectrum Analyzer

FREQUENCYCOUNTER

TP_FREQ24MHz ±720Hz

No.1Confirm Frequency

Voltmeter

KX

-TG

2559L

BS

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8.7. Frequency Table

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9 DESCRIPTION

9.1. FrequencyThe frequency range of 2.4015 GHz ~ 2.4705 GHz is used. Transmitting and receiving channels between base unit and handsetis same frequency. Refer to the Frequency Table.

9.2. Time Division Duplex (TDD) operationTransmission/reception between the base unit and handset is performed by time-sharing as shown in Fig. 7. 1 slot time oftransmission and reception is 1mS. Same frequency is used in transmitting and receiving. The figure shows an example; thefrequency of 1ch is used in transmitting between the base unit and handset.

Fig. 7

9.2.1. TDD Frame Format

The TDD frame is 2mS in length, and is composed of two symmetrical 960 µS TX and RX subframes. Each subframe contains 96bits of 10µS duration, with 40µS guard times between both TX and RX subframes.

Each subframe consists of the following five fields:

• A 12-bit Preamble field

• An 8-bit Data Channel field

• An 8-bit Sync Word

• A 64-bit ADPCM Payload

• A 4-bit Post-amble

Both the 8-bit sync word and 8-bit data channels are programmable via the DSP interface. In addition, the 64-bit payloadcan be filled either with ADPCM voice data, or can be used by the host DSP as a fast data channel between base andhandset.

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9.3. Spread SpectrumTransmission and reception are operated using the spread spectrum method.

DSS (Digital Spread Spectrum)

Mixing the original signal with the pseudo random noise code (PN code) works the spread spectrum. In this system PN code is 15chip. Although the band width is spread fifteen times, the power level per channel becomes lower.

Fig. 8

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9.4. Signal Flowchart in the Whole SystemReception

CN101 of the base unit is connected to the TEL line, and the signal is input through the bridge diode D101. While talking therelay (Q121) is turned ON and amplified at the amplifiers Q461, then led to DSP (IC501). DSP generates ADPCM signal. TheADPCM signal is input to RFIC (IC101) of RF UNIT, and is mixed with pseudo random noise code (PN code) to spread thespectrum. RFIC outputs FSK modulated RF signal. The RF signal is passed through the balun (T101) and filter (L107) to theT/R switch (IC109). And the RF signal amplifies by the power amplifier (IC105) and fed into T/R switch (IC110) and passesthrough filter (L106) to Diversity ANTENNA. As for the handset, RF signal from the antenna passes through filter (L106) andswitch by T/R switch (IC110) to LNA (IC106). The RF signal is amplified by LNA (IC106) and switched by T/R switch (IC109)and input to RFIC passing through filter (L107) and the balun (T101) to perform the de-spread, then input to DSP (IC201). DSPperforms ADPCM decoding to convert the signal into the voice signal, then it is output to the speaker.

Transmission

The voice signal input from the microphone is led to DSP (IC201). The DSP generates ADPCM signal. As well as the reception,it is converted into the RF signal by RFIC (IC101). Passing through the balun (T101) and filter (L107), to the T/R switch (IC109).And the RF signal amplifies by the power amplifier (IC105) and fed into T/R switch (IC110) and passes through filter (L106) toANTENNA. As for the base unit, RF signal from the Diversity antenna passes through filter (L106) and switch by T/R switch(IC110) to LNA (IC106). The RF signal is amplified by LNA (IC106) and switched by T/R switch (IC109) and is input to RFIC(IC101) passing through filter (L107) and the balum (T101) to perform the de-spread, then input to DSP (IC201). DSP performsADPCM decoding to convert the signal into the voice signal. The voice signal is amplified at the TX amplifier (Q131), then outputto the TEL line (CN101) through the relay (Q121) and bridge (D101).

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9.5.1. Calling

9.5.2. To Terminate Communication

9.5.3. Ringing

9.5.4. ID CHANGE

9.5. EXPLANATION OF DSP DATA COMMUNICATION

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10 TERMINAL GUIDE OF IC´S, TRANSISTORS AND DIODES

10.1. Base Unit

10.2. Handset

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11 BLOCK DIAGRAM (Base Unit)

Q371

Q311

Q6217V

7V

Q601

Q343

Q461

Q115

3.6V

3.6V

VPWR

VRF1

VRF2

PCONT

REGULATOR

Q611

S-LOW

IC551

EEP ROM

DA

TA

CS

CLK

RF_RESET

BBIC_PWDN

(RIGHT)ANT1

(LEFT)ANT2

KX

-TG

2559L

BS

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12 CIRCUIT OPERATION (Base Unit)

12.1. Power Supply CircuitFunction:

Power from the AC adaptor passes through a regulating consisting of IC301.

Circuit Operation:

IC301 is a regulated power supply. The voltage at point A is regulated to 4.5 V by IC301.

The voltage at point B is dropped by D509 to 4.1 V.

The voltage at point C is dropped by D521 to 3.8 V.

The voltage at point E is dropped by Q601 to 3.6V

12.2. DTMF SignalWhen the DTMF data from the Handset is received, the DTMF signal is output from pin 36 of IC501 and sent to the line throughQ131.

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12.3. Line Sending SignalThe coded signal input from the RF unit is decoded by IC501.

The audio signal output from IC501-36 and is input to telephone line.

12.4. Line Receiving SignalThe audio signal from line passes through Q131 and Q461 to pin38 and 39 of IC501(DSP). IC501 modulates this input audio signalto output to the RF unit.

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12.5. Calling Line Identification Circuit (Caller ID)Function:

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone companyto utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has beenentered for the circuit being used. This model can receive 2 types of Caller ID (FSK type, DTMF type)

• FSK type

The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bellsignal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying)format. Data “0” is a 1200 Hz or 1300 Hz sine wave, and data 1 a 2200 Hz or 2100 Hz sine wave.

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12.6. Parallel Connection Detection CircuitFunction:

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have acircuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephoneconnected in parallel is on hook or off hook by detecting changes in the T/R voltage.

Circuit Operation:

Parallel connection detection when on hook:

When on hook Q115 is ON, the voltage is monitored pin 40 of IC501. There is no parallel connection if the voltage is 1.65 V orhigher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:

When off hook Q115 is OFF, the voltage is monitored pin 40 of IC501; the presence/absence of a parallel connection is determinedwhen the voltage changes by 0.2 V or more.

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12.7. Telephone Line InterfaceCircuit Operation:

• ANSWER

In the idle mode, Q121 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:

T → L101 → R103 → C103 → Q101 → IC501 pin 64.

When the CPU (DSP) detects a ring signal, Q121 turns on, thus providing an off-hook condition (active DC current flow throughthe circuit) and the following signal flow is for the voice signal.

T → D101 → Q121 → Q131 → R139/R140 → C139 → RX

• ON HOOK

Q121 is open, Q121 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook condition.

• SPECIFICATIONS

In the on-hook state (idle), the current flows between the telephone line and the unit is as follows:

T → L101 → R103 → C103 → R106 → C104 → R104 → L102 → PO101 → R.

The DC component is blocked by C103, C104: thereby providing an on-hook condition.

The AC interface impedance is over 47 kΩ; thus, satisfying the telephone company requirements.

62

KX-TG2559LBS

12.8. Initializing CircuitFunction:

This circuit is used for to initialize the microcomputer when it incorporates an AC adaptor.

Circuit Operation:

When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC301, D509 and power is supplied to the DSP.

The set can operate beyond point A in the circuit voltage diagram.

12.9. Antenna DiversityAntenna Diversity improve conversation quality. This means to reduce some noise during conversation. RF unit send LQA (LinkQuality Alarm) signal to IC751 when increase Error Bit’s. Then IC751 control RF switch IC761 to switch another Antenna.

Antenna selection control by IC501 is available only in test mode.

63

KX-TG2559LBS

14 CIRCUIT OPERATION (Handset)

14.1. Power Supply CircuitVoltage is supplied separately to each block.

BATTERY+3.6V

KEY, BACK LIGHT

LCD

RF ICIC101

PA

REG +3.3VQ204, IC204

DSPIC201

E2PROMIC202

MICCIRCUIT

+3.6V

+3.3V

+3.3V

+3.3V

+2.7V

REG +3.3VIC203

Block Diagram (Handset Power)

RF UNIT

LEDS

+3.3V

BATT+BATT-

D214

D216

CHARGE2CN202

CHARGE1

Q203

Q211

CN202

14.2. Charge CircuitNi-cd battery is connected to CN202. When the handset is put on the cradle of the base unit, the power is supplied from CHARGE1and CHARGE2 terminals to charge the battery. Q207 detects the voltage of CHARGE1 and CHARGE2 terminals, then the handsetmakes ID code setting (*) with the base unit.

65

KX-TG2559LBS

14.3. Ringer CircuitIf the ringer volume is set to low and an alarm tone is output from 39 pin, IC201 DSP and input to Q209. Then Q208 is turned off.If the ringer volume is set to high, Q208 turns on and results in a louder beep tone.

14.4. Sending SignalThe voice signal from the microphone input to pin 42 (CIDIP) and pin 41(CIDIN) of IC201 (DSP). CN203 is the headphone jack.When the headphone is connected, the Q206 detect it. The input from the microphone of the handset (CIDIN, CIDIP) is cut andthe microphone signal from the headphone is input to pin 47 of IC201 (HMIN). Also the power for the microphone is supplied fromQ211, and the power is turned OFF on standby.

66

KX-TG2559LBS

14.5. Reception Signal CircuitThe received signal from the base unit is output from pins 33 (SPN) and 32 (SPP) of IC201 (DSP) as the voice signal. SPN is theinverse output of SPP, and the speaker is driven by SPN and SPP. CN203 is the headphone jack. When the headphone isconnected to this jack, the output to the speaker of the handset (SPN,SPP) is cut and the voice signal is output to the headphone(HSOUT) only.

67

KX-TG2559LBS

15 CPU DATA (Base Unit)15.1. IC501

68

KX-TG2559LBS

16 CPU DATA (Handset)16.1. IC201

69

KX-TG2559LBS

17 EXPLANATION OF IC TERMINALS (RF Unit, Base Unit)17.1. IC101

70

KX-TG2559LBS

18.1. Preparation • SOLDER

Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA

• Soldering iron

Recommended power consumption will be between 30 Wto 40 W.

Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)

(An expert may handle between 60 W to 80 W iron, butbeginner might damage foil by overheating.)

• Flux

HI115 Specific gravity 0.863

(Original flux will be replaced daily.)

18.2. Procedure 1. Temporary fix FLAT PACKAGE IC by soldering on two

marked 2 pins.

*Most important matter is accurate setting ofIC to the corresponding soldering foil.

2. Apply flux for all pins of FLAT PACKAGE IC.

3. Solder employing specified solder to direction of arrow, assliding the soldering iron.

18.3. Modification Procedure ofBridge

1. Re-solder slightly on bridged portion.

2. Remove remained solder along pins employing solderingiron as shown in below figure.

18 HOW TO REPLACE FLAT PACKAGE IC

71

KX-TG2559LBS

19 CABINET AND ELECTRICAL PARTS (Base Unit)

72

KX-TG2559LBS

20 CABINET AND ELECTRICAL PARTS (Handset)

73

KX-TG2559LBS

21 ACCESSORIES AND PACKING MATERIALS

74

KX-TG2559LBS

22 REPLACEMENT PARTSLIST

This replacement parts list are Brazil version only.

Note:

1. RTL (Retention Time Limited)

The marking (RTL) indicates that the Retention Time islimited for this item.

After the discontinuation of this assembly in production, theitem will continue to be available for a specific period oftime. The retention period of availability is dependent on thetype of assembly, and in accordance with the lawsgoverning part and product retention.

After the end of this period, the assembly will no longer beavailable.

2. Important safety notice

Components identified by a mark special characteristicsimportant for safety. When replacing any of thesecomponents, use only manufacture´s specified parts.

3. The S mark indicates service standard parts and may differfrom production parts.

4. RESISTORS & CAPACITORS

Unless otherwise specified;

All resistors are in ohms (Ω) K=1000Ω, M=1000kΩ

All capacitors are in MICRO FARADS (µF) P=µµF

*Type & Wattage of Resistor

22.1. Base Unit

22.1.1. CABINET AND ELECTRICALPARTS

Ref.No.

Part No. Part Name & Description Remarks

1 PQBC10333Z1 LOCATOR BUTTON S

2 PQGB7Y BADGE

3 PQGT14750Z NAME PLATE

4 PQHR10845Z LED LENS

5 PQKE10333Z1 HOOK LEVER S

6 PQSA10109Y ANTENNA

Ref.No.


7 PQSA10110Y ANTENNA

8 PQYF10195W1 LOWER CABINET S

9 PQYM10111W2 UPPER CABINET S

10 PQZHTG2583BH CHARGE TERMINAL ASS´Y

22.1.2. MAIN P.C. BOARD PARTSRef.No.


PCB1 PQWPG2559LBH MAIN P.C. BOARD ASS´Y (RTL)

(ICS)

IC301 PQVIXCF4502P IC S

IC331 PQVIPS3432UT IC S

IC501 C2HBBJ000007 IC

IC551 PQWIG2559LBH IC

IC741 PQVITC7S08FU IC S

IC751 PQVITC7W74U IC S

IC761 PQVISPM3204T IC S

(TRANSISTORS)

Q101 2SD1819A TRANSISTOR(SI)


Q121 2SA1625 TRANSISTOR(SI) S

Q122 PQVT2N6517CA TRANSISTOR(SI) S

Q131 2SC2120 TRANSISTOR(SI) S

Q311 2SD2136 TRANSISTOR(SI)













(DIODES)

D101 PQVDS1ZB60F1 DIODE(SI) S

D103 MA111 DIODE(SI)



D121 PQVDRLZ20A DIODE(SI) S

D131 PQVDRLZ2R0 DIODE(SI) S



D331 MA8036H DIODE(SI)





D509 PQVDHRU0203A DIODE(SI) S



D521 PQVDHRU0203A DIODE(SI) S





(LEDS)

LED541 LNJ308G8JRA LED

LED542 PQVDEL1921SR LED

LED543 PQVDEL1921SR LED

(COILS)

L101 PQLQXF330K COIL S

L102 PQLQXF330K COIL S

L501 PFVF2P221SG COIL

L515 PQLQR2K1A102 COIL

(SURGE ABSORBERS)

SA101 PQVDDSS301L SURGE ABSORBERS S

SA102 PQVDDSS301L SURGE ABSORBERS S

(OTHERS)

CN101 PQJJ2H003Z DC-TEL S

75

KX-TG2559LBS

Ref.No.


X501 PQVCK4096N9Z CRYSTAL OSCILLATOR S

G601 PQJT10152Z BATTERY TERMINAL






P101 PQRPAR390N POSISTOR S

S546 EVQPC005K PUSH SWITC

(RESISTORS)

R103 ERJ3GEYJ104 100k


R106 ERJ3GEYJ472 4.7k





R115 ERJ3GEYJ125 1.2M

R116 ERDS1VJ106 10M

R117 ERJ3GEYJ335 3.3M

R118 ERJ3GEYJ102 1k







R133 ERJ3GEYJ102 1k

R134 ERJ3GEY0R00 0

R136 ERDS1TJ330 33 S

R138 ERJ3GEYJ470 47


R140 ERJ3GEYJ821 820

R311 ERD25TJ221 220 S












R373 ERJ3GEYJ390 39

R374 ERJ3GEYJ220 22

R375 ERJ3GEYJ220 22

R376 ERJ3GEYJ220 22

R377 ERDS1TJ221 220 S

R378 ERDS1TJ221 220 S
















R446 ERJ3GEYJ105 1M



R449 ERJ3GEYJ102 1k


R461 ERJ3GEYJ150 15


Ref.No.



R465 ERJ3GEYJ390 39

R516 ERJ3GEY0R00 0

R521 ERJ3GEY0R00 0












R658 ERJ3GEYJ180 18



R664 ERJ3GEYJ180 18

R666 ERJ3GEYJ180 18




(CAPACITORS)

C101 ECKD2H681KB 680p S


C103 PQCUV1H154KR 0.15

C104 PQCUV1H154KR 0.15

C106 PQCUV1A684KB 0.68



C115 ECUV1H103KBV 0.01


C131 ECUV1H101JCV 100p


C134 ECEA1HKS100 10 S

C139 ECEA1CKA100 10

C140 ECUV1C473KBV 0.047


C302 ECUV1C104ZFV 0.1


C304 ECEA1CKA100 10

C306 ECEA1AU221 220


C311 ECEA1CKA100 10


C341 ECUV1H102KBV 0.001

C342 ECUV1H102KBV 0.001


C345 ECUV1C104KBV 0.1





C412 ECUV1A105ZFV 1


C414 ECEA1CKA100 10

C415 ECUV1A105ZFV 1

C431 ECUV1H272KBV 0.0027


C440 ECUV1H100DCV 10p S

C441 ECUV1A224KBV 0.22

C442 ECUV1C683KBV 0.068



C445 ECEA1CKA100 10

C448 ECUV1C473KBV 0.047


C451 ECUV1C473KBV 0.047

C452 ERJ3GEY0R00 0



C467 ECUV1H070CCV 7p

76

KX-TG2559LBS

Ref.No.


C501 ECEA0JU102 1000







C508 ECUV1H332KBV 0.0033

C511 ECUV1H152KBV 0.0015


C515 ECEA1CKS220 22 S


C521 ECEA1AU101 100 S



C526 ECUV1H332KBV 0.0033


C601 ECEA1AU101 100 S


C611 ECEA1AU101 100 S

C613 ECEA1AU101 100 S


C621 ECEA1EU101 100 S














22.1.3. RF P.C. BOARD PARTSRef.No.


PCB2 PQLP10243Z RF BLOCK

22.2. Handset

22.2.1. CABINET AND ELECTRICALPARTS

Ref.No.


101 PQADGP0831GN LIQUID CRYSTAL DISPLAY S

102 PQAX2P07Z SPEAKER

103 PQBC10335Z1 NAVI KEY BUTTON S

104 PQGT14751Z NAME PLATE

105 PQHE10119Z CUSHION , URETHANE FORM

106 PQHG10620Z PACKING RUBBER , BATTERY CO

107 PQHG10621Z RINGER RUBBER

108 PQHG10630Z PACKING RUBBER

109 PQHR10727Z LCD PLATE

110 PQHR10739Z SPEAKER HOLDER

111 PQHR10850Z LCD HOLDER

112 PQHS10384Z PACKING SHEET, RINGER

113 PQHS10386Z PACKING SHEET, MIC

114 PQHS10461Z PACKING SHEET, SPEAKER

115 PQHS10484Z PACKING SHEET, EARPHONE CAP

116 PQHS10485Z CUSHION, SPEAKER

117 PQHX10862Z LCD COVER SHEET

118 PQHX10934Z SHEET

119 PQHX10959Z RF SPONGE

120 PQJT10175Z CHARGE TERMINAL

121 PQKE10128Z1 EARPHONE CAP S

122 PQKE10129Z1 COVER S

Ref.No.


123 PQP510SVC BATTERY S

124 PQQT22262Z CHARGE LABEL

125 PQSA10120U ANTENNA

126 PQSX10171Z RUBBER SWITCH

127 PQKF10514Z2 LOWER CABINET S

128 PQKK10117Z2 BATTERY COVER S

129 PQHG10629Z RUBER, BATTERY

130 PQYMG2553BXS FRONT CABINET ASS´Y

22.2.2. MAIN P.C. BOARD PARTSRef.No.


PCB100 PQWPG2559LBR MIAN P.C BOARD ASS´Y (RTL)

(ICS)

IC201 C2HBBH000025 IC

IC202 PQWIG2559LBR IC

IC203 PQVIC62FP33M IC S

IC204 PQVIXCP3302M IC S

IC205 PQVIC61CN32N IC S

(TRANSISTORS)

Q201 PQVTDTC143E TRANSISTOR(SI) S


Q203 PQVTDTA143TU TRANSISTOR(SI)

Q204 2SA1797Q TRANSISTOR(SI) S




Q208 PQVTD123T146 TRANSISTOR(SI) S

Q209 PQVTD123T146 TRANSISTOR(SI) S

Q210 UN521 TRANSISTOR(SI)

Q211 PQVTDTA143TU TRANSISTOR(SI)

(DIODES)




D214 PQVD1SR154 DIODE(SI) S

D215 MA2ZD1400 DIODE(SI)

D216 PQVD1SR154 DIODE(SI) S

(LEDS)

LED201 PQVDSML310MT LED S







(COILS)

L204 PQLQR3FL121 COIL S

L205 PQLQR3FL121 COIL S

(CONNECTORS)

CN201 PQJS22B11Z CONNECTOR

CN202 PQJP2D13Z FPC CONNECTOR S

CN203 PQJJ1J007Z EAR JACK S

(OTHERS)

E101 PQJM146Y MICROPHONE

E102 PQEFBC12111B RINGER S

X201 PQVCI4096N3Z CRYSTAL OSCILLATOR

G1 PQJT10152Z CHARGE TERMINAL






(RESISTORS)








R209 ERJ3GEYJ102 1k

77

KX-TG2559LBS

Ref.No.






R217 ERJ3EKF4533 453k

R218 ERJ3GEYF824 820k S




R223 ERJ3GEY0R00 0






R229 ERJ3GEYJ102 1k

R230 ERJ3GEYJ102 1k

R231 ERJ3GEYJ102 1k


R233 ERJ3GEY0R00 0

R234 ERJ3EKF2204 2.2M

R235 ERJ3EKF2204 2.2M


R241 ERJ3GEY0R00 0

R242 ERJ3GEYJ180 18

R243 ERJ3GEYJ180 18








R251 ERJ3GEYJ120 12

R252 ERJ3GEYJ820 82






R266 ERJ3GEYJ105 1M


R271 ERJ3GEY0R00 0

R272 ERJ3GEYJ105 1M

R273 ERJ3GEY0R00 0

R274 ERJ3GEY0R00 0

R275 ERJ3GEY0R00 0

(CAPACITORS)










C213 ECEV1AA221 220






C220 ECEV0JA101 100



C223 ECST0JY106 10







Ref.No.









C249 ECST0GY226 22


C267 ECST0JY226 22

C270 ECST0JY475 4.7



C283 ECUV1A105ZFV 1

C290 ECUV1H102KBV 0.001

C291 ECUV1H102KBV 0.001




C298 ECUV1A105ZFV 1

22.2.3. RF P.C. BOARD PARTSRef.No.


PCB200 PQLP10244Z RF BLOCK

22.3. ACCESSORIES AND PACKINGMATERIALS

Ref.No.


A1 PQJA10075Z TEL CORD

A2 PQKE10127Z1 BELT CLIP S

A3 PQKL10038Y3 WALL MOUNT ADAPTOR S

A4 PQLV17LBZ AC ADAPTOR

A5 PQQX13104Z INSTRUCTION BOOK

P1 XZB21X35A03 PROTECTION COVER (For Baseunit)

P2 XZB10X35A02 PROTECTION COVER (forHandset)

P3 PQPK13456Z GIFT BOX

78

KX-TG2559LBS

23 FOR SCHEMATIC DIAGRAM

23.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. This schematic diagram may be modified at any time with the development of new technology.

23.2. Handset (SCHEMATIC DIAGRAM (Handset))Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.

2. The schematic diagrams and circuit board may be modified at any time with the development of new technology.

79

KX-TG2559LBS

23.3. MEMO

80

KX-TG2559LBS

24 SCHMATIC DIAGRAM (RF UNIT)24.1. Base Unit and Handset

IC110

IC105

IC11

3

IC11

2

IC109

IC114

IC101

IC106

KX

-TG

2559L

BS

81

25 SCHEMATIC DIAGRAM (Base Unit)

RF Signal

NC

NC

ATN

-DV

C

IC501

IC571

IC751

IC74

1

IC76

1

IC551

TALK TX

TALK RX

3.5V

3.7V

26mVp-p

TX High powerLevel +20 ± 4dBm2.4015 ~2.4705GHz

(1)

(4~

7)(1

8)(1

9)(2

0~26

)(2

7)(8

~17

)(2

)(3

)

82

KX-TG2559LBS

IC301

IC331

Input f=1.1kHz140mVp-p(-25dBm/600 )

Output 420mVp-p-13dBm

60mVp-p

20mVp-p

16mVp-p

22mVp-p

400mVp-p

4.1V

3.8V

4.1V

6.8V

4.5V4.1V

11.0V

7.4V

4.0V

3.7V

(1)

(4~

7)(1

8)(1

9)(2

0~26

)(2

7)(8

~17

)(2

)(3

)

TG2559LBS: SCHEMATIC DIAGRAM (Base Unit)

83

KX-TG2559LBS

26 SCHEMATIC DIAGRAM (Handset)

IC202

TX H/S

RX H/S

TX Normal

RX Normal

TX High powerLevel +20 ± 4dBm2.4015~2.4705GHz

RF SIGNAL

(1)

(2, 3

)(1

5~29

)(4

~14

)(3

2~36

)(3

9, 4

0)(3

7, 3

8)(4

1~43

)(44

~46

)(5

0~52

)(53

~55

)(4

7)(4

8)(4

9)(3

0, 3

1)

84

KX-TG2559LBS

IC201

IC204

IC203

IC205

TX H/S

RX H/S

TX Normal

f=1.1kHz18mVp-p (-45dBm/600 )

120mVp-p -26dBm

RX Normal

120mVp-p -26dBm

260mVp-p -18dBm

3.3V3.3V

160mVp-p -23dBm

f=1.1kHz18mVp-p (-45dBm/600 )

-28dBm 90mVp-p

RF SIGNAL

EE

PR

OM

_CS

LCD

_PO

WE

RM

IC_S

WLC

D_C

SB

LCD

_RS

LCD

_WR

LCD

_RD

LCD

_DR

0LC

D_D

R1

LCD

_DR

2LC

D_D

R3

VC

CG

ND

RF

_PW

_CT

LB

BIC

_PW

DN

EG

PIO

2 K

EY

_ST

RO

BLC

D_R

ES

ET

EG

PIO

4 K

EY

_ST

RO

BE

GP

IO5

KE

Y_S

TR

OB

EG

PIO

6 K

EY

_ST

RO

BE

GP

IO7

KE

Y_S

TR

OB

EG

PIO

8 K

EY

_ST

RO

BE

GP

IO9

KE

Y_S

TR

OB

NC

SP

I_D

OU

TS

PI_

EN

SP

I_C

LKG

ND

SP

I_D

IN

30 : ALARM_VOL

NC

CD

12C

D13

CD

14C

D15

VC

CG

ND

RF

_RE

SE

TA

DP

CM

_IN

AD

PC

M_O

UT

AD

PC

M_S

YN

CA

DP

CM

_BC

LKLI

GH

TE

D_L

ED

NC

NC

LCD

_B.L

HE

AD

SE

TN

CN

CN

CN

CIR

Q_T

XR

XN

CP

DN

RE

SE

TG

ND

XIN

XO

UT

VR

TC

VC

CP

LL

GNDPASPPSPN

VCCPAHSOUT

LOUTVCCA

LINLGS

DCINCIDINCIDIPCIDO

HMGSHMIN

GNDAMIN

MGSVREF

GNDPLLCHGS_LOWPCONTNCNCNCNCNCNCNCNCGNDVCCVCCGNDUART_RXUART_TX

98 : EEPROM_CLK99 : EEPROM_DI

100 : EEPROM_DO

(1)

(2, 3

)(1

5~29

)(4

~14

)(3

2~36

)(3

9, 4

0)(3

7, 3

8)(4

1~43

)(44

~46

)(5

0~52

)(53

~55

)(4

7)(4

8)(4

9)(3

0, 3

1)

TG2559LBS: SCHEMATIC DIAGRAM (Handset)

85

KX-TG2559LBS

27 CIRCUIT BOARD (RF Unit)

27.1. RF Unit Reference Drawing (Base Unit and Handset)

IC114

C158

R103

C182

C177

C174

C138

C151

C156

C139

C168

L111

C123

R136

R138

C137

C198

R142

C197

R156

R132

C136

C154

C175 C

176

C159

C160

C164

C170

C117

C107

L103

C153

L108

C109

L104

C173

C108

C183

C171

C186

L105L102

C105

R123

C166

C113

C116

C135

C141

C142

C120

L113

L112

C148

C155

C179

L114IC

105

IC113

IC112

IC101

TP_FREQ

FREQUENCY CONNECTOR

L107

T101

IC109

C121

C163C169

L116

L117

C165

L109

C172

C145

R127

C188

C157C146

L115C178 C161

C130

C185

L110

R150C134

R117

R149

R116

C133R122

R154

R114R147

C128

C124

R143

R111

C125

R144R145

C126

R146

R155

C122R151

C132R148

C131

C196

R126

C115

C114

C143

R121

R107

R108R109

R110

R131C127

R120

R105R115R130

R139

C184

C150

C149

R128

C162

C167

R129

C106

VC101X101

IC106IC110

L106

C111

C144

C110

R101

R104

C152

C112

C103

C140R102 C118R158

R157

C119R153

C190

C189

C192

C191

C194

C195

C193

R152

C129

C101

C102

C104C199

GND

GND

GND

VPWR2

RF_RESET

PCONT

S_LOW

PWRDIN

SPI_CLKIN

TX_HDPCMI

GND

GND

GND

GND

GND

VPWR

VRF2

VRF1

LQA

RX

_AD

PC

MO

PC

M_S

YN

C

PC

M_B

CLK

IRQ

GN

D

GN

D

SP

I_EN

SP

I_DO

UT

SP

I_DIN

TX

EX

GN

D

GN

D

AN

T

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

86

KX-TG2559LBS

28 CIRCUIT BOARD (Base Unit)

28.1. Component View

RF UNIT

G601G602G603

G604 G605 G606

IC571

IC501

E C

B

E C

BE

C B

E C

B

BCE

BCE BCE

IC301

IC331

IC751

IC761

IC741

KX-TG2559LBS

87

28.2. Flow Solder Side View

IC55

1B

E C

B E C

KX-TG2559LBS

88

29 CIRCUIT BOARD (Handset)29.1. Component View

IC20

1

E B

CE B

C

E BC

E BC

E BC

E BC

B EC

B EC

IC202

E BCB E

C

RF UNIT

IC20

4

IC203

IC20

5

KX-TG2559LBS

89

29.2. F

low

So

lder

Sid

eV

iew

D216

CN201

LED207LED206LED205

LINE1 LINE2 CONF

TALK UP DIRECT

LEFT

FUNC/EXIT DOWN

1 2 3

4 5 6

7 8

LED203

R203

LED204

R204

9

0 SYA

RDL/PAUSEFLS/CWIT

RIGHT

INT/CLEAR

R205R206

C215 C212

R272

C297C298

E B

C

R207

Q203

R261

R262C

211R

217C

210C

209C

208C

207C

206

R218

LED201

R201

LED202

R202

KX

-TG

2559LB

S

90

91

KX-TG2559LBS

M.HKXTG2559LBSPrinted in Japan

kx-tg2556lbs

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