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KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVBand FRDM-40XSF5-EVB evaluation boardsRev. 2.0 — 18 July 2018 User guide
1 FRDM-17XSF5-EVB
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20182 / 22
2 Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OREVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to aprinted circuit board to make it easier to access inputs, outputs, and supply terminals.This evaluation board may be used with any development system or other source ofI/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This evaluation board is not a Reference Design and is not intended torepresent a final design recommendation for any particular application. Final device inan application will be heavily dependent on proper printed circuit board layout and heatsinking design as well as attention to supply filtering, transient suppression, and I/Osignal quality.
The goods provided may not be complete in terms of required design, marketing, andor manufacturing related protective considerations, including product safety measurestypically found in the end product incorporating the goods. Due to the open constructionof the product, it is the user's responsibility to take any and all appropriate precautionswith regard to electrostatic discharge. In order to minimize risks associated with thecustomers applications, adequate design and operating safeguards must be providedby the customer to minimize inherent or procedural hazards. For any safety concerns,contact NXP sales and technical support services.
Should this evaluation kit not meet the specifications indicated in the kit, it may bereturned within 30 days from the date of delivery and will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein.NXP makes no warranty, representation or guarantee regarding the suitability of itsproducts for any particular purpose, nor does NXP assume any liability arising out of theapplication or use of any product or circuit, and specifically disclaims any and all liability,including without limitation consequential or incidental damages. “Typical” parameterscan and do vary in different applications and actual performance may vary over time.All operating parameters, including “Typical”, must be validated for each customerapplication by customer’s technical experts.
NXP does not convey any license under its patent rights nor the rights of others. NXPproducts are not designed, intended, or authorized for use as components in systemsintended for surgical implant into the body, or other applications intended to support orsustain life, or for any other application in which the failure of the NXP product couldcreate a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended orunauthorized application, the Buyer shall indemnify and hold NXP and its officers,employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of personal injury or death associated with such unintended orunauthorized use, even if such claim alleges NXP was negligent regarding the designor manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All otherproduct or service names are the property of their respective owners. © 2018 NXP B.V.
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20183 / 22
3 Getting started
The NXP analog product development boards provide an easy-to-use platform forevaluating NXP products. These development boards support a range of analog, mixed-signal, and power solutions. These boards incorporate monolithic integrated circuits andsystem-in-package devices that use proven high-volume technology. NXP products offerlonger battery life, a smaller form factor, reduced component counts, lower cost, andimproved performance in powering state-of-the-art systems.
The tool summary page is at http://www.nxp.com/FRDM-MC12XSF. The overview tab onthis page provides an overview of the device, a list of device features, a description of thekit contents, links to supported devices and a Get Started section.
The Get Started section provides information applicable to using the kit.
1. Go to http://www.nxp.com/FRDM-MC12XSF.2. On the Overview tab, locate the Jump To navigation feature on the left side of the
window.3. Select the Get Started link.4. Review each entry in the Get Started section.5. Download an entry by clicking on the linked title.
After reviewing the Overview tab, visit the other related tabs for additional information:
• Documentation: Download current documentation.• Software & Tools: Download current hardware and software tools.• Buy/Parametrics: Purchase the product and view the product parametrics.
After downloading files, review each file, including the user guide, which includes setupinstructions. If applicable, the bill of materials (BOM) and supporting schematics are alsoavailable for download in the Get Started section of the Overview tab.
3.1 Kit contents/packing listThe FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB andFRDM-40XSF5-EVB contents include:
• Assembled and tested evaluation board/module in anti-static bag• Connector 1x2 for power supply• Connector 1x6 for loads• Quick start guide• Warranty card
3.2 Required equipmentThis kit requires the following items:
• Power supply 7.0 to 18 V• Typical loads (DC motor, LED, bulb)• One of the following MCU boards:
– FRDM-KL25Z– FRDM-K64F– FRDM-KV10Z
• SPIGen
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20184 / 22
• CodeWarrior 10.6 or higher, Kinetis Design Studio 3.0.0 or higher, Driver Suite 10.4 orhigher, Processor Expert version RT6 or higher
3.3 System requirementsThe kit requires the following to function properly with the software:
• USB-enabled PC with Windows® XP or higher
4 Understanding the Freedom platform
The NXP Freedom development platform is a small, low-power, cost-effective evaluationand development system for quick application prototyping and demonstration of KinetisMCU families.
Figure 1. Freedom platform – MCU Freedom board with analog Freedom shield
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20185 / 22
5 Getting to know the hardware
5.1 Board overviewThe FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB andFRDM-40XSF5-EVB evaluation boards feature one of the ICs belonging to NXP’s 12XSFand 12XS6 high-side switch family.
The board incorporates up to 5 outputs with freewheeling diode protection and LEDindication, external smart power switch control output, on-board voltage regulator andlevel shifter (from 3.3 V to 5.0 V logic) and switch to enable operation of up to four boardsin parallel with separate chip-select pins (parallel SPI operation).
5.2 Device features12XSF and 12XS6 families of eXtreme switch products are the latest achievement inDC motors and automotive (12XS6) / industrial (12XSF) lighting drivers. The productsbelong to an expanding family to control and diagnose various types of loads, such asincandescent bulbs or light emitting diodes (LEDs), with enhanced precision.
The products combine flexibility through daisy-chainable SPI at 5.0 MHz, extended digitaland analog feedbacks, which supports safety and robustness.
This fourth generation of NXP's high-side switch family facilitates electronic control unitdesigns supported by the use of compatible MCU software and PCB footprints, for eachdevice variant.
Common features of 12XSF/12XS6 family:
• Operating voltage range of 7.0 V to 18 V, with sleep current < 5.0 µA• 5.0 MHz 16-bit SPI control of overcurrent profiles, channel control including 8-bit PWM
duty-cycles, output ON and OFF open load detections, thermal shutdown and pre-warning and fault reporting
• Output current monitoring with programmable synchronization signal and supplyvoltage feedback
• Programmable overcurrent trip levels• Watchdog and limp home mode• External smart power switch control (output 6)• −16 V reverse polarity and ground disconnect protections• Compatible PCB foot print and SPI software driver among the family
The 12XSF/12XS6 family products differ in number of available outputs and its RDS(on)resistance. The ICs present on one of the Freedom evaluation boards are in Table 1.
Table 1. Device featuresProduct number No. of outputs OUT1 OUT2 OUT3 OUT4 OUT5 OUT6
MC08XSF421 and MC08XS6421 4 + 1 21 mΩ 21 mΩ 8 mΩ 8 mΩ N.C Yes
MC17XSF400 and MC17XS6400 4 + 1 17 mΩ 17 mΩ 17 mΩ 17 mΩ N.C Yes
MC17XSF500 and MC17XS6500 5 + 1 17 mΩ 17 mΩ 17 mΩ 17 mΩ 17 mΩ Yes
MC40XSF500 and MC40XS6500 5 + 1 40 mΩ 40 mΩ 40 mΩ 40 mΩ 40 mΩ Yes
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20186 / 22
5.3 Board descriptionFigure 2 describes the main blocks of the evaluation board.
2
3
4
1
5 6 7 8 9
10
11
12
13
14
15
17 161819
Figure 2. Freedom board overview (without load)
Table 2. Freedom board overviewNumber Description
1 SW2 CS pin selection
2 Connector J8 (Power supply)
3 Connector J1 (Power supply)
4 Connector J2 (OUT6)
5 5.0 V power supply LED
6 LIMP button
7 Connector J4
8 Connector J6
9 Output LEDs
10 Connector J7 (OUT2)
11 Connector J7 (OUT4)
12 Connector J7 (OUT5)
13 Connector J7 (OUT3)
14 Connector J7 (OUT1)
15 Connector J7 (GND)
16 MC17XSF500 IC
17 Connector J5
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20187 / 22
Number Description
18 Connector J3
19 SW1 Direct control inputs
5.3.1 LEDs
The following LEDs are provided as visual output devices for the board:
Table 3. LED descriptionLED identifier Description
D7 5 V power supply present (voltage regulator output)
D8 Output 1
D9 Output 2
D10 Output 3
D11 Output 4
D12 Output 5
5.3.2 Connectors
Input/output connectors provide the following signals:
Table 4. Connectors descriptionConnector identifier Description
J1 VBAT Power (and AGND) connector
J2 External smart power switch control output (and AGND)connector
J3 2x10 Freedom board header
J4 2x8 Freedom board header
J5 2x8 Freedom board header
J6 2x6 Freedom board header
J7 Output 1 to 5 (and AGND) connector
J8 VBAT Power (and AGND) 5.5/2.1 mm socket
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20188 / 22
5.3.3 Switches definition
The following table defines the evaluation board switches and explains their functions:
Table 5. Switches definitionSwitch Description Setting Connection
ON Corresponding channel is onwhen direct inputs are usedand no level on MCU pin isset
SW1 Direct control inputs foroutputs 1 to 4
OFF Corresponding channel is offwhen direct inputs are usedand no level on MCU pin isset
1 ON, other OFF CSB3 used as chip-select pin
2 ON, other OFF CSB2 used as chip-select pin
3 ON, other OFF CSB1 used as chip-select pin
SW2 Chip-select pin selection
4 ON, other OFF CSB0 used as chip-select pin
5.3.4 Test point definition
The following test point provides access to various signals to and from the board:
Table 6. Test point definitionTest point Signal name Description
TP1 AGND Common ground for both MCU and analog Freedom board
5.3.5 Freedom board headers
Table 7 contains information about compatibility with selected MCU Freedom boards:
Table 7. Compatibility with selected MCU Freedom boardsFRDM-12XSF-EVB Pin description FRDM-KL25Z FRDM-K64F FRDM-KV10Z
J3 1 RSTB_FRDM eXtreme Switch reset J2 1 PTC12 J2 1 PTE26 J2 1 PTE18
J3 3 IN1 Direct control input 1 J2 3 PTC13 J2 3 X J2 3 PTB1
J3 5 IN2 Direct control input 2 J2 5 PTC16 J2 5 X J2 5 PTE19
J3 6 CSB0 Chip-select 0 J2 6 PTD0 J2 6 PTD0 J2 6 PTD6
J3 7 IN3 Direct control input 3 J2 7 PTC17 J2 7 X J2 7 PTE17
J3 8 MOSI SPI MOSI data J2 8 PTD2 J2 8 PTD2 J2 8 PTC6
J3 9 IN4 Direct control input 4 J2 9 PTA16 J2 9 X J2 9 PTE30
J3 10 MISO SPI MISO data J2 10 PTD3 J2 10 PTD3 J2 10 PTD3
J3 12 CLK SPI clock J2 12 PTD1 J2 12 PTD1 J2 12 PTC5
J3 13 CSB1 Chip-select 1 J2 13 PTE31 J2 13 X J2 13 X
J3 18 CSB3 Chip-select 3 J2 18 PTE0 J2 18 X J2 18 X
J3 19 CSB2 Chip-select 2 J2 19 PTD7 J2 19 X J2 19 X
J5 5 CLK_FRDM External clock for PWM J1 5 PTC3 J1 5 PTC1 J1 5 PTE25
J5 6 CSNS_SYNC Monitoring synchronization J1 6 PTD4 J1 6 PTB9 J1 6 X
J6 6 CSNS Monitoring output J10 6 PTB2 J4 6 PTB10 J4 6 X
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 20189 / 22
6 Installing the software and setting up the hardware
6.1 Using SPIGen software
6.1.1 Installing SPIGen freeware on your computer
The latest version of SPIGen is designed to run on Windows 8, Windows 7, Vista or XP-based operating systems.
To install the software, go to http://www.nxp.com/FRDM-MC12XSF. Locate and clickJump Start Your Design.
1. Download the SPIGen software as well as the associated configuration file.2. Run the install program from the desktop. The Installation Wizard conducts the rest of
the process.3. To use SPIGen, go to the Windows Start menu, Programs, SPIGen, and then click
on the SPIGen icon. The SPIGen Graphic User Interface (GUI) appears.4. Go to the file menu in the upper left hand corner of the GUI, and select Open. Browse
for the configuration file that was saved on the desktop earlier with the Jump start andselect it (“12XSF_SPIGEN_eval.spi”), then click Open.
5. The GUI shown in Figure 3 presents some basic SPI commands for quick evaluationof 12XSF devices in addition with access to I/Os with Extra pins. The commands aresent once (single command) or continuously in a loop (batch command).
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201810 / 22
Figure 3. SPIGen GUI
6.1.2 Connecting FRDM-KL25Z Freedom Development Platform
FRDM-17XSF5-EVB can be used with KL25Z Freedom board using SPIGEN software.An USB cable from a USB host connected to KL25Z mini-B USB connector, SPIGEN (7.xand above) and a power supply are needed to use the kit.
Installing the drivers
To flash the Freedom board using drag and drop from Windows Explorer, USB Driversand OpenSDA Firmware (MSD & Debug) from P&E Micro http://www.pemicro.com/opensda must be loaded on the board.
1. Enter OpenSDA Bootloader ModeUnplug the USB cable if attached. Press and hold the Reset button (SW1). Plug ina USB cable between a USB host and the OpenSDA USB connector. Release theReset button. A removable drive is visible in the host file system with a volume label ofBOOTLOADER. You are now in OpenSDA Bootloader mode.
2. Load an OpenSDA ApplicationLocate the OpenSDA Applications folder from the downloaded zip file. Copy andpaste or drag and drop the MSD Flash Programmer Application (MSD-FRDM-
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201811 / 22
KL25Z_vXYZ_Pemicro.SDA) to the BOOTLOADER drive (Make sure to unzip the filebefore doing the paste or drop). Unplug the USB cable and plug it again into the SDAUSB Connector. The new OpenSDA Application is now running and a FRDM-KL25Zdrive visible in the host file system.
3. Enter OpenSDA Bootloader ModeLocate SPIGEN UsbSpiDongleKL25Z_XXX.srec image folder in SPIGEN folder (C:\Program Files (x86)\SPIGen\SPI Dongle Firmware). Copy and paste or drag anddrop the .srec files to the FRDM-KL25Z drive. Unplug the USB cable for the openSDA USB Connector and plug it to the USB_KL25Z.
6.1.3 Setting up the hardware using SPIGen
To perform the examples included in the software bundle, the following connections andsetup must be performed:
1. Attach the +12 VDC supply to the VBAT input connector on the FRDM-17XSF5-EVBon J8 or J1 (making sure to observe the GND and +12 V terminals). The currentcapability of the +12 V supply should exceed the maximum total current that thenumber of simultaneously ON loads require.
2. Attach loads to the output terminals (OUT1..5).3. Turn on the +12 V supply. Verify all is working correctly by observing the +5.0 V LED
D7, which should be illuminated. .4. Connect the KL25Z to the PC using the USB KL25Z port (left side of SW1). The
hardware connection is shown in Figure 4. A window pops up on the SPIGEN GUI asshown in Figure 5.
Figure 4. Hardware setup
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
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User guide Rev. 2.0 — 18 July 201812 / 22
Figure 5. FRDM-KL25Z connected
6.1.4 Running the example batch files
1. Make sure that bundle 12XSF_SPIGEN_eval.spi is loaded on your SPIGEN interface.2. Go to the Batch commands page and select the batch file you want to run. There are
some choices that allows to Turn ON some outputs, simply refresh the Watchdog andread register, or root the IC’s temperature to the analog pin CSNS. Click on the SendContinuously button.
3. Observe the desire effect on the outputs or on analog feedback pin CSNS. Note thatwe can force Fail-safe mode during the SPI communication by pushing LIMP buttonon board (SW3).
6.2 Using Kinetis Design Studio and Processor ExpertThe Gen4eXtremeSwitch component for 12XSF and 12XS6 handles initialization, run-time configuration and diagnosis of the device via SPI, feedback measurement and directinput control.
The component package contains various examples showing features of both thecomponent and the device. The component and some examples in the componentpackage are intended for Kinetis Design Studio 3.2.0. For more information aboutGen4eXtremeSwitch component, Processor Expert and installation of KinetisDesign Studio, see Gen4eXtremeSwitch component user guide available at http://www.nxp.com/GEN4-EXTREMESWITCH-PEXPERT.
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201813 / 22
7 Schematics
7.1 FRDM-17XSF5-EVB
5 5
4 4
3 3
2 2
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0.02
2UF
U2
MC
17X
SF
500B
EK
CS
3
SC
LK4
SI
5
SO
7
OU
T6
8
VPWR33
IN2
28
RS
T2
OU
T4_
314
LIM
P31
CLK
32
NC
216
OU
T5_
117
OU
T5_
218
OU
T3_
119
OU
T3_
220
OU
T3_
321
VCC6
GND19
OU
T4_
213
OU
T4_
112
OU
T2_
211
OU
T2_
110
IN4
30IN
329
CP
1
OU
T1_
122
OU
T1_
223
GND224
CS
NS
25
CS
NS
_SY
NC
26
NC
115
IN1
27R
710
.0K
J7 CO
N_1
X6
123456
VC
C
GN
D
U4
74LV
C1G
125G
W-Q
100
1 2 345
J8
DC
_PO
WE
R_J
AC
K
1 32
R5
10.0
K
J1 CO
N_1
X2
1 2
D6
1N40
02
AC
J3 CO
N_2
X10
12
34 6
5 78
910
1112
1314
1516
1718
1920
J5 CO
N_2
X8
12
34 6
5 78
910
1112
1314
1516
D5
1N40
02
AC
R8
3K
R9
10.0
K
D4
1N40
02
AC
R12
10.0
K
TP
1
D3
1N40
02
AC
C14
0.1U
F
R14
10.0
K
C5
0.1U
F
D2
1N40
02
AC
R2
10.0
K
C4
0.1U
F
C3 10
uF
U1
LP29
50A
CD
T-5
.0G
OU
T3
IN1
GND4
C2
10uF
SH
3
SO
LDE
R S
HO
RT
D1
CM
MR
1U-0
2
AC
R4
10.0
K
J2 PLU
G_1
X2
1 2
C1
10uF
SW
2
SW
_DIP
-4/S
M1234
8765
R11
1K
D10
GR
EE
N
A C
SH
2
SO
LDE
R S
HO
RT
SH
1
SO
LDE
R S
HO
RT
D8
GR
EE
N
A C
Figure 6. FRDM-17XSF5-EVB
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201814 / 22
7.2 FRDM-17XSF4-EVB
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Level Shifter
FRDM
RS
TB
SP
I0_C
SB
CLK
SP
I0_C
LKS
PI0
_MO
SI
SP
I0_M
ISO
CS
NS
_SY
NC
B
CS
NS
OU
T_6
LIM
P
IN1
IN2
IN3
SP
I0_C
SB
1
SP
I0_C
SB
2
OUT_2OUT_4OUT_5OUT_3OUT_1
OU
T_6
SP
I0_C
SB
3S
PI0
_CS
B2
SP
I0_C
SB
1S
PI0
_CS
B0
OU
T_3
OU
T_2
OU
T_1
SP
I0_C
SB
_FR
DM
SP
I0_M
OS
I_F
RD
M
SP
I0_C
LK_F
RD
M
RS
TB
_FR
DM
SP
I0_C
SB
SP
I0_M
OS
I
SP
I0_C
LK
RS
TB
RS
TB
_FR
DM
IN4
CLK
_FR
DM
CLK
_FR
DM
IN2
IN3
IN4
OU
T_5
OU
T_4
OU
T_1
OU
T_2
OU
T_3
OU
T_4
OU
T_5
SP
I0_C
SB
_FR
DM
IN1
CLK
SP
I0_C
SB
0S
PI0
_MO
SI_
FR
DM
SP
I0_M
ISO
_FR
DM
SP
I0_C
SB
3
SP
I0_C
LK_F
RD
M
CS
NS
CS
NS
_SY
NC
B
SP
I0_M
ISO
SP
I0_M
ISO
_FR
DM
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
5V
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
VB
AT
VB
AT
VB
AT
VB
AT
5V
5V
5V
5V
5V
P3_
3V
AG
ND
AG
ND
P3_
3V
AG
ND
AG
ND
Dra
win
g T
itle:
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
Pag
e T
itle:
ICA
P C
lass
ifica
tion:
CP
:IU
O:
PU
BI:
SC
H-2
9222
PD
F: S
PF
-292
22F
1
FR
DM
-17X
SF
4-E
VB
C
Frid
ay, M
arch
04,
201
6
FRD
M-1
7XS
F4-E
VB
33
___
___
XD
raw
ing
Titl
e:
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
Pag
e T
itle:
ICA
P C
lass
ifica
tion:
CP
:IU
O:
PU
BI:
SC
H-2
9222
PD
F: S
PF
-292
22F
1
FR
DM
-17X
SF
4-E
VB
C
Frid
ay, M
arch
04,
201
6
FRD
M-1
7XS
F4-E
VB
33
___
___
XD
raw
ing
Titl
e:
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
Pag
e T
itle:
ICA
P C
lass
ifica
tion:
CP
:IU
O:
PU
BI:
SC
H-2
9222
PD
F: S
PF
-292
22F
1
FR
DM
-17X
SF
4-E
VB
C
Frid
ay, M
arch
04,
201
6
FRD
M-1
7XS
F4-E
VB
33
___
___
X
R6
10.0
KD
NP
D9
GR
EE
N
A C
SH
5
SO
LDE
R S
HO
RT
U2
MC
17X
SF
400E
K
CS
3
SC
LK4
SI
5
SO
7
OU
T6
8
VPWR33
IN2
28
RS
T2
OU
T4_
314
LIM
P31
CLK
32
NC
216
NC
317
NC
418
OU
T3_
119
OU
T3_
220
OU
T3_
321
VCC6
GND19
OU
T4_
213
OU
T4_
112
OU
T2_
211
OU
T2_
110
IN4
30IN
329
CP
1
OU
T1_
122
OU
T1_
223
GND224
CS
NS
25
CS
NS
_SY
NC
26
NC
115
IN1
27
D12
GR
EE
ND
NP
A C
C15
0.1U
F
SW
3LI
GH
T T
OU
CH
PU
SH
BU
TT
ON
14
23
C6
0.01
UF
C7
0.02
2UF
J6 CO
N_2
X6
12
34 6
5 78
910
1112
SW
1S
W_D
IP-4
/SM
1234
8765
SH
4
SO
LDE
R S
HO
RT
R13
10.0
K
J4 CO
N_2
X8
12
34 6
5 78
910
1112
1314
1516
D11
GR
EE
N
A C
D7
GR
EE
N
A C
C8
0.02
2UF
R3
10.0
K
C12
0.1U
F
C9
0.02
2UF
R1
220
C10
0.02
2UF
HE
F40
50B
T
U3
1A3
1Y2
2A5
2Y4
3A7
3Y6
4A9
4Y10
5A11
5Y12
6A14
6Y15
NC
113
NC
216
VDD1
VSS8
R10
5.0K
C11
0.02
2UF
DN
P
R7
10.0
K
VC
C
GN
D
U4
74LV
C1G
125G
W-Q
100
1 2 345
J7 CO
N_1
X6
123456
J8
DC
_PO
WE
R_J
AC
K
1 32
R5
10.0
K
J1 CO
N_1
X2
1 2
D6
1N40
02D
NP
AC
J3 CO
N_2
X10
12
34 6
5 78
910
1112
1314
1516
1718
1920
J5 CO
N_2
X8
12
34 6
5 78
910
1112
1314
1516
D5
1N40
02
AC
R9
10.0
K
D4
1N40
02
AC
R12
10.0
K
TP
1
D3
1N40
02
AC
C14
0.1U
F
R14
10.0
K
C5
0.1U
F
D2
1N40
02
AC
R2
10.0
K
C4
0.1U
F
C3 10
uF
U1
LP29
50A
CD
T-5
.0G
OU
T3
IN1
GND4
C2
10uF
SH
3
SO
LDE
R S
HO
RT
D1
CM
MR
1U-0
2
AC
R4
10.0
K
J2 PLU
G_1
X2
1 2
C1
10uF
SW
2
SW
_DIP
-4/S
M1234
8765
R11
1K
D10
GR
EE
N
A C
SH
2
SO
LDE
R S
HO
RT
SH
1
SO
LDE
R S
HO
RT
D8
GR
EE
N
A C
R8
3K
Figure 7. FRDM-17XSF4-EVB
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201815 / 22
7.3 FRDM-08XSF4-EVB
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Level Shifter
FRDM
RS
TB
SP
I0_C
SB
CLK
SP
I0_C
LKS
PI0
_MO
SI
SP
I0_M
ISO
CS
NS
_SY
NC
B
CS
NS
OU
T_6
LIM
P
IN1
IN2
IN3
SP
I0_C
SB
1
SP
I0_C
SB
2
OUT_2OUT_4OUT_5OUT_3OUT_1
OU
T_6
SP
I0_C
SB
3S
PI0
_CS
B2
SP
I0_C
SB
1S
PI0
_CS
B0
OU
T_3
OU
T_2
OU
T_1
SP
I0_C
SB
_FR
DM
SP
I0_M
OS
I_F
RD
M
SP
I0_C
LK_F
RD
M
RS
TB
_FR
DM
SP
I0_C
SB
SP
I0_M
OS
I
SP
I0_C
LK
RS
TB
RS
TB
_FR
DM
IN4
CLK
_FR
DM
CLK
_FR
DM
IN2
IN3
IN4
OU
T_5
OU
T_4
OU
T_1
OU
T_2
OU
T_3
OU
T_4
OU
T_5
SP
I0_C
SB
_FR
DM
IN1
CLK
SP
I0_C
SB
0S
PI0
_MO
SI_
FR
DM
SP
I0_M
ISO
_FR
DM
SP
I0_C
SB
3
SP
I0_C
LK_F
RD
M
CS
NS
CS
NS
_SY
NC
B
SP
I0_M
ISO
SP
I0_M
ISO
_FR
DM
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
5V
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
AG
ND
VB
AT
VB
AT
VB
AT
VB
AT
5V
5V
5V
5V
5V
P3_
3V
AG
ND
AG
ND
P3_
3V
AG
ND
AG
ND
Dra
win
g T
itle:
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
Pag
e T
itle:
ICA
P C
lass
ifica
tion:
CP
:IU
O:
PU
BI:
SC
H-2
9224
PD
F: S
PF
-292
24F
1
FR
DM
-08X
SF
4-E
VB
C
Frid
ay, M
arch
04,
201
6
FRD
M-0
8XS
F4-E
VB
33
___
___
XD
raw
ing
Titl
e:
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
Pag
e T
itle:
ICA
P C
lass
ifica
tion:
CP
:IU
O:
PU
BI:
SC
H-2
9224
PD
F: S
PF
-292
24F
1
FR
DM
-08X
SF
4-E
VB
C
Frid
ay, M
arch
04,
201
6
FRD
M-0
8XS
F4-E
VB
33
___
___
XD
raw
ing
Titl
e:
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
Pag
e T
itle:
ICA
P C
lass
ifica
tion:
CP
:IU
O:
PU
BI:
SC
H-2
9224
PD
F: S
PF
-292
24F
1
FR
DM
-08X
SF
4-E
VB
C
Frid
ay, M
arch
04,
201
6
FRD
M-0
8XS
F4-E
VB
33
___
___
X
R6
10.0
KD
NP
D9
GR
EE
N
A C
SH
5
SO
LDE
R S
HO
RT
D12
GR
EE
ND
NP
A C
C15
0.1U
F
SW
3LI
GH
T T
OU
CH
PU
SH
BU
TT
ON
14
23
C6
0.01
UF
U2
MC
08X
SF
421E
KCS
3
SC
LK4
SI
5
SO
7
OU
T6
8
VPWR33
IN2
28
RS
T2
OU
T4_
314
LIM
P31
CLK
32
NC
216
NC
317
NC
418
OU
T3_
119
OU
T3_
220
OU
T3_
321
VCC6
GND19
OU
T4_
213
OU
T4_
112
OU
T2_
211
OU
T2_
110
IN4
30IN
329
CP
1
OU
T1_
122
OU
T1_
223
GND224
CS
NS
25
CS
NS
_SY
NC
26
NC
115
IN1
27
C7
0.02
2UF
J6 CO
N_2
X6
12
34 6
5 78
910
1112
SW
1S
W_D
IP-4
/SM
1234
8765
SH
4
SO
LDE
R S
HO
RT
R13
10.0
K
J4 CO
N_2
X8
12
34 6
5 78
910
1112
1314
1516
D11
GR
EE
N
A C
D7
GR
EE
N
A C
C8
0.02
2UF
R3
10.0
K
C12
0.1U
F
C9
0.02
2UF
R1
220
C10
0.02
2UF
R8
3K
HE
F40
50B
T
U3
1A3
1Y2
2A5
2Y4
3A7
3Y6
4A9
4Y10
5A11
5Y12
6A14
6Y15
NC
113
NC
216
VDD1
VSS8
R10
5.0K
C11
0.02
2UF
DN
P
R7
10.0
K
VC
C
GN
D
U4
74LV
C1G
125G
W-Q
100
1 2 345
J7 CO
N_1
X6
123456
J8
DC
_PO
WE
R_J
AC
K
1 32
R5
10.0
K
J1 CO
N_1
X2
1 2
D6
1N40
02D
NP
AC
J3 CO
N_2
X10
12
34 6
5 78
910
1112
1314
1516
1718
1920
J5 CO
N_2
X8
12
34 6
5 78
910
1112
1314
1516
D5
1N40
02
AC
R9
10.0
K
D4
1N40
02
AC
R12
10.0
K
TP
1
D3
1N40
02
AC
C14
0.1U
F
R14
10.0
K
C5
0.1U
F
D2
1N40
02
AC
R2
10.0
K
C4
0.1U
F
C3 10
uF
U1
LP29
50A
CD
T-5
.0G
OU
T3
IN1
GND4
C2
10uF
SH
3
SO
LDE
R S
HO
RT
D1
CM
MR
1U-0
2
AC
R4
10.0
K
J2 PLU
G_1
X2
1 2
C1
10uF
SW
2
SW
_DIP
-4/S
M1234
8765R
111K
D10
GR
EE
N
A C
SH
2
SO
LDE
R S
HO
RT
SH
1
SO
LDE
R S
HO
RT
D8
GR
EE
N
A C
Figure 8. FRDM-08XSF4-EVB
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201816 / 22
7.4 FRDM-40XSF5-EVB
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Level Shifter
FRDM
RS
TB
SP
I0_C
SB
CLK
SP
I0_C
LKS
PI0
_MO
SI
SP
I0_M
ISO
CS
NS
_SY
NC
B
CS
NS
OU
T_6
LIM
P
IN1
IN2
IN3
SP
I0_C
SB
1
SP
I0_C
SB
2
OUT_2OUT_4OUT_5OUT_3OUT_1
OU
T_6
SP
I0_C
SB
3S
PI0
_CS
B2
SP
I0_C
SB
1S
PI0
_CS
B0
OU
T_3
OU
T_2
OU
T_1
SP
I0_C
SB
_FR
DM
SP
I0_M
OS
I_F
RD
M
SP
I0_C
LK_F
RD
M
RS
TB
_FR
DM
SP
I0_C
SB
SP
I0_M
OS
I
SP
I0_C
LK
RS
TB
RS
TB
_FR
DM
IN4
CLK
_FR
DM
CLK
_FR
DM
IN2
IN3
IN4
OU
T_5
OU
T_4
OU
T_1
OU
T_2
OU
T_3
OU
T_4
OU
T_5
SP
I0_C
SB
_FR
DM
IN1
CLK
SP
I0_C
SB
0S
PI0
_MO
SI_
FR
DM
SP
I0_M
ISO
_FR
DM
SP
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Figure 9. FRDM-40XSF5-EVB
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201817 / 22
8 Board layout
Figure 10. Top layout
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201818 / 22
Figure 11. Bottom layout
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201819 / 22
9 Bill of materials
Bill of materials for FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVBand FRDM-40XSF5-EVB are available at http://www.nxp.com/FRDM-MC12XSF on theOverview tab under Get Started.
10 References
Following are URLs where you can obtain information on related NXP products andapplication solutions:
NXP.com support pages Description URL
Freedom development boards Freedom development platform http://www.nxp.com/freedom
Freedom evaluation board Freedom evaluation board for eXtremeswitch 12XSF and 12XS6
http://www.nxp.com/FRDM-MC12XSF
MC12XSF product summary page External industrial lighting 5 MHz SPI-controlled switch
http://www.nxp.com/MC12XSF
MC12XS6 product summary page External automotive lighting multichanneleXtreme switch
http://www.nxp.com/MC12XS6
FRDM-KL25Z Freedom development platform for KinetisKL14, KL15, KL24, KL25 MCUs
http://www.nxp.com/FRDM-KL25Z
SPIGen SPI generator software http://www.nxp.com/SPIGEN
Kinetis Design Studio Integrated development environment withProcessor Expert
http://www.nxp.com/KDS
11 Revision historyRevision historyRev Date Description
v.1 20160516 • Initial version
v.2 20180718 • Added automotive reference (MC12XS6) in Section 5.1, Section 5.2 and Section 10• Updated Section 3
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201820 / 22
12 Legal information
12.1 DefinitionsDraft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.
12.2 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does notgive any representations or warranties, expressed or implied, as to theaccuracy or completeness of such information and shall have no liabilityfor the consequences of use of such information. NXP Semiconductorstakes no responsibility for the content in this document if provided by aninformation source outside of NXP Semiconductors. In no event shall NXPSemiconductors be liable for any indirect, incidental, punitive, special orconsequential damages (including - without limitation - lost profits, lostsavings, business interruption, costs related to the removal or replacementof any products or rework charges) whether or not such damages are basedon tort (including negligence), warranty, breach of contract or any otherlegal theory. Notwithstanding any damages that customer might incur forany reason whatsoever, NXP Semiconductors’ aggregate and cumulativeliability towards customer for the products described herein shall be limitedin accordance with the Terms and conditions of commercial sale of NXPSemiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makesno representation or warranty that such applications will be suitablefor the specified use without further testing or modification. Customersare responsible for the design and operation of their applications andproducts using NXP Semiconductors products, and NXP Semiconductorsaccepts no liability for any assistance with applications or customer productdesign. It is customer’s sole responsibility to determine whether the NXPSemiconductors product is suitable and fit for the customer’s applicationsand products planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriatedesign and operating safeguards to minimize the risks associated withtheir applications and products. NXP Semiconductors does not accept anyliability related to any default, damage, costs or problem which is basedon any weakness or default in the customer’s applications or products, orthe application or use by customer’s third party customer(s). Customer isresponsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid adefault of the applications and the products or of the application or use bycustomer’s third party customer(s). NXP does not accept any liability in thisrespect.
Suitability for use in automotive applications — This NXPSemiconductors product has been qualified for use in automotiveapplications. Unless otherwise agreed in writing, the product is not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer's ownrisk.
Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with allfaults” basis for evaluation purposes only. NXP Semiconductors, its affiliatesand their suppliers expressly disclaim all warranties, whether express,implied or statutory, including but not limited to the implied warranties ofnon-infringement, merchantability and fitness for a particular purpose. Theentire risk as to the quality, or arising out of the use or performance, of thisproduct remains with customer. In no event shall NXP Semiconductors, itsaffiliates or their suppliers be liable to customer for any special, indirect,consequential, punitive or incidental damages (including without limitationdamages for loss of business, business interruption, loss of use, loss ofdata or information, and the like) arising out the use of or inability to usethe product, whether or not based on tort (including negligence), strictliability, breach of contract, breach of warranty or any other theory, even ifadvised of the possibility of such damages. Notwithstanding any damagesthat customer might incur for any reason whatsoever (including withoutlimitation, all damages referenced above and all direct or general damages),the entire liability of NXP Semiconductors, its affiliates and their suppliersand customer’s exclusive remedy for all of the foregoing shall be limited toactual damages incurred by customer based on reasonable reliance up tothe greater of the amount actually paid by customer for the product or fivedollars (US$5.00). The foregoing limitations, exclusions and disclaimersshall apply to the maximum extent permitted by applicable law, even if anyremedy fails of its essential purpose.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.
12.3 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
KTFRDM–MC12XSFUG All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
User guide Rev. 2.0 — 18 July 201821 / 22
TablesTab. 1. Device features ................................................. 5Tab. 2. Freedom board overview .................................. 6Tab. 3. LED description .................................................7Tab. 4. Connectors description ......................................7
Tab. 5. Switches definition ............................................ 8Tab. 6. Test point definition ...........................................8Tab. 7. Compatibility with selected MCU Freedom
boards ............................................................... 8
FiguresFig. 1. Freedom platform – MCU Freedom board
with analog Freedom shield .............................. 4Fig. 2. Freedom board overview (without load) ............ 6Fig. 3. SPIGen GUI .................................................... 10Fig. 4. Hardware setup ...............................................11Fig. 5. FRDM-KL25Z connected .................................12
Fig. 6. FRDM-17XSF5-EVB ........................................13Fig. 7. FRDM-17XSF4-EVB ........................................14Fig. 8. FRDM-08XSF4-EVB ........................................15Fig. 9. FRDM-40XSF5-EVB ........................................16Fig. 10. Top layout ....................................................... 17Fig. 11. Bottom layout .................................................. 18
NXP Semiconductors KTFRDM–MC12XSFUGFRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.
© NXP B.V. 2018. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]
Date of release: 18 July 2018
Contents1 FRDM-17XSF5-EVB ............................................. 12 Important notice ..................................................23 Getting started .................................................... 33.1 Kit contents/packing list ..................................... 33.2 Required equipment .......................................... 33.3 System requirements .........................................44 Understanding the Freedom platform ............... 45 Getting to know the hardware ........................... 55.1 Board overview ..................................................55.2 Device features ..................................................55.3 Board description ...............................................65.3.1 LEDs .................................................................. 75.3.2 Connectors .........................................................75.3.3 Switches definition .............................................85.3.4 Test point definition ........................................... 85.3.5 Freedom board headers .................................... 86 Installing the software and setting up the
hardware .............................................................. 96.1 Using SPIGen software ..................................... 96.1.1 Installing SPIGen freeware on your
computer ............................................................96.1.2 Connecting FRDM-KL25Z Freedom
Development Platform ..................................... 106.1.3 Setting up the hardware using SPIGen ............116.1.4 Running the example batch files ..................... 126.2 Using Kinetis Design Studio and Processor
Expert ...............................................................127 Schematics ........................................................ 137.1 FRDM-17XSF5-EVB ........................................ 137.2 FRDM-17XSF4-EVB ........................................ 147.3 FRDM-08XSF4-EVB ........................................ 157.4 FRDM-40XSF5-EVB ........................................ 168 Board layout ...................................................... 179 Bill of materials ................................................. 1910 References ......................................................... 1911 Revision history ................................................ 1912 Legal information ..............................................20