kiss-104 data sheet 9-30€¦ · pot inerts the molten solder surfaces. the nitrogen es-capes...

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FEATURES: High speed Inline “Selective Soldering” system that will reach all areas of a panel up to 18” x 24” in perimeter. SMEMA protocol interface ready, CE certified. Automated flux application and the flexible “traveling mini wave” soldering process developed for the KISS-102. Set-up camera, process witness camera, and solder level control are included, Windows XP O/S with simple on line teach or off line pro- gramming using Gerber, DXF or DWG files. Completely enclosed with built-in fume collection. CE certified and OSHA compatible. Creates top-side solder fillets to class 3 EIA specifications. PCB is held stationary during the process preventing com- ponents from toppling over and “unset” intermetalic fillets. No nozzle or tooling changes required for most applications. Absolute control over all critical process parameters: - Solder temperature interlocked to within 2 degrees C. - Height, and travel speed of the solder wave. - Programmable initial pre-heat soak - Fluxing functions Can rapidly switch between Lead and No-Lead alloy com- patible solder pots for dual process capability. DESCRIPTION: The K.I.S.S.-104 is a fully automated in-line selective sol- dering machine using the proven ‘traveling mini–solder wave”. It is used to install through hole components on double sided SMT boards within close proximity of adja- cent components. This system overcomes the limitations of operator dependent soldering with a truly flexible mol- ten solder delivery system. K.I.S.S.-104 couples high throughput with precise proc- ess controls. The programmable features provide the tools to set all process parameters, including flux applica- tion, solder immersion depths, pre-heat dwells, travel dis- tances and speeds, solder temperature and wave height. Once set, the system will repeat precisely. PROCESS OVERVIEW: The automated process begins with the PCB/panel enter- ing the K.I.S.S.-104 on the edge rail conveyors built into the system in normal SMEMA fashion. The PCB is clamped flat into location. The cycle begins by applying flux precisely to all the sites to be soldered. Next the mini solder wave is automatically moved under the compo- nents to be soldered. The solder nozzle raises to just be- low the site allowing the heated nitrogen to pre-heat the site and activate the flux. The nozzle raises up further im- mersing the first of the leads, dwelling for initial “soak”. The nozzle travels over the entire site leaving perfect top and bottom side fillets at each pin. At the completion of the travel the solder pot lowers and moves to the next site. After completing the cycle the pot returns to the start position ready for the next cycle while the completed PCB/panel conveys out and the next PCB/panel conveys in. All programmed sites are soldered in the same cycle. A automated stepping function allows for processing ar- rays of boards in an X-Y matrix with minimal program- ming. A.C.E. Production Technologies l Spokane Valley WA (509) 924- 4898 l http:/www.ace- protech.com Model KISS-104 “Keep It Simple Soldering” “The Affordable” In- Line Selective Soldering Machine

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Page 1: KISS-104 Data Sheet 9-30€¦ · pot inerts the molten solder surfaces. The nitrogen es-capes surrounding the solder nozzle and PCB as the solder wave contacts the terminals, functionally

FEATURES High speed Inline ldquoSelective Solderingrdquo system that will

reach all areas of a panel up to 18rdquo x 24rdquo in perimeter

SMEMA protocol interface ready CE certified

Automated flux application and the flexible ldquotraveling mini

waverdquo soldering process developed for the KISS-102

Set-up camera process witness camera and solder level

control are included

Windows XP OS with simple on line teach or off line pro-

gramming using Gerber DXF or DWG files

Completely enclosed with built-in fume collection

CE certified and OSHA compatible

Creates top-side solder fillets to class 3 EIA specifications

PCB is held stationary during the process preventing com-

ponents from toppling over and ldquounsetrdquo intermetalic fillets

No nozzle or tooling changes required for most applications

Absolute control over all critical process parameters

- Solder temperature interlocked to within 2 degrees C

- Height and travel speed of the solder wave

- Programmable initial pre-heat soak

- Fluxing functions

Can rapidly switch between Lead and No-Lead alloy com-

patible solder pots for dual process capability

DESCRIPTION The KISS-104 is a fully automated in-line selective sol-dering machine using the proven lsquotraveling minindashsolder waverdquo It is used to install through hole components on double sided SMT boards within close proximity of adja-cent components This system overcomes the limitations of operator dependent soldering with a truly flexible mol-ten solder delivery system KISS-104 couples high throughput with precise proc-ess controls The programmable features provide the tools to set all process parameters including flux applica-tion solder immersion depths pre-heat dwells travel dis-tances and speeds solder temperature and wave height Once set the system will repeat precisely

PROCESS OVERVIEW The automated process begins with the PCBpanel enter-ing the KISS-104 on the edge rail conveyors built into the system in normal SMEMA fashion The PCB is clamped flat into location The cycle begins by applying flux precisely to all the sites to be soldered Next the mini solder wave is automatically moved under the compo-nents to be soldered The solder nozzle raises to just be-low the site allowing the heated nitrogen to pre-heat the site and activate the flux The nozzle raises up further im-mersing the first of the leads dwelling for initial ldquosoakrdquo The nozzle travels over the entire site leaving perfect top and bottom side fillets at each pin At the completion of the travel the solder pot lowers and moves to the next site After completing the cycle the pot returns to the start position ready for the next cycle while the completed PCBpanel conveys out and the next PCBpanel conveys in All programmed sites are soldered in the same cycle A automated stepping function allows for processing ar-rays of boards in an X-Y matrix with minimal program-ming

ACE Production Technologies l Spokane Valley WA (509) 924-4898 l httpwwwace-protechcom

Model KISS-104 ldquoKeep It Simple Solderingrdquo

ldquoThe Affordablerdquo In-Line Selective Soldering Machine

KISS-104 SPECIFICATIONS

Conveyor PCB Panel Size

Minimum Maximum 2rdquo x 2rdquo 19rdquo x 26rdquo SMEMA edge 3mm clearance Motion

Z-Axis AccuracyRepeatability +-002 Speed 0-40 inchesmin Travel Distance = 30rdquo

X and Y Axis AccuracyRepeatability +-002 Speed 0-140 inchesmin Solder Pot

Temperature Controller PID proportioning (0-350degC) plusmn 2degC

Solder Capacity 30 lbs Pump PC programmable control

Controls

PC with Windows XP OS

Physical

Dimensions 48 wide x 40 deep Weight 475 lbs

Facilities

Power 120VAC1 Ph60 Hz 15 amps Nitrogen consumption 15-50 CFH (for std nozzles) Air None required Exhaust Built in fume collection

SOLDER POT The solder pot wetted surfaces are specially treated to withstand aggressive no-lead solder alloys The heaters are sized to bring the solder safely to temperature within an hour Re-circulation of solder is accomplished via a programmable controlled motor coupled to a impeller as-sembly The solder distribution system is designed to vir-tually eliminate dross build up while providing an ex-tremely consistent and repeatable solder wave shape A nitrogen blanket captured within the enclosed solder pot inerts the molten solder surfaces The nitrogen es-capes surrounding the solder nozzle and PCB as the solder wave contacts the terminals functionally minimiz-ing icicles and solder bridges while providing an inerted return of the solder from the nozzle back into the pot The solder temperature is interlocked within plusmn 2degC of set point The capacity of the solder pot ensures sufficient solder mass for even the largest assemblies The nozzles are magnetically fixed and can be ex-changed in seconds Two spherical ldquobullet waverdquo nozzles are supplied with the system These are sufficient for most applications Additional standard and special pur-pose nozzles can easily be used enabling selective sol-dering of wide patterns (multiple rows) in close proximity to previously soldered components without reflowing them

SET-UP The initial programming is accomplished by one of two methods at your desktop or on the machine On your desktop simply import the PCB CAD file and pick the startstop positions for all devices to be soldered The process path and script is automatically created for you Circular and angular interpolation allows soldering large round arrays angularly placed connectors and step-and-repeat function for multiple boards in a XY matrix Optionally use the setup camera and joystick function to jog the solder nozzle and fluxer directly to the start and end of the row of terminals to be soldered The program is created as you proceed over the sites Either method is intuitive with an average program created within 30 min You can fine tune the XY and Z positions speeds solder wave height and other parameters to perfect the process

Our web site has a downloadable software demonstration

OPTIONS The KISS-104 is fully equipped with only minimal op-tions availably

Matching support bench with storage shelf casters and leveling feet In-line pre-heat modules for very dense product Additional solder pot (lead or lead-free) Additional solder nozzles (see data sheet)

ACE Production Technologies l Spokane Valley WA (509) 924-4898 l httpwwwace-protechcom

Page 2: KISS-104 Data Sheet 9-30€¦ · pot inerts the molten solder surfaces. The nitrogen es-capes surrounding the solder nozzle and PCB as the solder wave contacts the terminals, functionally

KISS-104 SPECIFICATIONS

Conveyor PCB Panel Size

Minimum Maximum 2rdquo x 2rdquo 19rdquo x 26rdquo SMEMA edge 3mm clearance Motion

Z-Axis AccuracyRepeatability +-002 Speed 0-40 inchesmin Travel Distance = 30rdquo

X and Y Axis AccuracyRepeatability +-002 Speed 0-140 inchesmin Solder Pot

Temperature Controller PID proportioning (0-350degC) plusmn 2degC

Solder Capacity 30 lbs Pump PC programmable control

Controls

PC with Windows XP OS

Physical

Dimensions 48 wide x 40 deep Weight 475 lbs

Facilities

Power 120VAC1 Ph60 Hz 15 amps Nitrogen consumption 15-50 CFH (for std nozzles) Air None required Exhaust Built in fume collection

SOLDER POT The solder pot wetted surfaces are specially treated to withstand aggressive no-lead solder alloys The heaters are sized to bring the solder safely to temperature within an hour Re-circulation of solder is accomplished via a programmable controlled motor coupled to a impeller as-sembly The solder distribution system is designed to vir-tually eliminate dross build up while providing an ex-tremely consistent and repeatable solder wave shape A nitrogen blanket captured within the enclosed solder pot inerts the molten solder surfaces The nitrogen es-capes surrounding the solder nozzle and PCB as the solder wave contacts the terminals functionally minimiz-ing icicles and solder bridges while providing an inerted return of the solder from the nozzle back into the pot The solder temperature is interlocked within plusmn 2degC of set point The capacity of the solder pot ensures sufficient solder mass for even the largest assemblies The nozzles are magnetically fixed and can be ex-changed in seconds Two spherical ldquobullet waverdquo nozzles are supplied with the system These are sufficient for most applications Additional standard and special pur-pose nozzles can easily be used enabling selective sol-dering of wide patterns (multiple rows) in close proximity to previously soldered components without reflowing them

SET-UP The initial programming is accomplished by one of two methods at your desktop or on the machine On your desktop simply import the PCB CAD file and pick the startstop positions for all devices to be soldered The process path and script is automatically created for you Circular and angular interpolation allows soldering large round arrays angularly placed connectors and step-and-repeat function for multiple boards in a XY matrix Optionally use the setup camera and joystick function to jog the solder nozzle and fluxer directly to the start and end of the row of terminals to be soldered The program is created as you proceed over the sites Either method is intuitive with an average program created within 30 min You can fine tune the XY and Z positions speeds solder wave height and other parameters to perfect the process

Our web site has a downloadable software demonstration

OPTIONS The KISS-104 is fully equipped with only minimal op-tions availably

Matching support bench with storage shelf casters and leveling feet In-line pre-heat modules for very dense product Additional solder pot (lead or lead-free) Additional solder nozzles (see data sheet)

ACE Production Technologies l Spokane Valley WA (509) 924-4898 l httpwwwace-protechcom