k. anderson, a. gupta, j. pilcher, h.sanders, f. tang, r. teuscher, h. wu
DESCRIPTION
Introduction Interface Design Performance and Radiation Test Results Production Quality Control Conclusions. ATLAS Tile Calorimeter Interface The 8 th Workshop on Electronics for LHC Experiments, Colmar, 9-13 September 2002. K. Anderson, A. Gupta, J. Pilcher, H.Sanders, - PowerPoint PPT PresentationTRANSCRIPT
ATLAS Tile Calorimeter InterfaceThe 8th Workshop on Electronics for LHC Experiments, Colmar, 9-13
September 2002
K. Anderson, A. Gupta, J. Pilcher, H.Sanders, F. Tang, R. Teuscher, H. Wu
The University of Chicago
IntroductionInterface DesignPerformance and Radiation Test ResultsProduction Quality ControlConclusions
INTRODUCTION: TileCal and Its Readout
Electronics 64 modules in barrel region
(r1=2.28M r2=4.23M L=5.64M)
128 modules in extended regions
(r12.28M r24.23M L= 2.65M)
256 electronics drawers (64x4)
InterfaceTileCal Interface
INTRODUCTION: TileCal and Its Readout Electronics
45 PMT Blocks in barrel region 31 PMT Blocks in extended regions
One Front-end Electronics 3-in-1 Card Per PMT Block
PMT High Voltage Boards 3-in-1 Motherboard (4 sections) 8 Trigger Summing Cards in barrel
region (Stacked on 3-in-1 Motherboard)
6 Trigger Summing Cards in extended region.
(Stacked on 3-in-1 Motherboard) 1 Source Calibration Card
(Stacked on 3-in-1 Motherboard) 8 Digitizer Boards in barrel region 6 Digitizer Boards in extended
regions 1 Interface Card
(Stacked on one of Digitizer Boards)
Each Electronics Drawer Contains Following Electronics Boards:
INTRODUCTION: Interface Location in Electronics Drawer
A total of 256 Interface cards needed (One per drawer)
Card dimensions: 189x100mm Located near center of drawer Receive TTC optical signals in
electronics drawer for functional and timing controls Convert to LVDS signals and
distribute to 8 digitizer boards and 3-in-1 mother board
Transfer event data from digitizer boards to RODs Input from 8 Digitizer Boards
(from 16 Tile-DMU chips) Output to off-detector ROD
modules via G-link
INTERFACE DESIGN: GoalsGoals:• Complete 2-fold
redundancy to ROD. (except for LVDS receivers) Avoid single point of
failure for data from full drawer
Output data robust against transient SEE errors on link
• TTC failure detection and automatic switch function Interface automatic
selects a TTC signal based on signal failure conditions
INTERFACE DESIGN: Goals (Cont.1)Goals:• Data Organizer
Collect data from 16 Tile-DMUs in parallel based on Tile-DMU output protocol
Repack 32-bit data words from scrambled data transferred over 2-bit LVDS data lines (40Mpbs)
Insensitive to timing differences related to digitizer board geometry
CRC-16 and Global CRC transmission error checks over input and output segments
Altera EP20K160E
INTERFACE DESIGN: Goals (Cont.2)
Goals:• Data Organizer
G-link protocol control logic.
640Mbps output data rate (371Mbps required for TileCal @ 100Khz LVL1A rate)
• Low Cost FPGA designs Altera EP20K200E On-board JTAG
configuration port
• Single 3.3V Power Supply
Altera EP20K160E
INTERFACE DESIGN: TTC Receiver
TTC Receiver Output Waveforms
INTERFACE DESIGN:Structure of Data Organizer
INTERFACE DESIGN: Tile-DMU data stream format
INTERFACE DESIGN: Tile-DMU data stream format
INTERFACE DESIGN: Repacked stream data format
INTERFACE DESIGN: G-link Optical Transmitter (Taiwan)
Serializer Output Waveforms
From G-link Serializer
max3288cue
VCSEL Diode
TEST RESULTS: System Readout PerformanceMuon response for the 3 sampling depths (=90o)
Pedestal Superimposed
•Using “signal” from empty events
•Width reflects energy algorithm as well as electronics
•10 digitizations for each measurement (not optimized)
Muon signal well resolved from pedestal
TEST RESULTS: Radiation Requirements
Interface located at z=160cm r=410cm
Radiation Type
Sim. Level
Safety Factors Required Level
Sim.
Low Dose Rate
Lot Varn.
Total
TID 0.023Krd 3.5 5 4 70 1.6Krd
NIEL 1.5x1010 n/cm2
5 1 4 20 3.0x1011 n/cm2
SEE 6.3x108
h/cm2
5 1 4 20 1.3x1010 h/cm2
TEST RESULTS: Radiation Tests Interface located at z=160cm r=410cm All 3 studies showed Interface was fully
operational under tests
Radiation Type
Required Level
Source ExposedDose
Test Lab
TID 1.6Krd Colbt-60 2.4krd Argonne
NIEL 3.0x1011 n/cm2
Neutron 5.0x1011
n/cm2
CEA/PROSPERODijon, France
SEE 1.3x1010 h/cm2
Proton 1.5x1010
p/cm2
Indiana Univ
Production Quality Control
Web Materials Schematics, specification drawings, gerber, QC
requirements, revision history etc. Instructions to vendor (PCB and assembly)
Parts, artwork files provided by Chicago, vendor responsible for PCB fabrication and assembly
5 trial boards based on full production setup Burn-in test (power-up @65C for one week) All functional and performance tests Record to Database (Web accessible) Others
Conclusions Design is well
suited to our needs
Performance and Radiation tests demonstrated well satisfactory
Mass production is being installed in TileCal