july 13, 2010itrs public conference – san francisco1 more-than-moore roadmapping update
TRANSCRIPT
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More-than-Moore RoadmappingUpdate
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• “More Moore”: ScalingContinued shrinking of physical feature sizes of the digital functionalities (logic and memory storage) in order to improve density (cost per function reduction) and performance (speed, power).
• “More than Moore”: Functional DiversificationIncorporation into devices of functionalities that do not necessarily scale according to "Moore's Law“, but provide additional value in different ways. The "More-than-Moore" approach allows for the non-digital functionalities to migrate from the system board-level into the package (SiP) or onto the chip (SoC).
• The Challenge: Integration of MM with MtMCreation of heterogeneous compact systems.
More Moore & More than Moore: Definitions
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Moore’s Law & More
More than Moore: Diversification
Mo
re M
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re:
Min
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riza
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Combining SoC and SiP: Higher Value SystemsBa
se
lin
e C
MO
S:
CP
U,
Me
mo
ry,
Lo
gic
BiochipsSensors
ActuatorsHV
PowerAnalog/RF Passives
130nm
90nm
65nm
45nm
32nm
22nm
16 nm...V
Information Processing
Digital contentSystem-on-chip
(SoC)
Beyond CMOS
Interacting with people and environment
Non-digital contentSystem-in-package
(SiP)
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Why a More than Moore roadmap ?
• ITRS has demonstrated value of roadmapping for CMOS – Identify pre-competitive research domains, enabling cooperation
between industries, institutes and universities.• Sharing of R&D efforts
• Reduction of development costs and time
– Synchronization of the E&M community with the Manufacturing community
– Increase resource efficiency through focus– Promote market growth and job creation
• More than Moore roadmapping offers a similar but more challenging opportunity– Need to propose a roadmapping methodology
• White paper
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5
Process
societal needs
lead markets
applicationsfunctions
needed
designs and devices
designtoolsprocesses
scenarii roadmap
size, suitability
FOM
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Spring 2011 workshop
Main MtM drivers
Automotivedrivers
Lightingdrivers
Energydrivers
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Main MtM drivers (from workshop)
Drivers Automotive Lighting Energy
Functionalities Smart-card like security
Reliability
Smart grid connection
Energy mgt
Generic technologies / devices
Energy storage devices
mmW comm.
Heat mgt
Sensors & actuators
Energy generation devices
ULP components
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MtM roadmapping next steps
• Cross TWG Study Group officially launched yesterday– A&P, MEMS, Design & System drivers, RF/AMS
• 2nd MtM workshop during 2012 Spring meeting – April 25th, in the Netherlands– Each group of CTSG presents status of tables derived from the
main drivers
• Quarterly conf calls in-between– First one to be held October 10th, 5pm CET, 8am PST
• Check on progress
• Add/withdraw drivers
• Extend CTSG membership
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Spring 2011 workshop
Main MtM drivers
Automotivedrivers
Lightingdrivers
Energydrivers
CTSG
Individual TWG tablesIndividual
TWG tablesIndividual TWG tablesIndividual
TWG tables
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Questions ? Feedback ?
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