jra3 i nstitute of p hysics ascr prague
DESCRIPTION
JRA3 I nstitute of P hysics ASCR Prague. ECAL, V FCAL (V. Vrba) HCAL (J. Cvach) Exchange in NA2 (travels 8 .5 k€ ). Tasks in EUDET & budget w/o overheads. Si sensor development for ECAL, VFCAL Monitoring system for HCAL Consumables - 81.7 k€ - PowerPoint PPT PresentationTRANSCRIPT
Munich, 18 Oct 2006 J. Cvach, annual JRA3 1
JRA3Institute of Physics ASCR Prague
1. ECAL, VFCAL (V. Vrba)2. HCAL (J. Cvach)3. Exchange in NA2 (travels 8.5 k€)
Munich, 18 Oct 2006 J. Cvach, annual JRA3 2
Tasks in EUDET & budget w/o overheads
Si sensor development for ECAL, VFCAL Monitoring system for HCAL Consumables - 81.7 k€
Si sensor development + production (34.6 k€) VME test stand (25742 €), calibration electronics
(16.5 k€) computing (4.9 k€)
Personnel - 13 k€ for PhD students, young postdocs Travels 4 k€ Contribution from the Institute
Permanent staff – 67 ppm Travels (6.7 k€)
Munich, 18 Oct 2006 Václav Vrba, SI ECAL Sensor Status 2006
Si Sensors for ECAL (V. Vrba)
Sensor ECAL prototype production: 2006: in four production runs of Si pad sensors at ON
Semiconductor we obtained 72 good fully tested wafers which have been integrated into ECAL prototype
January-July 2006: wafers delivered to Ecole Polytechnique 7 ECAL layers equipped with ON Semiconductor wafers
end of 2006: additional fabrication run at ON Semiconductor is planned to produce about 60 wafers for the full instrumentation for 2007 test beam.
DET1
DET2
DET3
DET4
DET5
DET6
DET7
DET8
DET9
Munich, 18 Oct 2006 Václav Vrba, ECAL status
I-V curves on pad arrays
Munich, 18 Oct 2006 5
Reverse current long term stability
2 weeks
Munich, 18 Oct 2006 V. Vrba, ECAL status 6
Sensor testing @ Institute of Physics AS CR
Test laboratory for measurement of Si sensors
Senzors from ON Semiconductor, Czech Republic
EUDET tasks• Design studies for finer
granularity (5x5 mm2) of Si sensors are under way
• Possibility to use 6” wafers is also investigated
Munich, 18 Oct 2006 J. Cvach, annual JRA3 7
HCAL - Calibration + Monitoring Board system (I. Polák)
CMB provides calibrated UV flashes to the scintillator tiles optical feedback via PIN photodiode sensing of temperature at scintillator planes and
on CMB connection via CANbus to the detector Slow
Control monitoring of temperature, voltages, … setting enable, amplitude, pulse width of each
LED
Calibration and monitoring board II
Calibration & monitoring board – to deliver LED light dynamic range 0.5 – 100 MIP
Functions LED control
Amplitude (via DAQ, CANbus, standalone)
Pulse width: 5 ns Enable
PIN diode readout Temp monitoring
Measurement of nonlinearity LED intensity varied by DAQ Intensity measured by PIN Absolute calib from linear part
3 pulsegenerators
12 PIN ampli
control
1V
10ns
Munich, 18 Oct 2006 J. Cvach, annual JRA3 9
Calibrating 18 SiPM with one LED
Gain calibration for a matrix of 18 SiPM connected to the same LED
Munich, 18 Oct 2006 J. Cvach, annual JRA3 10
HCAL plane
CMB
T
T
T
T
T
T
T
CAN (ADC, Enable Pulser,
DAC)
Polak, Janata,(Karstensen) Gadow
T
T
Goettlicher,Reinecke
T
T
HBAB_TOP
HBAB_BOT
VFECMB
CMB boards during CERN tests
Munich, 18 Oct 2006 J. Cvach, annual JRA3 11
VME stand – durable equipment financed from the EUDET project Replacement of old
CAMAC and NIM modules Measurements of signals
from photodetectors (PM, APD, …)
9 pieces of APDs, Hamamatsu S 8664-s
12 bit QDC, 16 chan., V792N
Controller V2718 connected by optical cable to PC
Reading, control with Labview
4-channel power supply N472 GPIB, serial busScope TDS 5104
Munich, 18 Oct 2006 J. Cvach, annual JRA3 12
Stand is operational – a EUDET milestone
Labview chart of signal processing LED 4 fibres read by APD +QDC
Ivo pulser + V993 dual timer – 1 kHz
What we gained? Larger dynamic range
10bit12bit QDC Sophisticated system
(new, VME) Short term usage: long
term tests of CMB
Linearity dependenceof 4 channels (APDs)to the increase (Vcalib)of the LED light
Initia
lisatio
n QD
C
readin
g
Inp
ut
bu
ffer
deco
din
g
Jan Smolík
J. Zálešák
Munich, 18 Oct 2006 J. Cvach, annual JRA3 13
Future stand use Long term tests and better
understanding of CMB Use a CMB board with (8 LED & PIN
diodes) + 8 APDs 16 QDC chan.
APD APD
Munich, 18 Oct 2006 J. Cvach, annual JRA3 14
Our immediate tasks in EUDET Production of Si wafers for ECAL module successfully integrated
into the prototype and operated in the test beam Design studies for finer granularity (5x5 mm2) of Si sensors are
under way; Possibility of the use of 6” wafers is investigated;
Students and young physicist (Petr Mikes, Michal Marcisovsky, Pavel Ruzicka, Miroslav Havranek) are involved in the project activities participating in the laboratory sensor evaluation, test beam runs at DESY and CERN, data analysis, simulation etc. They also participate in regular collaboration meetings.
HCAL – calibration electronics 2006: 40 (double) boards produced, 23 installed in the prototype,
one half financed from EUDET Investigations of functionality and long term stability of CMB
Participation in tests and data analysis
Munich, 18 Oct 2006 J. Cvach, annual JRA3 15
Resources EUDET Main contribution from EUDET
- consumables Upper table – our JRA3
spending profile by tasks Lower table – spending
according to categories
year Perm staff
Temp staff
Consum ables
Travel Durable equipm
Over-heads
Total (€)
Install ment
2006 3256 4308 15 356 4742 2860 6104 36 625 36 740
2007 8581
2008 8581
2009 5720
total 25742
year HCAL ECAL VFCAL
2006 12 k€ 6 k€ 2 k€
2007 12 6 5
2008 14 7 5
2009 6,55 1,9 4,15