iphone 3g teardown - amazon web services · immediately following the iphone launch at 12:01 july...

iPhone 3G TeardownRédigé par: Luke Soules

iPhone 3G Teardown Brouillon : 2018-09-11ID de tutoriel : 600 -

Ce document a Ã©tÃ© crÃ©Ã© le 2020-02-02 09:44:23 AM (MST).

© iFixit — CC BY-NC-SA fr.iFixit.com de 24

INTRODUCTION

We disassembled this iPhone on July 11, 2008.

OUTILS:SIM Card Eject Tool (1)Metal Spudger (1)Phillips #00 Screwdriver (1)




Étape 1 — iPhone 3G Teardown

We performed this disassemblyimmediately following the iPhonelaunch at 12:01 July 11, 2008, NewZealand time. That's 5:01 AM, July10, Pacific time for those of us whoaren't islanders.

Bookmark this page to catch all theaction! We'll still be updating thispage over the next several days aswe learn more about the internals.

If you're press interested ininterviewing us, we'd be happy totalk to you. You can reach our presscontact at kyle at ifixit.com.

Étape 2

Auckland, here we come!




http://www.timeanddate.com/worldclock/fixedtime.html?month=7&day=11&year=2008&hour=0&min=1&sec=0&p1=264

Étape 3

We've arrived!

Five people waited in line overnight.We're in the #4 spot.

It's cold!

Vodafone are being veryaccommodating, and iPhone Jonnyeven brought out an exercycle!

Étape 4

At about 5pm, someone brought usa TV so we can watch us on thenews.

At 5pm, the line was 15 people, butit ballooned rapidly and wrappedaround the corner.




http://1stinline.blogspot.com/

Étape 5

We handed out t-shirts at theVodafone store last night, and theywere hugely popular. You'll have tohit eBay if you want one.

Engadget are the only otherAmericans who flew out, and theyhave mugshots up of the first tenpeople in line.

Étape 6

Our stylish shirts in action!

It's the middle of winter here, andjust started raining. Fortunately, wehave an awning over our heads.




http://www.engadget.com/2008/07/10/meet-the-worlds-first-first-ten-iphone-3g-owners/

Étape 7

Only 135 minutes to go and about90 people in line.

You can barely see the Vodafonelogo from the end of the line.

Vodafone's red beanies are a big hit.

Étape 8

As you can see from the box, we gotthe black one. Rumor has it thewhite iPhones are out there, but asrare as an albino whale. This iPhonecost us $979 NZ without a contract(but locked to Vodafone, of course).Not sure what we're going to do witha Vodafone-locked iPhone inCalifornia, but we'll figure somethingout.

The packaging looks familiar...




http://uk.youtube.com/watch?v=WLGFkm7AYUI

All right, here's the specs we knowup-front:

The iPhone 3G is 4.5x2.4x0.48"(0.02" thicker than the originaliPhone), and weighs 4.7 ounces(0.1 ounce less). For reference,this is approximately the weight oftwo unladen swallows.

With its new rounded back, thenew iPhone feels smaller.Calculating the phone's volumewon't be easy mathematically,and measuring the phone'sdisplacement the easy wayprobably isn't a good idea.

The display is 3.5" diagonal,480x320 resolution for 163ppi.Also known as identical to theiPhone (not that we'recomplaining).

Étape 9

No surprises inside the box:

USB docking cable

Standard iPhone headphones

USB power adapter

Oh, what's this? A New Zealandpower plug! We've never gottenone of these in a box before!




http://en.wikipedia.org/wiki/Displacement_%2528fluid%2529

Étape 10

Removing the SIM card. Fortunatelyfor the world's paper clips, theiPhone 3G comes with a SIM ejecttool.

Perhaps the least-touted newfeature of the iPhone 3G is the flushheadphone jack, allowing non-Appleheadphones to be used without anadapter. Yay!




Étape 11

For comparison, here's a link to last-year's iPhone disassembly.

Our predictions:

Apple-labeled Samsungprocessor. [correct]

Either some kind of GPS chip, ornone at all. If there isn't a GPSchip, then it could be built into theprocessor. [Turns out it's anInfineon chip]

Lots of chips with only Applemarkings on them. Sometimes wecan tell what they are, but most ofthe time you have to take the chipitself apart first. [correct, but thisone's cheating]

Removing the display!




http://www.ifixit.com/Guide/First-Look/iPhone

Étape 12

Rotating the display up.

Apple used orange stickers tonumber the connectors to the logicboard 1 through 6.

The camera is located in the upperright corner of the phone.Unfortunately, it connects to thebottom of the logic board, meaningyou'll likely need to remove the logicboard from the phone to remove thecamera. We haven't tried removingthe camera, but would assume thatlike the original phone, the cameracan be removed for those wanting tobring their iPhone 3G into securelocations.

A little birdy has told me thatTechOnline will be decapping thechips we can't identify tomorrow,after the US release. They soak thechip in an acid bath to eat away theceramic coating, then use x-raysand other fancy equipment toexamine it.




http://www.techonline.com/

Étape 13

The display assembly separatedfrom the unit.

In a significant departure from thefirst iPhone, it appears that the LCDand glass covering are separatecomponents-- just like the iPodTouch. They were glued togetherbefore, making replacement screensvery expensive. The glass breaksmore than anything else, so this isgreat news for repairing the iPhone3G!

Étape 14

We had to remove 6 Phillips #00screws to separate the glass fromthe LCD.

The glass (with integrated touchsensors and chips) is underneath,while the LCD is being removed.

In the previous iPhone, the displaywas fairly monolithic. A number ofcomponents were connectedtogether via the display assembly--now the display just connects to themain board. Hopefully this will makeobtaining replacement parts easier--we've had trouble getting qualitysupplies of iPhone displays to sell.




Étape 15

Behold, the iPhone! Can you see the3G bits inside?

The two boards (logic andcommunications) are now one.Rather than stacking them, as in thelast model, they laid it out along theentire length. We're guessing thisallowed them to make the batterylonger.

We're not used to taking photosoutside our studio, but thesepictures are turning out greatbecause of our awesome friends inNZ.

Props to Andrei Smirnov of MacSolutions for helping us out. Theyare a Macintosh sales and supportcompany established in 1998 andbased on the North Shore,Auckland. Do us a favor and use hisservices the next time you're inAuckland!




http://www.macsolutions.co.nz/

Étape 16

Uh oh.

Let's try removing that.

And the iPhone explodes!

Étape 17

Just kidding. Look, the battery isn'tsoldered on!

Apple actually listens to us! Orsomething.




Étape 18

Dock and headphone connector.

The primary antenna is on the otherside of this part.

Once we get the phone completelyapart, we'll start posting chipnumbers. We'd love help identifyingchips from all of you, send us anyinside information [email protected]. We'll keep itanonymous.




Étape 19

This is where we get excited! We'vedone our best to identify everythingthat's on the iPhone board.

Semiconductor Insights andTechOnline have released thealmost-authoritative list of allsubstantial iPhone chips. They'vegraciously provided us with theirimages. We're going through andverifying their results now, but weexpect that their accuracy willsurpass our own.

So by our count, here's the chipcounts by manufacturer (moreimportant chips are bold):

Broadcom 1, Infineon 4, Intel 1,Linear Technology 1, Marvell 1,National Semi 1, NXP 1,Samsung 1, Skyworks 1, SST 1,ST Micro 1, Toshiba 1, Triquint 3(big win!), Wolfson 1.

Our list undoubtably omits anumber of components. Don'tfreak out if the chip you spentyears slaving over isn'tmentioned, please! We're happyto update it if you let us know.




http://www.eetimes.com/news/latest/showArticle.jhtml;jsessionid=PQBC4HQHI4MTSQSNDLSCKHA?articleID=208808671

http://www.techonline.com/

Étape 20

And Marvell for the win on the CSRBlueCore Bluetooth + WiFi. This isthe same chip as the iPod Touchand first iPhone.

Toshiba manufactured the flash inboth iPhone logic boards we'veseen so far. We'll see if this trendholds.




Étape 21

Intel NOR flash in the middle left ofthe shot: 3050M0Y0CE 5818A456.

The largest chip in the top left corneris an Infineon 337S3394 WEDGEbaseband marked SP836175G0822.

Small chip to the right of the NOR:Infineon BGA736 (Tri-Band HSDPALNA). Just beneath that is anInfineon UMTS Transceiver marked338S03532Z 60814.

Skyworks power amplifierSKY77340 (Power Amplifier ModuleQuad) on the top right: Octopartdatasheet

The chip in the top middle is SMP 3i6820, Infineon SM-Power3i. FromInfineon: the part is "optimized tosupport modem and data cardapplications based upon X-GOLD208 and X-GOLD 608, withfeatures ranging from EDGE up to3G and HSDPA."

Chips we need to identify: 6475 withM logo (rumored to be Murata IFSAW Filter).




http://www.infineon.com/dgdl/bga736l16.pdf?location=Products.Discretes.Small_Signal_Discretes___RF_.RF_MMIC.UMTS_LNA.DATASHEET.bga736l16.pdf&folderId=db3a304314dca38901154129d9cc161e&fileId=db3a304319c6f18c0119eba892fe5309

http://octopart.com/info/Skyworks+Solutions/SKY77340-13

Étape 22

The entire board (the EMI shield isremoved from the right side).

The previous shot is the top rightportion of this picture.

Removing the EMI shielding istricky, so we're taking our time.

If you'd like to comment publicly, usethe Gizmodo forums or reply viatwitter to ifixit, and Summize will pullit up.

Étape 23

The other half of the board. Note theApple-branded ARM on the left andthe SIM card holder at bottomcenter

Big news: Samsung DDR SRAMmarkers on the processor again.Looks like they win on the processorfront again (not that we wereexpecting anything different).




http://gizmodo.com/5023769/the-iphone-3g-gets-dissected

http://twitter.com/ifixit

http://search.twitter.com/search?q=ifixit

Processor markers: 339S0036ARM EMC567DB 819 8900BN182F0A3 0825 7511.101ZPD8163Y, 5974V CKUFBGHE0819 870628 P12 N3.Samsung DDR on the chip(K4X1G163PC-DGC3) is slightlydifferent from the first iPhone,which was K4X1G153PC.

SST SST25VF040B 1MB SPI SerialFlash to the left of the SIM card,along with a National SemiconductorLM2512AA Display Interface.

APPLE 338S0506 is a WolfsonWM6180C (We haven't seenWolfson disguise their chips like thisbefore). APPLE 338S0512 is anobfuscated NXP powermanagement chip.

The GPS chip is the grey chip in themiddle-right side of the board. It isan Infineon PBM2525 HammerheadII! Rumors that it would beintegrated into the processor havebeen disproved

The round grey chip to the right ofthe Apple-logo processor is the STMicro LIS331 DL Accelerometer.




http://octopart.com/info/Samsung/K4X1G163PC

http://www.sst.com/products.xhtml/serial_flash/25/3.0V/SST25VF040B

http://www.infineon.com/cms/en/product/channel.html?channel=ff80808112ab681d0112ab6ad4ef0641

http://www.embeddedstar.com/weblog/2007/12/05/st-lis331dl-lis331al/

Étape 24

The back of the logic board, afterpulling up the metallic shielding.

Étape 25

The 8GB NAND flash chip (ToshibaTH58NVG6D1DTG80), revealedafter removing a soldered-downcover. This chip was covered by aplastic shield as well, which we'vepartially removed to see themarkings beneath.




Étape 26

The three chips along the bottom areTriQuint Tritium PA-duplexers:TQM616035 TQM676031TQM666032. Presumably each oneworks on a different frequency band:"Each highly-integrated modulecontains a Tx input filter, a linearPower Amplifier, Duplexer, andCoupler."

This is a big win for TriQuint! Theirstock has been doing a bit bettersince we discovered this.

Étape 27

The rear panel remains. Looks likethat leaked shot was reasonablyaccurate.

Unlike the metal rear panel on theoriginal iPhone, the rear panelappears to be made from ABSplastic. The coat on the back feelsnice and is very reflective, hopefullyit's durable as well.

There doesn't appear to be a serialnumber on the back panel of ourphone. We don't know if that'sunique to our phone, or true with all3G iPhones.




http://www.triquint.com/prodserv/markets/handset/tritium.cfm

http://finance.google.com/finance?q=tqnt

Étape 28

The battery. Put your soldering ironsaway, they won't be needed! Applepart #616-0372.

The recycle marker on the battery isblacked out with a sharpie.Suspicious...

We were all expecting a biggerbattery, and I can't verify this, butthis page references the partnumber on the battery and lists acapacity of 1150 mAh, not the 1400mAh in the original. Can anyone digup more information?




http://certificates.iecee.org/cbtestcert/cbtestcert.nsf/eff34981b15cb391c12570a0004e79dd/d58dff04f62abec8c12574030050e226?OpenDocument

Étape 29

From top left to bottom right: Displayglass, LCD, Main board and EMIshield, Antenna and battery, Backpanel.

That's it! We'll keep updating thechips above, so keep checkingback. We'll post more photos asrequested, but we're going to snagsome sleep after waiting in line fortwo nights.

We'd like to thank some graciousAuckland residents for making thishappen:

Grant Virtue ofbrochuresunlimited for the facilityin downtown Auckland.

Oleg Boukhvalov of Weblab forhis electronics expertise and helpwith the disassembly.

Andrei Smirnov of MacSolutionsfor coordinating everything.

We'll be adding a selection ofiPhone 3G parts soon, as well as adetailed take-apart guide.




http://www.graphics.co.nz/

http://www.weblab.co.nz/

http://www.macsolutions.co.nz/

http://www.ifixit.com/Products/iPhone-3G/137

https://fr.ifixit.com/Topic/iPhone_3G

To reassemble your device, follow these instructions in reverse order.

Étape 30 — Final Thoughts

iPhone 3G Repairability Score: 7out of 10 (10 is easiest to repair).

LCD and front glass are not fusedand can be replaced individually.

Standard Phillips screws usedthroughout.

Battery is buried under the logicboard, making it difficult toreplace.




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