INVESTOR PRESENTATIONAUGUST 2014

2

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of our business thatconstitute forward-looking statements, which are found in various places throughout the press release, including , but notlimited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing ofpurchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use ofwords such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward lookingstatements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forwardlooking statements. While these forward looking statements represent our judgments and expectations concerning thedevelopment of our business, a number of risks, uncertainties and other important factors could cause actual developmentsand results to differ materially from those contained in forward looking statements, including the discovery of weaknesses inour internal controls and procedures, our inability to maintain continued demand for our products; the impact on ourbusiness of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipatedorders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand forsemiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts ofterrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing andprotect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; thoseadditional risk factors set forth in Besi's annual report for the year ended December 31, 2013 and other key factors thatcould adversely affect our businesses and financial performance contained in our filings and reports, including our statutoryconsolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter ourforward-looking statements whether as a result of new information, future events or otherwise.

August 2014

3

Agenda

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

August 2014

4

I. COMPANY OVERVIEW

August 2014

5

Company Overview

• Leading assembly equipment supplier with #1 and #2 positions in key products. 27% addressable market share

• Broad portfolio: die attach, packaging and plating• Strategic positioning in wafer level and substrate packaging • Global mfg. operations in 7 countries; 1,672 employees

worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• LTM revenue and net income of € 304.7 and € 35.7 million• Cash at 6/30/14: € 83.8 million• Total debt at 6/30/14: € 21.3 million• € 57 million of dividends and share repurchases since 2011

Financial Highlights

• Growth of advanced packaging, smart phones/tablets, Internet of Things and market share offer revenue upside

• Significant unrealized earnings potential from optimization of Asian production model, supply chain efficiencies and development of common platforms

Investment Considerations

August 2014

€ 85.5

€ 304.7

25.9%

41.6%

20%

25%

30%

35%

40%

45%

0

50

100

150

200

250

300

350

2003 LTM

Gro

ss M

argi

n (%

)

Rev

enue

(€

mill

ions

)

Revenue Gross Margin

6

Company Development

•2000 2002 2005 2009

Die Attach Acquisitions

•2006 Dragon I complete: € 6 million cost savings•2008 Dragon II complete: € 15 million cost savings•2010 Plan: € 7.0 million cost savings. Headcount and product line restructuring

•2012 : € 8.3 million cost savings. Headcount reduction. Plating unit rationalized

•2014: US die sorting operations to be rationalized. Transfer to Austria

Restructuring

•2006-09 Standard packaging and certain die bonding systems transferred to Malaysia

•2007-09 Dutch tooling & Hungarian die bonding transferred to Asia•2009-11 Epoxy DB transferred to Malaysia•2003-12 Malaysian system and Chinese tooling capacity expansion. •2013 Soft solder DB transfer to Malaysia. Production transfer completed•2006-13 Asian headcount increased from 34% to 56%

Asian Production Transfer

August 2014

• Singulation- FSL• Flip Chip

- 8800 QS- 8800 Chameo- 2100FC- 8800 TCB

• Multi Module Die Attach

- 2200 evoplus

Besi Equipment Portfolio

Die Attach

• Die Bonding- 2009 series- 2100 xPplus

- 2100 sDplus

- 2100 sD PPPplus

- 2100 SC

Packaging Plating & Other

• Die Sorting- DS 9000E- CS 1250- DS 11000

• Molding- AMS series- AMS Foil- AMS LM 95- AMS WMS

In Development

• Advanced TCB system • Common platforms• Next gen flip chip, epoxy and

diffusion solder die bonders• Next gen wafer molding

system

Datacon

Datacon

Datacon

Esec

Fico

Fico

Fico

Esec

- New product

7

• Plating- Leadframe- Solar- Film & foil

Meco

• Wire Bonding- 3100- 3200 Smart Card

• Trim & Form- Compact series- Power series- Compact Line XHD

August 2014

8

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

SubstrateWire Bond Assembly

SubstrateFlip Chip Assembly

Wafer Level PackagingFlip Chip Assembly

Wire BondDie Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

Besi Product Positioning

August 2014

9

Global Operations

as of 30 June 2014

Europe/NA Asia

Revenue (MMs) € 62.3 33.5% € 123.9 66.5%

Headcount 666 39.8% 1,006 60.2%

• Development activities in Europe and USA

• Increasing production and sales/service activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

ChengduShanghai

Korea

Taiwan

PhilippinesMalaysia

Singapore*

Salem*Suzhou

Radfeld, (Austria)*Cham,(Switzerland)*

Duiven & Drunen,(The Netherlands)*

Chandler

Shenzhen

August 2014

10

II. MARKET

August 2014

147.9

351.1 326.9

273.7 254.9

136.5 186.2

-1.0%

137.4%

-6.9%-16.3%

-6.9%

36.5%

-50%

0%

50%

100%

150%

-

100.0

200.0

300.0

400.0

2009 2010 2011 2012 2013 H1 2013 H1 2014

(€m

illio

ns)

Besi RevenueRevenue YoY Growth Rate

Assembly Equipment Market Trends

* Source: VLSI April 2014

2.1

4.7 4.3

3.9

3.0 3.4

3.5

-27.1%

124.0%

-7.7% -9.6%-23.1%

11.6% 4.0%

-50%

0%

50%

100%

150%

-

1.0

2.0

3.0

4.0

5.0

2009 2010 2011 2012 2013 2014E 2015E

(US

$ bi

llion

s)

Assembly Equipment*

Market Size YoY Growth Rate

• VLSI forecasts renewed growth of assembly market in 2014 and 2015• Besi revenue growth exceeding assembly market in 5 of past 6 years

August 2014 11

12

Die Bonding36.9%

Flip Chip17.1%

Die Sorting4.3%

Singulation8.4%

Presses8.7%

Molds15.8%

Lead Trim & Form7.2%

Plating1.6%

Assembly Equipment Market Composition

• Half of assembly market 2013 represented by die attach and wire bonding equipment

• Die Attach represents Besi’s largest addressable market

Die Attach 58%

Packaging 40%

Plating2%

Assembly Equipment Market * (2013: $3.0 billion)

Besi Addressable Market *(2013: $1.2 billion)

* Source: VLSI April 2014

Wire Bonding26.8%

Die Attach20.1%

Packaging23.1%

Plating0.6%

Other Assembly

(Inspection, Dicing)29.4%

August 2014

13

Customers OEMs End Products

Customer Ecosystem

• Blue chip customer base, top 10 customers represented 51% of 2013 revenue • Leading Asian Subcontractors and IDMs. 50/50% split in 2013• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek• Long term relationships, some exceeding 45 years

IDMs

Subcontractors

August 2014

Advanced Packaging Unit Volume and MarketShare Are Increasing

14

8%9%

10%

13%

19%

26%

31%32%

34%

36%

0%

5%

10%

15%

20%

25%

30%

35%

40%

-

5

10

15

20

25

30

35

2008 2009 2010 2011 2012 2013 2014 2015 2016 2017

AP

Mar

ket S

hare

%

M w

afer

s, 3

00M

M E

q.

Advanced Packaging Wafers

Advanced Packaging Unit Market Share (%)

CAGR 2008-2017: 22.7%

• Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process

• In growth phase with move to <20 nano driven by smart phones, tablets, autos and Internet of Things

Source: VLSI January 2014

August 2014

15

Advanced Packaging Growth Favors Besi

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage

• <40 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2013E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach• Die Sorting : DS 9000• Die Bonding : ES 2009, 2100• Flip Chip : DC 8800, 8800 TCB,

2100• Multi Module : DC evo 2200

Packaging• Molding : AMS-LM 95• Singulation : FSL

High Growth EndUser Areas:

Mobile internet devices, Autos,

MEMS, Internet of Things

Datacon Esec Fico

August 2014

16

Computer,

PCs

50%

Mobile

Internet

Devices

22%

Auto

13%

Industrial

10%

LED

3%

Service

2%

2008

And Is Reflected in BesiEnd User Application Trends

Computer,

PCs

20%

Mobile

Internet

Devices

35%

Auto

17%

Industrial

10%

LED

3%

Spares/

Service

15%

2013

Source: 2013 Company Estimates

• Mobile internet devices now equal 35% of Besi’s end user revenue

• Automotive has also increased significantly in recent years

• Service/spare parts have grown to 15%. Less cyclical revenue stream

August 2014

2010 2011 2012 2013 2014 2015 2016 2017

Units 15 60 120 184 263 331 398 463

-

100

200

300

400

500

Uni

ts (

mill

ions

)

Tablet Units

17

Source: Gartner

Driven Primarily by Growth in Mobile Internet Devices

• Rapid unit growth in smart phones and tablets forecast over next 5 years

• Estimated unit growth rates:

• Smart phones:• 2014: 25%• 2017: 1.8x

• Tablets:• 2014: 43%• 2017: 2.5x

• Significant potential revenue growth driver

2010 2011 2012 2013 2014 2015 2016 2017

Units 300 473 680 1,015 1,269 1,458 1,633 1,780

-

400

800

1,200

1,600

2,000

Uni

ts (

mill

ions

)

Smart Phone Units

49.2%

25.1%14.9%

12.0%

8.9%

43.8%57.8%

53.4%

42.7%25.9%

20.1%16.2%

100.5%311.2%

August 2014

18

Smart Phone Illustration

Main Components Manufacturer Country Besi Systems Utilized

Processor Samsung South Korea 8800FCQ, AMS-W, Singulation

DRAM Memory Samsung South Korea 2100sD, AMS-W, Singulation

Flash Memory Chip Samsung South Korea 2100sD, AMS-W, Singulation

Battery Samsung South Korea N/A

Power Management Dialog Germany 2100sD, 2009

Compass AKM Japan N/A

Accelerator/Gyroscope ST Micro Italy/France 2100sD

Communications

Radio Frequency Memory Intel USA 8800FCQ, Singulation

Wi-Fi/Bluetooth/GPS Broadcom USA 2200 evo, AMS-W, Singulation

Receiver/Transceiver Infineon Germany 8800FCQ, AMS-I, Singulation

PA ModuleSkyworks, Triquint USA

2200 evo, AMS-W, Singulation, 8800 Chameo

Video/Audio

Touch Screen Control TI USA 2100sD, AMS-W, Singulation

Audio Codec Cirrus Logic USA 2100sD, AMS-W, Singulation

LCD Display LG South Korea N/A

Touch Screen Wintek USA N/A

Camera – 5/8 megapixel/VGALG, Foxconn, Cowell

South Korea, China 2200 evo

• Besi systems can assemble components representing up to 50% of smart phone content.

August 2014

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity

19

• Move to <40 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 26% currently of total potential market of $1.0 billion

• Expected to gain share rapidly over next 6 years vs. wire bonding (3.5% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates by key IDMs/subcons

CAGR 2013 – 19Flip Chip 7.8%Wire Bond 4.3%

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

Source: VLSI July 2014

Flip Chip$392 30%

Wire Bonding

$896 70%

2019

August 2014

Flip Chip$250 26%

Wire Bonding

$695 74%

2013

Besi Is Gaining Market Share

20

-

50

100

150

200

250

2008 2009 2010 2011 2012 2013

Cumulative Growth: Besi vs. Assembly Equipment Mark et

Besi Assembly Equipment

Besi +71%

• Besi had 66% cumulative positive revenue variance vs. assembly market over past 5 years

Assembly Equipment +5%

August 2014

Particularly In Its Addressable Markets

21

• Gaining share in fastest growing segments of the assembly equipment market:• Flip chip die bonding, multi module die attach and ultra thin molding for

advanced packaging applications

Besi Market Share

Source: VLSI, April 2014 and Besi estimates 2012 2013

Total Assembly Equipment Sales 8.6% 10.8%

Besi Addressable Market 21.8% 27.0%

Total Die Attach Equipment 27.7% 33.1%

Die Bonding 29.7% 39.6%

Flip Chip 22.2% 25.4%

Other 25.9% 7.5%

Total Packaging Equipment 11.1% 16.0%

Molds 12.0% 19.2%

Lead Trim & Form 15.0% 17.6%

Singulation 5.3% 5.1%

Total Plating 75.8% 83.8%

August 2014

22

• Customers are largest producers. • Most advanced packaging applications

• Strong customer market shares:• ≈ 50 – 100% of die attach requirements

• ≈ 35 – 50% of packaging requirements

• Customer market shares p.a. vary based on capacity needs and purchasing cycles

• Primary competition:• Die Attach: ASM-PT, Hitachi• Packaging: Towa, Hanmi,

ASM-PT

And With Leading Edge Technology Customers

* No customer purchases indicated** Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly

production done by subcontractors*** In general, Samsung satisfies approximately 50% of its equipment needs internally

Die Attach PackagingIn USD 2011 2012 2013 2011 2012 2013SubcontractorsASE 76% 67% 59% 34% 36% 65%Amkor 36% 75% 84% 63% 45% 11%STATSChippac 100% 95% 100% 61% 28% 100%SPIL 63% 47% 93% 35% 37% 76%Unisem 100% 92% 84% 68% 0%* 0%*Cowell/Foxconn(Camera Modules) 0% 100% 0%*

IDMs **Skyworks 78% 100% 96% 0% 13% 24%ST Micro 92% 91% 72% 51% 44% 76%Infineon 93% 81% 97% 37% 0%* 24%Samsung*** 17% 5% 0%* 37% 0%* 100%

% of Besi Die Attachand Packaging systems revenue 30% 47% 43% 67% 53% 64%

August 2014

23

III. STRATEGY

August 2014

Key Strategic Objectives

Operational Objectives

Expansion of Asian supply chain. System module outsourcing

Die attach integration activities

Development Objectives

Advanced TCB die bonding development

Introduction of next generation die attach and wafer molding systems

Common platform/parts activities

2013 2014 2015

August 2014 24

Asian Production Transfer Completed

25

396

487

658 673

370

567

170

331

553 579

42.9%

68.0%

84.0% 86.0%

0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

-

100

200

300

400

500

600

700

800

2010 2011 2012 2013 H1 2013 H1 2014

% D

irect

Shi

pmen

ts

Shi

pmen

ts

Total Asian Shipments Direct Asian Shipments % Direct

+53%

August 2014

Has Led to Lower European and Aggregate Headcount

26

• Fixed European/North American headcount reducing:• Down 17.7% since 2011• Declined from 56% of total in 2009 to

40% at end of Q2-14

• Aggregate of 1,672 headcount at Q2-14 (including temps):• Up 9.7% vs. Q1-13• Asian production temps support Q2-14

order ramp738 741 680 624 623 610

772 802 799

810 839 897

1,510 1,543 1,479

1,434 1,462 1,507

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2010 2011 2012 2013 Q12014

Q22014

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC Total

51%

49%

52%

48%

54%

46%

56%

44%

57%

43%

60%

40%

August 2014

And Also Reduced Break Even Revenue Levels

27

270

235

212

-

50

100

150

200

250

300

2011 2012 2013

(€m

illio

ns)

(13.0%)

(10.0%)

August 2014

Workforce Has Also Become More Flexible and Scalable

• Workforce has become more scalable and flexible

• Revenue ramp achieved primarily using Asian temp production labor

1,510 1,543 1,479 1,434 1,462 1,507

194 64 60

24 107

165

1,704 1,607

1,539 1,458

1,569 1,672

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

-

500

1,000

1,500

2,000

2,500

2010 2011 2012 2013 Q1 14 Q2 14

Tem

p %

of T

otal

Hea

dcou

nt

Fixed Temp Temp % of Total

August 2014 28

Materials Cost Reduction Is a Key Priority

29

• Qualify and Select Asian Vendors• Replace European Vendors• 50% of the way there

Supply Chain Actions

• Redesign products• Increase standardization of systems

• Component parts• Modules

Development Actions

+5% Gross Margin Upside

• Material costs represent approximately 45% of revenue• Shift to Asia centric supply chain:

• Reduces transport, inventory costs and obsolescence• Improves cycle time and ramping flexibility

• Management Board reviews progress weekly component by component

August 2014

Partially Achieved Through Common Parts Product Redesign

• Development efforts underway to redesign die attach and packaging systems to increasecommon parts utilized per system

• Benefits: Lower unit cost, improved working capital mgt, shorter cycle times

• Anticipated completion date: Winter 2015/16

• Magazine handler• Wafer gripper• Dispenser• Wafer table• Wafer Cassette Handler• Die Ejector• Control Platform

Areas of focus:

Potential Unit Cost Savings

DB2100 (7%)

2200evo (11%)

8800FCQ (11%)

Average (9%)

30August 2014

31

IV. FINANCIAL REVIEW

August 2014

Summary Financial Highlights

32

• Transformation since 2008

• Strategic positioning in advanced packaging has yielded benefits :• Enhanced top line development• Increased gross margins

• Operating initiatives have supported gross margins and profits despite market decline from 2010 peak :• Product line restructurings• Asian production transfer• Reduction of European based costs• Increased tax efficiency• Increased scalability of business model

• Solid liquidity base to finance growth and shareholder dividends

Year Ended December 31, (€ millions, except share data) 2011 2012 2013

Revenue 326.9 273.7 254.9

Orders 301.1 276.1 251.9

Gross margin 40% 40% 40%

EBITDA 45.6 32.4 27.9

Pretax income 34.4 19.5 19.2

Net income 26.4 15.8 16.1

EPS (diluted) 0.73 0.42 0.43

Net margin 8% 6% 6%

Dividend per share 0.22 0.30 0.33

Net cash 62.7 79.5 71.0

August 2014

€ 72.4

€ 116.2

9.0%

19.7%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

55%

€ 0

€ 25

€ 50

€ 75

€ 100

€ 125

Q2 2013 Q2 2014

Net

mar

gin

%

€m

illio

ns

Revenue Net Margin

Gross Margin

OPEX

Headcount

Effective Tax Rate

Revenue Growth and Operational Progress Yield Increased Profitability

21.6% 9.4%

1,520 1,672

€ 21.0 MM

€ 24.6 MM

+10.0%

-12.2 points

+17.3%

40.4% 43.2%

+60.5%

+10.7%

€ 136.5

€ 186.2

7.5%

16.1%

6%

10%

14%

18%

22%

26%

30%

34%

38%

42%

€ 0

€ 25

€ 50

€ 75

€ 100

€ 125

€ 150

€ 175

€ 200

2013 YTD 2014 YTD

Net

mar

gin

%

€m

illio

ns

Revenue Net Margin

22.3% 9.9%

1,520 1,672

€ 42.0 MM

€ 46.1 MM

+10.0%

Gross Margin

OPEX

Headcount

Effective Tax Rate

-12.4 points

+9.8%

40.0% 42.9%+2.9 points

+36.5%

+8.6%

Q2-14/Q2-13 H1-14/H1-13

+2.8 points

August 2014 33

Business Has Become More Cyclical and Seasonal With Shorter Cycles

Mar10 Jun 10

Sept10

Dec10

Mar11 Jun 11

Sept11

Dec11

Mar12 Jun 12

Sept12

Dec12

Mar13 Jun 13

Sept13

Dec13

Mar14 Jun 14

Total Equipment 1.21 1.18 1.03 0.90 0.95 0.94 0.71 0.85 1.12 0.93 0.78 0.92 1.11 1.10 0.97 1.02 1.06 1.09

Assembly Market 1.51 1.35 0.81 0.86 1.01 0.92 0.81 1.02 1.28 1.11 0.53 0.92 1.08 1.26 0.68 1.06 1.25 1.25

1.21

0.90 1.12

0.78

1.06

1.51

0.81

1.28

0.53

1.26

0.68

1.25

0.50

0.75

1.00

1.25

1.50

1.75

• Besi order trends highly correlated to assembly equipment industry• Strong industry growth in H1 followed by weaker H2 has been the trend

Source: Semi July 2014

Assembly Market

Total Semi Equipment

August 2014 34

35

• Quarterly revenue/order patterns show cyclicality of semiconductor business :• Three cycles past 3 years• Short term patterns due to customer

caution and increased seasonality • Q3-13 trough. Large H1-14 rebound

• Gross margins have improved despite cyclicality :• Increased scalability of production model• Shift to higher margin systems• Lower unit costs due to:

• Asian production transfer• Reduction in European personnel

• Product mix shift to higher margin advanced packaging systems has aided gross margin development :• Multi module + flip chip die attach• Ultra thin molding systems• Drivers: mobile internet, intelligent auto

components, IOT and new devices• Exit from lower margin plating, wire

bonding and packaging systems

Quarterly Revenue/Gross Margin Trends

64

72 65

53

70

116

64

83

48

57

111

124

30.0%

32.0%

34.0%

36.0%

38.0%

40.0%

42.0%

44.0%

46.0%

48.0%

50.0%

-

20

40

60

80

100

120

140

Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14G

ross

Mar

gin

%

In M

illio

ns €

Revenue Orders Gross Margin

August 2014

Net Income Trends

• Quarterly net income trends reflect industry and seasonal volatility

• YOY Margins expanding• Net margin of 19.7% in Q2-14 vs. 9.0% in

Q2-13

• Aided by improving gross margins and significant operating leverage• Quarterly opex have ranged between

€ 20-25 million over past 10 quarters• € 23.8 million in Q2-14 (ex restructuring)

• As well as lower effective tax rate• Declined from 22.3% to 9.9% YTD• Full impact of 2012 European operational

restructuring and profit mix of European subsidiaries

3.8

6.5 4.4

1.4

7.0

22.9

5.9%

9.0%

6.8%

2.7%

10.0%

19.7%

0.0%

5.0%

10.0%

15.0%

20.0%

25.0%

0

2

4

6

8

10

12

14

16

18

20

22

24

26

Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14

(eur

o in

mill

ions

)

Net Income ex. NR Net IncomeNet Margin Net Margin ex. NR

3.4

36August 2014

37

Liquidity Trends

• Solid liquidity position• € 83.8 million cash at 6/30/14• € 2.21 per share vs. € 12.47 price • Net cash reached € 83.8 million in Q2-14

• Has Been Utilized to Enhance Shareholder Value• € 57 million spent on cash dividends and

share repurchases 2011-2014

• Strong balance sheet supports future organic growth and acquisition strategy

91.9

81.1 78.5

89.6 91.9

83.8

27.7 24.9

22.5 18.6 19.1

21.3

64.2

56.2 56.0

71.0 72.8

62.5

0

10

20

30

40

50

60

70

80

90

100

Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14

(eur

o in

mill

ions

)

Cash Debt Net Cash

August 2014

Dividend Trends

38

0.20 0.22 0.22

0.33

--

0.08

-

0.20 0.22

0.30

0.33

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

2009 2010 2011 2012 2013

Div

iden

d (€

)

Base Dividend Special Dividend

+10.0%

+36.4%

+10.0%

August 2014

39

V. OUTLOOK & SUMMARY

August 2014

2014 Industry Outlook

40

Global Market Environment Improving

VLSI sees assembly system growth in 2014/2015 driven by advanced packaging apps

New tech/device buys and capacity

additions

Renewed strength in tablets, smart

phones and automotive

Die bonding and flip chip are positive. TCB flip chip is

emerging

Companies with thin package

capabilities are winning

August 2014

Q3-14 Guidance

Revenue Gross Margin* Operating Expenses* Capex

Q2 Q3 Q2 Q3 Q2 Q3 Q2 Q3

€ 116.2 43.7% € 23.8 € 1.0

42%-

44%

Down10-15%

Up€ 1.0 MM

* Excluding restructuring

• Revenue up 50-60% above Q3-13. Market is stronger than prior years• 10-15% sequential revenue decrease due to seasonal industry trends• Gross margins range between 42-44% • Opex up 0-5%• High profit levels anticipated. Substantial growth vs. Q3-13• Capex of € 2.0 million

Up0-5%

August 2014 41

42

Summary

Leading semi assembly equipment supplier with #1

or #2 positions in fastest growing assembly

segments

Scalability and profitability of business model greatly

enhanced in cyclical industry

Strong H1-14 growth. Gaining market share in

advanced packaging. Favorable outlook for 2014

Solid liquidity position to finance growth

Significant upside potential.Advanced packaging

growth, operating initiatives and optimization of Asian

production model

Committed to enhancing shareholder value.

Attractive dividend yield relative to peers

August 2014