INVESTOR PRESENTATIONMAY 2015

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of our business thatconstitute forward-looking statements, which are found in various places throughout the press release, including , but notlimited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing ofpurchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use ofwords such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward lookingstatements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forwardlooking statements. While these forward looking statements represent our judgments and expectations concerning thedevelopment of our business, a number of risks, uncertainties and other important factors could cause actual developmentsand results to differ materially from those contained in forward looking statements, including the discovery of weaknesses inour internal controls and procedures, our inability to maintain continued demand for our products; the impact on ourbusiness of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipatedorders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand forsemiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts ofterrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing andprotect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; thoseadditional risk factors set forth in Besi's annual report for the year ended December 31, 2014 and other key factors thatcould adversely affect our businesses and financial performance contained in our filings and reports, including our statutoryconsolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter ourforward-looking statements whether as a result of new information, future events or otherwise.

May 2015 2

Agenda

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

May 2015 3

I. COMPANY OVERVIEW

May 2015 4

Besi Overview

• Leading assembly equipment supplier with #1 and #2 positions in key products. 32% addressable market share

• Broad portfolio: die attach, packaging and plating• Strategic positioning in substrate and wafer level packaging • Global mfg. operations in 7 countries; 1,680 employees

worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• 2014 revenue and net income of € 378.8 and € 71.1 million• Cash at 3/31/15: € 161.6 million• Total debt at 3/31/15: € 28.4 million• € 114 million of dividends and share repurchases since 2011

Financial Highlights

• Growth of advanced packaging, smart phones, wearable devices, auto electronics, IoT and market share gains offer revenue upside

• Significant unrealized earnings potential from optimization of Asian production, supply chain efficiencies and development of common platforms

Investment Considerations

May 2015 5

€ 85.5

€ 403.7

25.9%

45.3%

20%

25%

30%

35%

40%

45%

50%

55%

0

100

200

300

400

2003 LTM

Gro

ss M

argi

n (%

)

Rev

enue

(€m

illion

s)

Revenue Gross Margin

Company History

•2000 2002 2005 2009

Die Attach Acquisitions

•2006 Dragon I complete: € 6 million cost savings•2008 Dragon II complete: € 15 million cost savings•2010 Plan: € 7.0 million cost savings. Headcount and product line restructuring

•2012 : € 8.3 million cost savings. Headcount reduction. Plating unit rationalized

•2014: US die sorting operations rationalized. Transferred to Besi Austria

Restructuring

•2006-09 Standard packaging and certain die bonding systems transferred to Malaysia

•2007-09 Dutch tooling & Hungarian die bonding transferred to Asia•2009-11 Epoxy die bonder transferred to Malaysia•2003-12 Malaysian system and Chinese tooling capacity expansion. •2013 Soft solder die bonder transferred to Malaysia•2006-14 Asian headcount increased from 34% to 59%•2015: Transfer of certain software engineering, logistics and related administrative functions from Switzerland to Singapore

Asian Production Transfer

May 2015 6

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

SubstrateWire Bond Assembly

SubstrateFlip Chip Assembly

Wafer Level PackagingFlip Chip Assembly

Wire BondDie Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

Product Positioning

May 2015 7

Best in Class Product Portfolio

• Molding- AMS series- AMS LM 95- MMS series- FML

• Die Bonding- 2100 xPplus

- 2100 sDplus

- 2100 sD PPPplus

- 2100 HS - 2009 SSI- 2100 DS

Die Attach Packaging & Plating

• Multi Module Die Attach- 2200 evo- 2200 evo plus

• Flip Chip- 8800 FC QUANTUM- 8800 CHAMEO- 8800 TCB - 2100 FC

• Trim & Form- Compact series- Power series- Compact Line XHD New

• Plating- Leadframe- Solar- Film & Foil

In Development

•Next generation Die Attach•Next generation Packaging•Common modules

Datacon/Esec

Datacon

Esec

Fico

Meco

•

Fico

NewFico

• Singulation- FSL

New

New

• Die Sorting- DS 9000E- WTT- TTR- DLA

Datacon

NewNew

New

New

May 2015 8

Customers OEMs End Products

Customer Ecosystem

• Blue chip customer base, top 10 = 60% of 2014 revenue • Leading IDMs and subcontractors. 60/40% split in 2014• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek• Long term relationships, some exceeding 45 years

IDMs

Subcontractors

May 2015 9

Global Operations

as of 31 March 2015

Europe/NA Asia

Revenue (MMs) € 33.2 35.0% € 61.7 65.0%

Headcount 664 39.5% 1,016 60.5%

• Development activities in Europe and USA

• Increasing production and sales/service activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

LeshanChengdu

ShanghaiKorea

Taiwan

PhilippinesMalaysia

Singapore*

Suzhou

Radfeld, (Austria)*Cham,(Switzerland)*

Duiven & Drunen,(The Netherlands)*

Chandler

Shenzhen

May 2015 10

Year Ended December 31, (€ millions, except share data) 2012 2013 2014

Revenue 273.7 254.9 378.8Orders 276.1 251.9 407.6Gross margin 40% 40% 44%

EBITDA 32.4 27.9 82.1Pretax income 19.5 19.2 71.3Net income 15.8 16.1 71.1EPS (diluted) 0.42 0.43 1.87Net margin 6% 6% 19%

Net cash 79.5 71.0 118.0

Summary Historical Financials

• Record 2014 Results:• Revenue and orders +48.6% and 61.8%• Gross Margin +4.0% to 43.8%• Net Income +341% to € 71.1 million • Net cash +€ 47.0 million

• Primary drivers:• Industry rebound• Strategic positioning in advanced packaging

has accelerated market share gains• Enhanced profit potential of business model

• Operating initiatives have supported gross and net margin development

• Solid liquidity base to finance growth and shareholder returns

May 2015 11

Dividend Trends

0.20 0.22 0.30 0.33

1.50

1.25

0.73

0.42 0.43

1.87

4.0%4.3%

5.2%

4.0%

8.1%

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2010 2011 2012 2013 2014

Div

iden

d yi

eld

Div

iden

d (€

)

Dividend EPS (diluted) Total Dividend Yield (a)

a) Based on year end stock price

16% 30% 71% 77% 80%Payout Ratio:

May 2015 12

II. MARKET

May 2015 13

Assembly Equipment Market Trends

• VLSI forecasts muted growth in 2015 after big 2014 increase• Besi revenue growth exceeding assembly market in 5 of past 6 years

326.9 273.7 254.9

378.8

70.0 94.9-16.3% -6.9%

48.6%35.6%

-50%

0%

50%

100%

150%

-

100.0

200.0

300.0

400.0

2011 2012 2013 2014 YTD 2014 YTD 2015

(€m

illio

ns)

Besi Revenue Revenue YoY Growth Rate

4.3 3.9

3.0

3.7 3.9

-9.6%

-23.1%

24.3%

3.4%

-30%

-20%

-10%

0%

10%

20%

30%

-

1.0

2.0

3.0

4.0

5.0

2011 2012 2013 2014E 2015F

(US$

bill

ions

)Assembly Equipment Market Size YoY Growth Rate

Source: VLSI January 2015

May 2015 14

Die Bonding38.4%

Flip Chip16.2%

Die Sorting4.5%

Singulation8.3%

Presses8.9%

Molds16.1%

Lead Trim & Form6.3%

Plating1.3%

Assembly Equipment Market Composition

• Half of assembly market represented by die attach and wire bonding equipment• Die Attach represents Besi’s largest addressable market

Die Attach 59%

Packaging 40%

Plating1%

Assembly Equipment Market * (2014: $3.7 billion)

Besi Addressable Market *(2014: $1.6 billion)

* Source: VLSI Feb 2015

Wire Bonding22.3%

Die Attach28.4%Packaging

20.6%

Plating0.6%

Other Assembly

(Inspection, Dicing)28.1%

May 2015 15

Advanced Packaging Unit Volume and MarketShare Are Increasing

• Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process

• In growth phase with move to <20 nano driven by smart phones, tablets, autos, Internet of Things and wearable devices

Source: VLSI February 2015

10%13%

19%

26%

31%32%

34%35% 37% 38%

0%

5%

10%

15%

20%

25%

30%

35%

40%

-

5

10

15

20

25

30

35

40

45

2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

AP M

arke

t Sha

re %

M w

afer

s, 3

00M

M E

q.

Advanced Packaging Silicon Demand Growth & Market Share 2010 - 2019Advanced Packaging WafersAdvanced Packaging Unit Market Share (%)

CAGR 2010-2019: 21.1%

May 2015 16

Advanced Packaging Growth Favors Besi

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage

• <20 nanometer geometry will be the standard chip design over the next 3-5 years• System on Chip or System in Package via substrate and wafer level packaging process is the only answer• Besi has full range of AP systems. 2014E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach• Die Sorting: DS 9000• Die Bonding: ES 2009, ES2100• Flip Chip: DC 8800, ES2100• TCB: DC 8800 TCB• Multi Module: DC evo 2200

Packaging• Molding: AMS-LM 95• Singulation: FSL

High Growth EndUser Areas:

Mobile internet devices, Autos,

MEMS, Internet of Things, Wearable

devices

Datacon Esec Fico

May 2015 17

Computer, PCs50%

Mobile Internet Devices

22%

Auto13%

Industrial10%

LED3%

Service2%

2008

And Is Reflected in Besi End User Application Trends

Computer, PCs20%

Mobile Internet Devices

35%

Auto17%

Industrial10%

LED3%

Spares/ Service

15%

2014

Source: 2014 Company Estimates

• Mobile internet devices now equal 35% of Besi’s end user revenue

• Automotive has also increased significantly in recent years

• Service/spare parts have grown to 15%. Less cyclical revenue stream

May 2015 18

Driven Primarily by Growth in Internet Connected Devices

• 35% CAGR device growth forecast over next 5 years

• Powered by devices used for Internet of Things (IoT)

• Positive trajectory for smart phone, tables, wearables, and automotive

• Significant potential revenue growth driver

May 2015 19

New Smart Phone Designs Increase Addressable Market Potential

• Besi systems can assemble 50% of 2012 generation components and 70% of 2014 generation components

- NewMain Components

Generation 2012

Generation 2014

Manufacturer IDM/OSAT Besi system Utilized

Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LMDRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSLNAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LMPower Management

Apple PM IC X Dialog Dialog 2100sDPMIC X X Qualcomm N/A

M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LMAccelerometer/Gyroscope/Barometric

Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL3-ax accelerometer X Bosch Bosch evobarometric sensor X Bosch Bosch evo

CommunicationsGeneration

2012Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Wifi/NFCWifi module X X Murata Murata Murata's equipmentNFC X NXP Amkor 8800FCQ, AMS-W/LMNFC Booster IC X AMS Daca N/A

LTELTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LMLow Band LTE PAD X Skyworks Skyworks 2200evo, FSLMid Band PAD X Skyworks Skyworks 2200evo, FSLHigh Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM

Receiver/TransceiverRF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LMRF Receiver X X Qualcomm N/AEnvelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM

Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD PA

PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LMPA Module X Triquint ASE 2200evo, 2100sD

Video/AudioGeneration

2012Generation

2014Manufacturer IDM/OSAT Besi system Utilized

CameraBack side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evoFront 1.2M X X Apple Cowell, Sony 2200evo

Finger print sensor X Apple ASE 2200evoAudio

2+4 microphones X ST ST 2100 xpAudio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM

Touch screen controlTouch screen control X X Broadcom Signetics 2100sDTouch Transmitter X TI TI FCL

May 2015 20

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI February 2015

May 2015 21

• Move to <20 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 27% currently of total potential market of $1.1 billion

• Expected to gain share rapidly over next 6 years vs. wire bonding (4.4% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates by key IDMs/subcons

CAGR 2014 – 19*Flip Chip 6.6%Wire Bond 2.2%

Flip Chip$428 32%Wire

Bonding$929 68%

2019*

Flip Chip$311 27%

Wire Bonding

$833 73%

2014*

Besi Has Gained Market Share In Its Addressable Markets

• Gaining share in fastest growing segments of the assembly equipment market:• Flip chip and multi module die attach and ultra thin molding for advanced

packaging applications

Besi Market Share

Source: VLSI, Jan 2015 and Besi estimates 2012 2013 2014Total Assembly Equipment Sales 8.6% 10.8% 13.4%

Besi Addressable Market 21.8% 27.0% 31.7%

Total Die Attach Equipment 27.7% 33.1% 38.7%Die Bonding 29.7% 39.6% 44.0%Flip Chip 22.2% 25.4% 34.1%Other 25.9% 7.5% 10.0%

Total Packaging Equipment 11.1% 16.0% 18.0%Molds 12.0% 19.2% 21.2%Lead Trim & Form 15.0% 17.6% 18.1%Singulation 5.3% 5.1% 8.5%

Total Plating 75.8% 83.8% 90%+

May 2015 22

• Customers are largest producers. • Engaged in most advanced packaging applications

• Strong customer market shares:• 60 - 100% of die attach requirements

• 20 - 100% of packaging requirements

• Customer market shares p.a. vary based on capacity needs and purchasing cycles

• Primary competition:• Die Attach: ASM-PT, Hitachi, Canon• Packaging: Towa, Hanmi,

ASM-PT

And With Leading Edge Technology Customers

N/B No reported bookings for Besi or its competitors* Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly

production done by subcontractors** In general, Samsung satisfies approximately 50% of its equipment needs internally

Die Attach PackagingIn USD 2012 2013 2014 2012 2013 2014

SubcontractorsASE 67% 59% 69% 36% 65% 24%Amkor 75% 84% 89% 45% 11% 22%STATSChippac 95% 100% 85% 28% 100% 100%SPIL 47% 93% 89% 37% 76% 19%Unisem 92% 84% 100% N/B N/B N/BJCET 75% 48% 67% 0% 8% 0%Cowell/Foxconn

100% N/B 100%(Camera Modules) N/B N/B N/B

IDMs *Skyworks 100% 96% 100% 13% 24% 38%ST Micro 91% 72% 78% 44% 76% 42%Infineon 81% 97% 100% 0% 24% 90%Micron 86% 100% 43% 50% N/B 100%Samsung** 5% 0% N/B 0% 100% N/B

% of Besi Die Attach and Packaging systems revenue

49% 48% 60% 54% 66% 54%

May 2015 23

III. STRATEGY

May 2015 24

Summary Strategy

• Continue enhancing best in class <20 nano assembly equipment portfolio• Expand tech capabilities and applications for TCB line• IoT and wearables have potential to significantly expand addressable market

Develop new products and markets

• Leverage <20 nano expertise in flip chip, molding, multi module attach to further penetrate largest smart phone supply chains and expand in Chinese handset market

• Apply TCB tech advantage to more mainstream applications• Flip Chip/Wire Bond conversion for advanced applications can further grow market share

Increase market share in addressable markets

• Expand Asian materials sourcing and direct shipments• Start Chinese die bonding production for local market• Continue common platforms, common modules and common parts• Better align US dollar/CHF/euro exposure

Achieve a more scalable, flexible and lower cost manufacturing model

• Expand tech leadership in advanced packaging including wafer level assembly

Acquire companies with complementary technologies and products

May 2015 25

Operations Agenda

Operational Objectives

Expansion of Asian supply chain. System module outsourcing

Transfer of certain die bonding production from Malaysia to China

Transfer of certain Swiss Die Attach software, logistics and administrative functions to Singapore

Development Objectives

Advanced TCB die bonding development

Introduction of next generation packaging systems

Common platform/parts activities

2015 2016

May 2015 26

Asian Production Has Significantly Expanded

396

487

658 673

963

170

331

553 579

927

42.9%

68.0%

84.0% 86.0%

96.3%

0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

-

200

400

600

800

1,000

1,200

2010 2011 2012 2013 2014

% D

irect

Shi

pmen

ts

Ship

men

ts

Total Asian Shipments Direct Asian Shipments % Direct

May 2015 27

Leading to Lower European Headcount

• Fixed European/North American headcount reduction:• Down 19.4% since 2011• Declined from 56% of total in 2009 to

39% at Q1 2015

741 680 624 602 597

802 799

810 908 933

1,543 1,479 1,434

1,510 1,530

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2011 2012 2013 2014 Q1 2015

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC Total

52%

48%

54%

46%

56%

44%

60%

40%

May 2015 28

61%

39%

And Also Reduced Break Even Revenue Levels

270

235

212 207

-

50

100

150

200

250

300

2011 2012 2013 2014

(€m

illio

ns)

(13.0%)

(9.8%)(2.4%)

May 2015 29

Workforce Has Become More Scalable and Flexible

• 2014 revenue ramp achieved using primarily Asian production temps

• Aggregate headcount varies with cyclicality and seasonality of business

741 680 624 602 597

802 799 810 908 933

64 60

24 122 150

1,6071,539

1,458

1,632 1,680

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

-

500

1,000

1,500

2,000

2,500

2011 2012 2013 2014 Q1 2015

Tem

p %

of T

otal

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC

Temporary HC Temp % of Total

May 2015 30

Materials Cost Reduction Is Also a Key Priority

• Qualify and Select Asian Vendors• 50% of the way there

Supply Chain Actions

• Redesign products• Increase standardization of systems

• Component parts• Modules

Development Actions

+5% Gross Margin Upside

• Material costs represent approximately 45% of revenue• Shift to Asia centric supply chain:

• Reduces transport, inventory costs and obsolescence• Improves cycle time and ramping flexibility

• Management Board reviews progress weekly component by component

May 2015 31

Partially Achieved Through Common Parts Product Redesign

• Magazine handler• Wafer gripper• Dispenser• Wafer table• Wafer Cassette Handler• Die Ejector• Control Platform

Areas of focus:

Potential Unit Cost Savings

DB2100 (7%)

2200evo (11%)

8800FCQ (11%)

Average (9%)

May 2015 32

• Development efforts underway to redesign die attach and packaging systems to increasecommon parts utilized per system

• Benefits: Lower unit cost, improved working capital mgt, shorter cycle times

IV. FINANCIAL REVIEW

May 2015 33

€ 70.0

€ 94.9

10.0%

18.5%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

65%

70%

75%

80%

85%

90%

95%

€ 0

€ 25

€ 50

€ 75

€ 100

Q1 2014 Q1 2015

Net

mar

gin

%

€m

illion

s

Revenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate11.6% 12.9%

1,569 1,680

€ 21.5 MM

€ 25.3 MM

+111

+1.3 points

+17.6%

42.3% 49.0%

+35.6%

+8.5 points

Q1-15/Q1-14 FY 2014/FY 2013

+6.7 points

€ 17.5

€ 254.9

€ 378.8

6.3%

18.8%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

65%

70%

75%

80%

85%

90%

95%

0 €

50 €

100 €

150 €

200 €

250 €

300 €

350 €

400 €

2013 2014

Net

mar

gin

%

€m

illion

s

Revenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate15.8% 0.3%

1,458 1,632

€ 82.7 MM

€ 93.8 MM

39.8% 43.8%

+174

-15.5 points

+13.4%

+4.0 points

+48.6%

+12.5 points

€ 71.1€ 16.1€ 7.0

Revenue Growth and Margin Expansion Yield Increased Profitability

May 2015 34

Quarterly Book to Bill Trends Reflect Quarterly Seasonality and Volatility

• Strong industry growth in H1 followed by weaker H2 has been the trend• Assembly market more volatile than general semi equipment business

Source: Semi April 2015

Assembly Market

Total Semi Equipment

Mar 11 Jun 11 Sept11 Dec 11 Mar 12 Jun 12 Sept

12 Dec 12 Mar 13 Jun 13 Sept13 Dec 13 Mar 14 Jun 14 Sept

14 Dec 14 Mar 15

Total Equipment 0.95 0.94 0.71 0.85 1.12 0.93 0.78 0.92 1.11 1.10 0.97 1.02 1.06 1.10 0.94 0.99 1.10Assembly Market 1.01 0.92 0.81 1.02 1.28 1.11 0.53 0.92 1.08 1.26 0.68 1.06 1.25 1.25 0.69 0.84 1.34

0.95

0.71

1.100.97

0.94

1.10

1.01

0.81

1.26

0.68 0.69

1.34

0.50

0.75

1.00

1.25

1.50

1.75

May 2015 35

• Cyclical quarterly revenue/order patterns:• Three cycles past 3 years• Short term patterns due to customer

caution and increased seasonality • 2014 year end shows higher base line

order levels than prior years

• Gross margins have improved despite cyclicality:• Increased scalability of production model• Shift to higher margin advanced

packaging systems• Exit from lower margin plating, wire

bonding and packaging systems • Lower unit costs due to:

• Asian production transfer• Reduction in European personnel• Favorable USD/euro starting in H2-

14

Revenue/Order/Gross Margin Trends

72 65

53

70

116

104

8994.9

83

48 57

111

124

91

81

104.2

40.4%39.2%

40.1%

42.3%43.2%

45.3%43.8%

49.0%

48.2%

35.0%

40.0%

45.0%

50.0%

55.0%

60.0%

-

20

40

60

80

100

120

140

Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15

Gro

ss M

argi

n %

euro

in m

illion

s

Revenue OrdersGross Margin Adjusted Gross Margin

May 2015 36

Net Income Trends

7.0

3.4

12.2 14.2

(0.5)(2.0)

7.5

3.3

6.5

4.41.4

7.0

22.9 21.5

19.7

17.5

9.0%6.8%

2.7%

10.0%

19.7% 20.8%22.2%

18.5%

-25%

-15%

-5%

5%

15%

25%

35%

(3)

0

3

6

9

12

15

18

21

24

Q2-13(a)

Q3-13 Q4-13(a)

Q1-14 Q2-14 Q3-14 Q4-14(a)

Q1-15(a)

(eur

o in

milli

ons)

Net Income ex. NR Non Recurring Net Margin

May 2015 37

• Quarterly net income trends reflect industry and seasonal volatility

• Profit increase aided by revenue growth, through cycle gross margin expansion and opex leverage in business model

• Significant reduction in effective tax rate has also helped

• Net margin of 18.5% in Q1-15, up significantly from 10.0% in Q1-14

(a) Adjusted to exclude:After tax net restructuring (Q1-15)Deferred tax benefits (Q4-14)€ 0.5 million and € 2.0 million non recurring charges in Q2-13 and Q4-13, respectively

Liquidity Trends

• Solid liquidity position• € 161.9 million cash at 3/31/15• € 4.29 per share vs. € 29.87 price (as of March 31, 2015)

• Net cash reached € 133.1 million at year end of Q1 2015

• Has Been Utilized to Enhance Shareholder Value• € 114 million spent on cash dividends and

share repurchases 2011-2015

• Strong balance sheet helps support future organic growth and acquisition opportunities

38

81.1 78.5

89.6 91.9 83.8

105.4

135.3

161.6

24.9 22.5 18.6 19.1 21.3 19.3 17.3

28.5

56.2 56.0

71.0 72.8 62.5

86.1

118.0

133.1

0

20

40

60

80

100

120

140

160

180

Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15

(eur

o in

milli

ons)

Cash Debt Net Cash

May 2015 38

V. OUTLOOK & SUMMARY

May 2015 39

2015 Industry Outlook

Market Environment Remains Positive Although Mixed Picture by Supplier and Application

VLSI sees assembly system growth in 2015 driven by advanced packaging apps

New tech/device buys and capacity

additions

Strength in smart phones,

automotive, IOT and wearables

Die bonding and flip chip are positive. TCB flip chip is

emerging

Companies with thin package

capabilities are winning

May 2015 40

Q2-15 Guidance

Revenue Gross Margin* Operating Expenses*

Q1 Q2 Q1 Q2 Q1 Q2

€ 94.9 48.2% € 28.3

Up10-15%

• Underlying business growth continues• Revenue up approximately 10-15% vs. Q1-15 • Gross margins of 46-48%• Opex up 5-7% vs. Q1-15 due primarily to higher forex, R&D and warranty• Sequential Q2-15 and H1-15/H1-14 revenue and net income growth

Up5-7%

*excluding restructuring benefit

48%-

46%

May 2015 41

Summary

Leading semi assembly equipment supplier with #1

or #2 positions in fastest growing assembly

segments

Scalability and profitability of business model greatly

enhanced in cyclical industry

Strong 2014 growth. Gaining market share in

advanced packaging. Positive outlook for 2015

Solid liquidity position to finance growth

Significant upside potential.Advanced packaging

growth, operating initiatives and optimization of Asian

production model

Committed to enhancing shareholder value.

Attractive dividend yield relative to peers

May 2015 42