introduction to okins electronics
TRANSCRIPT
We are connecting to the future !
ins
Introduction toIntroduction toIntroduction toIntroduction to
OKins ElectronicsOKins ElectronicsOKins ElectronicsOKins Electronics
Introduction toIntroduction toIntroduction toIntroduction toIntroduction toIntroduction toIntroduction toIntroduction to
OKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins Electronics
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Contents
� Corporate Profile
� OKins Business Introduction
� BiTS Technologies & Engineering
� BiTS Products Details
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Company Profile
Company Name OKins Electronics CO., LTD.
CEO/President Jin-Kook Jun
Founded on Apr.13 1998
Employee 85 (as of Apr.2007)
Address HQ 6F Byucksan Sunyoung Technopia, 196-5,
Ojeon-dong, Uiwang-si, Gyunggi-do, Korea
R&D Samjon-ri 19, Songsan-myeon, Hwasung-si,
Gyunggi-do, Korea
Web site www.okins.co.kr
Contact (T)82.31.460.3500 (F)82.31.460.3555
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Mold & StampMold & Stamp
BUBU
SemiconductorSemiconductor
BUBU
Connector BUConnector BU
BiTSBiTS BUBU(Burn(Burn--In & Test Socket)In & Test Socket)
* BU : Business Unit
Business Portfolio
Display BUDisplay BU
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Organization
EngineeringEngineering
CEOCEO
Burn-in socketBurn-in socket
General AffairGeneral Affair
Test SocketTest Socket
PurchasingPurchasing
FinanceFinance
Spring probesSpring probes
Prod Eng’ringProd Eng’ring
Team IITeam II
Team ITeam I
ProductionProduction
SalesSales
Test SocketTest Socket
Burn-in SocketBurn-in Socket
BiTS BUBiTS BU Semicon BUSemicon BU
EngineeringEngineering
SalesSales
SalesSales
DevelopmentDevelopment
AdministrationAdministration
QCQC
QAQA
Connector BUConnector BU
COKCOK
ProductionProduction
Overseas BUOverseas BU
ProductionProduction
Display BUDisplay BU
EngineeringEngineering
ProductionProduction
MarketingMarketing
Stamping R&DStamping R&D
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Customer is always right; Customer provides the definition of quality. Quality
should be judged by customer not by ourselves, and we accept the judge by
customer.
� Our quality defines not only products, but also our services; Customer assess
the quality of our services as well as the quality of our products, when it comes
to total customer satisfaction. Our services will delight our customers beyond
expectation.
� The quality management system focus on prevention; It is too late when we
detect a defect, eliminating the cause of a defect is our principle in quality
management. Every possible means shall be implemented in order to prevent
any potential defect.
“OKins Quality principle is to deliver our customers never-content satisfaction
through continuous improvement with innovative quality products”
Our commitment to quality control system enforces not only to simply win market
share, but to offer the best quality. We believe the dedication to the OKins quality
management gives us the recognition worldwide.
Quality Principles
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Hsinchu, Taiwan
Yokohama, Japan
Phoenix, USA
Singapore
Suzhou, China
UK, Europe
OKins, Korea
Manila, Philippines
OKins Network
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
· New Intelligence Co., LTD.
· Tsu Yu Building
5F-2 NO.67 Tsu Yu Road
Hsin Chu, Taiwan, R.O.C.
· Contact : Amy Wu
· TEL : 886-3-534-6339
· FAX : 886-3-534-6337
· Antares-ATT K.K.
· 6F Paleana Building
2-2-15 Shin Yokohama,
Japan, 222-0033
· Contact : Masao Inagaki
· TEL : 81-45-473-9881
· FAX : 81-45-473-9884
· Antares Advanced Test Technologies
· 2102 W.Quail Avenue, Suite 2
Phoenix, AZ 85027
· Contact : Mark Murdza
· TEL : 1-623-581-5330
· TF : 1-800-348-2505 EXT.49
· FAX : 1-623-780-3987
Taiwan
Japan
U.S.A
· Antares Advanced Test Technologies
· The Siemens Center, 60 Macpherson Rd,
Blk 1, # 07-09A, Singapore 348615
· Contact : CK Wee
· TEL : 65-6391-5310
· FAX : 65-6292-2661
· Antares Advanced Test Technologies
· Burlington House369, Wellingborough RoadNorthampton NN24EU, England
· Contact : Trevor Beard
· TEL : 44-1604-638642
· FAX : 44-1604-621240
Singapore
China
Europe
· OKins China Suzhou Office
· 610,Blkb1A, Singa Plaza, No.8, Jinji Hu Road,
Suzhou Industrial Park, PRC. 215021
· Contact : Su Jin Jeong
· TEL : 86.512.6763.4380
· FAX : 86.512.6763.4381
OKins Network
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Corporate Profile
� OKins Business Introduction
� BiTS Technologies & Engineering
� BiTS Products Details
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Burn-in Socket
Test Socketfor Memory
Test Socketfor Non-Memory
Spring Probes
COK
Heat Sink
TSOP, BGA, CSP, PLCC, etc
Heat sinks for memory module
Change Over Kit for final package test
Customized design; single & dual ended
Logic, ASIC, RF, Wireless, CCM, etcATE handler, Manual operation
Spring probes (pogo), stamped contactTSOP, QFP, BGA, CSP, etc
BiTS (Burn-in & Test Socket) BU
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Products � I/O connectors (cell phone)
� 2pin battery connectors (cell phone)
� Joggle switch (MP3)
� 18pin plug (cell phone charger)
� I/O connectors (cell phone)
� 2pin battery connectors (cell phone)
� Joggle switch (MP3)
� 18pin plug (cell phone charger)
Connector BU
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Mold & Stamp BU
Business SubjectBusiness SubjectBusiness Subject
� Research & Development for
- Stamping technology: BeCu, etc
- Molding technology: fine pitch, low cost, etc
- Material research
� Production Support for
- Socket contact: burn-in socket, test socket
- Connector contact
- Memory module heat sink
- Socket molds: burn-in socket, test socket
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Service Area EDS (Electric Die Sorting)Package Test
Devices ASIC, Digital, Analog,Sensors, Mixed Signal, etc
Testers Advantest T3324Teradyne A360Eagle ETS-200FSTLA III (TAOS)Teradyne Flex (in plan)
Prober EG4080/4090P-8XL, 80W
Semiconductor BU (Test House)
Handler TAOS(YYE)
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Corporate Profile
� OKins Business Introduction
� BiTS Technologies & Engineering
� BiTS Products Details
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Strengths
� Comprehensive understanding of the test interface mechanism
: Various product line – test socket, burn-in socket, device carrier,
component parts, etc
� Flexible design proposal: compatible with market existing designs,
ATE, handlers, boards, etc
� Price and lead time competitiveness over high volume demand
� User friendly designed products that enables to minimize
maintenance time and cost
� Intimate relation with customers in many aspects known as the
best in the market
� Comprehensive understanding of the test interface mechanism
: Various product line – test socket, burn-in socket, device carrier,
component parts, etc
� Flexible design proposal: compatible with market existing designs,
ATE, handlers, boards, etc
� Price and lead time competitiveness over high volume demand
� User friendly designed products that enables to minimize
maintenance time and cost
� Intimate relation with customers in many aspects known as the
best in the market
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Customers
Customer ProductsCustomer Products
Samsung BI socket, Test socket, Carrier & kit
Hynix BI socket, Test socket, Carrier
Infineon BI socket (OEM)
Spansion BI socket (OEM), Carrier
Intel BI socket (OEM)
Amkor Test socket, Spring probes
Board houses BI socket, Test socket
Samsung BI socket, Test socket, Carrier & kit
Hynix BI socket, Test socket, Carrier
Infineon BI socket (OEM)
Spansion BI socket (OEM), Carrier
Intel BI socket (OEM)
Amkor Test socket, Spring probes
Board houses BI socket, Test socket
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Mechanical Engineering capable of mechanical design
- burn-in socket- test socket for memory & logic products- specific commercial connectors- other mechanical parts
� Electrical Engineering capable of electrical modeling and simulation- mechanical performance prediction
� Spring probes engineering for next generation devices- high speed- low inductance- high current- low cost
� Molding & Stamping capabilities for micro pitch products
� Micro machining technology- research team for MEMS and LIGA development
� Alternative contact development for test socket- low cost- high speed (RF, wireless, etc)- high performance in yield
� World wide research resources for new materials
� Mechanical Engineering capable of mechanical design
- burn-in socket- test socket for memory & logic products- specific commercial connectors- other mechanical parts
� Electrical Engineering capable of electrical modeling and simulation- mechanical performance prediction
� Spring probes engineering for next generation devices- high speed- low inductance- high current- low cost
� Molding & Stamping capabilities for micro pitch products
� Micro machining technology- research team for MEMS and LIGA development
� Alternative contact development for test socket- low cost- high speed (RF, wireless, etc)- high performance in yield
� World wide research resources for new materials
Engineering
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Mechanical Engineering
13 engineers capable of mechanical design
burn-in socket
memory test socket & kit
logic test socket
spring probe
connector
� Electrical Engineering
1 engineer capable of electrical modeling
electrical engineering Lab at a college
: modeling, simulation
� Mechanical Engineering
13 engineers capable of mechanical design
burn-in socket
memory test socket & kit
logic test socket
spring probe
connector
� Electrical Engineering
1 engineer capable of electrical modeling
electrical engineering Lab at a college
: modeling, simulation
Socket Engineering
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Burn-in Socket
� Various CSP socket outlines for users’ flexible BI board design
� Competitive price offer with fast lead time on high volume
production requirements
� Three different contact force contacts available upon package
balls composition: Eutectic and Pb-free
� Anti-sticking mechanism: Slider moves during cover press down
which prevents from ball sticking
� Abundant field experience & FA capability with working world
largest burn-in houses
� Burn-in Board supply could be possible upon request.
� Various CSP socket outlines for users’ flexible BI board design
� Competitive price offer with fast lead time on high volume
production requirements
� Three different contact force contacts available upon package
balls composition: Eutectic and Pb-free
� Anti-sticking mechanism: Slider moves during cover press down
which prevents from ball sticking
� Abundant field experience & FA capability with working world
largest burn-in houses
� Burn-in Board supply could be possible upon request.
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Current Capabilities Development Plans
TSOP 0.80/0.65/0.50mm Requirements driven
Sn/Pb, Pb-free Pb-free enforced
BGA/CSP 1.27/1.0x0.8/0.80/0.65/0.5mm below 0.5mm
Pinch Alternative contacts
Sn/Pb, Pb-free Pb-free enforced
LGA - 0.5/0.65/0.8mm
QFN 1.0/0.5mm 0.4/0.65mm pitch
Low cost
CLCC 1.0mm Requirements driven
Current Capabilities Development Plans
TSOP 0.80/0.65/0.50mm Requirements driven
Sn/Pb, Pb-free Pb-free enforced
BGA/CSP 1.27/1.0x0.8/0.80/0.65/0.5mm below 0.5mm
Pinch Alternative contacts
Sn/Pb, Pb-free Pb-free enforced
LGA - 0.5/0.65/0.8mm
QFN 1.0/0.5mm 0.4/0.65mm pitch
Low cost
CLCC 1.0mm Requirements driven
Burn-in Socket Plans
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Test Socket
� Excellent Contact Solutions with high performance spring probes
technology designed by OKins
� Price Advantages coming along with wide selection of open tools for
socket housing
� Existing ATE handlers compatible design: Advantest, Ando, Mirae,
Techwing, STH, etc
� Device carrier can be proposed at the time of test socket design:
OKins unique design proposal
� Fastest Lead Time on high volume production requirement
� Flexible Design for low & high volume
� Electrically and mechanically proven performance of single-ended
spring probe (barrel plunger)
� Excellent Contact Solutions with high performance spring probes
technology designed by OKins
� Price Advantages coming along with wide selection of open tools for
socket housing
� Existing ATE handlers compatible design: Advantest, Ando, Mirae,
Techwing, STH, etc
� Device carrier can be proposed at the time of test socket design:
OKins unique design proposal
� Fastest Lead Time on high volume production requirement
� Flexible Design for low & high volume
� Electrically and mechanically proven performance of single-ended
spring probe (barrel plunger)
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Category Speed Pitch Addition
Spring probes ~ 1.5GHz 0.5mm low cost for memory test
Spring probes 3.0GHz ~ 0.5mm RF test
Stamping ~ 800MHz 0.4mm low cost for memory test
Stamping - 0.2mm fine pitch
Elastomer 1.5GHz ~ 0.5mm low cost
Alternative - 50u ~ MEMS
Category Speed Pitch Addition
Spring probes ~ 1.5GHz 0.5mm low cost for memory test
Spring probes 3.0GHz ~ 0.5mm RF test
Stamping ~ 800MHz 0.4mm low cost for memory test
Stamping - 0.2mm fine pitch
Elastomer 1.5GHz ~ 0.5mm low cost
Alternative - 50u ~ MEMS
Test Socket Plans
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Design and Field Experiences obtained during high volume production
supply to largest memory IC makers.
� Various design options available for high performances: yield, life time,
electrical performance, etc.
� Thorough understanding of single-ended (barrel plunger) design
enables the users to get better performances.
� Research and development for best material selection & plate option
have been running in order to increase pin performance.
� Design and Field Experiences obtained during high volume production
supply to largest memory IC makers.
� Various design options available for high performances: yield, life time,
electrical performance, etc.
� Thorough understanding of single-ended (barrel plunger) design
enables the users to get better performances.
� Research and development for best material selection & plate option
have been running in order to increase pin performance.
Spring Probes
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Design Pro-E
IBM CADCAM
� Reliability Test socket multi tester
Milli-ohm meter
Mega ohm meter
Smart measuring scope
Load cell meter
Linear gauge
Hot temp. chamber
Durability tester
Withstanding voltage tester
X-ray inspector
High/low power microscope
3D level microscope (NEXIV)
SEM (scanning electron microscope)
Laser fusing equipment
�� DesignDesign ProPro--EE
IBM CADCAMIBM CADCAM
�� ReliabilityReliability Test socket multi testerTest socket multi tester
MilliMilli--ohm meter ohm meter
Mega ohm meterMega ohm meter
Smart measuring scopeSmart measuring scope
Load cell meterLoad cell meter
Linear gaugeLinear gauge
Hot temp. chamberHot temp. chamber
Durability testerDurability tester
Withstanding voltage testerWithstanding voltage tester
XX--ray inspectorray inspector
High/low power microscopeHigh/low power microscope
3D level microscope (NEXIV)3D level microscope (NEXIV)
SEM (scanning electron microscope)SEM (scanning electron microscope)
Laser fusing equipmentLaser fusing equipment
Capabilities
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
- Automatic pin insertion machine ; burn-in
- Manual assembly machine ; burn-in
- Laser marking machine ; test
- NC machine ; machining
- Spring probe assembly machine ; pogo pin
- Automatic pin insertion machine ; burn-in
- Manual assembly machine ; burn-in
- Laser marking machine ; test
- NC machine ; machining
- Spring probe assembly machine ; pogo pin
- Mold tool 3 suppliers Test, Burn-in, Carrier
- Molder 3 suppliers Test, Burn-in, Carrier
- Stamper 3 suppliers Test, Burn-in
- Machining 2 suppliers Test, COK
- Assembly in-house & Test, Burn-in, Carrier
3 suppliers
- Probe pin 3 suppliers Test
- Mold tool 3 suppliers Test, Burn-in, Carrier
- Molder 3 suppliers Test, Burn-in, Carrier
- Stamper 3 suppliers Test, Burn-in
- Machining 2 suppliers Test, COK
- Assembly in-house & Test, Burn-in, Carrier
3 suppliers
- Probe pin 3 suppliers Test
Manufacturing EquipmentsManufacturing EquipmentsManufacturing Equipments
Capabilities
Manufacturing Outsource CapabilitiesManufacturing Outsource CapabilitiesManufacturing Outsource Capabilities
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
� Corporate Profile
� OKins Business Introduction
� BiTS Technologies & Engineering
� BiTS Products Details
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
Burn-in Test Socket
# Burn# Burn--in Test Socketin Test Socket TSOP 0.5mm pitch 48, 54LD 300mils
0.65mm pitch 86LD 400mils
0.8mm pitch 54, 66LD 400mils
BGA 1.27mm pitch 33.2x28.4mm
0.8x1.0mm pitch 18x26mm
0.8mm pitch 20x20, 22x26, 22x28mm
0.65mm pitch 26x26mm
0.50mm pitch 19.5x26mm
Design Feature ;
♦ Compact design for high density on PC Board
♦ Various contact forces upon package balls
♦ Alternative socket lead length
♦ Long operation cycles over 30K times
♦ Zero insertion force for loading
♦ Competitive development cost
♦ Stable contactability for Lead-free balls
Products
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
# Test Socket# Test Socket TSOP-I 28/32/48 pin
TSOP-II 32/44/50/54/66/86 pin 400mils IC packages
QFP 100TQFP & 100PQFP
Design Feature ;
♦ Compact design for high density on PC Board
♦ Various contact designs available
♦ Operation cycles over 30K times
♦ Competitive development cost
♦ Designed for auto test handler use
Test Socket with stamped contactsProducts
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
# Test Socket# Test Socket TSOP-II 0.65, 0.8, 0.5mm pitch
TQFP 0.65mm pitch
BGA 0.5, 0.65, 0.8mm pitch (ball matrix upon customers’ inquiry)
Design Feature ;
♦ Compatible design for currently available handlers
♦ Use various spring probe pins for contact
♦ Compact design for high density on PC Board
♦ Operation cycles over 100K times
♦ Both machining & molding available for housing
♦ Designed for tin flake and contact contamination
♦ Self-Cleaning by device contact
♦ Competitive development cost
♦ Designed for high frequency device
♦ Excellent design for Current flow & Cold test
Test Socket with pogo for memory ATEProducts
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
# Logic Test Socket# Logic Test Socket BGA All ball counts and matrix (over 1,000 pin)
CSP All ball counts and matrix (Min 0.4mm pitch)
QFP/TQFP/TSOP All ball counts and matrix
QFN/MLF All package types available
Design Feature ;
♦ High reliability, high speed and low profile design
♦ Standard design for ATE handler
♦ Long operation cycles over 100K times
♦ Designed for tin flake and contact contamination
♦ Specific & customized design for low cost
♦ Industry standard footprint
♦ Easy operation by manual use
Test Socket for Logic DevicesProducts
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
# Spring Probe Pin# Spring Probe Pin Pitch 0.4~1.27mm pitch
Length Min 1.9mm and longer
Frequency Max 15GHz
Specification Design available for customers’ device specifications
Design Feature ;
♦ Diverse design features available
♦ Double-ended Plunger & Barrel Plunger
♦ Long operation cycles over 300K Times
♦ Excellent design for Current flow & Cold test
♦ Designed for Tin flake prevention
♦ Self-cleaning by solder ball Contact
♦ Stable contactability at Lead-free balls
Spring ProbesProducts
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
# Change Over Kit Compatible for various handlers design
Advantest, Ando, Mirae, TWE, STH, Hitachi, etc.
Design Feature ;
♦ Compatible with current ATE handlers
♦ Offer the optimized test condition
♦ Specifically designed for specific handlers
♦ Fast lead time for new development
♦ Competitive development cost
# Change Over Kit Preciser, Test tray with insert, Match plate, Buffer rail, Pitch converter, Vacuum head, Updown stopper, etc.
COK (Change Over Kit)Products
Excellence in Interconnection SysteminsOKins Electronics Co., LTD.
# Device Carriers Compatible for various testers design
- TSOP-I
- TSOP-II
- T/MQFP
- BGA/uBGA/FBGA & etc.
Device Carriers (Insert)
Design Feature ;
♦ Compact design for high density on tray
♦ Improved design from original concept
♦ Package self-alignment by free loading
♦ Competitive development cost
Products