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  • Introduction to Materials Science & Engineering& Engineering

    Course Objective...Introduce fundamental concepts in MaterialsScience

    You will learn about: material structure

    h t t di t t ti how structure dictates properties how processing can change structure

    This course will help you to: use materials properly realize new design opportunities

    with materials

    Chapter 1 - 1

  • LECTURESLecturer: (Kwangheon Park)Time: Tue,Thu. 9:00 10:30am Location:1-365Location:1 365 Activities:

    P t t i l Present new material Announce reading and homework Take quizzes and final Take quizzes and final

    Chapter 1 - 2

  • COURSE MATERIALSRequired text:

    Fundamentals of Materials Science and Engineering Fundamentals of Materials Science and Engineering, W.D. Callister, Jr. and D.G. Rethwisch, 3rd edition, John Wiley and Sons, Inc. (2008).John Wiley and Sons, Inc. (2008).

    Optional Material:Optional Material: The principles of engineering materials, Barrett, Nix, and

    Tetelman

    Chapter 1 - 3

  • COURSE WEBSITES

    Course Website: http://web.kyunghee.ac.kr/~kpark/ Syllabus Lecture notes Answer keys Answer keys Grades

    Text Website: http://www.wiley.com/college/callister

    Chapter 1 - 4

  • Chapter 1 - Introductionp

    What is materials science?What is materials science? Why should we know about it?

    Materials drive our societyStone Age Stone Age

    Bronze Age Iron AgeIron Age Now?

    Silicon Age?g Polymer Age?

    Chapter 1 - 5

  • Structure, Processing, & Properties

    ex: hardness vs structure of steel Properties depend on structure

    , g, p

    600

    (d)

    Data obtained from Figs. 11.31(a)d 11 33 ith 4 t% C itiB

    HN

    )

    400

    500

    60030m

    (c)

    (b) and 11.33 with 4 wt% C composition,and from Fig. 14.8 and associateddiscussion, Callister & Rethwisch 3e.Micrographs adapted from (a) Fig.11.19; (b) Fig. 10.34;(c) Fig. 11.34;ne

    ss (

    300

    4004m

    (b)

    30m

    (a)

    ( ) g ( ) gand (d) Fig. 11.22, Callister & Rethwisch 3e.

    Har

    d

    100

    200

    0 01 0 1 1 10 100 1000

    30m30m

    Processing can change structureCooling Rate (C/s)

    0.01 0.1 1 10 100 1000

    Chapter 1 - 6

    ex: structure vs cooling rate of steel Processing can change structure

  • Types of Materialsyp Metals:

    Strong, ductile High thermal & electrical conductivity Opaque, reflective.

    Polymers/plastics: Covalent bonding sharing of es Soft, ductile, low strength, low density Thermal & electrical insulators Optically translucent or transparent.

    Ceramics: ionic bonding (refractory) compounds of metallic & non-metallic elements (oxides, carbides, nitrides, sulfides)

    Brittle glassy elastic Brittle, glassy, elastic Non-conducting (insulators)

    Chapter 1 - 7

  • The Materials Selection Process

    1. Pick Application Determine required Properties1. pp q pProperties: mechanical, electrical, thermal,magnetic, optical, deteriorative.

    2. Properties Identify candidate Material(s)Material: structure, composition.

    3 M t i l Id tif i d P iProcessing: changes structure and overall shapeex: casting sintering vapor deposition doping

    3. Material Identify required Processing

    ex: casting, sintering, vapor deposition, dopingforming, joining, annealing.

    Chapter 1 - 8

  • ELECTRICAL Electrical Resistivity of Copper:

    6Adapted from Fig. 12.8, Callister & Rethwisch 3e. (Fig. 12.8 adapted from: J.O. Linde, Ann Physik 5, 219 (1932); and C.A. Wert and R.M. Th Ph i f S lid 2 d

    5

    6 Thomson, Physics of Solids, 2nd

    edition, McGraw-Hill Company, New York, 1970.)

    3

    4

    stiv

    ity,

    Ohm

    -m)

    2

    3

    Res

    is(1

    0-8

    O

    T (C)-200 -100 0

    1

    0

    Adding impurity atoms to Cu increases resistivity.Deforming C increases resisti it

    T ( C)200 100 0

    Chapter 1 - 9

    Deforming Cu increases resistivity.

  • THERMALS Sh ttl Til Th l C d ti it Space Shuttle Tiles:-- Silica fiber insulation

    offers low heat conduction.

    Thermal Conductivityof Copper:-- It decreases whenIt decreases when

    you add zinc!

    y 400

    Adapted from chapter-opening photograph, Chapter 17, Callister & R th i h 3 (C t

    nduc

    tivity

    m-K

    )

    400

    300

    Rethwisch 3e. (Courtesy of LockheedMissiles and SpaceCompany, Inc.)

    erm

    al C

    o(W

    /m 200

    100

    f f C &

    Composition (wt% Zinc)

    The

    00 10 20 30 40

    Adapted fromFig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems,

    Adapted from Fig. 17.4, Callister & Rethwisch 3e. (Fig. 17.4 is adapted from Metals Handbook: Properties and Selection: Nonferrous alloys and Pure Metals, Vol. 2, 9th ed., H. Baker, (Managing Editor), American Society for Metals,

    Chapter 1 - 10

    y ,Sunnyvale, CA)(Note: "W" denotes fig. is on CD-ROM.)

    ( g g ), y ,1979, p. 315.)

    100m

  • MAGNETIC Magnetic Permeability

    vs. Composition: Magnetic Storage:

    -- Recording medium p-- Adding 3 atomic % Si

    makes Fe a betterrecording medium!

    is magnetized byrecording head.

    recording medium!

    on Fe+3%Si

    gnet

    izat

    i

    Fe

    Magnetic Field

    Mag

    Adapted from C.R. Barrett, W.D. Nix, andA.S. Tetelman, The Principles ofEngineering Materials, Fig. 1-7(a), p. 9,1973. Electronically reproducedby permission of Pearson Education Inc

    Fig. 18.23, Callister & Rethwisch 3e.(Fig. 18.23 is from J.U. Lemke, MRS Bulletin,Vol. XV, No. 3, p. 31, 1990.)

    Chapter 1 - 11

    by permission of Pearson Education, Inc.,Upper Saddle River, New Jersey.

  • OPTICAL Transmittance:

    -- Aluminum oxide may be transparent, translucent, ory p , ,opaque depending on the material structure.

    polycrystal: polycrystal:single crystal

    polycrystal:low porosity

    polycrystal:high porosity

    Adapted from Fig 1 2Adapted from Fig. 1.2,Callister & Rethwisch 3e.(Specimen preparation,P.A. Lessing; photo by S. Tanner.)

    Chapter 1 - 12

  • DETERIORATIVE Stress & Saltwater...

    -- causes cracks! Heat treatment: slows

    crack speed in salt water! p

    held at 160C for 1 hred

    (m/s

    )

    as-is10-8

    160 C for 1 hr before testing

    i i l drac

    k sp

    ee

    10-10 Alloy 7178 tested in saturated aqueous NaCl solution at 23C

    Adapted from chapter-opening photograph,

    Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown

    increasing loadcr

    p p p g p g pChapter 16, Callister & Rethwisch 3e.(from Marine Corrosion, Causes, and Prevention, John Wiley and Sons, Inc., 1975.) 4m-- material:

    7150 T651 Al "alloy"

    Boveri Co.)

    7150-T651 Al alloy(Zn,Cu,Mg,Zr)

    Adapted from chapter opening

    Chapter 1 - 13

    Adapted from chapter-opening photograph, Chapter 11, Callister & Rethwisch 3e. (Provided courtesy of G.H. Narayanan and A.G. Miller, Boeing Commercial Airplane Company.)

  • SUMMARYCourse Goals:

    Use the right material for the job.

    Understand the relation between properties,structure, and processing.

    Recognize new design opportunities offeredb t i l l tiby materials selection.

    Chapter 1 - 14