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SDS Solder Ball Hidden Champion!

S-Pak Pb Free Solder Balls

Introduction

S-Pak Solder balls

IT Material Team

I. Company Overview

- Introduction of SDS

- History and Scope of business

ii. Manufacturing Process

Contents

IT Material Team

Introduction of SDS

• Company Name: SDS Co.,Ltd (“SDS”)

• Head office :#656 Tongsam-Ri, Namsa-Myun, Cheoin-Gu, Yongin-City, Gyounggi-Do, Korea

• Establishment: May 1th, 2009 (Start DK Metal from Feb. 1th, 1992.)

• President : Jeom Yup Choo

• Founding : USD 1.7 Million (Feb. 2013)

• Employee : 45 employees

• Sales Revenue : US $ 22 Million (2012)

• Web site: www.sds-m.com

• Contact : +82-31-332-7100(head office and Plant)

Seoul

Busan

Yongin City

SDS Co.,Ltd HQ

Solder balls, Adhesive resin

for NCP and thermal conductive

Gumi Factory; DK Metal

Raw solder materials.

Solder Anode, Bar solder

Flux core solder, Tape solder

IT Material Team

History

1992. 02 Launched DK Metal for Raw solder alloy (3th Raw Solder material maker in Korea)

2009. 05 Launched SDS Co., Ltd for semiconductor and electronic materials

SDS Merged Solder ball business from SK Chemicals (15TH May)

Vision for M/S 1ST Solder ball manufacture.

2009. 05 Acquired ISO9001:2008/ISO14001:2004 Quality and Environment system

2009. 05 Hynix’s AVL acquired. (2006.05 got first approval)

2009. 05 Amkor Korea, Amkor Philippine’s AVL acquired. (2006.11 got first approval)

2009. 06 Semiteq AVL acquired. (2008.06 got first approval)

2009. 08 Licensed from Fuji.

2010. 01 Developed new plant.(6,972m2)

2010. 04 Adopted New gas type balling machine (MD)

2010. 11 Developed Low-α Solder (LA Grade < 0.3 cph/cm2, 5N)

2011. 04 Establishment Company research center

2011. 05 Winpac AVL acquired.

2011. 06 Hitech semiconductor(China) AVL acquired.

2011. 06 ASE Korea AVL acquired.

2011. 09 Got No 1. evaluation result from Hynix

2011. 10 Signetics AVL acquired.

2012. 04 Venture company qualified.

IT Material Team5

Law Solder Materials

• Solder Ball Anode

• Bar Solder

• Tape Solder

• Solder Wire

• Anode

• No1. Solder ball manufacture

• Solder related materials

• Cu core solder balls

• Low M.P Solder balls

• Low Alpha solder balls

Advanced Solder Balls

Advanced IT Materials(Adhesive for electronics)

• Electronic Components

• COF Underfill for LDI PKG

• Adhesive for Semiconductor

• NCP and Thermal epoxy

Entry into Electronic Materials

Goal (2013)

Solder Ball

Adhesive for

Semiconductor

COF

Underfill

Ball Anode

Anode

Wire solder

Bar solder

Tape solder

The Systematization from raw solder material to Solder ball.

Scope of Business

IT Material Team

Sales

22 Million $ /year

Sales

40 Million $ / year

Target Sales

60 Million $ / year

M/S 1st Solder ball

Manufacture

2012 (Present) 2014 2016

~ 2012 2013 2014 … 2016

Investment $3,000,000 $1,000,000 $500,000

Capability (Kpcs/Month) 36,000,000 45,000,000 70,000,000 100,000,000

Domestic : M/S more than 30%

Oversea : M/S more than 30%

Sales status

IT Material Team

Market Share for solder ball only

• Raw solder materials

US$19 Mil.

Ball Anode

Flux core solder wire

Tape and Bar solder

Hynix: M/S 30%

Hitech: M/S 40%

AmKor K: M/S 10%

Amkor P: M/S 30%

Semiteq: M/S 80%

Winpak: M/S 50%

Signetics: M/S ~5%

ASEK: ~

SCK: ~

▼ 2012 Sales of solder balls (3 Million $)

• Solder balls

US$ 3 Mil.

Hynix(Korea): BOC(DRAM), POP for Apple

Hitech(China): BOC(DRAM)

Amkor(ATK, ATP): Qualcomm, Infineon,

Micron, Intel etc. nominated.

Semiteq/Winpak/Signetics: MCP, POP, BOC

IT Material Team

Domestic QML of Solder ball

Location of Qualified Site No. Ball size Product Description Remark

Hynix, Semiteq

Signetics, Winpak

1 0.450mm Sn/3.0Ag/0.5Cu For BOC Pkg.

2 0.450mm Sn/1.0Ag/0.5Cu Mobile DRAM

3 0.400mm Sn/3.0Ag/0.5Cu MCP

4 0.400mm Sn/1.0Ag/0.5Cu MCP

5 0.330mm Sn/1.0Ag/0.5Cu

6 0.300mm Sn/1.2Ag/0.5Cu/0.05Ni(LF35)

7 0.300mm Sn/1.0Ag/0.5Cu

8 0.250mm Sn/3.0Ag/0.2Cu Apple apply

9 0.250mm Sn/1.0Ag/0.5Cu POP

IT Material Team

Amkor(ATK, ATP) QML of Solder ball

Location of supply

SiteNo. SID# Ball size Product Description Remark

Amkor Technology

Philippines

1 101342915 0.300mm SAC105

2 101341354 0.400mm SAC105

3 101343795 0.457mm SAC105

4 101344782 0.250mm SAC105

5 101321203 0.300mm SAC305

6 101328363 0.350mm SAC305

7 101314854 0.400mm SAC305

8 101314851 0.457mm SAC305

9 101316438 0.508mm SAC305

10 101317030 0.250mm SAC405

11 101314628 0.400mm SAC405

12 101313156 0.300mm SAC405

13 101337576 0.300mm SAC1205(LF35)

14 101335954 0.250mm SAC1205(LF35) Infineon nominated

IT Material Team

Amkor Technology

Korea

101344782 0.250mm SAC105

Qualcomm, Infineon,

Micron, Intel

nominated.

Qualified all ball composition

and all ball SID# more than 7

0types.

Certain representative SID#

displayed as followed specif

ied alloy composition

SAC405

SAC305

SAC105

SAC1205(LF35)

101342551 0.300mm SAC105

101341354 0.400mm SAC105

101345004 0.400mm SAC105

101337577 0.250mm SAC1205(LF35)

101337576 0.300mm SAC1205(LF35)

101343043 0.400mm SAC1205(LF35)

101348061 0.450mm SAC1205(LF35)

101321203 0.300mm SAC305

101328363 0.350mm SAC305

101314854 0.400mm SAC305

101314851 0.457mm SAC305

101316438 0.508mm SAC305

101328137 0.609mm SAC305

101315156 0.635mm SAC305

101317030 0.250mm Sn/4.0Ag/0.5Cu

101313156 0.300mm Sn/4.0Ag/0.5Cu

101331689 0.508mm Sn/4.0Ag/0.5Cu

IT Material Team

Production Capa. (Right now)

Monthly Capa. 36 billion balls

Delivery : Within 2 Weeks

(Depend on customers request)

Division Note

B,C,W Separated each operation room

Selection line(7 Lines) Clean room condition (Class 100,000)

Range of Temp.: 20~26℃

Range of Humi.: Less than 55%Packing and Stock line

DBM(MD) room Adopt of new type of M/C (April. 2010)

area 3,500m2

SDS Solder ball Capacity

Separated roomStock room Clean room

IT Material Team

Characteristics of S-Pak Pb Free Solder Balls

Alloy Compositions of S-pak Solder ball

Types Alloy composition Melting Point(℃) Specific Gravity Remarks

Sn/PbSn / 37Pb 183 8.4 -

Sn / Ag / Pb 179 ~ 210 8.4 -

Pb Free

Sn / 3.5Ag 219 ~ 223 7.36

Low Pb Impurities

: Max. 0.03%

Free of surface

damage

Sn / 4.0Ag / 0.5Cu 217 ~ 219 7.4

Sn / 3.0Ag / 0.5Cu 217 ~ 219 7.4

Sn / 2.5Ag / 0.5Cu 217 ~ 219 7.4

Sn / 1.0Ag / 0.5Cu 217 ~ 227 7.33

Sn / 1.2Ag / 0.5Cu / 0.05Ni 217 ~ 227 7.33

* Alloy compositions various depend on custom’s request.

S-Pak Pb free solder ball’s alloy compositions are completely controlled in the Sn/Ag/Cu alloy system.

Basic element: Sn as balance element, Ag and Cu control within +/- 0.1% range.

Impurities: Low Pb impurities less than 0.04%, All of impurities has limit range and we are well controlling.

IT Material Team

Characteristics of S-Pak Pb Free Solder Balls

Size

(Ø , mm)

Composition

(Sn/Ag/0.5Cu)

Max. Impurities

Bake testBall

Shape

Melting point

Grade Tolerance(Unit: %) (Unit:%)

(Unit: ℃, by DSC)

0.150 Below & equal to 0.250:

+/- 0.005

Below

to 0.330:

+/- 0.0100

Above & equal to 0.330 :

+/- 0.0127

Above & equal to 0.500 :

+/- 0.0254

• Sn : balance

• Ag : 1, 1.2, 2.5,

3, 4

± 0.1

• Cu : 0.5 ± 0.05

• Pb : 0.04

• Zn : 0.001

• Al : 0.002

• Fe : 0.02

• Sb : 0.12

• As : 0.01

• Bi : 0.1

• Cd : 0.002

• Ni: 0.04

• Ge: 0.09

※ P, S : ND

(Using Not contain P & S)

Heating 150℃ for

12hr,

No discolor

• Minimized

dendrite

• Clean

surface

•

Cpk >=1.67

•

Roundness

< 1.5%

215 ~ 227

0.200

0.250

0.300

0.350

0.400

0.450

0.457

0.508

0.570

0.609

0.635

0.650

0.762

IT Material Team

Characteristics of S-Pak Pb Free Solder Balls

Quality control Method Analysis Equipments Reference

Solder compositions

Analysis of Compositions and

impurities

Sn: Remain.

Other: Spec. meet.

Size distribution 3D Analysis scope Cpk > 1.67

Ball Roundness 3D Analysis scope Roundness < 1.5%

Discolor Colorimeter B* Value < 5.5

Surface shape SEM, EDS Shape difference

ICP-

화학분석기

Spark-EMS

분석기

IT Material Team

Manufacturing processS-Pak Pb Free Solder Balls

World No.1 Solder ball Hidden Champion

S-Pak Pb Free Solder Balls

IT Material Team

Mother Ingot

Alloy Mixing and Melting

Sn, Ag, Cu

Furnace

Make Ingot

Ingot

Inert gasBalling

Balling in Inert Gas

• Surface cleanliness

• Surface appearance

• Ball Diameter

• Size Distribution

• Solder compositionsNG

NG

NG

OK

ScreeningInspection

Shape screenSize screen

Gas Process Flow

Gas process use inert gas instead of oil in balling process.

Solder liquid fall into inert gas tank and Oxygen concentration of the product is low.

Raw solder making process

IT Material Team

Alloy mixing

Process

Balling (DBM)

Middle QC

Ball Screen

Final QC

Out-going QC

INCOMING QC

Manufacturing Process

Raw solder making Process

Raw materials Alloy Mixing and Melting

Furnace

Alloy comp. check

Ingot Incoming QC

IT Material Team

Incoming (IQC)

Test Machine Test Time Purpose

Per Lot Special impurity check

(When customer ask)

YearlyOutside RoHS analysis

(SGS, TUV)

Per LotComposition Check

(Sn/Ag/Cu/Pb/Ge/Ni….)

ICP-Tester

Spark-EMS

Manufacturing Process [Incoming QC]

IT Material Team

Manufacturing Process [Balling Process]

Balling (DBM)

Molten metal drop into Inert

Gas(N2, He, Ar) atmosphere in Balling

Tank and progress in solidification.

Solder ball made into Inert Gas

state, there is no oxide content and

it make low surface oxide value.

Inert Gas

＜ Drop and Cooling

＜ Solidification

447 453

Real time size check By CCD Camera.

Ball size is well controlled by pressure and

Automatically calibrate ball sizes.

IT Material Team

Middle (QC)

Inspection Machine Test Time Purpose (Sample Size)

Per Lot

First Ball Size Inspection

(10%)

Surface condition

Per Lot

Discolor Ball Screen

After shaking

(40g)

3D Inspection Machine

Discolor Inspection Machine

Manufacturing Process [Middle QC]

IT Material Team

Ball Screen (Machine)

Size Screen

(Using precision electro forming Mesh < ± 1㎛)Shape Screen

(Ball rolling on the plate with special angle)

Inspection Machine

Manufacturing Process [Ball Screen]

NG

NG

OK

양품 불량

진동판 각도조정

IT Material Team

Final QC

Inspection Machine Test Time Purpose (Sample Size)

Per Lot

Second Ball Size and

Roundness Inspection

(300ea)

Surface damage check

(all lot by visual)

Per Lot

Discolor Ball &

Surface Oxidation Check

(40g)

Per LotComposition Check

(80g)

3D Inspection Machine

Shake Tester

Manufacturing Process [Final QC]

Spark-EMS

IT Material Team

Box & Bottle Check Test Time Purpose

Total Lot

1. Out box condition

2. Box Label Check

1. Bottle Label Check

(Lot No. / Barcode)

2. Cap Label & Color Check

Per LotOuting going product FA.

(200g)

Outing going QC

Bottle Label

Box Label

Manufacturing Process [OG QC]

Keeping sample