introducing freescale’s coldfire-based compressed audio
TRANSCRIPT
© Freescale Semiconductor, Inc., 2003, 2004, 2005, 2006, 2007. All rights reserved.
Freescale SemiconductorApplication Note
Document Number: AN2462Rev. 1, 2/2007
1 Is this MP3 Thing a Fad with Computer Geeks that Will Pass?
Although compressed audio (generally referred to as “MP3”) may have started life as a computer application, there are now many emerging markets where it can be found.
The rapid spread of digital audio compression technologies, such as MP3 (MPEG Audio Layers 3), is transforming the way we record, transport, and listen to music. The approximate 10:1 data compression achieved by MP3 makes it practical to transfer music files via the internet or via wireless interfaces, as well as requiring significantly less storage space.
The availability of recordable CD drives at consumer price points is also giving a new lease of life for the compact disc format. Indeed the relatively low cost and high storage capacity of blank CD media, together with its compatibility with existing playback systems in use all over the world may make the CD the ultimate MP3
Introducing Freescale’s ColdFire-Based Compressed Audio SolutionsMCF5249, MCF5249L, SCF5249, SCF5250
by: Ross McLuckie, East Kilbride, Scotland
Contents1 Is this MP3 Thing a Fad with Computer Geeks
that Will Pass? . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Why the MCF5249? . . . . . . . . . . . . . . . . . . . . . . .23 The Trio Software Demonstration . . . . . . . . . . . .84 Hardware Requirements . . . . . . . . . . . . . . . . . .105 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . .186 Appendix A: M5249C3 Schematics . . . . . . . . . .187 Appendix B: Audio Daughter
Card Schematics . . . . . . . . . . . . . . . . . . . . . . . .29
Why the MCF5249?
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music medium. A single CD can hold over 100 hours of music in MP3 form.
However the actual storage media used is not important and dependent on the intended application. Hard Disk Drives (HDD) are now small enough, with low power consumption, to provide a battery operated, hand held device capable of storing more than the average person’s entire music collection.
Flash based products, either using discrete chips and/or one of the numerous commercially available flash sticks may not be able to offer the storage capabilities of a CD or HDD, but can provide very small, pen-like products with no moving parts and very long battery life.
MP3 compatibility is very quickly spreading through numerous product ranges, portable audio players, home hi-fi, car audio, DVD players and game consoles are some good examples, but there are also some less obvious areas where MP3 is emerging, elevator music and floor announcements for example.
Although MP3 may be the most commonly known form of audio compression, there are several other algorithms available, such as Windows Media Audio (WMA) and Advanced Audio Codec (AAC), with the story unlikely to end there as new ways to improve quality and/or compression levels are discovered.
2 Why the MCF5249?In terms of their demands on a microprocessor, MP3-based digital audio systems share the requirement for significant amounts of control processing as well as digital audio signal processing. Control processing includes file management, data buffering, system control and user interface control, while the MP3 decode algorithm itself involves roughly 50 percent control-type functions and 50 percent signal processing. Other signal processing tasks include audio effects processing (e.g., dynamic bass boost) and digital volume control.
Typically these systems use separate Digital Signal Processing (DSP) and microcontroller devices to perform the signal processing and control tasks. Clearly a more efficient, lower cost solution would be to implement both tasks on a single microprocessor. The ColdFire 32-bit microprocessor provides a compact engine for control code processing with its variable-length RISC architecture, and the addition of the Enhanced Multiply and ACcumulate (EMAC) unit adds powerful DSP capability to the ColdFire architecture.
The MCF5249 integrated microprocessor combines a Version 2 ColdFire® processor core operating at 140MHz with the following modules:
• DMA controller with 4 DMA channels• Integrated Enhanced Multiply-ACcumulate Unit (EMAC)• 8-Kbyte Direct Mapped Instruction Cache• 96-Kbyte SRAM (A 64 Kbyte and a 32 Kbyte bank)• Operates from external crystal oscillator• Supports 16-bit wide SDRAM memories• Serial Audio Interface which supports IIS and EIAJ audio protocols• Digital audio transmitter and two receivers compliant with IEC958 audio protocol• CD-ROM and CD-ROM XA block decoding and encoding function• Two UARTs
Why the MCF5249?
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• Queued Serial Peripheral Interface (QSPI) (Master Only)• Two timers• IDE and SmartMedia interfaces• Analogue to Digital Converter• Flash Memory Card Interface• Two I2C modules• System debug support• General Purpose I/O pins shared with other functions• 1.8 V core, 3.3 V I/O• 160 pin MAPBGA package (qualified at 140 MHz) and 144 pin QFP package (qualified at
120 MHz)
Why the MCF5249?
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2.1 MCF5249 Block Diagram
Figure 1. MCF5249 Block Diagram
Standard ColdFire Peripheral Blocks
32K
64K
UARTInterface
I2CInterface
TimerSupport
Memory Stick/
Interface
Serial AudioInterface
(S)DRAMSRAM
MUX
IDE
SWESRE
IDE–DIORIDE–DIOW
IDE–IORDY
Secure Digital
QSPI_CS[3:0]QSPI_CLK
BUFEN1_B
BUFEN2_B
QSPI_DINQSPI_DOUT
EBUIN3/ADIN0_GP138EBUIN4/ADIN1_GP139RXD2/ADIN2/GP128CTS2/ADIN3/GP131TOUT1/ADOUT/GP135
DebugModule w/
JTAG
InstructionCache
ColdFire V2 Core
(160 BGA140 Mhz)
(144 QFP 120 Mhz)
SRAM1
SRAM0
Clock Multiplied
PLL
DMA
5x08Arbiter
Timer
I2C
DualUART
5x08Interrupt
S/DRAMInterface
ExternalBus
Translator
IDESmartMedia
InterruptController
QSPIInterface
AudioInterfaces
ADC
Flash MemoryCard
Interface
Why the MCF5249?
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2.2 ColdFire EMAC UnitThe ColdFire EMAC unit is an enhanced version of the existing MAC unit with additional features to improve signal-processing performance especially for digital audio applications. These new features include:
• Improved performance for 32x32 fractional and integer multiply-accumulate operations, with an effective issue rate of 1 clock cycle per MAC.
• Addition of three more accumulators to minimize MAC pipeline stalls caused by exchanges between the accumulator and the general purpose ColdFire registers. Many algorithms require multiple calculations on a given data set. By applying different accumulators to these calculations, it is often possible to store one accumulator without any stalls while performing operations involving a different destination accumulator.
• Implementation of 48-bit accumulation data path to allow the use of a 40-bit product plus the addition of 8 extension bits to increase the dynamic number range when implementing modern signal processing algorithms. Existing MAC features which are also important for efficient digital audio signal processing include:— Support for signed, unsigned integer and signed fractional operands.— Operand fetch in parallel with multiply accumulates.
2.3 Audio Interface ModuleThe advanced ColdFire audio peripherals that have been developed include IIS-compatible serial ports and an IEC958/SPDIF transceiver. A unique on-chip TDM (time-division multiplexed) bus has been engineered to allow signals to be routed easily between peripherals and CPU. These integrated audio peripherals help to lower overall system costs, as external audio interface devices are not required.
In CD and CD recordable systems, the CPU must be able to route digital audio signals to and from the drive electronics, from analogue-to-digital and to digital-to-analogue converters, and to and from the outside world. In addition, the transmission and reception of CD subcodes must be accommodated. Finally, it should be noted that compressed audio formats, such as MP3, use the CD-ROM file format for storage on CD.
A new Audio Interface Module has been designed to facilitate audio interchange in CD systems with the minimum of CPU intervention. The Audio Interface Module allows the device to receive and transmit digital audio over serial audio interfaces (IIS/EIAJ) and over digital audio interfaces (conforming to the European Broadcast Union (EBU)-IEC958 standard, and compatible with the Sony/Philips Digital Interchange Format).
The device is equipped with four serial audio interfaces, compliant with Philips IIS and Sony EIAJ format, two IEC958 receivers with four multiplexed inputs, and one IEC958 transmitter with two outputs (one for professional sub-code and one for consumer sub-code).
The Audio Interface Module connects all the audio interface ports to an internal 40-bit TDM bus to allow the direct retransmission of an audio signal received on one receiver to another transmitter, without CPU intervention. In parallel, the CPU is able to receive or transmit digital audio to and from any of the audio interfaces.
Why the MCF5249?
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2.4 Audio Interface Module Functional Diagram
Figure 2. Audio Interface Module Functional Diagram
The Audio Interface Module includes a hardware CD-ROM encoder/decoder, which optionally applies CD-ROM header detection, scrambling/de-scrambling, and electronic data check functions required for reading and writing CD-ROMs. This allows the device to provide MP3 functionality using only low-cost audio drives, computer CD-ROM-type drives are not required.
2.5 32-Bit Data PathIt is generally accepted in digital audio engineering that to process 16-bit signals with no loss of audio quality requires a processor with greater than 16-bit precision. This is because the internal data path of a 16-bit processor has the same resolution as the desired output and rounding errors, which occur during arithmetic operations, are inevitably transferred to the output. DSPs that are 16-bit often have to use extended precision modes requiring three to four times the number of CPU cycles to achieve acceptable audio quality.
With its 32-bit data paths and 48-bit accumulators, the ColdFire with EMAC architecture is capable of extremely efficient processing of certain audio algorithms. For example, Freescale’s ColdFire MP3 decoder has been tested as having 18 bits of accuracy compared to the ISO standard floating point implementation, equivalent to a signal-to-noise ratio of 108 dB. However, the MP3 decoder requires just 19 MHz* on a ColdFireV2 with EMAC core.
NOTEWorst-case data and assume single cycle memory accesses.
Audio Bus -- 40-bit Time Multiplexed Bus
EBU1Receiver
EBU2Receiver
IIS1Receiver
IIS3Receiver
IIS4Receiver
CPUOutput
CPUOutput
CPUOutput
EBU1Transmit
IIS1Transmit
IIS2Transmit
CPUInput
CPU Input
CDROMDecoder
CDROMEncoder
Select Select SelectSelect Select
FIFO6 Fields
FIFO6 Fields
FIFO6 Fields
FIFO6 Fields
FIFO6 Fields
CPU Bus
CPU Bus
Why the MCF5249?
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2.6 Low System Power DissipationIn battery operated systems, such as portable MP3 players, it is important to minimize the system power consumption in order to minimize the inconvenience and expense of changing or recharging the battery. The following factors are identified as significantly contributing to the power dissipation of an electronic system:
• Operating Voltage: This is perhaps the most important factor as power dissipation is proportional to the square of the voltage, thus a reduction of operating voltage from 2.5V to 1.8V reduces power dissipation by approximately one half. The available operating voltage range is essentially a function of the semiconductor process technology used to manufacture the Integrated Circuit (IC) in question. The fully automated, synthesizable design methodology employed for ColdFire-based Is makes the widest range of manufacturing technologies available with the minimum of effort since only standard library elements and compiled memories are used. Also, the design can be easily migrated to new manufacturing processes, as they become available. Existing 0.18micron CMOS logic processes use core supply voltages in the range 1.5 V–1.8 V. Next generation 0.13micron processes will allow supply voltages of around 1.0 V.
• Operating Frequency: Since power dissipation of synchronous digital logic is proportional to the switching frequency, it is important to minimize the operating clock frequency required. Freescale’s ColdFire MP3 decoder requires just 19 MHz on a ColdFireV2 with EMAC core, allowing a ColdFire-based MP3 player to operate from a very low system clock frequency.
• Integration Level: A highly integrated system solution, with most functions included in a single IC, can dramatically reduce system power dissipation because with multiple separate Is, powerful output drivers are required to overcome the large capacitance of the interconnecting Printed Circuit Board (PCB) traces. Freescale’s ColdFire audio solutions combine DSP and MCU functionality with application-specific peripherals and on-chip memory to minimize the number and switching frequency of inter-chip connections.
2.7 Code Density and System IntegrationIn many designs, the cost of memory exceeds the microprocessor cost, so this factor can significantly impact overall system cost. The ColdFire processor architecture addresses these requirements through a variable-length instruction set to maximize code density implemented in a RISC-based approach, providing a very efficient silicon design.
Simple instructions require only a 16-bit instruction length while more complex instructions are implemented in 32 or 48 bits. Each instruction takes only the amount of space required with the result that both memory storage space and memory interface bandwidth are minimized.
With the addition of the EMAC, the ColdFire CPU becomes a very good control-code processor that is also capable of efficient signal processing. For example, Freescale’s MP3 decoder requires just 37 Kbytes of memory, including 17.5-Kbyte ROM and 19.5-Kbyte RAM.
Combining DSP and MCU functionality in the same core together with very efficient use of on-chip and off-chip memory results in lower overall system cost.
The Audio Interface Module provides a high level of digital audio connectivity on-chip, further reducing component count, PCB footprint, and system cost.
The Trio Software Demonstration
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2.8 Large Address Range and Cache ArchitectureThe ColdFire architecture’s 32-bit address range and on-chip cache make it well suited for running the large software stacks needed for file management, data buffering, and control in CD and MP3 systems. ColdFire devices can address large continuous address ranges without the need for bank switching required by some 16-bit architectures. On-chip caches deliver good performance and minimize off-chip accesses (and therefore power dissipation) even with slow external memory.
2.9 Programmable FlexibilityThe fact that a software programmable architecture is used, rather than hardwiring certain algorithms, means that the system can be easily upgraded to support new algorithms and standards as they emerge. Competitors to the widely used MP3 compression algorithm, such as AAC and WMA, which claim improved quality and/or compression levels have already emerged and there will surely be others in future. A programmable signal-processing engine also allows customers to implement their own proprietary audio processing algorithms in order to differentiate their product from competitors.
2.10 Tools Support—RTOS and Development ToolsAll ColdFire based devices include a Background Debug Module (BDM) on chip with a common interface to debug tools available from third party vendors and Freescale’s Metrowerks division.
The BDM enables the programmer to directly control the CPU, access its registers, as well as the use of breakpoints, single stepping through code, and real-time trace of application code.
The BDM interfaces to development tools via a standard 26-pin header, so a simple register map change is all that is required for development tools to support new ColdFire family members.
The similarity of the ColdFire programming model to that of the industry standard 68K architecture has made it easy for a wide range of development tools suppliers to support the ColdFire product family. A list of third party development tools can be found on Freescale’s web site at www.freescale.com.
The standard BDM interface and wide range of development tools contribute to the “ease of use” of the ColdFire architecture. Hardware and Software developers have a choice of powerful solutions to meet their development tool needs, and new system-on-chip derivatives can be accommodated by the tools with little or no delay to the time to market of the customer’s end product.
3 The Trio Software DemonstrationThe software demonstration was developed by part of Freescale’s Global Software Group (GSG), based in India. The Trio demonstration, along with several other software packages, can be downloaded from www.freescale.com.
The demonstration is intended for evaluation only, to show how easily MP3 compatibility could be added to any system. If appropriate the Trio code can be supplied as a fully supported library module, via a license agreement.
The Trio Software Demonstration
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3.1 Software Features• Audio CD playback• MP3 playback (MPEG-1 Layer 3 and MPEG-2 Layer 3 with lower sampling rates)• WMA playback (high rate, mid rate and low rate)• WAV file playback (16- or 8- bit linear samples; sampling rates supported same as for MP3 and
WMA)• CD-DA, CD-R, CD-RW and CD-ROM discs• 12 cm discs• ISO-9660 Level 3 file system with Joliet extension• ISO-9660 Joliet format for Macintosh• UDF file system, version 1.5, with fixed and variable packets• Multi-session discs (up to five sessions)• Mixed discs (data and audio tracks)• Copy-protected CD-DA discs• Display of ID3 tags V1.1, V2.2, V2.3, V2.4• Disc start-up retry (for open discs and discs with errors)• Servo switch-off after filling up internal buffer• Basic player controls
— Play/Pause/Stop— Next track/Previous track— Fast forward/Rewind— Digital Volume Control— Hold (disable keypad)
• Track/File programming• Flat/Hierarchical/Collapsible file system browsing• Playlist• Shuffle• Repeat (None/One/All/AB)• Pre-set 5-Band Graphical Equalizer (Flat/Rock/Classic/Jazz/Ultra bass modes)• User Definable 5-Band Graphic Equalizer• ESA, with 4X ADPCM compression• Intro-Scan• Lid Open/Close detect, with player stop on Lid Open• Booting from Flash memory• Last three file systems stored during power-down in flash memory for quick start-up• Resume on power-up with previous settings and playing position• Software update from CD
Hardware Requirements
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• Additional displays through Menu— Hold/Resume setting— Decoder Information (type, sampling rate, bit rate)— Time (Elapsed/Remaining time for current track)— ID3 and WMA tags display of artist, title, album, genre and year
• Configurable SSC (sub-code and sector controller) and BFM (buffer and file management)• Easy to add new decoders (e.g., Ogg Vorbis, MP3Pro) and additional audio post processing (e.g.,
SRS WOW, QSound Sizzle)
3.2 System TestingThe demo has gone through some basic system tests using various types of disc. In total about 130 discs have been used. Different CD writers (HP and Sony) have been used. In addition, testing has been done using the ABEX test discs from Almedio Japan. These cover a range of tests, including scratches, black dot, black band, fingerprints, multi-session, MP3 and WMA, tones of various frequencies, left and right channel separation, directory structure, nested directories, ID3 tags etc.
For more details, refer to the Almedio web-site at www.almedio.co.jp/english/tmsection_index.phtml.
4 Hardware RequirementsTo run the demo requires a modified M5249C3 evaluation board (EVB), an audio daughter card and a modified CD player based on Philips’s CD10 Servo chipset.
4.1 M5249C3 ModificationsFirst, check expansion connectors (J4 and J5) are fitted, allowing connection to the daughter card. If required to retro-fit the connectors, various height options are available, it is recommended to use the tallest option (13 mm), allowing easier access to the numerous connectors on the daughter card and reducing the risk of component fouling between the two boards. The connectors are available from AMP, part number 5-179010-5.
It is also necessary to remove some components from the board to prevent IO conflicts when running the demo, U13, U14, U19, R109, R110, and R115 to R117 must be removed.
NOTEEnsure short circuits are not introduced when adding and/or removing components.
The demo software can be built to run either from Flash or SDRAM, see software documentation. In order to build and run a suitable image requires a Diab ColdFire Compiler licence (version 4.3f) and WindRivers’s VisionProbe II BDM cable (or suitable alternative).
Alternatively contact your local Freescale representative about acquiring an appropriate ROM image to program the onboard memory with any suitable programming tool, including the M5249C3’s dBUG command line monitor/debugger.
Hardware Requirements
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NOTEIf using dBUG, program the Flash memory before modifying the EVB itself.
After successfully running the demo, audio output from the CD player can be heard from the headphone jack plug (J1), with interaction possible through the daughter card’s user interface—LCD and keypad.
Hardware Requirements
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4.2 M5249C3 EVB (Required Jumper Configuration and Modification)
Figure 3. M5249C3 EVB Required Jumper Configuration and Modification
ExpansionConnectors
HeadphoneJack Plug
Remove U13, U14,
U19, R109, R110
Hardware Requirements
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4.3 Audio Daughter Card (Required Jumper Configuration)
Figure 4. Audio Daughter Card (Required Jumper Configuration)
g
CD PlayerInterface
LCD Contrast(If Required)
Hardware Requirements
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4.4 CD Player ModificationsAlthough in theory it should be possible to convert any CD player, based on the CD10 servo chipset, to run the demo, in practice it would be simpler to follow the worked example shown.
Any of the following Philips’s portable CD player model numbers should be suitable, however the one used in the demo, which is known to work, is the AX5015:
AX2000, AX2001, AX2002, AX2003, AX2011, AX5000, AX5001, AX5002, AX5003, AX5004, AX5006, AX5011, AX5012, AX5013, AX5014, AX5015, AX5016, AX5017, AX5018, AX5019
The modifications required, include removing and refitting some components on the CD player circuit board and providing a wired interface between the modified CD player and the daughter card.
NOTEEnsure short circuits are not introduced when removing components from the circuit board.
J13 and J15 on the daughter card are intended to provide the necessary interface, J15 can be used to power the CD player, with a +5 volt DC, centre +ve, power supply. The following table details the minimum required interface between J13 and the CD player.
Table 1. CD Player Interface
J13Pin Number
MCF5249Pin Name
MCF5249Function
CD PlayerConnection
CD PlayerReference
1 SDATAI1 IIS1 SDATAI 7880-11
2 SCLK1 IIS1 SCLK 7880-13
3 LRCK1 IIS1 LRCK 7880-12
4 EF/GPIO19 EF EF 7830-30
5 CFLG/GPIO18 CFLG CFLG 7830-53
6 SCLK4/GPIO50 GPO SDA 3413
7 LRCK4/GPIO46 GPO SCL 3412
8 RTS0/GPO30 GPO RAB 3861
9 RTS1/GPO31 GPO SILD 3860
10 RCK/GPIO51 GPO PORES 3864
11 SFSY/GPIO52 GPO SMUTE 7400-63
12 SUBR/GPIO53 GPO SLEEP 7400-64
13 CTS0/GPI30 GPI WAKE 6400
14 TIN0/GPI33 GPI RESUME 3403
15 TIN1/GPIO23 GPI HOLD 3402
Hardware Requirements
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16 RXD0/GPI27 GPI LID SWITCH 3404
17 RESET RESET RESET 2405
18–28 — — — —
29–30 GND GND GND 2257–2250
Table 1. CD Player Interface (continued)
J13Pin Number
MCF5249Pin Name
MCF5249Function
CD PlayerConnection
CD PlayerReference
Hardware Requirements
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4.5 Circuit Board Modifications
Figure 5. Circuit Board Modifications
This assembly drawing shows a summary ofall possible versions. For components used inspecific versions see circuit diagram or partslist.
For service testpoints seecircuit diagram “CD-Part”
COPPERSIDE VIEW Remove Is 7400,
7880 and resistor
Move resistor 3289 to location 3290
Hardware Requirements
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4.6 Circuit Board Modifications (continued)
Figure 6. Circuit Board Modifications (continued)
This assembly drawing shows a summary ofall possible versions. For components used inspecific versions see circuit diagram or partslist.
For service testpoints seecircuit diagram “CD-Part”
COPPERSIDE VIEW
J13-4J13-10J13-5J13-1J13-3J13-2
J13-16J13-15J13-14J13-7J13-6J13-9J13-8
J13-29J13-13J13-11J13-12J13-17J13-30
Conclusion
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5 Conclusion
5.1 Advantages of the MCF5249 for Digital AudioTo achieve high volume sales, consumer audio equipment must have the following attributes:
• Affordability: Low system cost by having control and DSP functions on a single CPU, good code density for efficient use of memory and high levels of integration.
• Ease of Use: Compiler friendly architecture, good development tools, fully automated design methodology for faster time to market and flexibility to changing requirements.
• Long Battery Life (in portable applications): Operation at low voltages and low clock frequencies, high levels of system integration.
The MCF5249 is a low cost, high performance (125 MIPS @ 140 MHz), low power (1.3 mW per MHz), highly integrated processor designed specifically for compressed audio applications, capable of supporting CD, HDD and/or Flash Media stick applications.
The software implemented decoder approach provides excellent performance (MP3 decoder requires only 19 MHz), whilst future proofing designs against new algorithms, by allowing software upgrades.
A fully supported software library, via a license agreement, is readily available.
5.2 Additional InformationThere are numerous CD servo chipsets available, and although this demo is based on Philips’s CD10, support is also available for Sony and Sanyo chipsets, with additional support being added as required.
In addition to the decoder, Freescale has also implemented a real-time MP3 encoder on the ColdFire architecture. A high quality MP3 encoder has been developed, rivalling the best MP3 encoders available in terms of audio quality, this allows the MCF5249 to meet the requirements of CD burner products.
The Trio demo is currently based on the CD platform, the HDD demo is in development.
Although the MCF5249 was originally intended for compressed audio applications, its low cost, high performance is helping it find other markets requiring a similar split between control and signal processing, such as biometric applications, for example, finger print recognition.
6 Appendix A: M5249C3 Schematics
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 19
5 5
4 4
3 3
2 2
1 1
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CC
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F524
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oard
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U_O
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SDRAM_CS2
She
et 1
0
IDE
R/W
BU
FEN
B2/
GP
IO17
D[3
1:16
]
A[2
4:1]
GP
IO5
EF/
GP
IO19
IDE
IOR
DY
/GP
IO16
IDE
IOR
/GP
IO13
IDE
IOW
/GP
IO14
She
et3
CP
USD
ATA
I1S
DA
TAI3
/GP
I41
SD
ATA
I4/G
PI4
2
SD
ATA
O2
SC
LK1
SC
LK2/
GP
IO48
SC
LK3/
GP
IO49
SC
LK4/
GP
IO50
LRC
K1
LRC
K2/
GP
IO44
LRC
K3/
GP
IO45
LRC
K4/
GP
IO46
EB
UIN
1/G
PI3
6E
BU
IN2/
GP
I37
EB
UIN
3/G
PI3
8E
BU
IN4/
GP
I39
EB
UO
UT1
/GP
O36
EB
UO
UT2
/GP
O37
SD
ATA
O1/
GP
IO25
RXD0/GPI27-CTS0/GPI30RXD1/GPI28-CTS1/GPI31
TXD0/GPO27
-RTS0/GPO30TXD1/GPO28
-RTS1/GPO31
TOU
T0/G
PO
33TO
UT1
/GP
O35
TIN
0/G
PI3
3
RC
K/G
PIO
51S
FSY
/GP
IO52
SU
BR
/GP
IO53
SDA0/QSPIDIN
SDA1/GPIO55SCL1/GPIO3SCL0/QSPICLK
CRIN
XTR
IM/G
PO
38C
L11/
GP
O39
CL1
6/G
PO
42
QSPI_CS2/GPIO21QSPI_CS1/GPIO24
EF/
GP
IO19
CFL
G/G
PIO
18TI
N1/
GP
IO23
QSPI_DOUT/GPIO26QSPI_CS0/GPIO29
QSPI_CS3/GPIO22
IDE
DIO
R/G
PIO
13ID
ED
IOW
/GP
IO14
IDE
IOR
DY
/GP
IO16
BU
FEN
B1/
GP
IO57
BU
FEN
B2/
GP
IO17
SW
E/G
PIO
12S
RE
/GP
IO11
SD
ATA
0_S
DIO
1/G
PIO
54S
DA
TA1_
BS
1/G
PIO
9S
DA
TA_B
S2/
RST
OS
DA
TA3/
GP
IO56
SC
LKO
UT/
GP
IO15
PS
TCLK
PS
T[3:
0]D
DA
TA[3
:0]
-TA
CM
DS
DIO
2/G
PIO
34
-RE
SE
T
DS
CLK
DS
I-B
KP
T
DS
O
-OE
R/W
BC
LK
SD
RA
M_C
S2
-CS
1
-SDRAS
SDRAM_CS1-SDCAS
-SDWESDUDQMSDLDQM
BCLKE
-CS
0
GPIO5
GP
IO6
A[2
4:1]
D[31:16]
TCK
HI-Z
She
et 7
Mem
ory
D[3
1:16
]
A[2
4:1]
-CS
0
-OE
R/W
-RE
SE
T
BC
LKE
BC
LK
SD
RA
M_C
S1
-SD
WE
SD
LDQ
MS
DU
DQ
M
-SD
RA
S-S
DC
AS
She
et 2
Aud
ioSD
ATA
O2
CL1
1/G
PO
39C
L16/
GP
O42
SC
LK2/
GP
IO48
LRC
K2/
GP
IO44
SC
LK3/
GP
IO49
SC
LK1
LRC
K1
SD
ATA
I1
She
et4
Deb
ug_T
est P
oint
s
DS
O
DS
CLK
-BK
PT
DS
I
PS
TCLK
-TA
-RE
SE
T
PS
T[3:
0]D
DA
TA[3
:0]
-CS
0R
/W-O
EB
CLK
CRIN
She
et5
Eth
erne
t
A[2
4:1]
D[3
1:16
]
BC
LK
-RE
SE
T
-CS
1
R/W
-TA
_IN
-TA
GP
IO6
-OE
She
et6
Exp
ansi
on C
onne
ctor
s
D[3
1:16
]
A[2
4:1]
SD
RA
M_C
S2
-CS
1
SDRAM_CS1
-CS
0
-SDRAS-SDCAS
-SDWE
SDLDQMBCLKE
R/W -OE
BC
LK
SDUDQM
DS
CLK
-BK
PT
DS
ID
SO
-TA
GP
IO5
GP
IO6
-RE
SE
T
SD
ATA
I1S
DA
TAI3
/GP
I41
SD
ATA
I4/G
PI4
2
SD
ATA
O1/
GP
IO25
SD
ATA
O2
SC
LK1
SC
LK2/
GP
IO48
SC
LK3/
GP
IO49
SC
LK4/
GP
IO50
LRC
K1
LRC
K2/
GP
IO44
LRC
K3/
GP
IO45
LRC
K4/
GP
IO46
DD
ATA
[3:0
]P
ST[
3:0]
PS
TCLK
SC
LKO
UT/
GP
IO15
SD
ATA
3/G
PIO
56S
DA
TA_B
S2/
RS
TOS
DA
TA1_
BS
1/G
PIO
9S
DA
TA0_
SD
IO1/
GP
IO54
SR
E/G
PIO
11S
WE
/GP
IO12
CM
DS
DIO
2/G
PIO
34
BU
FEN
B2/
GP
IO17
BU
FEN
B1/
GP
IO57
IDE
IOR
DY
/GP
IO16
IDE
DIO
R/G
PIO
13ID
ED
IOW
/GP
IO14
QS
PI_
DO
UT/
GP
IO26
QS
PI_
CS
0/G
PIO
29
TIN
1/G
PIO
23C
FLG
/GP
IO18
EF/
GP
IO19
QS
PI_
CS
1/G
PIO
24
QS
PI_
CS
3/G
PIO
22Q
SP
I_C
S2/
GP
IO21
CL1
6/G
PO
42C
L11/
GP
O39
XTR
IM/G
PO
38
CRIN
EB
UIN
1/G
PI3
6E
BU
IN2/
GP
I37
EB
UIN
3/G
PI3
8E
BU
IN4/
GP
I39
EB
UO
UT1
/GP
O36
EB
UO
UT2
/GP
O37
RX
D0/
GP
I27
TXD
0/G
PO
27
-RTS
0/G
PO
30
-CTS
0/G
PI3
0R
XD
1/G
PI2
8
TXD
1/G
PO
28
-RTS
1/G
PO
31
-CTS
1/G
PI3
1
TOU
T0/G
PO
33TO
UT1
/GP
O35
TIN
0/G
PI3
3
RC
K/G
PIO
51S
FSY
/GP
IO52
SU
BR
/GP
IO53
SD
A0/
QS
PID
INS
CL0
/QS
PIC
LK
SD
A1/
GP
IO55
SC
L1/G
PIO
3
-TA
_IN
HI-Z
TCK
She
et9
Seria
l_I2
C_Q
SPI
SC
LK4/
GP
IO50
LRC
K4/
GP
IO46
SD
ATA
I3/G
PI4
1S
DA
TAI4
/GP
I42
TXD
0/G
PO
27TX
D1/
GP
O28
-RTS
0/G
PO
30-R
TS1/
GP
O31
RX
D0/
GP
I27
-CTS
0/G
PI3
0R
XD
1/G
PI2
8-C
TS1/
GP
I31
SD
A1/
GP
IO55
SC
L1/G
PIO
3S
CL0
/QS
PIC
LKS
DA
0/Q
SP
IDIN
QS
PI_
DO
UT/
GP
IO26
QS
PI_
CS
0/G
PIO
29Q
SP
I_C
S1/
GP
IO24
QS
PI_
CS
2/G
PIO
21Q
SP
I_C
S3/
GP
IO22
D[3
1:16
]
A[2
4:1]
D[3
1:16
]
A[2
4:1]
A[2
4:1]
PS
T[3:
0]
D[3
1:16
]
DD
ATA
[3:0
]
DD
ATA
[3:0
]P
ST[
3:0]
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
20 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
MT0
= L
OW
and
MT1
= H
IGH
prov
ides f
aste
st M
UTE
time
CKS
= LO
W 2
56fs
MCL
KDI
F =
HIG
H so
aud
io int
erfa
ce s
et fo
r I2S
mod
e (2
0-bit
iffs
>40
)
Anal
og g
roun
d
All d
efau
lt ju
mpe
r set
tings
on
this
shee
t are
bet
ween
pin
s 1
& 2
Mot
orola
SPS
TSP
G -
32-b
it Em
bedd
ed C
ontro
ller D
ivisio
n (T
ECD)
Anal
og g
roun
d
Anal
og g
roun
d
Anal
og ri
ght c
hann
el in
put
Anal
og le
ft ch
anne
l inpu
t
All a
nalo
g gr
ound
- sin
gle
grou
nd c
onne
ctio
n to
dig
ital g
roun
d
Jum
pers
13
& 14
are
fitte
d du
ring
asse
mbl
y
MCF
5249
- Au
dio
Inte
rface
s1.
1
MCF
5249
Eva
luat
ion
Boar
d - P
art n
umbe
r RE1
0811
B
B
210
Thur
sday
, Mar
ch 0
7, 2
002
Title
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
+5V
J9
RCA
PHO
NO J
ACK
1
2
J10
RCA
PHO
NO J
ACK
1
2
R119
18R1
2018
J1 STER
EO J
ACK
SOCK
ET S
W 3
.5m
m
1234
JP13
12
JP14
12
U1
AK43
60VF
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
MCL
KPD
NBI
CKSD
ATA
LRCK
MT0
MT1
DEM
MUT
ENBO
OST
CKS
DIF
TST1
TST2
VDD
VSS
VREF
VCO
MTS
T3HP
VCC
HPG
ND NCAO
UTL
AOUT
R
C10
10uF
16V
R107
470
R2 10
C4
10uF
16V
C61u
F 50
V
C116
4.7u
F 25
V
C118
4.7u
F 25
V
C11
330u
10V
C50.
1uF
C119
4.7u
F 25
V
C81uF
50V
C70.1u
F
C120
4.7u
F 25
V
C12
330u
10V
C9 0.1u
F
C122
10uF
16V
C14
0.22
uFC121
10uF
16V
JP3
CKS
Low=
256
fs, H
igh=
384
fs
1 3
2
C13
0.22
uF
C127
0.1u
F
C117
2.2n
F
C126
0.1u
F
C125
0.1u
F
U19
AK53
53VT
1 2 3 4 5 6 7 8910111213141516
AINR
AINL
VREF
VCO
MAG
NDVA VD DG
NDSD
TOLR
CKM
CLK
SCLK
PDN
DIF
TTL
TST
JP4
DIF
Low=
16b
it LS
B ju
stifie
d, H
igh=
I2S
16/1
8/20
-bit
1 3
2
C123
2.2n
F
C3 0.1u
F
R1 10
C124
0.1u
F
R108
470
RP43
4x 4
.7K
12
34
56
78
12
34
56
78
JP2
BOO
ST L
ow =
no
high
pas
s co
rrect
ion,
Hig
h =
high
pas
s co
rrect
ion
1 3
2
JP1
DEM
Low
= n
o de
-em
phas
is, H
igh
= de
-em
phas
is
1 3
2
L3FE
RRIT
E_BE
AD1
2
SDAT
AO2
CL11
/GPO
39CL
16/G
PO42
SCLK
2/G
PIO
48
LRCK
2/G
PIO
44
SCLK
3/G
PIO
49
SDAT
AI1
LRCK
1CL
16/G
PO42
SCLK
1CL
11/G
PO39
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 21
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
+3.3
V s
uppl
y de
coup
ling
+1.8
V s
uppl
y de
coup
ling
Jum
pers
onl
y re
quire
d if
I2C
cha
nnel
0 is
use
d.Fo
r ass
embl
y fit
to o
ne ju
mpe
r pin
onl
y.
Def
ault
jum
per s
ettin
g be
twee
n pi
ns 1
& 2
,de
bug
mod
e - B
DM
. Set
ting
betw
een
pins
2 &
3 e
nabl
es J
TAG
mod
e
Mot
orol
a S
PS
TS
PG
- 32
-bit
Embe
dded
Con
trolle
r Div
isio
n (T
ECD
)
Mot
orol
a S
PS
Col
dFire
MC
F524
9
MC
F524
9 C
PU
and
Pul
l-ups
1.1
MC
F524
9 E
valu
atio
n B
oard
- P
art n
umbe
r RE
1081
1B
C
310
Tues
day,
Mar
ch 1
9, 2
002
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
PS
T0P
ST1
PS
T2P
ST3
A[2
4:1]
D[3
1:16
]
D31
D30
D29
D28
D27
D26
D25
D24
D23
D22
D21
D20
D19
D18
D17
D16
A24
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
DD
ATA
0D
DA
TA1
DD
ATA
2D
DA
TA3
RP
1-7
RP
1-7
+3.3
VP
+1.8
VP
+3.3
VP
+1.8
VP
+3.3
VP
+5V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V+3
.3V
+3.3
V
+1.8
VP
+1.8
VP
RP
24B
47
RP
21A
47
C34
1nF
RP
40B
47
RP
14x
4.7
K1
23
45
67
8
12
34
56
78
RP
26A
47
RP
30C
47
C17
0.1u
F
RP
39A
47
RP
29A
47
RP
25B
47
RP
29C
47
RP
18C
47
C19
1nF
RP
40C
47
RP
16C
47
RP
37C
47
RP
14D
47
C23
470p
F
RP
33B
47
RP
37D
47
RP
15D
47
JP7
DE
BU
G
1 3
2
RP
84x
4.7
K1
23
45
67
8
12
34
56
78
RP
24x
4.7
K1
23
45
67
8
12
34
56
78
RP
28C
47
RP
25C
47
RP
34C
47
RP
30A
47
RP
26C
47
C21
1nF
RP
16A
47
RP
35A
47
RP
34B
47
RP
31D
47
RP
33D
47
C13
0
470p
F
C16
0.1u
F
RP
26B
47
RP
17C
47
C36
470p
F
RP
30D
47
RP
20A
47
RP
27B
47
RP
24C
47
C15
0.1u
F
U2
MC
F524
9 M
AP
BG
A16
0
D4
A1
D3
G3
K4
B1
C2
C1
E3
D2
D1
E2
F3
E1
E4
F2 F1
F4
G4
G1
G2
H3
H1
H4
H2
J1 J2 K1
K2
L1 L2 M1
M2
N1
N4
N5
P5
J3
J4
K6
K3
K5
L3
L4
M3
N2
M4
P1
P2
N3
P3
P4
L5
P8
N7
P7
N6
P6
L6
L7 K7
L8
K8
N8
P9
L9
N9
K9
P10
N10
L10
P11
P12
N11
P13
N12
M11
P14
N13
K10
K11
M12
L12
N14
M13
M14 L1
3
L14
L11
K13
K12
K14J11
J13J12
J14H11
H12
H14
H13
G11
G14
G12
G13
F14
F11
F13
E9
E14
F12
E13
E10
E12
E11
D14
D13
C14
D12
C13
B14
D11
C12
B13
C11
A14
A13
B12A12
B11
A11
B10
D10
A10B
9
D9
A9
D8
A8
E8
B8
E7
D7
A7
B7
A6
E6
B6
D6
A5
B5
D5
A4
A3
B4
A2
B3
C4
B2
C3
E5
SC
L0/Q
SP
ICLK
CS
0
A21
A22
A23
A11
A10A
9
CMDSDIO2/GPIO34
A18
A17
BC
LK/G
PIO
10
SCLKOUT/GPIO15
BC
LKE
SD
A0/
QS
PID
IN
DA
TA_2
4
SD
UD
QM
/UW
E
EF/GPIO19
SDATA0_SDIO1/GPIO54
DA
TA_2
5D
ATA
_26
SDATA2_BS2/RSTO
DA
TA_2
7
PAD-GND
DA
TA_2
8D
ATA
_29
DA
TA_3
0D
ATA
_31
A13
A14
A15
A16
A19
A20
GPIO5/INT5
QSPI_DOUT/GPIO26
DA
TA_2
1
SDATA3/GPIO56
BUFENB1/GPIO57
CORE-VDD
A25
row
/A24
colu
mn_
GP
O8
CORE-GND
PAD-VDD
QSPI_CS1/GPIO24
TEST2
SD
RA
M_C
S1
SDATA1_BS1/GPIO9
SD
RA
SS
DC
AS
SD
WE
SD
LDQ
M/L
WE
QSPI_CS0/GPIO29
GPIO6/INT6
DA
TA_1
6D
ATA
_17
DA
TA_1
8D
ATA
_19
DA
TA_2
0
QSPI_CS2/GPIO21
DA
TA_2
2D
ATA
_23
QSPI_CS3/GPIO22
PAD-VDD
SD
RA
M_C
S2/
GP
IO7/
INT7
EB
UO
UT2
/GP
O37
CFLG/GPIO18
EB
UO
UT1
/GP
O36
CORE-GND
EB
UIN
3/G
PI3
8E
BU
IN2/
GP
I37
CORE-VDD
SC
L1/G
PIO
3/IN
T3
RS
TI
TOU
T1/G
PO
35
LRC
K2/
GP
IO44
OE
SD
A1/
GP
IO55
SD
ATA
O2/
GP
O41
SC
LK2/
GP
IO48
PAD-GND
BUFENB2/GPIO17
TEST3
SD
ATA
O1/
GP
IO25
LRC
K1
LRC
K4/
GP
IO46
SD
ATA
I4/G
PI4
2
SC
LK1
SC
LK4/
GP
IO50
TA/GPIO20
SD
ATA
I1
EB
UIN
1/G
PI3
6
PLLGVDDPLLGGND
PLL1GNDPLL1VDD
PLLCGNDPLLCVDD
IDEDIOW/GPIO14
CRIN
IDEDIOR/GPIO13
IDEIORDY/GPIO16
CL11/GPO39
SU
BR
/GP
IO53
CL16/GPO42
XTRIM/GPO38
TRST/DSCLK
SFS
Y/G
PIO
52
CORE-VDD
R/W
RC
K/G
PIO
51
TMS/BKPT
CORE-GND
TCK
PAD-GND
DBDCPST3/GPIO62
CNPSTCLK/GPIO63
DBDCPST1/GPIO60
PAD-VDD
DBDCPST2/GPIO61
DBDCPST0/GPIO59
TDI/DSI
TEST0
TIN
0/G
PI3
3
HI-Z
DBDCDDATA3/GPIO4/INT4
TOU
T0/G
PO
33
DBDCDDATA1/GPIO1/INT1DBDCDDATA2/GPIO2/INT2
CTS
1/G
PI3
1
DBDCDDATA0/GPIO0/INT0
RX
D1/
GP
I28
TDSO
RTS
1/G
PO
31
SD
ATA
I3/G
PI4
1
CTS
0/G
PI3
0
TXD
1/G
PO
28
RTS
0/G
PO
30
EB
UIN
4/G
PI3
9
SRE/GPIO11
LRC
K3/
GP
IO45
SWE/GPIO12
TXD
0/G
PO
27
SC
LK3/
GP
IO49
RX
D0/
GP
I27
CS
1/G
PIO
58
CORE-GND
A1
TIN1/GPI023
A2
A3
PAD-GND
A4
A6
A5
A8
A7
CORE-VDD
A12
TEST1
PAD-VDD
RP
19B
47
C27
0.1u
F
RP
29D
47
RP
23B
47
RP
34x
4.7
K1
23
45
67
8
12
34
56
78
RP
27D
47
RP
34D
47
RP
44x
4.7
K1
23
45
67
8
12
34
56
78
RP
39C
47
RP
22C
47
C28
0.1u
F
RP
94x
4.7
K1
23
45
67
8
12
34
56
78
RP
24D
47
RP
39D
47
C30
0.1u
F
RP
35D
47
RP
16D
47
C22
1nF
RP
74x
4.7
K1
23
45
67
8
12
34
56
78
RP
30B
47
RP
27A
47
RP
14C
47
RP
19C
47C24
470p
F
RP
28B
47
RP
25A
47
RP
25D
47R
P23
A47
JP5
SD
A0
12
RP
15B
47
C37
470p
F
RP
32C
47
RP
33C
47
RP
32D
47
RP
17A
47
RP
36A
47
RP
28D
47
RP
38D
47
RP
20B
47
RP
21B
47
RP
64x
4.7
K1
23
45
67
8
12
34
56
78
RP
31B
47
RP
31C
47
C33
1nF
RP
38B
47
RP
38C
47
RP
24A
47
RP
21C
47
C29
0.1u
F
RP
23D
47
RP
20C
47
RP
36C
47
RP
18A
47
RP
40A
47
JP6
SC
L01
2
RP
37B
47
C25
470p
F
RP
39B
47
RP
17B
47
RP
32A
47
RP
36B
47
RP
19A
47
RP
35C
47
RP
28A
47
RP
36D
47
RP
22A
47
RP
22D
47
RP
16B
47
RP
15C
47
RP
18D
47
RP
35B
47
RP
14A
47
RP
18B
47
RP
21D
47
RP
40D
47
RP
29B
47
RP
26D
47
RP
22B
47
RP
34A
47
RP
23C
47
C38
470p
F
C18
0.1u
F
RP
14B
47
RP
19D
47
RP
33A
47
RP
32B
47
C31
1nF
C26
470p
F
RP
37A
47
C20
1nF
RP
31A
47
RP
20D
47
RP
27C
47
RP
17D
47
RP
15A
47
RP
38A
47
C35
470p
F
C32
1nF
RP
54x
4.7
K1
23
45
67
8
12
34
56
78
SD
ATA
I1S
DA
TAI3
/GP
I41
SD
ATA
I4/G
PI4
2
SD
ATA
O2
SC
LK1
SC
LK2/
GP
IO48
SC
LK3/
GP
IO49
SC
LK4/
GP
IO50
LRC
K1
LRC
K2/
GP
IO44
LRC
K3/
GP
IO45
LRC
K4/
GP
IO46
EB
UIN
1/G
PI3
6E
BU
IN2/
GP
I37
EB
UIN
3/G
PI3
8E
BU
IN4/
GP
I39
EB
UO
UT1
/GP
O36
EB
UO
UT2
/GP
O37
SD
ATA
O1/
GP
IO25
RX
D0/
GP
I27
-CTS
0/G
PI3
0
RX
D1/
GP
I28
-CTS
1/G
PI3
1
TXD
0/G
PO
27-R
TS0/
GP
O30
TXD
1/G
PO
28-R
TS1/
GP
O31
TOU
T0/G
PO
33TO
UT1
/GP
O35
TIN
0/G
PI3
3
RC
K/G
PIO
51S
FSY
/GP
IO52
SU
BR
/GP
IO53
SD
A0/
QS
PID
IN
SD
A1/
GP
IO55
SC
L1/G
PIO
3
SC
L0/Q
SP
ICLK
CR
INX
TRIM
/GP
O38
CL1
1/G
PO
39C
L16/
GP
O42
QS
PI_
CS
2/G
PIO
21
QS
PI_
CS
1/G
PIO
24E
F/G
PIO
19C
FLG
/GP
IO18
TIN
1/G
PIO
23Q
SP
I_D
OU
T/G
PIO
26Q
SP
I_C
S0/
GP
IO29
QS
PI_
CS
3/G
PIO
22
IDE
DIO
R/G
PIO
13ID
ED
IOW
/GP
IO14
IDE
IOR
DY
/GP
IO16
BU
FEN
B1/
GP
IO57
BU
FEN
B2/
GP
IO17
SW
E/G
PIO
12S
RE
/GP
IO11
SD
ATA
0_S
DIO
1/G
PIO
54S
DA
TA1_
BS
1/G
PIO
9S
DA
TA_B
S2/
RS
TOS
DA
TA3/
GP
IO56
SC
LKO
UT/
GP
IO15
PS
TCLK
PS
T[3:
0]
DD
ATA
[3:0
]
-TA
CM
DS
DIO
2/G
PIO
34
-RE
SE
T
DS
CLK
DS
I-B
KP
T
DS
O
-OE
R/W
BC
LK
SD
RA
M_C
S2
-CS
1
-SD
RA
S
SD
RA
M_C
S1
-SD
CA
S-S
DW
ES
DU
DQ
MS
DLD
QM
BC
LKE
-CS
0
GP
IO5
GP
IO6
A[2
4:1]
D[3
1:16
]
TCK
HI-Z
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
22 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
IMPO
RTA
NT
NO
TE: O
NLY
a 3
.3V
BDM
debu
ggin
g ca
ble
can
be u
sed
with
the
MC
F524
9 pr
oces
sor.
NO
TE: 4
.7K
pul
l up
resi
stor
s ar
e us
ed o
n si
gnal
s -B
KP
T, D
SC
LK,
DS
I, D
SO
, -R
ES
ET
& -T
A.
NO
TE: P
lace
TP
7 &
TP
8 at
the
corn
ers
of th
e P
CB
toal
low
eas
y co
nnec
tion
of 's
cope
pro
be g
roun
d le
ads.
Thes
e te
st p
oint
s ar
e fit
ted
for b
oth
prot
otyp
e an
dpr
oduc
tion
boar
ds.
Mot
orol
a S
PS
TS
PG
- 32
-bit
Em
bedd
ed C
ontro
ller D
ivis
ion
(TE
CD
)
NO
TE: T
est P
oint
s TP
1 to
TP
6 ar
e on
lypo
pula
ted
on p
roto
type
boa
rds.
Ple
ase
use
the
labe
l sho
wn
for e
ach
test
poi
nton
the
silk
scre
en o
f the
PC
B.
JUM
PE
RS
10
& 1
1 S
HO
ULD
BE
INS
TALL
ED
AC
RO
SS
PIN
S 1
&2
DU
RIN
G A
SS
EM
BLY
.
Cor
e V
olta
ge.
I/O o
r Pad
Vol
tage
.
Deb
ug (B
DM
) Por
t & T
est P
oint
s1.
1
MC
F524
9 E
valu
atio
n B
oard
- P
art n
umbe
r RE
1081
1B
A
410
Thur
sday
, Mar
ch 0
7, 2
002
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
DD
ATA
3
DD
ATA
0D
DA
TA2
DD
ATA
[3:0
]
PS
T1P
ST2
DD
ATA
1
PS
T3
PS
T[3:
0]
PS
T0+1
.8V
+3.3
V
+1.8
V+3
.3V
TP7
GR
OU
ND
1
JP11
1
2
3
TP4
CH
IP S
ELE
CT
01 TP
6
CP
U C
LOC
K O
UTP
UT
1TP2
OU
TPU
T E
NA
BLE
1 TP8
GR
OU
ND
1
TP1
TRA
NS
FER
AC
K1 TP
3
RE
AD
/WR
ITE
1
C39
47pF
TP5
CP
U C
LOC
K IN
PU
T1
J2S
hrou
ded
BD
M H
eade
r
1 3 5 7 9 11 13 15 17 19 21 23 25
2 4 6 8 10 12 14 16 18 20 22 24 26
JP10
1
2
3
DS
O
DS
CLK
-BK
PT
DS
I
PS
TCLK
-RE
SE
T
-CS
0R
/W
-OE
BC
LKC
RIN
PS
T[3:
0]
DD
ATA
[3:0
]
-TA
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 23
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
NOTE
: sep
arat
ene
twor
k gr
ound
.
NOTE
: sep
arat
ene
twor
k gr
ound
.
NOTE
: sep
arat
ene
twor
k gr
ound
.
NOTE
: Pla
ce v
ia's
on a
ll unu
sed
U5I/O
pin
s. U
5 is
an is
pGAL
whi
chal
lows
re-p
rogr
amm
ing
via J
12.
Mot
orola
SPS
TSP
G -
32-b
it Em
bedd
ed C
ontro
ller D
ivisio
n (T
ECD)
OSC
ILLA
TOR
LAYO
UT F
OO
TPRI
NT F
OR
8 &
14 D
IL O
SC. P
ACKA
GES
NOTE
: JP1
5 is
norm
ally
fitte
d.Re
mov
e to
allo
w us
e of
CS1
with
exp
ansio
n co
nnec
tors
.
10/1
00ba
seT
Ethe
rnet
Por
t & M
agne
tics
1.1
MCF
524
Eval
uatio
n Bo
ard
- Par
t num
ber R
E108
11B
B
510
Mon
day,
Mar
ch 1
8, 2
002
Title
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
A1A2A3A4A5A6A7A8A9A10
A11
A12
A13
A14
A15
A[24
:1]
D16
D17
D18
D19
D20
D21
D22
D23
D27
D28D29D30D31
D26
D24D25
D[31
:16]
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
+3.3
V
+3.3
V
U5isp
GAL
22LV
10-5
LJ P
LCC
28pi
n
1234
5 6 7 8 9 10 11
12131415161718
19202122232425
262728 TCLK
CP/I0I1I2
I3 I4 I5 MO
DEI6 I7 I8
I9I10VSSTDII11I/O9I/O8I/O
7I/O
6I/O
5TD
OI/O
4I/O
3I/O
2
I/O1I/O0VCC
RP10
4x 7
5
12345678
12345678
R86
49.9
U3
25M
hz
1 7814
411
NC GND
CLK
VDD
NCVD
DR8
749
.9
U4
SMSC
LAN
91C1
11-N
E
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
3334353637383940414243444546474849505152535455565758596061626364
6566676869707172737475767778798081828384858687888990919293949596
979899100101102103104105106107108109110111112113114115116117118119120121122123124125126127128
VDD
nCSO
UTIO
S0IO
S1IO
S2EN
EEP
EEDO
EEDI
EESK
EECS
AVDD
RBIA
SAG
NDTP
O+
TPO
-AV
DDTP
I+TP
I-AG
NDnL
NKLB
KnL
EDA
nLED
BG
NDM
DIM
DOM
CLK
nCNT
RLIN
TR0
RESE
TnR
DnW
R
VDDnDATACSnCYCLEW/nRnADSARDYGNDnVLBUSAENLCLKnSRDYVDDnLEDVnRDYRTNX25OUTD31D30D29D28GNDD27D26D25D24GNDD23D22D21D20VDDD19D18D1
7D1
6G
NDD15
D14
D13
D12
GNDD1
1D1
0D9D8VD
DA1A2A3A4A5A6A7A8A9A10
A11
A12
A13
A14
A15
GND
nBE0
nBE1
nBE2
nBE3VDD
D7D6D5D4
GNDD3D2D1D0
GNDTX25VDD
TXEN100COL100
TXD3TXD2TXD1TXD0GNDRX25
CRS100VDD
RXD3RXD2RXD1RXD0
RX_DVRX_ERXTAL1XTAL2
C42
0.1u
F
R85
1K
T1
HALO
TG
110-
S050
N5
1 2 3 6 7 891011141516
R121
1K
J12
iSP
Prog
.
1 2 3 4 5 6 7 8
R91
24.9
JP15
12
R92
24.9
C43
1nF
V1 VIA
1
R93
11K
1%
R88
1K
C40
1nF
RP11
4x 1
0K1
23
45
67
8
12
34
56
78
V2 VIA
1C4
40.
1uF
R94
10K
C45
0.1u
FC4
60.
1uF
C47
1nF
C48
1nF
C49
1nF
C41
10nF
J3
Amph
enol
RHJ
S-53
81 R
J45_
LED
1 2 3 4 5 6 7 8
9
13
1112
10
14
1 2 3 4 5 6 7 8 9
13
1112
10
14
RP12
4x 1
0K 12
34
56
78
12
34
56
78
RP45
4x 4
.7K
12
34
56
78
12
34
56
78
RP13
4x 1
0K 12
34
56
78
12
34
56
78
R89
24.9
R90
24.9
A[24
:1]
D[31
:16]
BCLK
-RES
ET
-CS1
R/W
-TA_
IN
GPI
O6
-OE-T
A
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
24 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mot
orol
a S
PS
TS
PG
- 32
-bit
Embe
dded
Con
trolle
r Div
isio
n (T
ECD
)
NO
TE: P
leas
e pl
ace
D13
thro
ugh
D21
dio
des
toge
ther
in a
line.
Analogue Ground
MC
F524
9 E
xpan
sion
Con
nect
ors
1.1
MC
F524
9 E
valu
atio
n B
oard
- P
art n
umbe
r RE
1081
1B
C
610
Thur
sday
, Mar
ch 2
1, 2
002
Title
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
D[3
1:16
]
D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
A[2
4:1]
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
DD
ATA
3
DD
ATA
1
PS
T1
PS
T0
DD
ATA
2
DD
ATA
[3:0
]
PS
T2
PS
T[3:
0]P
ST3
DD
ATA
0
+1.8
V+1
.8V
+1.8
V+1
.8V
+3.3
V+3
.3V
+5V
+5V
+3.3
V+3
.3V
+5V
+5V
+3.3
V
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V
+5V
+1.8
V
+3.3
V
D14
RE
D L
ED
R11
747
0R
109
470
D21
RE
D L
ED
D17
RE
D L
ED
C66
470p
F
J5
AM
P 1
7798
3-5
120w
ay S
MT
Rec
epta
cle
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
R11
3
470
J4
AM
P 1
7798
3-5
120w
ay S
MT
Rec
epta
cle
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
C64
470p
FC
6310
nFC
6210
nFC
6547
0pF
R12
3
4.7K
C61
470p
FC
6047
0pF
C59
470p
FC
5847
0pF
R11
447
0
C57
10nF
R11
547
0
C56
10nF
D19
RE
D L
ED
D18
RE
D L
ED
C53
0.1u
FC
5410
nFC
5510
nFC
501n
F
R11
647
0
D15
RE
D L
ED
C51
1nF
D20
RE
D L
ED
R11
147
0
C67
470p
FC
520.
1uF
D13
RE
D L
ED
D16
RE
D L
ED
R11
047
0R
112
470
D[3
1:16
]
A[2
4:1]
SD
RA
M_C
S2
SD
RA
M_C
S1
-CS
0
-SD
RA
S
-SD
CA
S-S
DW
E
SD
LDQ
M
BC
LKE
R/W -O
E
BC
LK
SD
UD
QM
DS
O
-TA
GP
IO5
GP
IO6
-RE
SE
T
SD
ATA
O1/
GP
IO25
SD
ATA
O2
SC
LK1
SC
LK2/
GP
IO48
SC
LK4/
GP
IO50
LRC
K1
LRC
K2/
GP
IO44
LRC
K3/
GP
IO45
LRC
K4/
GP
IO46
DD
ATA
[3:0
]
PS
T[3:
0]
PS
TCLK
SC
LKO
UT/
GP
IO15
SD
ATA
3/G
PIO
56
SD
ATA
_BS
2/R
STO
SD
ATA
1_B
S1/
GP
IO9
SD
ATA
0_S
DIO
1/G
PIO
54
SR
E/G
PIO
11
CM
DS
DIO
2/G
PIO
34B
UFE
NB
2/G
PIO
17
BU
FEN
B1/
GP
IO57
IDE
IOR
DY
/GP
IO16
IDE
DIO
R/G
PIO
13
IDE
DIO
W/G
PIO
14
QS
PI_
DO
UT/
GP
IO26
QS
PI_
CS
0/G
PIO
29
TIN
1/G
PIO
23
CFL
G/G
PIO
18
EF/
GP
IO19
QS
PI_
CS
1/G
PIO
24
QS
PI_
CS
3/G
PIO
22Q
SP
I_C
S2/
GP
IO21
CL1
6/G
PO
42
CL1
1/G
PO
39X
TRIM
/GP
O38
CR
IN
EB
UIN
1/G
PI3
6E
BU
IN2/
GP
I37
EB
UIN
3/G
PI3
8
EB
UIN
4/G
PI3
9
EB
UO
UT1
/GP
O36
EB
UO
UT2
/GP
O37
RX
D0/
GP
I27
TXD
0/G
PO
27
-RTS
0/G
PO
30
-CTS
0/G
PI3
0
RX
D1/
GP
I28
TXD
1/G
PO
28
-RTS
1/G
PO
31
-CTS
1/G
PI3
1
TOU
T0/G
PO
33
TOU
T1/G
PO
35
TIN
0/G
PI3
3
RC
K/G
PIO
51S
FSY
/GP
IO52
SU
BR
/GP
IO53
SD
A0/
QS
PID
IN
SC
L0/Q
SP
ICLK
SD
A1/
GP
IO55
SC
L1/G
PIO
3
-TA
_IN
SD
ATA
I4/G
PI4
2
SD
ATA
I3/G
PI4
1
-CS
1
HI-Z
SD
ATA
I1
TCK
SC
LK3/
GP
IO49
SW
E/G
PIO
12
DS
I
DS
CLK
-BK
PT
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 25
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mot
orola
SPS
TSP
G -
32-b
it Em
bedd
ed C
ontro
ller D
ivisio
n (T
ECD)
Flas
h m
emor
ySD
RAM
mem
ory
DEFA
ULT
SETT
ING
- JU
MPE
R 12
SHO
ULD
BE IN
STAL
LED
ACRO
SS P
INS
1&2
Flas
h &
SDRA
M m
emor
y1.
1
MCF
5249
Eva
luat
ion
Boar
d - P
art n
umbe
r RE1
0811
B
B
710
Thur
sday
, Mar
ch 0
7, 2
002
Title
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
D24
D20
D18
D22
D16
D29
D27
D23
D19
D25
D22
D29
D31
D23
D27
D16
D20
D19
D17
D18
D26
D31
D28
D17
D21
D30
D28
D24
D30
D26
D[31
:16]
D25
D21
D[31
:16]
A[24
:1]
A[24
:1]
A17
A7A8
A20
A1
A18
A10
A18
A19
A[24
:1]
A20
A14
A6A11
A17
A19
A22
A11
A13
A9 A2A5
A12
A16
A12
A[24
:1]
A16
A21
A15
A15
A4
A14
A13
A10
A9
A3
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V
C72
0.1u
FC7
10.
1uF
R103
4.7K
C73
1nF
C74
1nF
U7 K4S6
4163
3D-G
(4M
x16)
52P
BGA
(4x1
3)
A6
A5 B6
F5
C6 D6
E5
D5 E6 G6
B5 H5 H6J6 J5 J2
L6L5 M6
M5 N5
G2
G5
N2 M2
M1 L2 L1 K2
J1H1H2N1
G1 F1
C5
E1 D2
F2
D1 C1E2
B1 A2
A1K6 K5
B2
F6
N6 C2
K1
VDD
DQ0
DQ1
VSSQ
DQ2
DQ3
VDDQ
DQ4
DQ5
DQ7
VDDQ
DQM
L
WE#
CAS#
RAS# CS
#
A10
A0 A1 A2 A3
VDD
VSS
A4 A5 A6 A7 A8 A9CK
ECL
K
DQM
H
VSS
DQ8
DQ9
VSSQ
DQ10
DQ11
VDDQ
DQ12
DQ13
VSSQ
DQ14
DQ15
VSS
BA0
BA1
VSSQ
DQ6
VDD
VDDQ
A11
C75
1nF
C76
1nF
C70
0.1u
F
R95
4.7K
JP12 16
MBi
t Fla
sh B
oot
1
2
3
U6
AM29
LV16
0DB9
0EC
(1M
X16
bit)
48pi
n TS
OP
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24252627282930313233343536373839404142434445464748
A15
A14
A13
A12
A11
A10
A9 A8 A19
NC WE#
RESE
T#NC NC RY
/BY#
A18
A17
A7 A6 A5 A4 A3 A2 A1A0CE
#VS
SO
E#DQ
0DQ
8DQ
1DQ
9DQ
2DQ
10DQ
3DQ
11VC
CDQ
4DQ
12DQ
5DQ
13DQ
6DQ
14DQ
7DQ
15/A
-1VS
SBY
TE#
A16
C69
0.1u
F
D[31
:16]
A[24
:1]
-CS0
-OE
R/W
-RES
ET
BCLK
EBC
LK
SDRA
M_C
S1-S
DW
E
SDLD
QM
SDUD
QM
-SDR
AS-S
DCAS
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
26 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
3.3V
Reg
ulat
or
Auga
t 25V
-02
2-wa
y Ba
re W
irePo
wer
Conn
ecto
r
NOTE
: Sch
ottk
y Di
ode
prev
ents
exc
essiv
edi
ffere
nce
betw
een
3.3V
& 1
.8V
rails
, at p
ower
dow
n
5.0V
Reg
ulat
or
Powe
r Jac
k Co
nnec
tor -
2.1m
m d
iam
eter
1.8V
Reg
ulat
or
JP8
SHO
ULD
BEIN
STAL
LED
DURI
NGAS
SEM
BLY
NOTE
: Dio
des
prev
ent e
xces
sive
diffe
renc
e be
twee
n 3.
3V &
1.8
Vra
ils, a
t pow
er u
p
All c
aps
less
than
1uF
are
0805
bod
ysiz
e
All r
esist
ors
are
0805
bod
y siz
e.
JP9
SHO
ULD
BEIN
STAL
LED
DURI
NGAS
SEM
BLY
HARD
_RES
ET
Mot
orola
SPS
TSP
G -
32-b
it Em
bedd
ed C
ontro
ller D
ivisio
n (T
ECD)
DC v
olta
ge in
put r
ange
+7
to +
14V
Debo
unce
d IR
Q7
Sign
al
NOTE
: the
pos
itive
term
inal
of e
ach
powe
rco
nnec
tor i
s sh
own
on th
e sil
kscr
een
ofth
e PC
B
+
+
-
-
Abor
t/IRQ
7
Powe
r Sup
ply,
Res
et &
Clo
ck O
scilla
tor
1.1
MCF
5249
Eva
luat
ion
Boar
d - P
art n
umbe
r RE1
0811
B
B
810
Thur
sday
, Mar
ch 2
1, 2
002
Title
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
+1.8
V+3
.3V
+5V
+1.8
VP
+5V
+3.3
V+1
.8V
+3.3
V
+3.3
V
+3.3
V
+3.3
VP
+3.3
V
+3.3
V
+5V
+1.8
V
+3.3
V
+1.8
V
+3.3
V+3
.3V
C81
0.1u
F
P2
1 2
C82
0.1u
F
D7
MBR
S340
T3
21
C83
1nF
C88
0.1u
F
C84
1nF
U8LT
1086
CM
3
1
2VI
N
ADJ
VOUT
D5 RED
LED
D12
+5V
GRE
EN P
OW
ER L
ED
D1 MBR
S340
T3
21
C92
22pF
R98
120
R106
560
C85
1nF R1
0056
C90
330u
F
L1 25uH
U10
NC7S
ZU04
1 2 3
5 4
OE
A GND
VCC Y
C91
0.1u
F
C97
330u
F
S1
KS11
R23C
QD
RESE
T
P1 Switc
hcra
ft RA
PC71
2123
JP9
12
D6 MBR
S340
T3
21C86
10uF
U11
LM25
96S-
3.3
12
5
3
4
6
VIN
VOUT
~ON/
OFF
GND
FB
TAB
R97
270
C94
0.1u
F
X111
.289
6 M
Hz 12
C115
1nF
D2
MBR
S340
T3
21
C98
0.1u
F
S2 KS11
R22C
QD
C93
22pF
D8 MBR
S340
T3
21
R96
1K
J11
PC p
ower
1 2 3 4
+12V
GND
GND +5
V
JP8
12
C87
330u
F
R99
3K
U9
MAX
6355
LSUT
-T
1 2 3456
RST
GND M
RVc
c3RS
TIN
Vcc5
D3 MRA
4003
T3
D10
RED
LED
D11
+3.3
V G
REEN
PO
WER
LED
C96
1000
uF
R105
270
R104
270
R101
1M
D4
MRA
4003
T3
D22
+1.8
V G
REEN
PO
WER
LED
L2
25uH
R118
22
U18
TLC7
733I
D
8 7 5 6 1
432VC
CSE
NSE
RESE
T
RESE
T
CONT
ROL
GND
CTRESI
N
F1
5A F
ast b
low.
C95
1nF
R122
4.7K
U12
LM25
96S-
5
12
53
46
VIN
VOUT
~ON/
OFF
GND
FBTAB
CRIN
-RES
ET
SDRA
M_C
S2
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 27
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
TERM
INAL
PO
RT9-
WAY
D-T
YPE
(Fem
ale)
AUXI
LLAR
Y PO
RT9-
WAY
D-T
YPE
(Fem
ale)
NOTE
: The
I2C/
Mbu
s on
the
MCF
5249
will
supp
ort b
oth
3.3V
& 5
V de
vices
.
NOT
POPU
LATE
D AT
ASS
EMBL
Y.
NOT
POPU
LATE
D AT
ASS
EMBL
Y.
Mot
orola
SPS
TSP
G -
32-b
it Em
bedd
ed C
ontro
ller D
ivisio
n (T
ECD)
RS23
2 Tr
ansc
eiver
.
RS23
2 Tr
ansc
eiver
.
RS23
2 Se
rial,
I2C
& Q
SPI I
nter
face
s1.
1
MCF
5249
Eva
luat
ion
Boar
d - P
art n
umbe
r RE1
0811
B
B
910
Thur
sday
, Mar
ch 0
7, 2
002
Title
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
+3.3
V
+3.3
V
+5V
+3.3
V
+3.3
V
+3.3
V+5
V
+5V
C110
0.22
uF
C104
0.22
uF
C99
0.22
uF
C105
0.22
uF
J6
QSP
I con
nect
or 0
.1 p
itch
1 2 3 4 5 6 7 8 9 10
C106
0.22
uF
P45 9 4 8 3 7 2 6 1
RP44
4x 4
.7K
12
34
56
78
12
34
56
78
C100
0.22
uFC1
011n
F
U13
MAX
3225
CAP
1 2 3 4 5 6 7 8 9 101112131418 1516171920
READ
YC1
+V+ C1
-C2
+C2
-V- T2
OUT
R2IN
R2O
UTIN
VALI
DT2
INT1
INFO
RCEO
N
GND
R1O
UTR1
INT1
OUT
VCC
FORC
EOFF
U14
MAX
3225
CAP
1 2 3 4 5 6 7 8 9 101112131418 1516171920
READ
YC1
+V+ C1
-C2
+C2
-V- T2
OUT
R2IN
R2O
UTIN
VALI
DT2
INT1
INFO
RCEO
N
GND
R1O
UTR1
INT1
OUT
VCC
FORC
EOFF
C109
0.22
uF
C107
1nF
C103
0.22
uF
P35 9 4 8 3 7 2 6 1
C108
0.1u
F
C102
0.1u
F
J7 I2C
Mol
ex C
onn.
715
65
1 2 3 4
SCLK
4/G
PIO
50
LRCK
4/G
PIO
46
SDAT
AI3/
GPI
41
SDAT
AI4/
GPI
42
TXD0
/GPO
27
TXD1
/GPO
28-R
TS1/
GPO
31
RXD0
/GPI
27
-CTS
0/G
PI30
RXD1
/GPI
28
-CTS
1/G
PI31
SDA1
/GPI
O55
SCL1
/GPI
O3
SCL0
/QSP
ICLK
SDA0
/QSP
IDIN
QSP
I_DO
UT/G
PIO
26Q
SPI_
CS0/
GPI
O29
QSP
I_CS
1/G
PIO
24Q
SPI_
CS2/
GPI
O21
QSP
I_CS
3/G
PIO
22
-RTS
0/G
PO30
Appendix A: M5249C3 Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
28 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mot
orola
SPS
TSP
G -
32-b
it Em
bedd
ed C
ontro
ller D
ivisio
n (T
ECD)
Bi-d
irect
iona
l
Uni-d
irect
iona
l
IDE
Inte
rface
1.1
MCF
5249
Eva
luat
ion
Boar
d - P
art n
umbe
r RE1
0811
B
B
1010
Thur
sday
, Mar
ch 2
1, 2
002
Title
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
D31
D30
D29
D28
D27
D26
D25
D24
D23
D22
D21
D20
D19
D18
D17
D16
A[24
:1]
A1 A2 A3 A4 A5
IDE_
D11
IDE_
CS1
IDE_
A2
IDE_
D1
IDE_
D13
IDE_
D14
IDE_
A1ID
E_A0
IDE_
D12
IDE_
D15
IDE_
D10
IDE_
D2
IDE_
CS0
IDE_
D8
IDE_
D12
IDE_
D14
IDE_
D13
IDE_
CS0
IDE_
A2ID
E_A0
IDE_
D15
IDE_
D8ID
E_D7
IDE_
D4ID
E_CS
1
IDE_
D3
IDE_
D9
IDE_
D11
IDE_
D5
IDE_
D10
IDE_
D6
IDE_
D9
IDE_
RESE
T
IDE_
D0
IDE_
D1ID
E_D2
IDE_
D3ID
E_D4
IDE_
D5ID
E_D6
IDE_
D7
IDE_
IOW
IDE_
IOR
IDE_
IOCH
RDY
IDE_
IRQ
IDE_
ACTI
VITY
IDE_
D0
IDE_
A1
+3.3
V +3.3
V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
D9 RED
IDE
LED
C113
1nF
RP41
4x 4
.7K
12
34
56
78
12
34
56
78
RP42
4x 1
0K
12
34
56
78
12
34
56
78
R102
270
C111
1nF
U17 MC7
4LCX
1624
5DT
2 3 5 6 8 9 11 12 13 14 16 17 19 20 22 23 1 48 25 24 4 10 15 21
28 34 39 4547 46 44 43 41 40 38 37 36 35 33 32 30 29 27 26 7 18 31 42
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1B8
2B1
2B2
2B3
2B4
2B5
2B6
2B7
2B8
1DIR
1OE
2OE
2DIR
GND
GND
GND
GND
GND
GND
GND
GND1A
11A
21A
31A
41A
51A
61A
71A
82A
12A
22A
32A
42A
52A
62A
72A
8
VCC
VCC
VCC
VCC C1
140.
1uF
U16 MC7
4LCX
1624
5DT
2 3 5 6 8 9 11 12 13 14 16 17 19 20 22 23 1 48 25 24 4 10 15 21
28 34 39 4547 46 44 43 41 40 38 37 36 35 33 32 30 29 27 26 7 18 31 42
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1B8
2B1
2B2
2B3
2B4
2B5
2B6
2B7
2B8
1DIR
1OE
2OE
2DIR
GND
GND
GND
GND
GND
GND
GND
GND1A
11A
21A
31A
41A
51A
61A
71A
82A
12A
22A
32A
42A
52A
62A
72A
8
VCC
VCC
VCC
VCCC1
120.
1uF
J8
HDR2
0 X
2 Sh
roud
ed
252321191715131197531
2624222018161412108642
2728
2930
3132
3334
3536
3738
3940
252321191715131197531
2624222018161412108642
2728
2930
3132
3334
3536
3738
3940
R/W
BUFE
NB2/
GPI
O17
D[31
:16]A[
24:1
]
EF/G
PIO
19
GPI
O5
IDEI
ORD
Y/G
PIO
16ID
EIO
R/G
PIO
13ID
EIO
W/G
PIO
14
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 29
7 Appendix B: Audio Daughter Card Schematics
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
30 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Hier
arch
ical B
lock
Dia
gram
1.2
MCF
5249
Eva
luat
ion
Boar
d - A
udio
Dau
ghte
r Car
d
B
17
Wed
nesd
ay, O
ctob
er 2
3, 2
002
Mot
orol
a SP
S TS
PG -
32-b
it Em
bedd
ed C
ontro
ller D
ivis
ion
(TEC
D)Ti
tle
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
Shee
t 4
Audi
oSDAT
AO2
CL11
CL16
SCLK
2LR
CK2
SCLK
1LR
CK1
SDAT
AO1
EBUI
N1EB
UIN2
EBUI
N3EB
UIN4
EBUO
UT1
EBUO
UT2
SMUT
E
Shee
t7
CD In
terfa
ce A
dapt
ers
Shee
t 3
Flas
h M
edia
CLK
CMD
CDWP
DAT0
DAT1
DAT2
DAT3
Shee
t 5
USBA[
24:1
]D[
31:1
6]
CS1
RD WR
INT1
INT2
BUFE
NB1
RESE
T
Shee
t 6
Trio
Inte
rface
ADIN
0AD
IN1
ADIN
2AD
IN3
ADO
UT
SDAT
AISC
LKLR
CKEF CF
LGSD
ASC
LRA
BSI
LDPO
RES
SMUT
ESL
EEP
RESU
ME
HOLD
DOO
RSW
RESE
T
PLAY
SID
LCDC
LKRS LC
DRST
CS2
FOK
RF-
PWR
RW/R
OM
/OFF
1X/2X
CD-S
QCK
CD-D
EM
CD-S
QSO
Shee
t 2
M52
49C3
Inte
rface
EBUI
N1/G
PI36
EBUI
N2/G
PI37
EBUI
N3/A
DIN0
/GPI
38EB
UIN4
/ADI
N1/G
PI39
EBUO
UT1/
GPO
36EB
UOUT
2/G
PO37
SDAT
AO1/
GPI
O25
LRCK
1SC
LK1
SDAT
AO2/
GPO
41LR
CK2/
GPI
O44
SCLK
2/G
PIO
48
CL11
/GPO
39CL
16/G
PO42
RXD1
/ADI
N2/G
PI28
CTS1
/ADI
N3/G
PI31
TOUT
1/AD
OUT
/GPO
35
SCLK
4/G
PIO
50LR
CK4/
GPI
O46
EF/G
PIO
19CF
LG/G
PIO
18
RTS0
/GPO
30RT
S1/G
PO31
RCK/
GPI
O51
SFSY
/GPI
O52
SUBR
/GPI
O53
TIN0
/GPI
33TI
N1/G
PIO
23RX
D0/G
PI27
RESE
T
CTS0
/GPI
30
SDAT
A0_S
DIO
1/G
PIO
54SD
ATA1
_BS1
/GPI
O9
SDAT
A2_B
S2/R
STO
SDAT
A3/G
PIO
56
SRE/
GPI
O11
CMD_
SDIO
2/G
PIO
34
SWE/
GPI
O12
SCLK
_OUT
/GPI
O15
A[24
:1]
D[31
:16]
BUFE
NB1/
GPI
O57
OE
R/W
QSP
IDO
UT/G
PIO
26SC
L0/Q
SPIC
LKQ
SPIC
S0/G
PIO
29Q
SPIC
S1/G
PIO
24Q
SPIC
S2/G
PIO
21
TXD0
/GPO
27TX
D1/G
PO28
TOUT
0/G
PO33
SDAT
AI3/
GPI
41
SCLK
3/G
PIO
49
LRCK
3/G
PIO
45
QSP
ICS3
/GPI
O22
SDAT
AI1
SDAT
AI4/
GPI
42
DDAT
A0/G
PIO
0DD
ATA1
/GPI
O1
CS1
A[24
:1]
D[31
:16]
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 31
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
SDAT
AI1
is c
onne
cted
to
the
ADC
on t
he m
othe
rboa
rd
IIS2
als
o dr
ives
the
hea
dpho
neDA
C on
the
mot
herb
oard
DAC
conf
igur
atio
n op
tion
s
AK43
93 i
n pa
rall
el m
ode,
IIS
com
pati
able
or 2
0-bi
t LS
B ju
stif
ied
via
DIF1
Do w
e ne
ed a
ny m
ore
sign
al c
ondi
tion
ing
befo
re t
he j
acks
AK43
93 i
n pa
rall
el m
ode,
IIS
com
pati
able
or 2
0-bi
t LS
B ju
stif
ied
via
DIF1
Audi
o In
terfa
ce1.
2
MCF
5249
Eva
luat
ion
Boar
d - A
udio
Dau
ghte
r Car
d
B
27
Wed
nesd
ay, O
ctob
er 2
3, 2
002
Mot
orol
a SP
S TS
PG -
32-b
it Em
bedd
ed C
ontro
ller D
ivis
ion
(TEC
D)Ti
tle
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
CKS2
CKS1
CKS0
DFS
DEM
0DE
M1
MCL
KPD
N
MUT
E
DEM
0
CKS2
DFS
CKS1
PDN
DFS
DEM
0
CKS0
DEM
1
CKS0
DEM
1
CKS1
CKS2
MUT
E
MCL
K
PDN
MCL
K
DIF1
DIF1
MUT
EDIF1
+3.3
V
+3.3
V
+3.3
V
+5V
+3.3
V
+3.3
V
+3.3
V
+3.3
V
+5V
-VS
+VS
-VS
+VS
+VS
+VS
-VS
-VS
+VS
+VS
-VS
-VS
+5VD
+5VD
+5VD
+5VD
+5VD
+5VD
-VS
+VS
+3.3
VVC
C
C27
0.1u
FC2
810
uF 1
6V
C23
0.1u
F
C29
1nF
R30
13K
R28
22K
R27
18K
R25
22K
C21
0.1u
F
C37
100p
F
C19
0.1u
F
C46
1nF
R26
13K
R29
18K
C20
4.7u
F 25
V
C47
100p
F
C22
4.7u
F 25
V
JP2 123 R40
470R
JP4 1 2 3
R33
18K
R31
22K
R32
13K
R35
18K
R36
13K
R34
22K
C54
100p
F
R38
1K
C52
100p
F
C53
1nF
U7A
74HC
U04
12
U7B
74HC
U04
34
R2O
UT1
RCA
PHO
NO J
ACK
1
2
L2O
UT1
RCA
PHO
NO J
ACK
1
2
C24
10uF
16V
R37
4K7
C50
1nF
DCDC
1
NMA0
512S
1 2 4 5 6
VCC
GND
-V 0V +V
C48
0.1u
F
U5 AK43
93
1 2 3 4 5 6 7 8 9 10 11 12 13 141516171819202122232425262728
DVSS
DVDD
MCL
KPD
NBI
CKSD
ATA
LRCK
SMUT
E/CS
NDF
SDE
M0/
CCLK
DEM
1/CD
TIDI
F0DI
F1DI
F2BV
SSVR
EFL
VREF
HAV
DDAV
SSAO
UTR-
AOUT
R+AO
UTL-
AOUT
L+VC
OM
P/S
CKS0
CKS1
CKS2
C35
10uF
16V
C36
0.1u
F
C44
0.1u
F
L4 FERR
ITE_
BEAD
12
C49
10uF
16V
C45
10uF
16V
JP3
HEAD
ER 6
X2
12
34
56
78
910
1112
JP1A
1 4 7 10 13 16 19 22
1 4 7 10 13 16 19 22
JP1C
3 6 9 12 15 18 21 24
3 6 9 12 15 18 21 24
JP1B
2 5 8 11 14 17 20 23
2 5 8 11 14 17 20 23
U7C
74HC
U04
56
U7F
74HC
U04
1312
U7E
74HC
U04
1110
U7D
74HC
U04
98
LK73
12 R7
010
K
C34
0.1u
F
C42
4.7u
F 25
VC4
34.
7uF
25V
C58
47pF
LK25
12
C16
10uF
16V
C17
0.1u
F
LK22
12
LK26
12
LK27
12
C59
0.1u
F
LK24
12
U10
GP1
FA55
0TZ
1 2 3
VIN
VCC
GND
R1O
UT1
RCA
PHO
NO J
ACK
1
2
L1O
UT1
RCA
PHO
NO J
ACK
1
2
LK23
12
LK29
12
LK28
12
C60
4.7u
F 16
V
C57
0.1u
FU6 OPA
2134
/SO
123 45 6
7
8
OUT
A-IN
A+I
NA
V-+INB
-INB
OUT
B
V+
L1 FERR
ITE_
BEAD
12
C55
10nF
U4 OPA
2134
/SO
123 45 6
7
8
OUT
A-IN
A+I
NA
V-+INB
-INB
OUT
B
V+
U3 AK43
93
1 2 3 4 5 6 7 8 9 10 11 12 13 141516171819202122232425262728
DVSS
DVDD
MCL
KPD
NBI
CKSD
ATA
LRCK
SMUT
E/CS
NDF
SDE
M0/
CCLK
DEM
1/CD
TIDI
F0DI
F1DI
F2BV
SSVR
EFL
VREF
HAV
DDAV
SSAO
UTR-
AOUT
R+AO
UTL-
AOUT
L+VC
OM
P/S
CKS0
CKS1
CKS2
R14
13K
R17
18K
R18
13K
L3 FERR
ITE_
BEAD
12
R16
22K
R15
18K
EBUO
UT1
RCA
PHO
NO J
ACK
1
2
L2 FERR
ITE_
BEAD
12
R13
22K
EBUI
N1RC
A PH
ONO
JAC
K1
2
C18
100p
F
C25
1nF
T1 TTW
B101
0
16
34
C26
100p
F
C39
4.7u
F 25
VC4
00.
1uF
C38
0.1u
FC4
14.
7uF
25V
T2 TTW
B101
0
16
34U8 G
P1FA
550R
Z
1 2 3
VCC
GND
VOUT
R22
22K
R21
18K
R19
22K
R20
13K
R23
18K
R24
13K
C32
1nF
C33
100p
F
C31
100p
F
C56
1uF
R41
180R
R42
110R
R39
110R
EBUO
UT1
EBUO
UT2
EBUI
N1EB
UIN2
EBUI
N3EB
UIN4
SDAT
AO1
LRCK
1
SCLK
1
CL11
SCLK
2
LRCK
2
CL16
SDAT
AO2
SMUT
E
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
32 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Note
s :
CMD,
DAT
1, C
D an
d WP
sig
nals
dri
ve L
ED's
on
the
moth
erbo
ard.
It i
s po
ssib
le t
o co
nnec
t to
eit
her
the
SD o
r Me
mory
Sti
ckin
terf
ace,
but
not
bot
h si
mult
aneo
usly
.
The
Writ
e Pr
otec
t an
d Ca
rd D
etec
t si
gnal
s on
the
SD
inte
rfac
e ca
n be
con
figu
red
as e
ithe
r ac
tive
hig
h or
low
.
Memo
ry S
tick
car
d in
sert
ion/
extr
acti
on i
s no
rmal
ly u
sed
topr
ovid
e th
e ap
prop
riat
e po
wer
cycl
ing,
but
it
is a
lso
poss
ible
to
over
ride
thi
s us
ing
the
CD s
igna
l.
Flas
h M
edia
Inte
rface
1.2
MCF
5249
Eva
luat
ion
Boar
d - A
udio
Dau
ghte
r Car
d
B
37
Wed
nesd
ay, O
ctob
er 2
3, 2
002
Mot
orol
a SP
S TS
PG -
32-b
it Em
bedd
ed C
ontro
ller D
ivis
ion
(TEC
D)Ti
tle
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
+3.3
V
+3.3
V+3
.3V
+3.3
V
+3.3
V+3
.3V
+3.3
V+3
.3V
+3.3
V+3
.3V
J10
Mem
ory
Stick1 2 3 4 5 6 7 8 9 10
VSS BS
VCC
SDIO
RSVD IN
SRS
VDSC
LKVC
CVS
S
J9 FPS0
09-2
203-
10
1 2 3 4 5 6 7 8 9101112
CD/D
AT3
CMD
VSS
VDD
CLK
VSS
DAT0
DAT1
DAT2
CDCD/W
P-CO
MW
P
R72
68K
R74
68K
R73
68K
R76
68K
R75
68K
R46
4K7
R47
1KQ
1BC
807
R45
4K7
LK30
12
C62
4.7u
F 16
V
LK32
12
LK31
12
LK35
12
LK34
12
LK33
12
LK37
12
LK36
12
C61
4.7u
F 16
V
R43
10K
DAT0
DAT1
DAT2
DAT3
CMD
WP
CDCLK
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 33
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Anal
ogue
Gro
und
M52
49C3
Inte
rface
1.2
MCF
5249
Eva
luat
ion
Boar
d - A
udio
Dau
ghte
r Car
d
B
47
Frid
ay, S
epte
mbe
r 13,
200
2
Mot
orol
a SP
S TS
PG -
32-b
it Em
bedd
ed C
ontro
ller D
ivis
ion
(TEC
D)Ti
tle
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
D[31
:16]
A[24
:1]
+3.3
V+3
.3V
+5V
+5V
+3.3
V+3
.3V
+5VD
+5VD
BUFE
NB2
1
SDRA
MCS
21
TA1
J5
AMP
1779
83-5
120
way
SMT
Rece
ptac
le
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
J4
AMP
1779
83-5
120
way
SMT
Rece
ptac
le
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960
6162
6364
6566
6768
6970
7172
7374
7576
7778
7980
8182
8384
8586
8788
8990
9192
9394
9596
9798
9910
010
110
210
310
410
510
610
710
810
911
011
111
211
311
411
511
611
711
811
912
0
GPI
O5
1
SDA0
1
GPI
O6
1
SCL1
1
SDA1
1
XTRI
M1
DDAT
A21
DDAT
A31
PST0
1
IDEI
ORD
Y1
PST1
1
IDED
IOR
1
PST2
1
IDED
IOW
1
PST3
1
PSTC
LK1
SDAT
A0_S
DIO
1/G
PIO
54
SDAT
A1_B
S1/G
PIO
9
SDAT
A2_B
S2/R
STO
SDAT
A3/G
PIO
56
SWE/
GPI
O12
SRE/
GPI
O11
CMD_
SDIO
2/G
PIO
34
SCLK
_OUT
/GPI
O15
EBUI
N1/G
PI36
EBUI
N3/A
DIN0
/GPI
38
EBUI
N4/A
DIN1
/GPI
39
EBUO
UT1/
GPO
36
EBUO
UT2/
GPO
37
SDAT
AO1/
GPI
O25
LRCK
1
SCLK
1
SDAT
AO2/
GPO
41LR
CK2/
GPI
O44
SCLK
2/G
PIO
48
CL11
/GPO
39
CL16
/GPO
42
RXD1
/ADI
N2/G
PI28
CTS1
/ADI
N3/G
PI31
EF/G
PIO
19
CFLG
/GPI
O18
TOUT
1/AD
OUT
/GPO
35
SCLK
4/G
PIO
50
LRCK
4/G
PIO
46
RTS0
/GPO
30
RTS1
/GPO
31
RCK/
GPI
O51
SFSY
/GPI
O52
SUBR
/GPI
O53
TIN0
/GPI
33
TIN1
/GPI
O23
RXD0
/GPI
27
RESE
T
CTS0
/GPI
30
A[24
:1]
D[31
:16]
R/W OE
EBUI
N2/G
PI37
QSP
ICS0
/GPI
O29
QSP
ICS1
/GPI
O24
QSP
ICS2
/GPI
O21
QSP
IDO
UT/G
PIO
26
SCL0
/QSP
ICLK
TXD0
/GPO
27
TXD1
/GPO
28
TOUT
0/G
PO33
LRCK
3/G
PIO
45
SCLK
3/G
PIO
49
SDAT
AI3/
GPI
41
QSP
ICS3
/GPI
O22
SDAT
AI1
BUFE
NB1/
GPI
O57
SDAT
AI4/
GPI
42
CS1
DDAT
A0/G
PIO
0DD
ATA1
/GPI
O1
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
34 Freescale Semiconductor
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 35
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
DMA
inte
rfac
e
500m
A pe
r ch
anne
l
Host
OTG
Mini
-AB
Rece
ptac
le
Devi
ce
USB
Inte
rface
1.2
MCF
5249
Eva
luat
ion
Boar
d - A
udio
Dau
ghte
r Car
d
B
67
Wed
nesd
ay, O
ctob
er 2
3, 2
002
Mot
orol
a SP
S TS
PG -
32-b
it Em
bedd
ed C
ontro
ller D
ivis
ion
(TEC
D)Ti
tle
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
A1 A2 D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
A[24
:1]
D[31
:16]
+3.3
V+3
.3V
+3.3
V+5
VD
+3.3
V
+3.3
V+3
.3V
+5VD
+3.3
V+3
.3V
+3.3
V
U1 ISP1
362
156 51554950 545345
3224 25 28 29 31
364647 33 34 35 39 94
21 20 22 30
4861 62
52 58
23 59
1914
603863 64
2726
2 3 5 6 7 8 10 11 12 13 15 16 17 18
40
4443
3742 41 57
DGND
VCC(
5.0)
AGND
VBUS
OTG
_DM
1O
TG_D
P1
CP_C
AP2
CP_C
AP1
OTG
MO
DE
RESE
T
DREQ
1DR
EQ2
DACK
1DA
CK2
INT2
H_P
SW2
H_DM
2H_
DP2
H_SU
SPD/
WUP
D_SU
SPD/
WUP
H_P
SW1
GL
DGND
VCC(
3.3)
CS RD WR
INT1
IDA0 A1
VCC(
3.3)
VCC(
3.3)
TEST
0TE
ST1
DGND
VCC(
3.3)
TEST
2
CLKO
UT
D0 D1
DGND
VCC(
3.3)
D2 D3 D4 D5 D6 D7 D8 D9 D10
D11
D12
D13
D14
D15
VCC(
3.3)
X2X1
DGND
H_O
C1H_
OC2
DGND
J6 MIN
IAB
1 2 3 4 5
R622
R
R522
R
J8 USB-
CONA
1 2 3 4
C10
1nF
C11
0.1u
FC8 1n
FC9 0.
1uF
C7 0.1u
FC6 1n
F
U2 MIC
2026
1 2 3 45678
ENA
FLG
AFL
GB
ENB
OUT
BG
NDINO
UTA
R10
10K
GL1
R91K
C3 10nF
R11
10K
C4 0.1u
FC5 10
uF 1
6VC1
30.
1uF
C12
1nF
LK77
12
LK76
12
LK75
12
C1 22nF
C51
10uF
16V
R310
K
R110
K
JP7 1 2 3
DACK
11
DREQ
21
DREQ
11
DACK
21
CLKO
UT1
OTG
ENB
1 2
C30
10uF
16V
R71
10K
C98
47pF
C97
47pF
VBUS
1
ID1
OTG
MO
DE1
R12
1M
J7 USB-
CONB
1 2 3 4
R722
R
R822
R
LK20
12
LK3
12
LK21
12
LK6
12
LK5
12
LK4
12
LK10
12
LK9
12
LK8
12
LK7
12
LK13
12
LK12
12
LK11
12
LK16
12
LK15
12
LK14
12
LK1
12
C96
47pF
LK18
12
C95
47pF
LK17
12
LK2
12
R210
K
Y1 12M
Hz
R410
K
HW
UP1
1D
WU
P11
C14
22pF
C15
22pF
D[31
:16]
A[24
:1]
RD WR
BUFE
NB1
RESE
T
INT1
INT2
CS1
Appendix B: Audio Daughter Card Schematics
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
36 Freescale Semiconductor
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Conn
ecti
ons
to P
hili
ps C
D10
base
d player
Adap
ter
PCB
to p
rovi
de b
ackw
ard
comp
atab
ilit
y to
exi
stin
g Tr
iosy
stem
s
GND
GND
SDAT
AISC
LKLR
CKEFCF
LGSD
ASC
LRA
BSI
LDDM
_PWM
PORE
SSM
UTE
SLEE
PEB
UIN
GND
+AV
GND
2.7V
RESE
TDO
ORSW
HOLD
RESU
METE
MPBA
TT_L
VLCH
G_DE
TCH
G_ON
DC_I
NAC
CUWA
KE
116
P3
116
P2
P1
1
P1 m
ount
ed o
n th
e un
ders
ide
of t
he P
CB.
The
top
of t
he b
oard
sho
uld
be f
lush
with
P1
to a
void
fou
ling
wit
h J1
5 on
the
C3 b
oard
.
CD_D
ATA
CD_B
CKCD
_LRC
KCD
-SCL
KCD
-SEN
SCD
_DDA
TCD
_DCL
KCD
_DXL
TCD
_XRS
TCD
-SCO
RCD
-C2P
OCD
-XRO
F
GND
GND
+5V
+5V
CD-E
MPH
STOP
DOOR
SW
CD-F
OKCD
-AGC
CD-L
DON
CD-E
SPS
CD-S
QSO
CD-S
QCK
PLAY
GND
GND
+5V
SDAT
AI1
SCLK
1LR
CK1
EF/G
PIO1
9CF
LG/G
PIO1
8SC
LK4/
GPIO
50LR
CK4/
GPIO
46RT
S0/G
PO30
RTS1
/GPO
31RC
K/GP
IO51
SFSY
/GPI
O52
SUBR
/GPI
O53
PLAY
KEY
TIN0
/GPI
33TI
N1/G
PIO2
3RX
D0/G
PI27
RESE
TQS
PICS
3/GP
IO22
TXD0
/GPO
27TX
D1/G
PO28
TOUT
0/GP
O33
SDAT
AI3/
GPI4
1LR
CK3/
GPIO
45SD
ATAI
4/GP
I42
SDAT
AI1
SCLK
1LR
CK1
EF/G
PIO1
9CF
LG/G
PIO1
8SC
LK4/
GPIO
50LR
CK4/
GPIO
46RT
S0/G
PO30
RTS1
/GPO
31RC
K/GP
IO51
SFSY
/GPI
O52
SUBR
/GPI
O53
PLAY
KEY
TIN0
/GPI
33TI
N1/G
PIO2
3RX
D0/G
PI27
RESE
TQS
PICS
3/GP
IO22
TXD0
/GPO
27TX
D1/G
PO28
TOUT
0/GP
O33
SDAT
AI3/
GPI4
1LR
CK3/
GPIO
45SD
ATAI
4/GP
I42
Conn
ecti
ons
to S
ony
chip
set
bas
ed player
S1
1S1
mou
nted
on
the
unde
rsid
e of
the
PCB
.
The
top
of t
he b
oard
sho
uld
be f
lush
with
S1
to a
void
fou
ling
wit
h J1
5 on
the
C3 b
oard
.
S2
1
CD In
terfa
ce A
dapt
ers
1.2
MCF
5249
Eva
luat
ion
Boar
d - A
udio
Dau
ghte
r Car
d
B
77
Mon
day,
Oct
ober
28,
200
2
Mot
orol
a SP
S TS
PG -
32-b
it Em
bedd
ed C
ontro
ller D
ivis
ion
(TEC
D)Ti
tle
Size
Docu
men
t Num
ber
Rev
Date
:Sh
eet
of
LK72
12
S1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
J14
12345678910111213141516
J11
12345678910111213141516
S2
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
J12 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
NOTES
Introducing Freescale’s ColdFire-Based Compressed Audio Solutions Application Note, Rev. 1
Freescale Semiconductor 37
Document Number: AN2462Rev. 12/2007
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