1.0 INTRODUCTION

1

1.0 INTRODUCTION

1.1 Placement

For the industrial training, I was placed at an international semi-conductor

factory known as STATS ChipPAC (Malaysia) Sdn. Bhd. (SCM) This 488,000

square foot facility in Kuala Lumpur provides a full range of integrated test and

assembly services.

There are several departments in the firm such as Human Resource, IC

Assembly, Power and IC Test. As for me, I was placed at the IC Assembly Front of

Line (FOL) as a trainee in preventive maintenance group. Here, I have gain lots of

important knowledge on maintenance, parts, measurements, and cautions for the

machine used in the factory especially the gold wire bonding machine.

My task is mostly on preventive maintenance activities for the gold wire

bonding machine where I must do some servicing for once every three month which

applied to each machine. This can assure the efficiency percentage of the machine

maintains or better if it is increased. I also get to do other tasks such as helping

other engineer with their works.

1.2 Objective

The works that I have exposed/involved along the training period mostly are

following the underlying objectives of industrial training that are:

Manufacturing / production process and or its optimization process.

Mechanical design and product/system development.

Maintenance and repair of machineries or equipments.

Product testing and quality control.

2

2.0

ORGANIZATION

BACKGROUND

3

2.0 ORGANIZATION BACKGROUND

2.1 History & Milestone

STATS History

2004  STATS and ChipPAC agree to merge creating world's premiere

semiconductor test and assembly solutions company

2003  Entered into strategic alliance with SimmTech for substrate support and

technology

 2003  Installed 100th Teradyne Catalyst platform

 2003  Announced integrated turnkey solution for the Wireless market

 2002  FastRamp acquired Conexant test operations in San Diego, California

2002  Launched mySTATS enterprise portal

2001  Launched FastRamp Test Services, a high-end test laboratory

2001  Acquired majority stake in Taiwan test house, Winstek Semiconductor

Corporation

2001  Expanded unique thermal simulation service

2000  Listed on NASDAQ and the Singapore Exchange

1995  Expanded into full turnkey services with assembly operations

1995  Established test operations

ChipPAC History

2004  STATS and ChipPAC agree to merge creating world's premiere

semiconductor test and assembly solutions company

 2003  ChipPAC first to market with six Stacked-Die CSP

2003  ChipPAC offers industry's thinnest four chip Stacked-Die CSP products

2002  Announcement of China expansion, extending leadership

4

2002  ChipPAC engineers five Stacked Chips in a 1.4mm thick package

2002  ChipPAC standardizes on eRoom solution; deploys global automated design

scheduling system

2001  ChipPAC introduces industry’s first advanced package design and

characterization system

 2001  ChipPAC recognized as a Top Exporter in China marketplace

 2000  Initial public offering

2000  Acquisition of Malaysia plant

1999  Leveraged buyout by Management, Bain & CVC

1997  ChipPAC brand initiated

1995  Start of China operations

1994  Start of merchant assembly and test of high volume Intel BGA

Tan Lay Koon

President and Chief Executive Officer

 Tan Lay Koon is President and Chief

Executive Officer of STATS ChipPAC Ltd.

Previously, Mr. Tan served as Chief Financial

Officer for STATS, Ltd. and was promoted to

his current position in June 2002. Prior to

joining the company, Mr. Tan was an investment banker with Salomon Smith

Barney, the global investment banking unit of Citigroup Inc. He has also held

various positions with the Government of Singapore, Times Publishing Limited

and United Overseas Bank Limited in Singapore. Mr. Tan graduated with a

Bachelor of Engineering (First Class Honors) from the University of Adelaide

Australia as a Colombo Plan Scholar. He also holds a Master of Business

Administration (Distinction) from the Wharton School of the University of

Pennsylvania where he was elected a Palmer Scholar.

5

STATS ChipPAC (Malaysia) Milestone

Factory operations began as RCA 1974

and Harris 1975

o Harris and RCA/GE merged in

Dec 1988

o Spin-off into Intersil in Aug

1999

o Acquired by ChipPAC in July

2000

o Merged into Stats Chippac

August 2004

2.2 Organization Chart

STATS ChipPAC Malaysia

6

1974

1989

19992000

ChipPAC

2004

Figure 2.0: STATS ChipPAC (M) Milestone

2.3 Company Information

STATS ChipPAC Ltd. is a premier service provider of semiconductor

packaging design, assembly, test, and distribution solutions. A trusted partner

supplier to leading semiconductor companies worldwide, STATS ChipPAC's

unique value to its customers is fully integrated, multi-site, end-to-end assembly

and testing solutions that bring products to market and volume production

faster.

STATS ChipPAC is a leader in mixed signal testing and advanced

packaging technology for semiconductors used in diverse end market

applications including communications, power, digital consumer, and

computing. Our customers comprise some of the largest wafer foundries,

integrated device manufacturers (IDMs) as well as fables companies in the

United States, Europe and Asia.

With a strategic manufacturing presence spanning Singapore, China,

Malaysia, South Korea, Taiwan and the United States, and customer support

offices throughout the United States, Europe, and Asia, STATS ChipPAC

7

Figure 2.1: STATS ChipPAC (M) Organization Chart

provides customers with total supply chain solutions tailored to their needs.

Technology development centers are located in California, Arizona and South

Korea. Corporate headquarters are located in Singapore

STATS ChipPAC's 488,000 square foot facility in Kuala Lumpur

provides a full range of integrated test and assembly services. In addition to

being the primary high volume site for BCC (Bump Chip Carrier) packaging

and test, the Malaysian facility specializes in power management technology

with a wide range of discrete power packaging and test services. Its portfolio

includes LFCSP (Lead-frame Chip Scale Packaging) packaging as well as RF

signal testing. The Kuala Lumpur facility features a state of the art automated

product distribution centre and is certified to IS09002, ISO14001 and

ISO/TS16949:2002 quality standards.

The customers of STATS ChipPAC are IBM, Intel, Fujitsu, AMD,

nVIDIA, Fairchild and many more. Almost all of the big company of

semiconductor is STATS ChipPAC customer.

2.4 Quality at STATS ChipPAC

STATS ChipPAC - Malaysia (Kuala Lumpur)

• ISO / TS16949:2002 - May 2004

• SO 9001:2000 - May 2004

• Sony Green Partner - September 2003

• OHSAS 18001:1999 - December 2001

• ISO 14001:1997 - December 1999

8

3.0 IC ASSEMBLY FOL

DEPARTMENT

9

3.0 IC ASSEMBLY FOL DEPARTMENT

3.1 Introduction

IC Assembly is one of the departments that available in STATS ChipPAC

Malaysia. This department involve in dealing with BCC (Bump Chip Carrier),

QFNp (Quad Flat No Lead Punch) and QFNp (Quad Flat No Lead Sawn) IC

packages. There are two main sections in IC Assembly which are Front of Line

(FOL), and End of Line (EOL). For the FOL, this section started from handling

the die bank until the 3rd Opt inspection.

3.2 Process Flow

10

Die Bank

Wafer Thickness (1st)

Wafer Thickness (2nd)

Wafer Detapping

Wafer Back Grind

Wafer Tapping

2nd Optical Inspection

Wafer Saw

Wafer Mount

Coverlay (QFNs)

Die Attach

Wire Bond

Pre Bond Plasma Cleaning(QFNp)

Laser Strip ID Marking

Die Attach Cure

3rd Optical Inspection

Post Bond Plasma

Cleaning(QFNs)

11

3.3 Gold Wire Bonding Machine

The gold wire bonder machine (ex: K&S 8028 Gold Ball Bonding Platform)

was designed to make gold wire interconnections on semiconductor integrated

circuit (IC) devices. The machine makes wire connections by means of a thermo-

sonic ball bonding process that uses heat, force and ultrasonic energy to form an

inter-metallic bond between a gold wire and an aluminized surface on a

semiconductor device.

12

Figure 3.0: IC Assembly FOL Process Flow Chart

The term ‘ball bonding’ refers to the process whereby the leading edge of

each wire (i.e.; the first bond) is melted to form a ball prior to bonding.

This machine consists of SVGA monitor, upper console, microscope, XY

table, Material Handling System (MHS), control panel, lower console, signal tower

and optics assembly.

The XY table (figure 3.2) consists of sliders, mechanical couplings and drive

systems mounted on a large casting. Individual linear servomotors are responsible

for “X” (left-right) and “Y” (front-back) motions. The bond head and optical

systems are mounted on the XY table. During operations, the two servo motors

move them in X and Y axes to target reference points and bond locations. During

13Figure 2.1Wire bonder machine

Figure 3.1: Gold (Ball) Wire Bonding Machine

automatic operation, the servo motors are controlled by bonder software. In

teaching and in manual operation, they are driven by trackball on the operator

control panel.

The bond head (figure 3.3) consists of the transducer/capillary assembly and

Z-drive. A linear servo motor is responsible for the up-down motion of the

transducer/capillary. This motor applies all of the pressure needed to make the bond.

While pressure is applied, ultrasonic energy from the transducer is coupled through

the capillary to promote the formation of the bond between the wire and the work

surface. After the bond is completed, the capillary lifts off of the work surface and

the XY table moves to position the capillary above the second bond. The bond head

moves vertically and horizontally as needed to shape the wire before descending to

make second bond.

The bond head also includes the Electronic Flame-Off (EFO) wand used to

form the wire ball, wire clamps to hold the wire it is being broken loose from

second bond and the mechanism to feed wire from a spool to the capillary.

14

Figure 3.2XY table

The lower console (figure 3.4) of the bonder contains power supply and

distribution systems, PC boards for the bonder, air pressure input filter, disk drives

and cooling systems. The power systems consists of a power cord, power supply

assembly and cabling that connects the power supply outputs to alternating current

(AC) or direct current (DC) powered electrical devices. A hard disk drives that

contains all of the software for the machine operation, device programming and

bonding is mounted in the lower console. The hard disk drives are used primarily

for storage of process programs and machine operating software.

15

Figure 3.3Bond head

Figure 3.4Lower console

For the upper console (figure 3.5), the bonder uses a 2” (51mm) diameter

wire spool that is mounted on the front face of the upper console. A motor turns the

spool to feed wire as needed. Wire feed is controlled by an optical sensor, which

maintains a constant length of wire between the spool and the capillary. When the

gold wire moves away from in front of optical sensor, motor operation is enabled.

The motor is disabled when the wire triggers the sensor or after a minimum duration

feed.

The pneumatic system components mounted in the upper console regulate

and control application of compressed air and vacuum used in the wire feed

systems. Compressed air is also routed to a solenoid valve assembly at the MHS and

to a vacuum pump that creates vacuum to secure leadframe die paddles at the

workholder heat block. Pressure is used in the MHS to maintain gripping force on

leadframes during indexing operations. Other uses of compressed air include X, Y

and Z axes servo motor cooling, stabilization of the bond site video image during

PRS eye point find operations and modulated cooling of bond head components to

limit bond location drift during operations.

16

Figure 3.5Upper console

This machine using 15” colour SVGA monitor (figure 3.6) (for model 8028)

that uses 110 Vac from the main power supply convenience outlet panel. The

monitor operates at 1024 x 768 screen resolution with a 70 Hz screen update rate.

Displays on the monitor screen include virtual “keys” and menus of software

options that can be selected using the trackball, definitions of operator panel

function keys, an area or “window” that contains a graphical representation of the

device being processed and a window that shows live video from the camera.

SVGA screen graphics are generated by the vision system assembly as requested by

the bonder control system and mixed with camera video for display on the monitor.

A charge-coupled device (CCD) video camera system is currently used in

the 8028 vision system (figure 3.7). The camera system consists of one or two

remote camera heads mounted on the optics assembly and a camera control box

mounted beneath the video monitor on the upper console. The vision system

supplies operating power and synchronization signals to the camera system, and the

camera system returns composite video to the vision system, through a single cable

connected to an analog camera port connector on the vision system assembly face

plate (labeled cam 1). Internally, the remote camera head has ½” format CCD

sensor. When compared to cameras used on earlier K&S bonders, this camera

system offers light sensitivity.

17

Figure 3.6Monitor

Other assemblies enclosed within the upper console are the wire feed/bond

integrity test system (BITS) circuit board, which operates the wire feed system and

detects non stick bonds; the EFO electronics that create a high voltage charge at the

bond head EFO wand for ball formation and an upper machine interface board that

provides connection points for upper console cables. The upper machine interface

also has sensor interface circuitry for XY table limit sensors.

User interface components mounted on the lower console include the control

panel assembly and a power control. The control panel assembly consists of a

trackball pointing device with three key switches, an operator’s keypanel, and a

programmer’s keyboard (figure 3.8). The main power is located at the right-front of

the lower console. The operator’s keypanel has keys that move the screen cursor or

X, Y and Z axes of motion, numbered keys for entry of numeric data and twelve

function keys whose function are defined in the graphical user interface (GUI)

display on the video monitor. The QWERTY keyboard, mounted within a drawer

below the operator’s keypanel and trackball, may be used to make mode/function

selections or enter alphanumeric data when required.

18

Figure 3.7: vision system

Communications between the control panel and 8028 control system are

handled by the vision system assembly (mounted in the lower section of the card

rack assembly). At the control panel, the trackball assembly, keyboard and the

trackball key switches (3 keypad assembly) are each connected by short cables to

the operator’s keypanel assembly circuit board. This allows them to be easily

disconnected in the event that any control panel subassembly needs to be replaced.

A single cable carries data from the control panel assembly to the vision system via

an asynchronous serial interface per RS232 and provides operating power for the

control panel components. At the vision system, the control panel communications

19

Figure 3.8Control panel

cable is connected to the serial port connector on the vision system face plate

(labeled COM 1).

The machine software communicates with the operator through a graphical

user interface (GUI) (figure 3.9) displayed on the screen of the video monitor. The

GUI has virtual keys that can be selected to perform machine functions and gain

access to programming, operation and configuration menus. Two “windows” in the

GUI show live bond site video and a graphical representation of the current process

program. Other information is constantly displayed for the operator’s convenience

(MHS heater temperatures, X, Y and Z axes positions, operating prompts, etc.)

Other indicators include the signal light tower and audible alarm (also

mounted on the upper console) that inform the operator of machine status (normal

operation, material equipment, or error condition) during production operations.

Targeting of devices is accomplished by the vision system and optics (figure

3.10). The electronic optical system includes a single or dual magnification optics

(figure 3.11) assembly (objective lens and mirror systems) on which is mounted one

or two solid state video camera head and bond site illuminators (vertical and

oblique). All are mounted on the front Y slide above the bond head. The single

magnification optics assembly is standard on the 8028; the dual magnification/ dual

camera optics assembly is available as an option; two camera head are cabled to the

camera control box, one for each of the two magnification of the bond site; low

20

Figure 3.9GUI

power (2x) and high power (6x).each of the optical paths provides a different

magnification of the bond site; one equal to that of the single magnification optics

(2x or low magnification), the other at a higher magnification (6x or high

magnification). They can also be individually set to different focus height range.

The electronic crosshair in the video window of the GUI display corresponds to the

position of the capillary over the device during bonding operations. Some optical

parameters (lightings, etc) are software adjustable.

21

Figure 3.10:Vision system and optics location

A camera control box (figure 3.11) is mounted on top of the upper console

beneath the video monitor. In a single magnification optics system, a single video

camera head is connected to the box. In dual magnification system, two camera

heads are connected to the control box. The control box sends composite video to

the vision system for image processing and monitor display.

The vision system (figure 3.11) assembly is an independent image

processing system that allows the bonder to operate without user attention by

automatically finding device reference points (“eye points”) before each device is

bonded. The bonder can compensate for variations in die position from package to

package based on the location of the found reference points. The Video Lead

Locator (VLL), a subsystem of the vision system, operates in a similar manner. It

finds the exact taught location of bond positions on the outer leads of each device to

ensure accurate second bond placement.

22

Figure 2.10

Figure 3.11:Vision system and optics

The VLL maintains informations about each taught lead, which includes the

position angle, width and illumination levels. When running in Auto Mode, the

VLL will locate the leads as part of the package alignment process and will return

any lead displacement to the bonder to ensure correct bond placement.

The vision system takes its video image directly from the camera control

box. This makes it easier to adjust lighting for optimum effect. Image are stored,

processed and analyzed by a dedicated processor and memory system which is part

of the vision system. Other machine functions performed by the vision system

include generating monitor graphics and displays, controlling the LED bond site

illuminators and providing an interface for the operator control panel. Video output

of the vision system, which includes colour graphics displays and live bond site

video, is displayed on a video graphics adapter (VGA) monitor mounted at the top

of the upper console assembly. A microscope with zoom capability is provided for

general purpose inspection of the device.

The MHS performs all functions necessary to move and position leadframes

and their magazines during the wire bonding process. The MHS consists of three

major subsystems:

Input magazine handler (handles input magazines)

Workholder

Output magazine handler (handles output magazines)

23

The input magazine handler (figure 3.12) stages several multi slot extruded

aluminium magazines that contain die-bonded leadframes. Multiple magazines are

used to provide sufficient storage capacity of these devices to minimize material

replacement time. Each magazine has a fixed pitch (distance) between leadframe

slots, but the number of magazine pitches between adjacent leadframes stored in the

magazine may vary. Magazine dimensions and slot pitches must be constant in the

same process batch or lot.

Workholder (figure 3.13) contains the mechanisms and assemblies required

to remove leadframes from the input magazine handler, advance (index) them under

the bonding tool, then eject them into the output magazine handler. In addition, the

workholder provides heating (preheat, bond site and post heat zones), locating and

clamping for each device on the leadframe during the bonding operation. The

24

Figure 3.12: Input magazine handler

workholder is capable of locating each device on the leadframe at the bond site with

a high degree of repeatability while providing a high transfer rate to maintain high

throughputs. Three independently programmable heaters are located:

Prior to the bond site (Preheat)

At the bond site (Bond site)

After the bond site (Post heat)

Each heater location has an independent thermocouple and temperature

controller circuit to program, measure and control heater performance. The

temperature controller circuit are all part of a circuit board assembly housed in the

lower console card rack.

The clamping system (part of workholder) registers and clamps the

leadframe at the bond site to ensure a consistent bonding process. Clamping action

requires the coordinated motion of a heated lower support block and a clamping

frame, parts of which are customized for a particular leadframe design.

The output magazine handler (figure 3.14) stages multiple slot extruded

magazines for ejection of bonded devices. Output magazines are initially empty and

accept the wire bonded leadframes into the magazine slots as they are removed from

the workholder.

25

Figure 3.13: Work-holder

The software is organized by “modes” with related or interdependent

procedures grouped together within each mode. Software is menu driven with

options displayed on the video monitor. The keyboard and trackball are used to

respond when appropriate. The monitor will also display error messages in the event

of a system error.

Specification for machine:-

Facility requirement

Electrical

Line voltage: 100, 115, 200, 220, 230, 240 Vac, Single Phase, 50/60Hz (+/-

3Hz)

Power Consumption: 2.0 kVA (nominal)

Compressed Air

Minimum pressure: 65 psi (4.6kg/cm2)

Air Consumption: 65psi

Filtration: 0.3µm

Dew point: 41ºF @65psi (5ºC @ 4.6kg/cm2)

Operating Environment

Temperature

26

Figure 3.14: output magazine handler

59ºF - 86ºF (15ºC - 30ºC)

Atmospheric Pressure

540-810mm Hg

Relative Humidity

30-70% RH (non-condensing)

Material Handling Capability

Leadframe Dimensions

Length: 3.5 to 10.5 in. (90 to 267 mm)

Width : 0.60 to 3.2 in. (15.2 to 81.3mm)

Thickness: 0.004 to 0.035 in. (0.10 to 0.89mm)

Die Pad Down Set: Up to 0.090 in. (2.3mm)

Die Site Pitch: 0.1 to 3.5 in. (2.5 to 90mm)

Lead Pitch (min.): 0.0026 in. (66µm) with 1 mil (25µm) wire

Lead Width (min.): 0.0016 in. (40µm) with 1 mil (25µm) wire

Min. Lead Spacing: 1 mil (25µm)

Magazine Dimensions

Width: 0.7 to 3.75 in. (20 to 95.3mm)

Length: 5.00 to 10.75 in. (127 to 237mm)

Height: 2.0 to 7.0 in. (127 to 273mm)

In this IC Assembly Department, about 5 model of machine (K&S 1488,

K&S 8028, K&S 8028 PPS (Precision Plus Speed), Maxµm Plus and Maxµm

Ultra). Maxµm Ultra is the latest model. The differences between these 5 models

are its bond pad opening and bond pad pitch. Bond pad pitch is distance (pitch)

from center of the pad to the center of adjacent pad. Bond pad opening is distance of

the pad.

Machine Bond Pad Opening Bond Pad Pitch

27

Table 3.0: Difference on Bond Pad Opening & Pitch for K&S & Maxµm Ultra

K&S 1488 80 – 100 µm 80µm - 100µm

K&S 8028 PPS 60 – 80 µm 60 – 70 µm

Maxµm Ultra 40 – 50 µm 40µm - 50µm

3.4 Outfit/Gauge/Equipment/Item

o Outfit:

To enter the factory, one must wear some items as a proper outfit that has

been set by the company’s rules.

Conductive Shoe/heel strap/Shoe cover

28

Figure 3.16: K&S 8028

Figure 3.15: Die/Device

- Must wear to remove ESD (Electro Static Discharge) from body

- Act as grounding for the user body

Name tag

- For personal identification

The proper outfits are important before entering the clean room to make sure

that the body is covered with the ESD protection

Finger cots:

29

Figure 3.17: Heel Strap Figure 3.18: Conductive Shoe

Figure 3.19: Name Tag

- Must be wear on each finger

- To protect for direct electric shock

Jumpsuit:

- Must be wear properly according to do’s and don’ts

- Protect from ESD shock to product and the user

- Included ESD booties that act as groundings.

-

Wrist straps:

30

Figure 3.20: Finger Cots

Figure 3.21: Jumpsuit

- Must be test the effectiveness before doing any work or even nearing

any equipments

- Will be connected to grounding cord to remove ESD from our body

o Equipment/Item:

Kimwipes tissue:

- Use for delicate task

- Did not produce small particle or dust

31

Figure 3.22: Wrist Strap

Figure 3.23: Kimwipes tissue

Hex Key/ Allen Key:

- To loosen/tighten hex screw

Screw Driver:

- To loosen/tighten screw

32

Figure 3.24: Hex Key

Figure 3.25: Screw Driver

Vacuum cleaner:

- Suck all contaminating item or dust from the machine

NSK Grease:

- Applied to the slide for smoother movement

33

Figure 3.26: Vacuum Cleaner

Figure 3.27: NSK Grease

Methanol Chemical

- To clean the stains on parts, machines, and equipment

Multi-meter:

- To check the groundings of machines

34

Figure 3.28: Methanol

Figure 3.29: Multi-meter

Heat Block Base & Heating Element:

- Heat Block Base: to balance and hold the heat block when bonding

process

- Heating Element: to be insert into HBB, heat the heat block

Scope meter:

- Calibrating the Z-encoder voltage

- Connecting the wire to the Z encoder terminal at the cards slot

35

Figure 3.30: (i) small base, (ii) wide base, (iii) heating element

(i) (ii) (iii)

Figure 3.31: Scope meter

Capillary:

- Wire inserted to perform bonding

- Forming ball shape and wire cutting when bonding

- Different characteristic for different color (Appendix A)

o Calibration Gauge:

Calibration gauge is use to help in calculating the measurement to get the

default or program requirement for a machine

36

(1)(2)

(3)

(4)(5)

Figure 3.32: Various types of Capillaries

Figure 3.33: Calibration Gauge

(1) Calibration Heat Block insert gauge

To set the center for the bond head and rails

(2) Bond Force gauge

To be used in bond force calibration and clamp calibration

(3) Clamp gauge

To be used in clamp calibration

(4) Perpendicular gauge

To be use in Z-axis Adjustment calibration

(5) Calibration wafer

To be use in indexer and x-sensor calibration

37

4.0 TRAINING

ACTIVITIES

38

4.0 TRAINING ACTIVITIES

The difficulties along the training period are to get use of the industrial life especially

for the first month but recover from time to time. Another difficulty is photo for some

the activities done cannot be taken because of the rule restriction by the company.

Therefore some of the training activities did not have the appropriate photo.

4.1 Orientation

For every newcomer, they will be enter an orientation to ensure that they can

follow the company rules ad regulation and also have the safety awareness for

themselves, the machines, the products, and the company it-self.

4.1.1 Safety Awareness & Proper Protection Equipment (PPE)

- Give awareness on accident at job, recognize type of PPE, and how to

use & taking care of PPE

- learning all about the safety and proper equipment for different task

- learning the cautions sign that generally use in industry

4.1.2 Electro Static Discharge (ESD) Awareness

- ESD is static charge that transfer from one item to other item

39

Figure 4.0: Various types of PPE

- ESD occur from movement, physical contact, or when item rubbing each

other and separate

- Happen when high static charge flow to low static charge

- General voltage that produce by ESD

Walking across carpet: 1,500 - 35,000 volts

Walking on floor: 250 - 12,000 volts

Worker sit and get up from seat: 700 - 6,000 volts

Pulling sticking tape to be use: 9,000 - 15,000 volts

- ESD can cause damage to the small component (mostly damage occur

with only 50 volts)

- Must always use ESD protection

- ESD protection equipment must be test every time entering the factory

and into the production floor

4.1.3 Data Login & Error Correction (DLEC)

Like a special format on writing the production data and correcting

when errors in data occur.

- Only black ball pen are use and no other pens are allowed

40

Figure 4.1: How ESD produce

Figure 4.2: Testing the ESD protection equipment

- Writing must be clear and no double write on the same side

- Short cut (“) are not allowed

- For error correction, one can only correct by draw a line to the error and

corrected near the error with employee number and date

- The date can only be write by 2 places of day, 3 places of moth (in

English), and 2 places of year (i.e. 02 APR 08)

From the orientation program, I get to learn the way of working in the factory

where I can assume that each company has their own work style and all of it

must be followed properly to make sure that all task are well manage. This is

importance where a well manage company result to healthy economical status.

When all are manage systematically and safely, customer will have the

confidence to trust the company

4.2 Preventive Maintenance

The task given is to do preventive maintenance (PM) especially on gold wire

bonding machine. Preventive maintenance includes cleaning machine areas,

searching for any problem potentials, servicing the machine, repairing major

problem, change any faulty parts, correcting minor errors (Appendix B) and also

calibrating machine to it optimal status. It is quite difficult to the PM works in

379 08701552403APR03

QUANTITY IN : 397

41

Figure 4.3: Incorrect data login

Figure 4.4: correcting errors in data login

the early month because most of the parts of the machine are fragile and

sensitive, and problem can occur if the task does not being handled properly.

- Preventive Maintenance Activities

a) PM is start by checking the machine PM due date in the computer data

or in the printed machine for PM schedule.

b) After founded the machine that need to be PM, I then ask for the

Manufacturing Assistance (MA) to stop the machine from continuing

running the production (If it running the production) and clear the work-

holder area from any lead-frames. The stopped production is transferred

to other machine to make sure that productivity is not largely disturbed.

c) Cleaning:

Machine on PM due date

Stop production & clearing

workholder (MA)

Cleaning

Calibrating

Setup

Test bond

Ready for production (MA)

Data from calibration taken are wrote into Check List(Appendix

C)

42

Figure 4.5: SCM Preventive Maintenance procedures

Cleaning is important to ensure the cleanliness of the machine and to

prevent contamination to the product/device and the gold wire when

bonding process running. Any contaminated process may result to

bonding error (i.e. EFO Open)

The process flow of cleaning is:

The motor stop button are pushed

Acknowledge PM status for the machine at the host computer

(located on each row of machine), and the machine is switch Off

Note: If there are no computer connected to the machine, the

program must be save in to the machine’s hard disk before

switching it Off

The covers for the work-holder, upper-back, and lower-back are

removed.

Previous PM activities include taking out the work-holder to be

service at the PM room. For servicing the work-holder, the

pneumatic 3/2 way solenoid control valve and lead screw that

controlling the indexer movement are removed and separate to

parts to be clean using methanol chemical. Later the parts are

attached back and the work-holder is blown using air gun to

remove particles and dust at every inch of it. The air flow system

of the work-holder is test buy inserting the air gun nozzle into an

air hole and blow. The system must be clear from any blocks or

leaks. After that the work-holder is attached back to the

machine. Current PM does not need to taken the work-holder out

except if problems occur to it.

The whole areas of the machine are vacuumed especially at the

work-holder, inside XY table areas (Bond-head), filters, and, the

power supply. These places area important for making sure the

machine is away for any potential problems (i.e. over heating

due to the filters full of dust, and contamination of the lubricated

parts and gold wire)

43

Any sliding element areas are wipes using special tissue to

remove the old applied grease before applying new one on it.

Grease is important to ensure the smoothness of the slides when

movement happens. It also important to reduce friction that can

cause heat that later produce wears of the slide’s surface. Old

grease are contaminated with dust and other particle and can

resolve to overheat when friction.

Markers from pen on the machine are accidentally happen when

any of the pen users slide the pen on the machine surface. The

markers can be clean using methanol chemical and wipe it of

using tissues. This is to ensure that the machine looks neat and

not messy.

After all cleaning are finished, and the wires and covers are

attached back, the machine is then switched On

d) Calibration:

Calibration is done to make sure that the machine will be working in it

specified measurement. This is to ensure that it can perform in the

optimal or increasing efficiency. Wrong calibration can resolve to

problem for the machine and the production. Thus, each calibration must

be done correctly to prevent any errors or major problems occur.

The calibration procedures can be preformed individually and have no

strict sequence. For the PM, we have done the calibration according

general needs of the machine (begin after removing heat block insert,

clamp insert configure heat block width, detach EFO wand, and wire

removed from capillary)

44

I. Work-holder menu

o Rails

Purpose: to teach front and rear rail home positions

with respect to center of bond in Y axis

Procedures:

Select CALIBRATION>WORK HOLDER>

RAILS

Align horizontal crosshair with front edge of

the heat block insert die cavity. Select OK

Align horizontal crosshair with back edge of

the heat block insert die cavity. Select OK

Remove heat block insert. Select OK. Indexer

rails close.

After cleaning

Configure heat block, remove EFO wand, & Remove

wire from capillary

Calibrate Z-Encoder

using Scope meter (Motor Stop status)

Calibrate Rails,

indexer, x-sensor,

jam detect, &

tucker eject

Calibrate Z-axis

adjustment

Calibrate clamp

Calibrate bond force, USG, EFO

height (Wand

attached back)

Attach heat block insert and

clamp insert

Calibration

finished

Check groundin

g

45

Figure 4.6: SCM Calibration Sequence

Align horizontal crosshair with the back edge

of the notch on the vertical lead frame

stopping surface at rear indexer rail. Select

OK

Bench straight edge against the lead frame

stopping surface at front rail. Align horizontal

crosshair with the straight edge to locate the

lead frame stopping surface. Select OK

o Clamp

Purpose: to set bond plane height

Tool: Clamp calibration gauge

Procedures:

Select CALIBRATION>WORK HOLDER>

CLAMP

Insert clamp calibration gauge near to

capillary position when prompted

Remove clamp calibration gauge

Place heat block insert when prompted. Target

at flat-non cavity area of the heat block and

press OK. The capillary will contact with heat

block to calibrate height

Place clamp insert when prompted. Target at

flat-non cavity area of the clamp and press

OK. The capillary will contact with clamp

block to calibrate height

o Indexer

Purpose: to teach indexer home position with respect

to center of bond in X axis

Tool: calibration wafer

Procedures:

46

Select CALIBRATION>WORK HOLDER>

INDEXER

Align vertical crosshair with left edge of the

heat block die cavity. Select OK

Align vertical crosshair with right edge of the

heat block die cavity. Select OK

Remove the heat block insert. Select OK

Place the calibration wafer on the rail,

benching it against the rear rail and the left

side of the close indexer gripper jaws. Select

OK

Align vertical crosshair with left edge side of

the calibration wafer. Select OK

Remove calibration wafer. Select OK

o X – sensor

Purpose: to teach distance between X registration

sensor and bond site in X axis

Tool: calibration wafer

Procedures:

Select CALIBRATION>WORK HOLDER>

X SENSOR

Align vertical crosshair with left edge of the

heat block die cavity. Select OK

Align vertical crosshair with right edge of the

heat block die cavity. Select OK

Remove the heat block insert. Select OK

Place calibration wafer on top of the X

registration sensor. Select OK.

47

The indexer will pick up the calibration wafer

and place it somewhere on top of the head

block area

Align vertical crosshair with left edge side of

the calibration wafer. Select OK

Remove calibration wafer. Select OK

o Jam Detect

Purpose: calibrate indexer jam detector

Procedures:

Select CALIBRATION>WORK HOLDER>

JAM DETECT

The machine performs the indexer jam control

calibration automatically

When done, a message box is displayed

stating that calibration was successful. Select

OK to accept the calibration result.

o Tucker Eject

Purpose: to teach indexer gripper position where

tucker blade tip is aligned with outside of off-loader

side wall

Procedures:

Select CALIBRATION>WORK HOLDER>

TUCKER EJECT

Observe the displayed Warning, then select

OK

Use the left/right arrow keys on the control

panel to move the index gripper in the X axis

until the right edge of the cut in the tucker

blade in flush with the outside surface of the

output magazine handler side wall. Select OK

48

II. Bond Head menu

o Z-Axis adjustment

Purpose: to set the perpendicular level for the

transducer with the heat block

Tool: perpendicular gauge, bond force gauge (as

weight)

Procedures:

Select CALIBRATION>BOND HEAD> Z-

AXIS ADJUSTMENT

Select Z-axis Alignment. Select Continue

Adjust the position of the transducer so that it

can be calibrated with out problems or

breaking the capillary. Select Continue

Place perpendicular gauge under the

transducer (Y axis position). Measure the

height from both perpendicular peaks using

Shim.

The different of height between peaks must

not exceed 32 mils. Adjust must be done if the

value is exceed.

Select Continue until comes to Z-axis

Adjustment back.

Select back Z-axis Alignment and Select

Continue

Adjust the position of the transducer so that it

can be calibrated with out problems or

breaking the capillary. Select Continue

Place perpendicular gauge under the

transducer (X axis position). Measure the

49

height from both perpendicular peaks using

Shim.

The different of height between peaks must

not exceed 32 mils. Adjust must be done if the

value is exceed.

o Bond force

Purpose: To ensure that actual bond force is equal to

programmed bond force

Tool: Bond force Calibration Gauge

Procedures:

Select CALIBTATION>BOND

HEAD>BOND FORCE

Move the tips of the capillary over the heat

block (not on cavities)

Select Calibrate, Capillary move down to

contact heat block

When prompted, mount bond force

calibration gauge on front of bond head

link. Select Done

Machine calibrates bond force. Result

displayed (scale factor and force used to

lift tool).

Remove weight. Select OK

o Ultra-Sonic Generator (USG)

Purpose: To tune ultrasonic generator output to

resonant frequency of ultrasonic system

Procedures:

Select CALIBRATION>BOND HEAD>USG

The old impedance reading is taken. Select

Calibrate.

50

Wait until the machine finish calibrating. New

impedance reading is taken (the range must be

between 15 to 60 ohm). Select Accept

o Electro Flame-Off (EFO) Height

Purpose: to set bond position where capillary tip is

level with top of EFO wand.

Procedures:

Select CALIBRATION>BOND HEAD> EFO

HEIGHT

The initial height is taken

The bond head is chess to front. Enable Z

chess (press [SHIFT] + [F9])

Perform wand height calibration:

o Press up/down arrow keys on control

panel to align capillary tip level with

EFO wand top surface

o The height must be at height of 270

mils

o Adjust the EFO wand height to be

aligned with the capillary tip. Select

Accept

e) Setup:

Setup is done after the calibration procedures are finished. It is one of

the most important part in PM beside calibration where positioning of

the overlay with the real die/device are involve. The setup need to done

carefully so that the bonding process is correct and to ensure less or zero

waste that will produce. The setup procedures are also almost as the

same as calibration where most setup are according to the machine need.

Normal setup procedures after PM are:

Teaching heat-block position

51

The position of heat block is teach to ensure the center between

front and rear rail, and for the alignment of indexing the lead

frame

o Automatically enter when new program is downloaded or

select PROGRAM>MHS TEACH>TEACH HEAT

BLOCK POSITION

o The heat-block and the clamp must be is Close status

o Chess crosshair to upper left corner at one of clamp dies

cavity. Press B3,B1 (for point 1)

o Same position goes to point 2. Press B3,B1

o For point 3, the die position must be taken symmetrically

with point 1 and 2 die and chess crosshair to its lower

right corner. Press B3,B1

o Select Done

Calibrating crosshair offset

Crosshair offset must be calibrated to make sure that the position

of bonding is as the same as the crosshair current position. Error

in calibration the offset may cause wrong bond or imprecision

bonding at the pad area

o Put dummy into magazine and place them at the pick up

area of the input elevator.

o Press Index button. The lead frame will be positioned

between clamp insert and heat block insert.

o Select CALIBRATION>BOND HEAD>CROSSHAIR

OFFSET

o Position crosshair to any where at lead frame lead area

and ‘Mark’ (B1).

o Chess the center or crosshair with the marked position.

Press ‘Calibrate’ (B3). The value of crosshair offset is

52

shown. The value must be between 400 mils to 420 mils

only. If exceeded, the bond head top must be adjusted.

o Press OK

Teach bond position

This task must be done to ensure that the lead frame is indexed

with the correct position. Incorrect position may cause wrong

bond or failure when bonding.

o Make sure that the lead frame is inside the magazine and

placed at the pick up area.

o Select PROGRAM>MHS TEACH> TEACH BOND

POSITION

o Leaf frame is automatically indexed, and enter the lead

frame position menu.

o Chess the crosshair at the upper left corner (press B1) and

lower right corner symmetrically (Press B1) of the lead

frame that can be viewed at the clamp cavity. This to

center the lead frame and die with the clamp cavity. Press

Done

o Operator point is teach as the same as the previous upper

left corner position. Press B1, OK and Done

o The eye points of the lead frame are teach at the upper

left corner (press B3,OK) and the lower right corner

(press B3, OK) at one of the device/die only. Press Done

Overlay aligning

The overlay must be aligned with the current device so that the

bond head can bond at the right place on the die by following the

overlay position.

o The position of the dummy/production must be at the

right place for bonding

53

o The overlay is shown.

o One of the overlay point at Pad side for device #1 are

centered with the crosshair

o Select DEVICE OPERATION>MORE

SELECTOR>SELECT ALL>DONE>MOVE

o The arrow of the scroll ball must be in the camera view

side. Press B1. A red box appeared at the middle of the

crosshair

o The crosshair is pointed at the same Pad point and the

same device number but only at the real device. The

crosshair is centered at the pad side. Press B1. The

overlay is on top of same device number as it self.

o Edit Reference System selected. Press B1 (arrow inside

camera view side). The position of Pad is aligned

according to program specification. Eye points are taught

for the pads. Lighting at the pads is also being taught too.

o Crosshair is chassed at one of the Leads point.

o Select Edit Reference System. Press B1 (arrow inside

camera view side). The position of Leads is aligned

according to program specification. Eye points are taught

for the Leads. Lighting at the pads is also being taught

too.

o Align reference selected, Align entire package.

o

f) Test Bond:

Test bond is done after the overlay finished align with the current device.

It is best if done at the dummy to make sure that the bonding is correct

before the production is ran. At the test bond, crosshair offset, bond

position and ball shape will be corrected. Before the test started, gold

54

wire must be inserted through the tensioner, wire clamp and capillary

and bond off first.

o AUTO is selected. Press Run/Stop

o The bonds at the pads are check to ensure that it is hundred

percent inside the pad box.

o Crosshair offset must be done if the bond does not hundred

percent in side the pads

o The test bond is ran again and again until all the side get accurate

bonding and no other problems occurs

g) Ready for Production

After all calibration and setup are completed, the program is the checked

at the host computer to ensure that the specifications are followed. The

machine is ready for continuing running the production.

55

Figure 4.7: Correct Bond. 100% inside pads

Figure 4.8: Incorrect Bond or misplace. Due to wrong crosshair

offset

4.3 Additional tasks

Helping engineer with newly arrived machine

New arrived machine must be handled carefully to prevent for any

damages to the machine

Set grounding to most ungrounded machines

Machine that supplied with electricity need to be ground to prevent from

damaging the machine of harming the user safety is short circuit happen

Making pneumatic connection from supply to machine

The gold bonding machine also uses the pneumatic system. For the

machine that have problem in it air system or new machine, the

connection must be made so that the machine can he used.

Repair wiring & PM ISP 3000 Inspection machine

56

Figure 4.9: New arrived machine to be sent to production line

Figure 4.10: ISP 3000 Inspection machine (one a year PM)

The machine is placed at the 3rd opt section. The PM work not only

servicing gold wire bonder machine but also other machine that closely

connected with the gold wire bonder

5.0 CONCLUSION

57

5.0 CONCLUSION

Through out the twenty weeks of industrial training in STATS ChipPAC (M) Sdn.

Bhd., lots of things have been learnt and it was a great experience. The knowledge in

the real industries is gained and useful in the future especially after the graduation.

From the training experience, trainee will get use to the way of working in the

industries where it was a difference then the life at campus. More type of person they

will encounter and for the training experience that they manage to adjust themselves

when working someday. This is important to prevent culture shock that may bring

negative influents to their life. A successful blender can result to harmony partnership

with the other workers and that can help the company environment to be the best place

for work.

Training in STATS ChipPAC can gain lots of knowledge especially about new

machine that did not have in the university. The knowledge include on the purpose of

the machine, where does it made, cautions on handling, the important of maintenance

and many more. All of this knowledge not only for the machine that use in the factory,

but can be applied to other machine that can be found in other industries or even in the

university.

The important of maintenance is one of the useful knowledge to be gained.

Maintenance plays higher role on maintaining the efficiency of a machine. Machine that

does not go through maintenance can resolve to slow productivity or damaged. All parts

must be ensured it effectiveness so the efficiency will be increase. Maintenance can also

be applied to other then machine, even human life it self.

Most of the training activities do follow the underlying industrial training objective

where Manufacturing / production process and or its optimization process are learnt for

58

the maintenance activities to ensure the efficiency of the machine. Maintenance and

repair of machineries or equipments is also gained directly. For Product testing and

quality control, this is the knowledge that is gained after each time finishing the

preventive maintenance.

SUGGESTIONS FOR FINAL YEAR PROJECT

For final year project, I would like to create a robot arm to pick and place the thing from

one place to another. Sometimes the thing is too heavy for human to lift it. So, robot arm

are useful in this situation. The robot arm will suitable for production environment.

The robot arm will sense the thing, pick up the pieces and grab it. The arm will holding the

piece, make a move from right to left and vice versa and put it in the right place. The arm

will consist electronics, mechanical, controls and programming. The sensors and materials

to build the arm are one of the important parts.

The arm is about basic robotic sensing and locomotion principles and controlling the arm. It

can be command to grab, release, lift, lower, rotate wrist and pilot sideway 180 degrees.

The arm provides five axes of motion.

1. Base Right / Left 180 degrees

2. Shoulder 90 degrees

3. Elbow 90 degrees

4. Wrist rotate counter clockwise and clockwise 180 degrees

5. Gripper open and close

59

60