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5 th International Workshop on New Photon-Detectors November 27 th 29 th 2018, University of Tokyo Alessandro Razeto -- Laboratori Nazionali del Gran Sasso

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Page 1: International Workshop on New Photon-Detectors November 27 th … · 2018-11-27 · SPE recharge time SiPM signal shape . 16 D. Marano et al., IEEE TNS 11,11,13 SPE recharge time

5th International Workshop on New Photon-Detectors

November 27th – 29th 2018, University of Tokyo

Alessandro Razeto -- Laboratori Nazionali del Gran Sasso

Page 2: International Workshop on New Photon-Detectors November 27 th … · 2018-11-27 · SPE recharge time SiPM signal shape . 16 D. Marano et al., IEEE TNS 11,11,13 SPE recharge time

Several particle detectors use liquified noble gasses as target LXe = 165 K -- LAr = 87 K -- LNe = 27 K

Liquified noble gasses shows Very high light yield O(10 pe/keV)

Very high electron livetime O(10 ms)

Beam experiments: Neutrino Long and Short baseline experiments at FNAL: DUNE/ICARUS

MEG/MEG-II

Low Background experiments: Dark Matter detectors: DarkSide-20k, Xenon-nT

Double beta detectors: NEXO

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Page 3: International Workshop on New Photon-Detectors November 27 th … · 2018-11-27 · SPE recharge time SiPM signal shape . 16 D. Marano et al., IEEE TNS 11,11,13 SPE recharge time

SiPMs are working down to the freeze-out at ~ 25 K Their compact size and no HV simplify the design of new detectors

High PDE and high granularity offers uncharted possibilies for segmented detectors (CALOCUBE) On the other hand for large detectors the small size of SiPMs compared to PMTs is a

problem

The cryogenic read-out poses a number of problems

Optimize connection schemes

Development of cryo-electronics Number of signal extractions

Dissipated power

Radiopurity of components and circuits

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• Dark noise reduction by more than 7

orders of magnitude

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• Increased afterpulse

• Lower gain operation

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• Dark noise reduction by more than 7

orders of magnitude

NUV-HD-

SF

At a given temperature and overvoltage higher Rq -> longer recharge time -> lower triggering probability in the same cell -> lower afterpulse probability

-> lower divergence probability

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• Dark noise reduction by more than 7

orders of magnitude

• Increased afterpulse

• Lower gain operation

• For poly-silicon based Rq

• Rq strongly depends on T

• Pulse shape changes

• longer recharge time

NUV-HD-

SF

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• Dark noise reduction by more than 7

orders of magnitude

• Smaller peak current

• Increased afterpulse

• Lower gain operation NUV-HD-

SF

• For poly-silicon based Rq

• Rq strongly depends on T

• Pulse shape changes

• longer recharge time

F. Acerbi et al., IEEE TED 64,2,17

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Extended Gain SiPM for Cryogenic Application

from FBK

Extended Overvoltage at 77 K

> 14 V

Low afterpulse

Page 10: International Workshop on New Photon-Detectors November 27 th … · 2018-11-27 · SPE recharge time SiPM signal shape . 16 D. Marano et al., IEEE TNS 11,11,13 SPE recharge time

The increased stability at cryogenic temperarure can be beneficial to:

Increse the gain or

Decrease the recharge time or

Decrease the DCR

FBK produced several SiPM variants for DarkSide Extensive tests are ongoing to best match:

The experiment specifications (PDE/DCR/AP/DiCT)

The coupling with the cryogenic FEB

10

DarkSide-20k

Photo Detector Module

specifications:

• Surface = 25 cm2

• PDE > 45 % @ 420 nm

• DCR = 0.08 cps/mm2

• TNC < 40%

• Noise Hits ~ DCR

• Timing ~ 10 ns

• Dynamic range > 50 pe

• Total power < 250 mW

SNR > 8 BW ~ 30

MHz

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τ = 60-70 ns DCR = 0.2 cps/mm2

AP = 21%

87 K

25 μm

1-2 MΩ

7 VoV

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τ = 500 ns

AP = 0.7%

87 K

25 μm

10 MΩ

9 VoV

DCR = 0.2 cps/mm2

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D. Marano et al., IEEE TNS 11,11,13

SPE recharge time

S

iPM

sig

na

l sh

ap

e

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D. Marano et al., IEEE TNS 11,11,13

SPE recharge time

S

iPM

sig

na

l sh

ap

e

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D. Marano et al., IEEE TNS 11,11,13

SPE recharge time

The knowledge of the signal shape is important to

optimize connection scheme and amplifier design Long recharge times are preferred for charge amplifiers Short recharge times are preferred for trans-impedance

amplifiers

Rq ~ 1-10 MΩ

RL ~ 10-50 Ω

N ~ 1 - 100 k

FC ~ 5-10

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SiPM passive ganging allows to connect more SiPMs with the same read-

out channel In parallel: increasing the capacitance

or

In series: reducing the effective gain

MEG-II uses a hybrid passive ganging mode

Signal in series

Bias in parallel

Signal then extracted to room temperature This allows fast recovery time

Small number of channels

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Assuming:

N= 40k

Rq = 1 MΩ

Rs = 50 Ω

Cd = 30 fF

F = 5

τd2 = 30 ns

τi2 p ≈ 120 ns

τi2 S ≈ 20ns

τ ≈ 135 ns

τ ≈ 25 ns

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Bias uniformity is provided by the resistor network

Auto-balancing does not work at cryogenic temperature The dark rate is too low

Leackage current would dominate the divider

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Static SiPM model

The static model defines the noise gain of the

connected amplifier

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D. Marano et al., IEEE TNS 11,11,13

For FBK at 77 K:

• Cd ~ 20 – 100 fF

• Rq ~ 2 – 10 MΩ

Transition frequencies

are size independent

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Cd/Rd with impedance analyzer

FBK NUV-HD -- 1 cm2 SiPM

d

CS

IPM

] R

SIP

M [Ω

]

V = VBD

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Rq significantly increases in LN2

CS

IPM

] R

SIP

M [Ω

]

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Page 25: International Workshop on New Photon-Detectors November 27 th … · 2018-11-27 · SPE recharge time SiPM signal shape . 16 D. Marano et al., IEEE TNS 11,11,13 SPE recharge time

Several effects contribute to the noise budget The thermal noise of the resistors in the SiPM: eJ = 0.1 – 0.6 nV √Hz

The voltage noise of the amplifier: en = 0.2 - 5 nV √Hz

The current noise of the amplifier: in = 0.001 – 1 pA √Hz

Considering a BW of 50 MHz the current noise is negligible

106 e- in 500 ns (τ) -> current of 300 nA

1 pA * √50 MHz -> noise current of 7 nA

The voltage noises are amplified by the noise gain

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BW & output noise spectrum depends on the SiPM static model

4 regions can be identified

F << : intrinsic unamplified en

F << : en + eT amplified by

F > : en + eT amplified by (if present)

Natural cut-off of the amplifier

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BW & output noise spectrum depends on the SiPM static model

4 regions can be identified

F << : intrinsic unamplified en

F << : en + eT amplified by

F > : en + eT amplified by (if present)

Natural cut-off of the amplifier

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BW & output noise spectrum depends on the SiPM static model

4 regions can be identified

F << : intrinsic unamplified en

F << : en + eT amplified by

F > : en + eT amplified by (if present)

Natural cut-off of the amplifier

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BW & output noise spectrum depends on the SiPM static model

4 regions can be identified

F << : intrinsic unamplified en

F << : en + eT amplified by

F > : en + eT amplified by (if present)

Natural cut-off of the amplifier

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BW & output noise spectrum depends on the SiPM static model

4 regions can be identified

F << : intrinsic unamplified en

F << : en + eT amplified by

F > : en + eT amplified by (if present)

Natural cut-off of the amplifier

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F [Hz]

F [Hz]

For some SiPM classes Rq nullifies at few MHz

In this case Rs avoid the NG divergence at

Nois

e

Model

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• Most producers are distributing heterojunction BJT based amplifiers – For high bandwidth applications GHz

– For very low noise applications sub-nV/√Hz

• HBTs are great signal amplifiers at cryogenic temperature – They are BJT -> very low en

– Low 1/f noise

– Noise and BW are better at cryogenic temperature

For fast TIA amplifiers en is more important than in

FET technology typically

• en ~ 4 nV/√Hz & in ~ 10 fA/√Hz

FET technology may not be the best choice

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LMH6629 from TI:

• Works down to 40 K

• Stable for |Av| > 10

• Very high bandwidth

• Increasing at low T

• ~0.2 pF in Fb path

• Very low noise

• Max bias 5 V

• 60 – 80 mW

• Pout1dB = 16 dBm (3.8 Vpp)

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Where:

• Req accounts for all resistors

• en is modeled as a Johnson source

• in is modeled as Shotky noise of |ib| + |io|

• N is the output noise density @ 1MHz

The fit reproduces the data at better

than 2.5 %

The voltage noise density of the LMH6629 is equivalent to a 20 Ω resistor

constant

M D’Incecco et al., IEEE TNS 65,4,18

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Standard Transimpedance design except:

• Few tweaks for stabilization

• R+ , R-, Ci

• Cf is due to parasitic effects (~0.2 pF)

• The series resistor Rs

RSIPM

CSIPM

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5x5 mm @ 300K SNR = 27.7 @ 5 VoV (1.3 106)

1x1 cm² @ 77K G = 106

SNR = 18

1PE resolution: 0.06

1x1 cm² & G = 106

1x1 cm²

RSIPM

CSIPM

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1 cm2 @ 77 K:

Using matched filter

Gain 106

SNR = 30 SNR = 18

1PE resolution: 0.06

With standard NUV-HD-LF

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1 cm2 @ 77 K:

Using matched filter

Gain 106

Jitter = 1 ns

SNR = 30

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10% of noise

1 cm2 @ 77 K:

Rn = 20 Ω

Rs = 20 Ω

Req = 60 Ω

Rf = 3.9 k Ω

no = -141 dBm

41 M D’Incecco et al., IEEE TNS 65,4,18

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• To read 6 cm2 with the same amplifier a

hybrid ganging solution is used

• Virtual ground summing does not change

the shape of the signal

• This design increases the capacitance seen by

the TIA only by 50%

• For cryogenic use a precision voltage divider is

required • Otherwise the voltage division will be defined by the leakage current

Req

Ceq

OPA838

Four 6 cm2 channels are summed with an active adder

6 x 1 cm2 SiPM

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PRELIMINARY

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Design similar to DarkSide

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Design similar to DarkSide

OPA656

FET-Based

en = 7 nV/√Hz (300 K)

~ 3 kΩ

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Interest on cryogenic readout is increasing

We proved that large SiPM arrays O(25 cm2) can be read with outstanding SNR and timing performances SNR > 20 & timing down to few ns

Shortly we will test fast FBK SiPMs tiles which should increase further the SNR

The cryogenic electronics built on commercial components ready available Using radiopure components

Groups are starting to develop cryogenic capable integrated solutions INFN-Torino for DarkSide

NEXO 3D development

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More frequent at low overvoltage

Very recently we discovered some shorts O(10 s) bursts with up to many thousands PE

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Matched filter is the optimal linear filter to extract a signal of

know shape in the presence of additive stochastic noise.

The filtered signal is obtained by cross-correlating the raw

waveform for the signal template

The output is symmetric around the peak, giving a better

identification of the timing.

We successfully tested an online FPGA based

implementation

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Req

Ceq

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6 cm2 @ 77 K:

Rn = 20 Ω

Rs = 60 Ω

Req = 60 Ω

Rf = 10 k Ω

no = -127 dBm

Req

Ceq

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15% of noise 6 cm2 @ 77 K:

Rn = 20 Ω

Rs = 60 Ω

Req = 60 Ω

Rf = 10 k Ω

no = -127 dBm

Req

Ceq

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6 cm2 @ 77 K:

Rn = 20 Ω

Rs = 60 Ω

Req = 60 Ω

Rf = 10 k Ω

no = -127 dBm

6 x 1 cm2 independent readout (with analog sum)

6/√6 ~ 2 times better Req

Ceq

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6 cm2 @ 77 K:

Rn = 20 Ω

Rs = 60 Ω

Req = 60 Ω

Rf = 10 k Ω

no = -127 dBm

Req

Ceq

Open space to integration? It depends

For simple TIA with MOS technology

Typical en ~ 2 nV/√Hz <-> Rn(MOS) ~ 1 kΩ

For smarter designs work in progress

(see slides from Manuel Rolo)

6 x 1 cm2 independent readout (with analog sum)

6/√6 ~ 2 times better