Intel 2014 OverviewMariusz Jadwiszczok & Patrik StaafEMEA Sales and Marketing Group

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Intel’s Mission

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Utilize the power of Moore’s Law to bring smart, connected devices to

every person on earth.

Intel’s VisionIf it is smart and connected, it is best with Intel.

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Data Center Client Ultra-Mobile Wearables/IoT

ASMO

EMEA

PRC

APJ

>75% of Business is outside the U.S.*

*Business defined as end market consumption based on units sold

Geographies

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Hi-K Metal Gate

Strained Silicon

3D Transistors

65 nm 45 nm 32 nm 22 nm 14 nm 10 nm 7 nm90 nm

Enabling new devices with higher functionality and complexity while

controlling power, cost, and size

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Predictable Silicon Track Record

Executing toMoore’s Law

Leading Edge Process Technology

* Forecast

Transistor Performance/ Generation

32nm45nm

1x

0.1x

0.01x

0.001x

65nm 22nmL

ow

er

Tra

nsi

sto

r L

ea

ka

ge

Higher Transistor Performance (Switching Speed)

14nm*

Mobile Always-on Circuits

Client Computing

Mobile Computing

Server Computing

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Network

Storage

Software

ServersEnterprise IT Cloud Service

ProvidersCommunication

Service ProvidersTechnical Computing

Data Center GroupDefining and leading an open data center, cloud computing, and connected systems infrastructure that will connect and enrich the lives of every person on earth through

seamless and pervasive computing.

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PC Client GroupWin the Hearts of Users by Creating and Bringing to Market

the Next Generation of Personal Computing Experiences

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Powering the next generation of tablets, smartphones, feature phones and communication solutions

Mobile and Communications Group

* Other names and brands may be claimed as the property of others.

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New Devices Group

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Deliver groundbreaking new device technologies and platforms that inspire and create the best human interaction to our virtual and physical worlds

Smart Devices Platforms for Creators

Internet of Things Group

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Lead the industry in transforming businesses and the way we live by makingit simple to create exciting, new IoT solutions

GATEWAY

NETWORKINFRASTRUCTURE

DATA CENTER/ CLOUD

THINGS

7 YEARS

SILICON, SOFTWARE AND SECURITY

SCALABILITY

Devices that connect to the Internetintegrating greater compute capabilitiesusing data analytics to extract information

THE INTERNET OF

THINGS:

Cloud API Services

Client Software Platforms

Intel Software & Services GroupSSG enhances computing and connectivity for Intel Architecture across the

software ecosystem and through our software products and services.

NetworkInfrastructure

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Cloud and Data Center Products

Intel Developer Zone

* Other names and brands may be claimed as the property of others.

Deliver breakthrough innovations to fuel Intel’s growth and

technology leadership

INTEL LABSCOLLABORATE FOR RESULTS

UNIVERSITIES GOVERNMENTS INDUSTRY

KEY RESEARCH FOCUS AREAS

USEREXPERIENCE

ARCHITECTURE AND DESIGN

SYSTEMS AND SOFTWARE

SECURITY AND PRIVACY

INTEGRATED COMPUTING

STRATEGY, PLANNING and COLLABORATION

INTEL LABS EUROPE

Sustainable

Intelligent Systems

INTEL LABS CHINAChina Tech Ecosystem

ADDITIONAL ORGANIZATIONS

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Making and managing financially attractive investments in support of Intel’s strategic objectives

STRATEGIC FINANCIAL

Intel Capital

1,339 Companies • US $11B+ Invested55 Countries • 344 M&A Transactions • 206 IPOs

1414

Capital

Intel® EducationEmpowering Youth. Transforming Communities.

150M Students Learning with Technology

10M Teachers Empowered with Professional Development

7M Students in Affiliated Science Competitions

4M Employee Volunteer Hours for Education

$100M Annual Investmentto Improve Education in

100 Countries

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Embedded:Internet of Things,

Industrial & F.A.,Retail, Energy, Transport

and more…

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Configurable TDP / Low Power Mode (cTDP/LPM)

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- Starting from Haswell (Broadwell & Skylake also enabled)

- Not for battery saving – it’s about thermals

- Also affects Turbo modes

- LPM does processor off-lining or enables minimumfrequency (depends on workload)

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Broadwell

all 14-nm technology

Wearables, start with Edison

Intel

Expansion Boards

Partner

Expansion BoardsBuilt to Order

Expansion Boards

https://www.sparkfun.com/categories/272

Intel Quark (Galileo)

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- Processor UnCore

- DDR3 memory controller

- Up to 2GB @ 800MTs

- ECC-On-Chip Option

- Embedded 512KB SRAM

- Legacy Block

- PC compatible IO, APICs,RTC, etc.

- 20MHz Legacy SPI for boot code

- Low cost 5-pin JTAG Port

- Industry Standard I/O Hardware

- 2 - x1 PCIe Gen 2*

- 2 - 10/100Mb Ethernet MACs

- 2 - USB2 host ports (EHCI, OHCI)

- 2 - HS UART controller

- 2 – 25MHz SPI ports for peripherals

- 1 – USB2 HS Device port

- 1 - SD/SDIO/eMMC interface

- 1 – I2C/GPIO Host controller

- 16 - GPIOs w prog interrupts

- Industry Standard Software Support

- Standard Compiler Support

- Pentium ISA Compatibility (.586)

- Runs unmodified Linux Kernels (v3.8+)

- Yocto based distribution

- Validated w WR IDP 2.0 (Linux & VxWorks)

- Open Source UEFI EDK II

- GRUB boot loader support

- Open OCD Debugging support

- Compliant with PCIe, USB, ACPI standards

- Thermals

- TDP = 1.9W Extended temp (-40 to +85 C)

- TDP = 2.2W Commercial Temp: 0 – 70°C

- Programmable Thermal sensor

- Electricals:

- Single xtal for internal/external clocks

- Enabled Single std external VR solution

- Physical

- Package size 15x15mm

- 393 Pin, FC BGA bare die

- 0.593 Ball Pitch

- Enables FR4 SFF Board

- Security

- Secure Boot Technology Option

- Supervisory Mode Execution Protection

- Secure Recovery for UEFI FW

- Secure Remote Upgrade w/ WR IDP 2.0

- Intel® Quark™ Processor Core

- Single Quark CPU Core, Single Thread

- 32 bit, x86, @ 400MHz

- 16KB L1

- 1.25 DMIPs/MHz

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mSATA

M.2

2.5” SATA

Phi co-proc

Network (10/25/40/100G)

Core

Atom

Wireless

WiFi / BT

3G / LTE

Quark and Edison

Xeon 1S, 2S, 4S, …

NVMe / SATA

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Back Up

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Production MI Gateways are ready for the end customer!

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OEM gives image to ODM to load onto GW’s.

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From Development to Production: MI Gateway

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WRS creates BSP3

Intel qualifies HW design & BSP

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ODM selects design based on

MI spec

4*

OEM buys a production DK

(from Intel or ODM) to build image & get distribution rights

5*

OEM gets IDP release w/support of

target ODM HW & builds image

ODM creates BSP

OR

4* Qualifications: SK100 is needed by ODM if they want to produce their own dev kit. DK50 is NOT production ready. Must use DK100, DK200 or qualified ODM dev kit.5* Note: the “Binary” image includes OS, middleware & OEM-specific value-add app all in one single image.

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ODM purchases MI-specific SoC (w/ rights to

distribute image)

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ODM builds MI GWs and loads image on

them

Competitive Analysis Key Results

Key Findings:

• Moon Island positioned well in all five categories vs. competition

• Crowded industry with solutions ranging in features and price

• Low end offerings <$100 with basic encryption to pass through data

• High end offerings with router like functionality >$1000

Key Moon Island Differentiators:

• Comprehensive security features

• IA stability & scalability

• Development environment with open platform

43*Other names and brands may be claimed as the property of others.

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v2.0(Shipping now)

v2.1(2014)

Targeted 3.0+ Features(2015+)

Ecosystem and3rd Party Support

Development Tools

Data Storage

Analytics

Predictive Maintenance

EMS-IBM

Energy Services

Eurotech

End Point Device Manageability

AT&T

Securityand

Manageability

White Listing

Read/Write Control

Web interface

OMA-DM, TR-069

UEFI Secure Boot

Cloud-based manageability

Pre-loaded and Validated Wind River EMS agent

EMS and McAfee (MEC)

White List

Read/Write Control

Enhanced Security

Device Attestation

Deep Packet Inspection

UX Getting Started Guides Quick Start Guides Include out-of-box usages with Dev Kits

Protocols MQTT, SSH, ZigBee, etc. Same as v2.0 Expanded communication: CDMA + LTE

Wireless Hart, 6LoWPan, EnOcean

HW / OS

Wind River Linux 32bit

Wind River IDP

Intel® Quark SoC

Intel® Atom™ Processor

eMMC Support Intel® Core Processor

Virtualization (legacy app support)

Wind River OS

64bit Support (Atom, Core)

VXworks RTOS

Intel® Gateways for IoT Roadmap

All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice *Other names and brands may be claimed as the property of others.

Connectivity

Deve

lop

me

nt E

nviro

nm

ent

Intel BSP: Board and Modules (Intel® Quark™ SoC, Intel® Atom™ SoC)

Linux* 5.0.1

Ecosystem

Apps &

Services

SI/ITOs,

Customers

Manageability SecurityCloud

Connector

OMA DM

TR-069

Web Config

OpenSSL* Library

SRM Signing Tool

Certificate Management

Secure Boot

Application Integrity Monitor

Application Resource Control

Secure Package

Management

Encrypted Storage

McAfee* Embedded

Control

Intel Gateways Solutions for IoT Software

Third Party

2G/3G/4G

Bluetooth*

Ethernet

Zigbee*† Stack

Serial / USB

VPN

WiFi Access Point

MQTT

Lua*

Java*

OSGi*

McAfee*

Embedded

Control

Runtime

Environment

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All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.*Other names and brands may be claimed as the property of others. †Enabled by third party hardware,

History of IntelBack in 1968, two scientists, Robert Noyce and Gordon Moore, founded

Intel with a vision for semiconductor memory products. By 1971, they had introduced the world’s first microprocessor. Since then, Intel has established a heritage of innovation that continues to

expand the reach and promise of computing while advancing the ways people work and live worldwide.

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Intel Corporation The World’s Largest Semiconductor Manufacturer

• Leading Manufacturer of Computer, Networking & Communications Products

• Founded by Gordon Moore and Robert Noyce in 1968

• Headquartered in Santa Clara, California

• $52.7B in Annual Revenues - 25+ Consecutive Years of Positive Net Income

• 170 Sites in 66 Countries

• Over 107,000 Employees – 84,600 technical roles, 10,200 Masters in Science, 5,400 PhDs, 4,000 MBAs

• Named one of the Top Ten Most Valuable Brands in the World by Interbrand

• Ranked #42 on Fortune’s World’s Most Admired Companies

• Largest Voluntary Purchaser of Green Power in the United States for 6 years in a row

• Invests $100 Million Each Year in Education Across More than 100 Countries

• 4 Million Hours of Volunteer Service toward improving education over the past decade

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Intel’s Advantage

Packaging

Software

Intel Architecture Product Design

Manufacturing

Co-Optimized Process & ProductCo-Optimized Architecture & Software

Best Performance, Power, SecurityRapid Product Ramp

Process Technology

Common

TOOLSCommon

GOALS

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Fab and Assembly / Test Sites

IrelandOregon

Arizona

New Mexico

Massachusetts

Costa Rica

Chengdu

Vietnam

PenangKulim

Dalian

Israel

Wafer Fabs

Assembly/Test

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Intel® Processors

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QUARKQUARK

World’s First Conflict-Free Microprocessors1

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TANTALUMTUNGSTEN

TIN GOLD

1 Intel has manufactured the world’s first commercially available “conflict-free” processors. “Conflict-free” means “DRC conflict-free”, which is defined by the Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.

What are Conflict Minerals?Conflict Minerals are metals that come

from the Democratic Republic of Congo (DRC), a place where violent militias and

rebel groups control trade, exploit workers, and finance violence.

What has Intel done?Intel, along with partners, created an

audit and verification system that supports responsible sourcing of minerals from the DRC and the

pursuit of conflict-free supply chains.

Innovation for the Planet

Energy Efficient ComputingNext billion PCs and servers will consume HALF the

energy and deliver 17X the compute capacity(2007-2014) Source: Intel

Eco Technology InnovationTechnology innovation is fundamental to finding

solutions to the world’s environmental challenges

Pursuing a Gentler FootprintLargest voluntary purchaser of “green” power in the U.S.

for 6 years in a row*

*According to EPA Green Power Program ratings

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SSDs – from datacenter to consumer, all FFs

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AMT implementation

CPT

LAN

CPU/iGFXIMC

DDR3

PEG

LAN

SMBusPCIe

SPI FLASH

NVM

SPISusWell

DDR3

Sideband Signals

Embedded Keyboard Controller (EC)

Embedded Keyboard Controller (EC)

LAN

Intel® ME

ME+ ME System

SPISPI

LAN

DISPLAY

SRAM

- Intel® Ethernet controller

- Intel® Chipset

- Embedded controller or SIO

- Additional Power Wells

(for OOB ops, V3.3M and V1.1M)

- Enough SPI Flash to store Intel®

Management Engine Firmware

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Web UI

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VNC (graph KVM)

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VNC (text and BIOS)

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Serial console(text, commands)