intelligence augmentation in high-tech manufacturing · industry 1.0 mechanical production powered...
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Intelligence Augmentation in High-Tech Manufacturing
Ahmer Srivastava, Director of AnalyticsHDD Wafer Operations
October 2017
Big Data Analytics & Smart Manufacturing: Only if it were that easy…
Safe Harbor | Disclaimers
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• Broad storage portfolio, including HDDs, SSDs, embedded and removable flash memory, and storage-related systems
• Vertically integrated business model to maximize operational efficiency
• Consistent profitable performance, strong free cash flow
~72BTotal Addressable
Market (TAM)*
13,500+Total Issued Patents,
Worldwide
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A Global Leader in Storage Technology
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A Global Leader in Storage Technology
11/14/2017 6©2017 Western Digital Corporation or its affiliates. All rights reserved.
Innovation is Enabling Rapid Rate of Data Generation
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Exponential Growth in Data Generated
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Delivering the Possibilities of Data
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Anatomy of a Hard Disk Drive (HDD)
Head Stack Assembly
Disk
Spindle Motor
Flex Circuit & Pre-amp Device
Base Machined Casting
Voice Coil Magnet
PCBA & Electronics
Air Filter
Load & Unload Casting
Internally Manufactured
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Anatomy of a Hard Disk Drive (HDD)Disk Clamp
Top Disk
Bottom Disk
Spacer
TopVCM
Head Stack Assembly
BottomVCM
Ramp
Top Cover
Motor BaseAssembly
Latch
Recirc Filter
Read-Write Head on Head Gimbal Assembly
Casting • Forging • Machining •
Stamping • Molding • SMT •
Semiconductor • Substrates •
Epoxies & special adhesives •
Rare earths • High precision assembly
Internally Manufactured
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Hard Disk Drive: A Very Complex Piece of HardwareDEALING WITH COMPLEXITY
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Imagine one hair sliced into 17000 pieces. Each piece is ~6nm wide.
Assuming, head flies over the disk at a height of <10 nm.
No asperities allowed above ~6nm glide height - one asperity rejects the surface!
The relative fly height of the head and flatness of the disk media surface is equivalent to:
Flying from SF to NY at a height of <1m without contact
reference: Eric Champion, Western Digital, circa 2014
Reader Sensor
Air Bearing Surface (ABS) Writer Main Pole
Wa
fer
Pro
ce
ss
De
vic
e S
tac
k B
uil
dMagnetic Head Fabrication. 3-Dimensional, Complex Nanoscale Fabrication
Nanoscale 3D fabrication process requiring tight tolerance controls
Long processing time, delayed feedback
Material layers down to 3-4 atoms thick, requiring high precision
Functional geometries <30nm
Final device structure must withstand severe mechanical stress
z
x
y
Perspective: Individual Magnetic Heads on a Dime
WAFER MAGNETIC HEAD (DEVICE)
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6 Decades of Innovations – Phenomenal Scaling!HOW DO WE SURVIVE?
IBM RAMAC(first HDD)
CAPACITY
12 TB
FORMAT
8 disks 3.5”
AREAL DENSITY
864 Gbit/sqin
DATA RATE
12 Gb/s
POWER
~10 W
COST/MB
<$0.000032
Ultrastar HE12
(latest HDD)
2016
2.4M xincrease
>99.9%smaller
432M xdensity
80K xfaster
99.6%less power
1956
CAPACITY
5 MB
FORMAT
50 disks 24”
AREAL DENSITY
2 Kbit/sqin
DATA RATE
150 Kb/s
POWER
2374 W
COST/MB
$10,0001x 108
cost improvement
1 source: anandtech2 source: website©2017 Western Digital Corporation or affiliates. All rights reserved.
Operational Realities with Increasing Product Complexity in Manufacturing WHY DO WE NEED TO INVEST?
OPERATIONS REALITIES• Long total cycle times• Large number of permutations• Global manufacturing footprint• Leading edge technology• Increasing product complexity• High unit volumes
BUSINESS DRIVERS• Cost reductions
• Quality improvements
• Improving asset utilization
• Improve labor efficiency
• Highly competitive environment
Courtesy of Dave Rauch, SVP Western Digital
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Aligning Smart Factory Initiatives to Stakeholder KPIsWHAT ARE WE TRYING TO ACHIEVE?
BusinessDrivers
B O T T O M L I N E
Less variation
Improved asset utilization
Improved efficiency
No deviations• No misprocessing
• Improved quality and reliability
• Improved customer experience
Tighter parametric distributions• Higher yields
• Lower DPPM
• Matched equipment
Improved time to problem resolution• Faster cycles of learning
• Faster new product ramps to maturity
Lower cost• Faster cycle times
• Higher asset efficiency (OEE)
• Lower LOH
• Test time reduction
• Higher engineer / management productivity
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Enablers & ChallengesDEFINING OUR JOURNEY
ENABLERS• Computing power at low cost• Cheap, available sensor technology• Increasing Bandwidth• Significant collection of data• Most of data is structured
CHALLENGES• Production, process and product
data are fragmented
• Sampling plans are not cohesive
• Costs money and disrupts production
• Unclear payoffs
• Lack of appropriate skill set
• Financial and mind-share risk
Courtesy of Dave Rauch, SVP Western Digital
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Industry 4.0 – Next wave in ManufacturingOVERVIEW OF INDUSTRIAL REVOLUTIONS
Adapted from Christoph Roserhttp://www.allaboutlean.com(Wikipedia)
Industry 1.0 Mechanical production powered by steam and water
Industry 2.0 Mass production assembly lines, division of labor, powered by electricity
Industry 3.0 Automated production using advances in electronics and information technology
Industry 4.0 Cyber Physical Systems; Intelligent production incorporated with IOT, cloud and big data; physical and software components deeply intertwined
18th Century 19th Century 20th Century Today
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Smart Manufacturing (SM) enables all information about the manufacturing process to be available when it is needed, where it is needed, and in the form it is needed across the entire manufacturing value-chain to power smart decisions. Smart Manufacturing Leadership Coalition SMLC / CESMII
Artificial intelligence (AI) is intelligence exhibited by machines. Study of "intelligent agents": any device that perceives its environment and takes actions that maximize its chance of success at some goal.
Intelligence Augmentation (IA), on the other hand, is the idea of a computer system that supplements and supports human thinking, analysis, and planning, leaving the intentionality of a human actor at the heart of the human-computer interaction.
Key Emerging Themes related to Smart Factory: General Definitions
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SOURCE: https://iot-analytics.com/industrial-internet-disrupt-smart-factory/
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interconnectedness
ANALYTICS
LEARN & DOEXECUTION & PROCESS CONTROL MES, SPC, APC, FAULT DETECTION, PREDICTIVE MAINTENANCE (PdM), REAL-TIME DISPATCH …
OPERATIONS OPTIMIZATION OPERATIONAL EFFICIENCY ON FACTORY FLOOR, CYCLE TIME, CAPACITY PLANNING & SCM, EQUIPMENT UTILIZATION, PLANT SIMULATION …
ADVANCED ANALYTICS PERFORMANCE & QUALITY ANALYTICS, ANOMALY DETECTION, PATTERN RECOGNITION, PRODUCT YIELD OPTIMIZATION, FIELD RELIABILITY …
FACTORY
THINGSFACTORY
FLOOR
AUTOMATION
CONNECTHOST INTERFACE, DAQ/IP, GATEWAY, LOW POWER DEVICES, MESSAGING
STORAGE & COMPUTE
COLLECT
DATA STORE, DATA LAKE, BIG DATA LOCAL | DV | CLOUD | HYBRID
BATCH
STREAM
EVENT PROCESSING
UDFs
Based on Ishikawa & Lean Six Sigma
6 M’s of Manufacturing
Clear strategy for capturing all relevant data in the automation layer is key
Generalized Framework for Factory Operations and Product Analytics
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• Next-generation Advanced Process Control … overview of APC
• Virtual Metrology & Virtual Fabrication (digital 3D reconstruction of device for design & process optimization)
• Application of machine learning and deep learning for intelligent pattern recognition & process optimization
• Predictive Analytics for Yield Optimization & Intelligent Testing
• Capacity Modeling, Real-Time Inventory Management & Smart Dispatch
• “Digital twin” for equipment fingerprinting, fleet chamber matching, predictive maintenance (PdM), and plant simulation
• Digital Assistant with AI-based Recommendation Engines
Opportunities for Intelligence Augmentation in a Smart Factory
*”Digital twins” refer to computerized companions of physical assets
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Based on Ishikawa & Lean Six Sigma
6 M’s of Manufacturing
Advanced Process Control: An Overview
• APC is an extension of Process Control which fundamentally is about reducing variability• The use of automation technologies + equipment interfaces + applied statistics
• A vehicle for putting into action the insights learned with data science
“In control theory, Advanced Process Control (APC) refers to a broad range of techniques and technologies implemented within industrial process control systems.”
RUN-TO-RUN CONTROL FAULT DETECTION FAULT CLASSIFICATION
KEY COMPONENTS
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Feedforward Run-to-Runcontroller
Run-to-Runcontroller
Feedback Feedback
Advanced Process ControlFUNCTIONAL DESIGN
28
Shop Floor
Metrology Process ToolProcess ToolMetrology
Processflow
Metrology
Fault Detection databasefor offline analysis
Fault Detectionmodels
Fault Detectionmodels
Stopprocess
ACTIONS
MESTool Maintenance
MESProduct Hold
EmailNotification
Stop Eq.Process
Stopprocess
Courtesy of Norm Armour, Western Digital
Fault Detection(Tool)
Run-to-Run control(Product)
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Case Study: Real-time Fault Detection in Ion MillingSCRAP & REWORK REDUCTION THROUGH FAULT DETECTION MODELS
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Ar+
Ar+
Ar+
Ar+
Ar+
Ar+
Ar+
Ar+
Ar+
Ar gas
PBN
Beam grid (+)
Suppressor grid (-)
Material removed
wafer
Ion mill process chamber (simplified)
Redep
Ground
Courtesy of Yeak-Chong Wong et al., Western Digital
Enabled Scrap & Rework Reduction
Real time data analysis:maximum value of each step is saved as analysis data.
Suppressor Current(Hi Power)
Multi-step recipe
Analysis for 1 month of data from Ion Mill Process Module
Suppressor Current
FDC model detects limit for fault condition to trigger actions:Stop Tool, Notify DMT, Put Tool-Down, and Hold Wafer in MES system
Current back to normal after high voltage is applied to grid burning off redep.
PROBLEM: No Fault Detection Tool aborts at single set limit Manual recovery of abort wafer
results in rework or scrap Risk of under-etch wafer escape
SOLUTION: With Detection Implementation Customized FD based on different power levels Stop tool (gracefully) No manual recovery ; avoid wafer rework or scrap Put wafer on-hold automatically
Case Study: Enabling Virtual Metrology leveraging TIBCO Spotfire Platform
• Virtual Metrology (VM) is a promising solution to enhance APC with real-time feedback and lower cost of metrology in factories
• TIBCO Spotfire Platform provides comprehensive data preparation, advanced analytics and visualization capabilities
• Virtual Metrology model built using machine learning approach with TIBCO® Enterprise Runtime for R (TERR) within SpotfirePlatform
• Exploratory data visualization to evaluate prediction performance, model robustness and enable model diagnostics, as well as allowing users to
– Setup proactive alert on model performance
– Export result to relational database
– Integrate with APC system for feedforward or feedback control
Leveraging Spotfire platform for development of Virtual Metrology models to enhance Advanced Process Control. A scalable solution that can be generalized for multiple process modules in factories.
Courtesy of Yeak-Chong Wong, Western Digital
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Case Study: Intelligent Pattern Recognition
COMMON FRAMEWORK FOR REPRESENTING KNOWLEDGE
DATA AUTOMATION
DATA VISUALIZATIONENG. PRODUCTIVITY
DIAGNOSTIC
MACHINE LEARNING FOR CLASSIFICATION
PREDICTIVE
EMBEDDED CLOSED-LOOP ANALYTICS (EDGE)
PRESCRIPTIVE
Machine-intelligent ecosystem for continuous detection, classification, and predictive quality management of unit of production
COLLECT VISUALIZE MODEL OPERATIONALIZE
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Factory data collection systems unification/simplification and accelerated failure analysisOpportunities for deep-learning approaches for real-time alert & closed-loop recommendation system
Case Study: Intelligent Pattern RecognitionIMPROVING ENGINEERING PRODUCTIVITY WITH AUTOMATED DIAGNOSTIC TOOL
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TTL Reduction from Weeks to Minutes
Example Defect Class Types
FEATURE 1 FEATURE 2 FEATURE 3 FEATURE 4 FEATURE 5
AFTER
Engineering Productivity Improvement for Wafer Pattern Identification
BEFORE
LOG
SC
ALE
(TT
L)
AFTER
VIRTUAL FACTORYPHYSICAL FACTORY
1010101110001010010100101010
execute model, analyze, optimize
• SimulateDesign, Process & Planning – Accelerate Learning Cycles
• OptimizeOperation and maintenance of physical assets, systems and manufacturing processes
• Anticipate, Predict & Prescribe“What-If” scenarios to anticipateunexpected events (e.g., tool down event, expediting ship plans, new machine installation, unplanned maintenance) and to indicate required actions (e.g., condition-based maintenance).
A Digital Twin is a computerized companions of physical assets, processes and systems
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With ambient intelligence in the “smart” factory, devices would work in concert to support managers and engineering in carrying out their daily activities and tasks in an easy, natural way using information and intelligence from a network of connected devices and systems.
• embedded: many networked devices integrated into the environment context aware: devices can recognize you and your situational context
• personalized: they can be tailored to your needs
• adaptive: they can change in response to you• anticipatory: they can anticipate your desires
without conscious mediation.
Reference: Zelkha et al. 1998; Aarts, Harwig & Schuurmans 2001
Intelligence is not an Individual Trait
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“Good Morning, Michael. Would you like your briefing now?”
“Good Morning, Spotty. How am I tracking to the Pack Plan for the week?”
“That’s unfortunate. What is causing the shortfall?”
“Any recommendations on recovery”
Digital Assistant for Factory Management
Factory Assistant
PREVIOUS
I was able to identify 2 mitigation paths to help recover shortfall by 98%.
Factory inventory and equipment analysis identified the following key contributors
Yield on Velo Product 3% lower vs Plan
Tool-05 Excursion in Segment 5: -4.3d delay
High UDT-QUALWAIT for Tool-03: -0.5d delay
NEXT
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“You have a few principal bottlenecks in Factory 7 currently impacting Velo product, resulting in a
5% shortfall versus planned pack-out. This means 30-32 unit shipment shortage or ~4d
delay in meeting complete customer demand.”
71% of manufacturers say IoT will have a
notable impact on their business over the
next five years….
SOURCE: Forbes Article “Making Internet of Things (IoT) Pay In Manufacturing” (2016), http://bit.ly/2yIP2Ye
44% of manufacturers say that their biggest obstacle in
leveraging the IoT is their company’s limited
knowledge of how the IoT can improve operations
and products.
The journey to the next frontier…
58% of manufacturers say that improving
product quality is the most important
objective they are pursuing by
incorporating smart devices or
embedding intelligence.
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The Prepared Mind: Embrace AmbiguityOpportunity, not a deterrent
ADOPTED FROM: The Process of Design Squiggle by Damien Newman
INNOVATION
“We may not know what that answer is, but we know that we have to give ourselves permission to explore.”
Embrace Ambiguity
Patrice Martin, co-lead and creative director of IDEO.org
Industrial Data Science applications and IIOT in smart factory context are still evolving; it can sometimes feel like working in high uncertainty space.
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Building Mindshare ... Going beyond algorithms and technology alone
IDEAS PEOPLE TECHNOLOGYBUILD.MEASURE.LEARN WISDOM OF CROWDS. POLYGLOT ARCHITECTURE.
LEAN FORWARD.
“The Lean Startup” by Eric Ries
“Open Innovation: The New Imperative for Creating and Profiting from Technology”
by Henry ChesboroughGOOD READS
“Precision: Principles, Practices and Solutions for the Internet of Things”
by Timothy Chou
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©2017 Western Digital Corporation or affiliates. All rights reserved.
VIDEO
In Summary
We, together as pioneers in digital manufacturing, are at the eve of a new industrial revolution.
We are embarking on a era where confluence of low-cost, scalable computing power, new memory technologies, innovations in sensor
technology, communication protocols and machine-learning algorithms is making our ability to execute on connected factories — and the knowledge
required to run modern “intelligent” factories — a reality.
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