innovating test for better faster introduction to on-wafer
TRANSCRIPT
Innovating TestTechnologies
for bettermeasurementsfaster Introduction to
On-Wafer Characterizationat Microwave Frequencies
Chinh DoanGraduate Student
University of California, Berkeley
Innovating TestTechnologies
for bettermeasurementsfaster Introduction to
On-Wafer Characterizationat Microwave Frequencies
Dr. Tariq AlamSenior Applications Engineer
Cascade Microtech, Inc.
E-Mail: [email protected]
presented by: Chinh Doan,University of California, Berkeley
Innovating TestTechnologies
for bettermeasurementsfaster
Presentation Outline
• Microwave Probing Technology– Air CoplanarTM Probes
• On-Wafer Calibration Methods– SOLT, TRL/LRM, SOLR, LRRM
• On-Wafer Verification Methods
• Layout Rules
• Calibration and Measurement Software– WinCalTM
Innovating TestTechnologies
for bettermeasurementsfaster
What Are My Measurement Objectives ?
• Now
– Determine S-parameters of on-waferactive devices between 500 MHz to 5 or50 GHz or beyond
• Future?
– ↑ Wafer size (6 to 8 to 12 inch)
– ↑ Frequency range of interest
– ↑ Need for thermal measurements
– ↑ Test automation for throughput
Innovating TestTechnologies
for bettermeasurementsfaster • Vector Network Analyzer
• Cables
• Probes
• Probe positioners
• Probe station
• Controller
• Contact Substrate
• Impedance Standard Substrate (ISS)
What Equipment Do I Need ?
Only Cascade Microtech provides the Total Measurement Solution from the Test Ports of the VNA down to the wafer level
Innovating TestTechnologies
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Microwave Probing
• On-wafer fixturing needs:• Electrically
– wide BW transmissionlines
– low contact R• Mechanically
– consistent probe shape
– placement
– durability
Optimize for loss, impedance match, power and current handlingcapability, contact force, tip visibility...
Innovating TestTechnologies
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Microwave Probe Transmission Line Contacts
Poor
Better
BestPrecise line impedance rightto the ground-signal-groundcontacts
Long path to single groundcontact limits bandwidth
Variable loop inductanceprevents calibration(Requires repeatable transition)
Innovating TestTechnologies
for bettermeasurementsfaster
ACP Probe Technology
Low-loss, low density teflon dielectric coaxMicrowave absorber
- consistent attenuation- termination of coaxial shield energy- provides rigidity
15 W CW at 10 GHz5 A DC current
Absorber
Block
K-Connector
HardAbsorber
Low-LossCable
Air CoplanarWaveguide Tip
SoftAbsorber
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Low-loss ACP
• Low-loss andstandard ACPProbes
• Application– Noise
measurements
– Load Pull
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Air-Coplanar Tips
• Precision tip fabrication
for tight impedance control
Preferred 23°°contact angle
Clear view ofcontact point
Wide contactarea
l High tip visibility for
consistent placement
on pads
BeCu tips for Au or Cu padsTungsten tips for Al pads
Innovating TestTechnologies
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Installing and Using ACP Probes
*definition: planarization -the ability to insure allcontacts are at the sameheight
φ Use Cable strain relief onpositioners
Use Contact Substrate toplanarize probes
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Using ISS Alignment Marks
Full skate and overtravelInitial contact
• Used to set ‘skate’ and probe separation
Internal Apex
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Maintaining ACP Probes
• Keep tips clean of dirt and debris
• Inspect and clean connectors
• Electrical verification -- Probe Test
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Calibration
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How Do I Calibrate My VNA ?
•°
•° vv v
° °
° °Forward
Reverse
Switch PerfectReflectometer
Port 1
ErrorAdapter
Port 2
DUT[S]
ao bo
a3 b3
Microwave Errors (Forward) Calibration Standards
Directivity Port-2 Match Open ThruPort-1 Match Transmission Tracking Short LineReflection Tracking Crosstalk Load Etc.
Innovating TestTechnologies
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One-port Network Analyzer Model
bO
ED ES
ER
aO
1
ΓΓDUT
Calibrate with three known reflection coefficients
l Short - open - load (SOL)
l Short - offset short1 - offset short2
ED = Directivity of coupler
ER = frequency response of measurement channel
ES = Port match
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Two-port Network Analyzer Model(Forward Model)
Calibrate with short-open-load on each portplus a Thru (SOLT) (uses 10 knowns)
bO
ED ES
ER
aO
1 S12
ELS22S11
S21 ET
EX
b3DUT
EL = Models signal reflected back into DUT from P2
ET = Models imperfections in transmission response
Innovating TestTechnologies
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VNA CalibrationbO Ideal
NetworkAnalyzeraO
S12 S22S11
S21
a3
DUT
b3
e10e00e11e01
e22e33
e32
e23
N1
N2
N3
One port ortwo port
calibration standards
• Switch modelled and measured separately
– signals simultaneously measured
– two two-port error boxes
Innovating TestTechnologies
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GROUND
GROUND
SIGNAL
GROUND
SIGNAL
GROUNDThru
GROUND
GROUND
SIGNAL SIGNAL
ShortGROUND
GROUNDGROUND
GROUND
GROUND
SIGNAL SIGNAL
Loads
GROUND
Calibrating the Probe Tips with CoplanarWaveguide Impedance Standards
ISS
• Electrical behavior of standards
– standard dimensions
– probe pitch
– probe placement (use alignmentmarks)
– cal coefficients supplied with probe
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SOLT Calibration
• All standards must beperfectly known– available on virtually every
vector network analyzer (CalKitrequired)
– open has capacitance (oftennegative)
– short and load haveinductance
– sensitive to probe placement
– mathematicallyoverdetermined
– unpredictable behavior
DelayThru
Thru
Short Open(probes in air)
Load
Lterm
Lshort Copen
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TRL/LRM Calibration• Thru-Reflect-Line
– requires least info about standards
– S-parameters referenced to line Zo
– reference plane at centre of Thru
– requires multiple probe spacings
– Design rules
– Zo is inherently complex at lowfrequencies
– not suitable for fixed spacing probes(e.g., probe card)
• Line-Reflect-Match– referenced to Zmatch
Thru
Line(s)
Reflect
Match
OR
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Multi-line TRL Benchmark CalMethod
• Modified TRL algorithm developed bythe U.S. National Institute ofStandards and Technology
• Benchmark on-wafer calibrationmethod
• Takes an optimal weighted averageof all the line measurements
• On-wafer standards (with DUT)preferred
• Renormalizes the S-parameterimpedance to 50 Ohms
Thru
Line(s)
Reflect
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SOLR Calibration
• Short-Open-Load-Reciprocal Thru– reciprocal Thru requires only S12 =
S21
– tolerant to lossy or highly reactiveinsertion standard
– convenient for use with fixed probespacing in probe cards
– Does not require a customThru
– convenient for use when DUTterminals are orientated at 90°
– available in WinCal
Short
Open(probes in air)
Load
Reciprocal
OR
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SOLR for Right Angle Measurements
• Carefully constructed rightangle ‘Thru’ standard
• Thru is non-ideal, large dipat 20 GHz
• Errors in standard cal’s
• SOLR immune to Thruerrors
-1.0
-0.5
0.0
0.5
1.0
0 5 10 15 20 25 30 35 40 45 50
|S21|[dB]
[GHz]
Orthogonal SOLT
Orthogonal SOLR
Straight LRRM
Orthogonal LRRM
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LRRM
• Cascade Microtech Calibration Research
– Line-Reflect-Reflect-Match Calibration– like TRL, only Match acts as infinitely high loss line
– one transmission line standard only allows fixed probespacing calibration
– Thru (line) delay, Match resistance must be known
– measurements referenced to laser trimmed resistor
– required measurement of only one load standard
– load inductance compensation
– uses off-wafer standards (ISS)
– same standards as SOLT only - no need for cal kit
– available in WinCal
Line
Reflect
Reflect(probes in air)
Match
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LRRM Calibration
l System drift baselinel LRRM compares with
system drift limit– best fixed probe
position calibration
l SOLT /LRM– growing error w/freq– possible CalKit error– possible ref plane
error
Innovating TestTechnologies
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Popular Calibration Methodsfor Wafer Probing
Z0 Inherently Probe Card Absolute Reference Consistent Support Accuracy
Trimmed Resistor No Fair Fair
Transmission Best (if Lines Yes Poor Corrected)
Trimmed Resistor Yes Fair Good
Trimmed Resistor Yes Best Good
SOLT
TRL
LRM/LRRM
SOLR
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Calibration Verification
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How Do I Know If My Calibration is Successful ?
GROUND
GROUND
GROUND
SIGNAL SIGNAL
PadOpen stub
GROUND
GROUND
GROUND
SIGNAL
GROUND
SIGNAL
GROUND
GROUND
GROUND
SIGNAL
Line (delay)
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Calibration Verification Standards
Thru0.5 1.0
0.1 GHz
40.0 GHz
-0.10
-0.05
0.00
0.05
0.10
0 5 10 15 20 25 30 35 40
[dB
]
[GHz]
•Unity Gain
•1 pS Line
•Phase Lag
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Calibration Verification Standards
•Unity Gain
•Negative Capacitance
Reflect(probes in air)
10 2050
10
2050
-10
-20-50
0.1 GHz
40.0 GHz
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
0 5 10 15 20 25 30 35 40
[dB
]
[GHz]
Innovating TestTechnologies
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Calibration Verification Standards
• Measured S21 when probes placed on 50ohm loads
Match
-80
-70
-60
-50
-40
-30
-20
-10
0
0 5 10 15 20 25 30 35 40
S21 of Standard Loads
[dB]
[GHz]
HPC40 onHPC ISS
Innovating TestTechnologies
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Independent Calibration VerificationStandards
OpenstubG
G
S
0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 2050
0.2
0.4
0.6
0.81
1.5
2
3
4
5
10
20
50
-0.2
-0.4
-0.6
-0.8-1
-1.5
-2
-3
-4
-5
-10
-20
-50
0.1 GHz
40.0 GHz
-1.5
-1.0
-0.5
0.0
0 5 10 15 20 25 30 35 40
[dB]
[GHz]
• Linear Phase Lag
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Common Calibration Errors
• Poor CalibrationVerification/Repeatability
• Calibration Drift
• Narrow Band ‘Suck out’
• Inaccurate Probe Placement
• Inaccurate Probe Definitions
• Poor Probe Contact
• LRM Sensitivity to Differencesin Load Standards
• Incorrect Models for Lines
• Poor Phase Stability of Cable
• Dirty Connectors
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Beware of an Unconnected Substrate
GS pads fringe to the ground plane or chuck
GSG pads shield like CPW
• Parasitic couplings to the conductors near DUT
• GSG shields magnetic and electric fields better than GS
Fields terminate onbackside of wafer
on one side
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Layout Guidelines
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Device Characterization with CoplanarWaveguide Microwave Probes
GROUND SOURCE
SOURCE
DRAINGATE
GROUND
GROUND
GROUND
SIGNAL SIGNAL
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for bettermeasurementsfaster
Pad Size (Passivation Window)
• Recommended minimum pad size is 80um x 80um forACP Probes when performing automatedmeasurements
• Smaller pad dimensions can be used for manualprobing
• HPC Probe allows 40um x 70um manual probing
• Passivation height must be considered
• Pad height variation must not exceed 25um
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Process Control Monitor DeviceLayout
G
S
G
G
S
G
GSG Test Device Open Pads & Metal Shorted Metal(Remove Ypad) (Remove Zmetal)
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PPR Corrected H21 Measurement0.25 µm CMOS Transistor
.1 1 10 100FREQUENCY (GHz)
H21
-20
0
20
40
60
As measured FT = 25 GHz
Corrected for pad parasitics FT = 33 GHz
Innovating TestTechnologies
for bettermeasurementsfaster
WinCal
• VNA Calibration and Measurement Tool
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for bettermeasurementsfaster
Calibration Features
• Calibration
– SOL, SOLT, SOLR,LRM, LRRM, TRL
– Stability tests
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Setting Up a CalKit
CalKit can be easily defined and downloaded to VNA– Removes one of the most common sources of error
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Measurement Features
• Tools
– Read/Save S-Parameters
– Pad ParasiticRemoval
– Probe Test
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Monitoring the Calibration
• Stability check checkssystem drift
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Pad Parasitic Removal
• Measures intrinsic devices
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Calibration Repeatability
LRRM automatic calibration is
very repeatable
Operator dependent probeplacement errors– manual cal’s are not
as repeatable
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Summary
• Microwave measurements require carefulcalibration, verifications and attention to detail
• Many new applications to accommodatethe varied needs of growing wireless andhigh-speed digital needs
• Let Cascade Microtech help you keep up withfuture innovations