CENTER FOR VISION, AUTOMATION & CONTROL

INLINE COMPUTATIONAL IMAGING AIT Inline Computational Imaging (ICI) is a novel single sensor technology for simultaneous 2D and 3D inline inspection even for challenging inspection tasks.

OPPORTUNITIES • Enhanced 2D imaging, e.g. gloss / shadow reduction, • all-in-focus, high-dynamic range, etc.• Simultaneous 2D and 3D inspection• 3D measurements down to µm range• Advanced inline inspection for 2D and 3D features even for

materials with challenging surface properties• Material classification, e.g. metal vs. plastic• Inspection of optically variable devices and holograms• Detection of defects and fine surfaces structures

ADVANTAGES

• Reliable, fast and accurate• Simple and compact, using only one camera• Easy to integrate• Works for objects with different surfaces (matt / glossy,

structured / unstructured) at the same time• Inspection in motion (no stop-and-go required)• Dynamic adaptable to changing requirements in terms of

speed, accuracy and surface quality• Patented technology

AIT ICI 3D reconstruction AIT ICI All-in-focus State-of-the-art image

State-of-the-art image reconstruction AIT ICI Bright fieldAIT ICI Gloss suppression

Inline Computational Imaging (ICI) is a novel single sensor technology capable for simultaneous 2D and 3D inline inspection. It combines the advantages of light field and photometric stereo technology into one compact solution. ICI technology is a new type of image acquisition system combined with smart algorithms for high resolution and high speed 2D and 3D inspection.

INLINE COPUTATIONAL IMAGING

ICI PROCESSING PIPELINE AND SOFTWARE MODULES

AIT ICI SENSOR SYSTEM The ICI sensor system consists of one multi-line scan camera fitted with a standard non-telecentric lens, two static light sources and a moving sample part. Each of the lines act as an individual line scan camera that captures the corresponding image line by line while the object moves underneath the camera. This gives an image stack consisting of multiple images each seeing the object under a slightly different viewing and illumination angle than the other lines.

This makes the AIT ICI technology a smart combination of light field and photometric stereo imaging.

AIT ICI SOFTWARE MODULESThe AIT ICI algorithms have been designed specifically to work with the ICI sensor system and provide enhanced 2D images together with a high definition 3D reconstruction. All algorith-ms are highly optimized for high processing speed and best results quality. They are largely independent from compute and imaging platforms and supports decentralized processing and reporting.

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The AIT ICI technology can be tailored to fit various applications and meet their specific requirements concerning optical and depth resolution, working distance and acquisition speed and result quality. The optical configurations listed below provide possible examples for standard, micro and large scale 2D & 3D inspection with AIT ICI.

AIT ICI technology is also compatible with different illumination strategies to make it even more suitable for a broad spectrum of industrial inspection tasks.

FLEXIBLE AND SCALABLE FOR INDUSTRIAL NEEDS

SCALABLE OPTICAL RESOLUTION

WORKS WITH SEVERAL ILLUMINATION OPTIONS

ADAPTABLE TO SPEED AND QUALITY REQUIREMENTSThe AIT ICI technology is a multi-line-scan technology which works with any number of lines. This makes the technology easy adoptable for varying speed and quality requirements just by changing the number of lines used.

Higher detailed resultsHigher number of lines Higher amount of data capturedLonger processing timeLower acquisition speed

Less detailed resultslower number of lines lower amount of data capturedfaster processing timehigher acquisition speed

STANDARD SCALE MICRO SCALE LARGE SCALE

Optics 45mm f/4Modified 10x industrial inspection microscope

with NA=0,2820mm f/2.8

Working Distance 128 mm 34 mm 570 mm

Lateral resolution 20 µm/pixel 1 µm/pixel 200 µm/pixel

Field of view 46 mm 1,1 mm 462 mm

Depth resolution *) 20 µm 1 µm 100 µm

Min./typ. Nr. of viewing angles 3 / 11 3 / 30 3 / 11

Depth range 10 mm 300 µm 200 mm

Typical. acquisition speed 100 mm/s 10 mm/s 1 m/s

*) using Light Field and Photometric Stereo

Supported illumination options are:• Continuous illumination• Strobed illumination• In-axis illumination• Diffuse illumination

All illumination strategies enable computational:• Gloss- and shadow suppression • High dynamic range imaging• OVD and hologram detection and inspection• Fine surface structures / normals • Independency from ambient illumination conditions

STANDARD SCALE ICI - 2D/3D INSPECTION AT 20 µm

MICRO SCALE ICI - 2D/3D INSPECTION DOWN TO 1 µm

LARGE SCALE ICI - 2D/3D INSPECTION FOR BIGGER PARTS

Standard scale ICI shows its works with

• optical resolutions of about 20 µm/pixel • acquired at a speed of 100 mm/s • depth resolution of 20 µm

The 3D reconstruction can be used for

• metric depth measurements and profile extraction• Electronic parts: semiconductors, PCBs• Security prints: braille script, embossing, holograms

Large scale ICI works with

• field of view of about 460 mm • depth resolution up to 200 µm • acquisition speed at 1 m/s and an • optical resolution of 200 µm/pixel.

This makes large scale ICI suitable for inspection and measurement of bigger objects like • injection molded parts• metallic plates• wooden boards and many more

2,381mm 1,064mm

Micro Scale ICI is designed to inspect small objects at high speed and high accuracy. Therefore micro scale ICI works with

• Moving objects• Fast acquisition speed up to 10 mm/s• Optical resolution down to 1 µm/pixel

This makes micro scale ICI suitable for inspection and measurement of small sized objects even with highly glossy surfaces like for example

• Wafers• Weld inspection• IC packages and BGAs• Depth analysis of embossings and coins

METAL PARTS

Simultaneous 3D measurement and surface quality inspection for me-tallic parts can be solved using ICI technology. The advantage of using several viewing angels makes the detection of cracks, pores and other surface defects much more robust than using standard machine vision solutions. ICI is a suitable solution for metal surface inspection e.g. for• Crack detection• Distinguish between machining marks and scratches, cracks, etc.

ELECTRONIC PARTS & PCB INSPECTION

Inspection of electronic parts and PCBs must cope with challenges like e.g. glossy solder spots and dark assembly parts with dark labelling. ICI solves these challenges and can be used for • Solder inspection, detection of bad solder spots• Assembly control including 3D inspection for pin heights• Inspection of glossy and dark matt materials at the same time• Wafer inspection (e.g. cracks)

SECURITY PRINT INSPECTION

Besides traditional color imprint inspection ICI can also perform• Inline hologram inspection, not only for presence but also to check for

the correct color shifting effects• Quality inspection of intaglio print and tactile elements (3D depth)• Inspection of embossing, braille writing, seals, etc.• Inspection of decor elements like high gloss printings and lacquered

areas

INSPECTION OF CHALLENGING MATERIALS

ICI works largely independent from the objects reflectance properties. It provides high quality 2D images together with precise 3D reconstruction also for challenging objects, like highly glossy, unstructured and even dark materials.• 2D and 3D inspection with one system• Flexible parametrization for inspection speed and accuracy• Works well with challenging reflectance properties

Inline Computational Imaging offers numerous new possibilities for industrial inline quality inspection. The technology was specifi-cally developed for high-performance industrial inspection and thus it is suitable for automated optical inspection for a wide variety of object categories. To meet the industrial requirements, it works largely independent from the objects surface properties. This means one can inspect glossy as well as matt, structured, unstructured and even dark objects with a single setup. Defects down to the range of a few μm can be detected with high accuracy and reliability.

NEW OPPORTUNITIES FOR INDUSTRIAL INLINE INSPECTION

ELECTRONIC

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//01 Wafer inspection//02 2D & 3D PCB inspection //03 Solder inspection//04 PCB assembly

//05 Hologram & security print inspection//06 Braille embossing & print inspection//07 Embossing

//08 Coin 3D and texture//09 Material classification

AIT AUSTRIAN INSTITUTE OF TECHNOLOGY GMBH Petra Thanner Tel +43(0) 50550 2802 Giefinggasse 4, 1210 Wien petra.thanner@ait.ac.at www.ait.ac.at/hpv

//01 //02 //03

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//05 //06 //07 //08 //09

Optical resolution 1 to 200 µm/pixel

Multi-line rate up to 120kHz

Field of view 1 to 462 mm

Depth resolution 1 to 100 µm

Number of viewing angles min. 3 | typ. 11

Illumination options strobed | continuous, axial | diffuse

TECHNICAL DATA

blue = matt | red = semi-glossy | yellow = glossy HIGHLIGHTS

• Multiple viewing & illumination angles simultaneously

• Works with diverse material types (glossy, matt) at the same time

• Simultaneous 2D and 3D inline inspection

• One system for 2D and 3D inspection

• Compact setup suitable for challenging inspection tasks

• Single sensor system with standard machine vision components

• Flexible for a wide range of industrial inspection tasks

• High speed and high accuracy at the same time

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