infineon automotive power module hybridpack2 100kw 3-phase teardown reverse costing report...
DESCRIPTION
The new automotive three-phase Six-Pack configuration in HybridPACK2 Up to 100KW power management FS600R07A2E3 is a new-power module three-phase six-pack for the automotive market from Infineon. With a maximal power of 100KW, 650V and 600A the HybridPACK2 is optimized for the hybrid and electric vehicle applications. The HybridPACK2 has a pin-fin base plate ready for direct liquid cooling. The power module integrates IGBT3 and EMCON3 diodes from Infineon. Yole Developpement is pleased to publish the reverse costing report on the FS600R07A2E3 performed by System Plus. Based on a complete teardown analysis (power module, mechanical parts, IGBTs and Diodes), the report provides an estimation of the production cost of HybridPACK2 module, IGBT3 transistor and EMCON3 diode.TRANSCRIPT
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
September 2013 Version 1 – Written by Sylvain HALLEREAU
Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8
3. Physical Analysis 14– Synthesis of the Physical Analysis
– Package analysis
– Characteristics and marking
– Housing
– Base Plate Cross-Section
– DBC Cross-Section
– IGBT Analysis
– Dimension
– Guard Ring
– Trench Gate Cross-Section
– Revelation
– Diode Analysis
– Dimension
– Guard Ring
– Revelation
4. Manufacturing Process Flow 54– Overview
– IGBT and Diode Process Flow
– Description of the Wafer Fabrication Units
– IGBT Process Flow
– Diode Process Flow
– Package Process Flow
5. Cost Analysis 66– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
– Cost Analysis IGBT
– Wafer Cost Hypothesis
– IGBT Wafer Cost
– Breakdown per process step
– IGBT Equipment Cost per Family
– IGBT Material Cost per Family
– IGBT Probe Cost
– IGBT Die cost
– Cost Analysis Diode
– Cost Analysis FS600R07A2E3
– Assessing BOM
– DBC Cost
– FS600R07A2E3 Module Cost
– Yield Synthesis
6. Estimated Manufacturer Price Analysis 101– Manufacturers ratios
– Estimated manufacturer Price
Contact
Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 3
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Module is analyzed and measured.• The dies are extracted in order to get overall data: dimensions, pad number, die marking.• Set up of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment.•Cost simulation of the process steps with different year scenarios.
Selling price analysis
• Supply chain analysis.• Analysis of the selling price.
Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 4
The FS600R07A2E3 power module is a 3-phase Six-Pack configuration of 650V 600A.
Pin-Fin baseplate for direct liquid coolingwhich significantly improves the thermalcycles capability and extends the lifetime ofthe power module. The Pin-Fin baseplate withits excellent cooling properties enables a veryhigh power density of the HybridPACK™ 2package. (Infineon Datasheet)
Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Aluminum layerThickness: xxµm
Oxide layer 1Thickness: xxµm
Oxide layer 2Thickness: xxµm
Polysilicon layerThickness: XXµm
Guard Ring : Cross-Section SEM view
Guard Ring : Cross-Section SEM view
Aluminum layerThickness: xxµm
Polyimide layerThickness: xxµm
Silicon
Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 6
• The final IGBT die cost is between $xx and $xx according to yield variations.
• The test and yield losses costs represent xx% of the total manufacturing cost.
– The die cost includes the rejects at probe test and dicing.
– The yield losses represent the rejected finished dies cost.
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Power-One TRIO-27.6-TL
• The Reverse costing analysis represents the best cost/price evaluation given the publically availabledata, completed with industry expert estimates.
• These results are open for discussion. We can re-evaluate this circuit with your information. Pleasecontact us: