indianauniversityindianauniversity spring 2001 transpac engineering and future plans james williams...

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Spring 2001 I N D I A N A U N I V E R S I T Y TransPAC Engineering and Future Plans James Williams [email protected] and Chris Robb [email protected]

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Page 1: INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams williams@iu.edu and Chris Robb chrobb@iu.edu

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TransPAC Engineering and Future Plans

James Williams

[email protected]

and

Chris Robb

[email protected]

Page 2: INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams williams@iu.edu and Chris Robb chrobb@iu.edu

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What is TransPAC?

TransPAC is a cooperative project funded by the US NSF and the Japanese JST to provide a high-performance network connection between the Asia-Pacific and the United States science communities; and, to encourage the use of that network in the development of cooperative science.

Page 3: INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams williams@iu.edu and Chris Robb chrobb@iu.edu

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From an engineering perspective, TransPAC has three components

1. The TransPAC circuit between Tokyo and Chicago, landing at the STAR TAP.

2. The equipment configuration at the Tokyo site (Tokyo XP)

3. The equipment configuration at the Chicago site (Chicago XP)

This talk focuses on current configurations, future plans for these three components and some applications.

Page 4: INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams williams@iu.edu and Chris Robb chrobb@iu.edu

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TransPAC Circuit - 1998

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TransPAC Circuit - 1999

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TransPAC Circuit - 2000

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TransPAC Circuit - 2001

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Tokyo XP - 2000

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Current Chicago XP

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Future TransPAC Circuits - 2001

Page 11: INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams williams@iu.edu and Chris Robb chrobb@iu.edu

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Future TransPAC Circuits - 2002

Page 12: INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams williams@iu.edu and Chris Robb chrobb@iu.edu

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Future TransPAC Circuits - 2003

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Tokyo XP - 2001

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Chicago XP: The Future

• Replacement of Cisco 7505 router with Juniper M20

• TransPAC OC3mon deployed; more powerful general Unix host deployed

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Chicago XP: The Further Future

• Removal of Cisco LS1010

• cflowd data from Juniper would capture all data

• Less reliance on OC3mon machine

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Interesting TransPAC Applications

• Telemicroscopy

• Measurement issues

• N-body problem

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Scientific InstrumentsTrans-Pacific Telemicroscopy

Scientists at the Osaka University Research Center for Ultra High Voltage Electron Microscopy (UHVEM) and University of California San Diego National Center for Microscopy and Imaging Research (NCMIR) successfully use international advanced research networks to couple the world's largest and most powerful (3 million volt) transmission electron microscope at UHVEM to a remote-use computer pavilion set up at NCMIR.

http://www.npaci.edu/online/v3.10/telemicroscopy.html

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TransPAC interface at STDV Utokyo to UIC

Slide courtesy of Linda Winkler - STAR TAP

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Foofoo.mht

TransPAC Flow Analysis Tool

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N-body Problem

Simulate gravitational interactions among many particles

Special purpose computer at University of Tokyo (GRAPE)

Storage of data (terabytes/month initially) at Indiana University

TransPAC as enabling network

I2SS as test new technology

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Questions??

James Williams

[email protected]

Chris Robb

[email protected]