IEEE TENSYMP 20205th-7th June 2020

Organized by

IEEE R10 and IEEE Bangladesh Section

Dhaka, Bangladesh

IEEE R10 Meeting, 7th March 2020

DHAKA: A CITY OF HERITAGE

• Capital of Bangladesh

• Old Dhaka:

Landmarks of 17th

Century

• New Dhaka:

Modernized City

• Well connected by bus

and air to tourist spots:

sea beach,

hilly region,

tea garden

wild forest

INTERNATIONAL ACCESS

• All R10 sections & globe are connected by Air

SHAHJALAL INTERNATIONAL AIRPORT

Major International Carriers:

Air India; Air Arabia, Bangkok Airways

China Eastern; China Southern

Dragon air; Druk Air

Emirates; Etihad Airways; Flydubai

Jet Airways; Kuwait Airways

Malaysia Airlines; Maldivian; Malindo Air; Mihin Lanka

Pakistan Int Air.; Qatar Airways; Saudia

Singapore Airlines; Thai Airways; Tiger Airways; Turkish Airlines

HOT CLIMATE

June, Summer Season

Season of fruits

Lichi, Mango

Avg Temperature: 27 C

Sunshine

Sea beach, tea garden

TOURIST ATTRACTIONS

LOCAL DELICACIES

INTERNATIONAL CONFERENCES

IEEE SPICSCON, BECITHCON, PEEIACON, RAAICON 2019: 4 co-located conferences along with IEEE SPS, EMBS, IAS & RAS BD Chapters respectively.

300 participants from 10 countries, 10 speakers

IEEE R10-HTC 2017: 700 participants,12 countries,22 Speakers

IEEE WIECON-ECE 2015: 90 foreign delegate out of 137

IEEE R10 Meeting 2015: 110 foreign delegates

Others:

Average International Conference per year = 10

ICECE (total 10 times, since 2001, biennial)

ICCIT (total 20 times, annual)

VENUE: PAN PACIFIC SONARGAON HOTEL-Five star hotel

-Organizing state level and International events

regularly

-Hosted VVIP Guests like US Presidents, Secretary

of State, UK PM and so on

INTERNATIONAL ADVISORY COMMITTEE

Meya Meyappan,FIEEE, IEEE EDS President, USA

M Saif Islam, FIEEE, UC Davis, USA

Mohammad S Alam, FIEEE, Texas A & M U, USA

Magdalena Salazar-Palma, FIEEE, SPAIN

Soumitro Banarjee, FIEEE, IISER, India

Nikhil R Pal, FIEEE, Past IEEE CIS President, India

Bhargab B. Bhattacharya, FIEEE, IITK, India

K V S Hari, FIEEE, IISC, India

Sajal K. Das, FIEEE, Missouri S&T, USA

Ljiljana Trajkovic, FIEEE, SFU, Canada

M. Fazlur Rahman, FIEEE, UNSW, Australia

Bhabni P. Sinha, FIEEE, ISI, USA

Cheng Ming, FIEEE, SU, China

SN Singh, FIEEE, IIT Kanpur, India

S. K. Ramesh, FIEEE, Cal. State Uni., USA

Dejan Milojicic, FIEEE, HP, USA

Frede Blaabjerg, FIEEE, IEEE PELS President, Denmark

Udaya K. Madawala, FIEEE, U of Auckland, NZ

Gaurav Sharma, FIEEE, U of Rochester, USA

Muhammad H Rashid, FIEEE, FPU, USA

Bozenna Pasik-Duncan, FIEEE, Past IEEE WIE Chair

Tomy Sebastian, FIEEE, IEEE IAS President, USA

Saifur Rahman, FIEEE, Past IEEE PES President, USA

Sankar K. Pal, FIEEE, ISI, India

M. Omair Ahmad, FIEEE, Concordia U, Canada

Kartik Kulkarni, IEEE HAC Chair, Oracle, USA

Ekram Hossain, FIEEE, U Manitoba, Canada

V.R. Singh, LFIEEE, NPL, India

Vincenzo Piuri, FIEEE, U' degli Studi di Milano, Italy

Seishi Takamura, FIEEE, NTTMIL, Japan

Fred Schindler, FIEEE, Anlotek Ltd, USA

Muhammad A. Alam, FIEEE, Purdue University, USA

36 IEEE Fellows

TECHNICAL PROGRAM COMMITTEE

Khan M. Iftekharuddin, Old Dominion Uni., USA

Masud Chowdhury, U Kansas-Missouri City, USA

Riadul Islam, UMBC, USA

Selim M. Shahriar, Northwestern Uni, USA

M. Rafiqul Haider, U Alabama Birmingham, USA

Ahmedullah Aziz, U Tennessee , USA

Lance Fung, Murdoch University, Australia

Lillykutty Jacob, NIT Calicut, India

Tanzima Islam, Texas Tech Uni., USA

Tetsuya Shimamura, Saitama Uni., Japan

Arumugam Manoharan, U Wollongong, Australia

Bashir I. Morshed, U Memphis, USA

Suryanarayana Doolla, IIT Bombay, India

Rajashree Jain, SIU, India

Md Ashfaqur Rahman, Texas A &M U, USA

J Ramkumar, IIT Kanpur, India

Elmer Dadios, De la Salle University, Philippines

Arokiaswami Alphones, Nanyang Tech. Uni, Singapore

Abdullah Al Mamun, National Uni. Of Singapore

Ramalatha Marimuthu, KCT, India

Nahid Al Masood, BUET, Bangladesh

Abdul Hasib Chowdury, BUET, Bangladesh

Md. Shahjahan, KUET, Bangladesh

Imamul Hasan Bhuiyan, BUET, Bangladesh

Mohiuddin Ahmad, KUET, BangladeshPallab Ganguly, Jadavpur Uni, India

Total 138 TPC Members

HONORABLE R10 ADVISORS

Kukjin Chun, R10 Director (2017-18), Korea

Deepak Mathur, R10 Director-Elect (2020-21), India

Ramakrishna Kappagantu, R10 Director (2015-16), India

Lawrenc Wong, R10 Director (2011-12), Singapore

Sri Niwas Singh, FIEEE, Vice-Chair, Technical Activities, R10 Execom

Zia Ahmed, Vice-Chair Membership Activities , R10 Execom

Takao Onoye, Professional Activities , R10 Execom

Takako Hashimoto, Secretary , R10 Execom

COMMITTEEHonorary ChairAkinori Nishihara, FIEEE2019-2020 IEEE Region 10 Director

General ChairCelia Shahnaz

Program Committee ChairShaikh Anowarul Fattah

Members

Moshiul Hoque, Yeasir Arafat

Raihan ur Rashid S.M.Saiduzzaman

Dipayan Saha Zafir Shafee

THEME OF TENSYMP 2020

Technologies for Impactful Sustainable Development

SCOPEAntenna and Microwave

Biomedical Engineering & Bioinformatics

Circuits and Systems

Communications and Networks

Computational Intelligence

Computer Systems

Devices, Materials and Processing

Information Technology

Internet of Things

Machine Learning and AI

Power, Energy and Machines

Robotics, Automation and Control Systems

Sensor Technologies and Applications

Signal Processing

Industrial applications

Others

http://tensymp2020.com/

Website

Total Submission: 845

Local Submission: 705

Foreign Submission: 140

Countries(14):

India, Bangladesh,

Malaysia, USA,

Philippines , South Korea,

Canada, Mongolia,

Australia, China,

Colombia, Indonesia,

Taiwan, Japan

MEET THE SPEAKERS

EVENTS

Technical Talks, Keynote/Invited Talks, Workshop/Tutorial

Awards/Travel Grants

IEEE Society Specific Activities

Exhibition & Live Demo

Events with Students: Hack-a-thon and Project Competition with live demo

Events with Young Professionals

Events with Women in Engineering

IEEE SIGHT Groups Activity Presentation:

Training on Social Return on Investment & SDG

Industrial Panel : Industry Visits for student authors

Educational Activity Track

City Tour as part of registration benefit

REGISTRATION FEES

Authors/

Participants

Non-student fees

(USD)

Student fees

(USD)

Non-

member

Member Non-

member

Member

International 400 350 300 250

Local 250 200 175 150

One registration covers one paper.

Max 1 additional paper @ 50 USD can be added

IMPORTANT DATES

Events Deadline

Special Session (SS) Proposals Feb. 15, 2019

Submission of Regular/SS Papers* Feb. 29, 2020

Notification of Acceptance April 15, 2020

Camera Ready Submission April 30, 2020

Author Registration April 30, 2020

*Four page full paper submission.

SIGNIFICANT LANDMARKS OF DHAKA

WELCOME YOU TO TENSYMP 2020