ieee swtw 2011 probe card cost drivers - ira feldman 110621
DESCRIPTION
Ira Feldman's presentation about cost drivers for the design and fabrication of semiconductor wafer test probe cards. Presented at the IEEE Semiconductor Wafer Test Workshop, June 2011.TRANSCRIPT
Probe Card Cost Drivers from Architecture to Zero Defects
Ira Feldman Feldman Engineering Corp.
June 12 to 15, 2011 San Diego, CA
June 12 to 15, 2011 IEEE SW Test Workshop 2
Overview • Cost, Price, & Cost Drivers • Serial Processing – Drilling Example • NRE • Advanced Process Technology • Profitless Prosperity • Cost Savings • Summary
Note: price/cost examples are approximate and from multiple vendors not necessarily those identified or shown.
Cost vs. Price
June 12 to 15, 2011 IEEE SW Test Workshop 3
Price
Gross Profit = Price – Cost Gross Margin = Gross Profit / Price
Cost Value
Vertical Probe Head
June 12 to 15, 2011 IEEE SW Test Workshop 4
MicroProbe Apollo
Printed Circuit Board
Space Transformer
BGA (Solder Attach)
Upper Guide Plate
Lower Guide Plate
Spacer
Probes
Machine Shop Cost Drivers
June 12 to 15, 2011 IEEE SW Test Workshop 5
Programming Material
Setup Time Run Time Inspection
Yield
Guide Plate Drill Example
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Don’t bother… “Ferrari”
Cost Per Drill Hole
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Don’t bother… “Ferrari”
Machine Cost $300,000 Annual Maintenance 7%
Useful Life 7 years Total Cost $447,000
FaciliEes Annual Cost $35,000 Total Annual Cost $68,857
Machine Cost 25% uElizaEon $31.44 /hr 85% uElizaEon $9.25 /hr
Tooling per hole $ 0.05
Make vs. Buy
June 12 to 15, 2011 IEEE SW Test Workshop 8
Utilization Lead Time
Quality Fixed vs. Variable Cost
Cost (Make) vs. Price (Buy)
NRE
June 12 to 15, 2011 IEEE SW Test Workshop 9
NRE
Non Recurring Engineering Expense
Architecture Design Tester Customer R&D NRE NRE NRE
Design Input X X
Probes ? Guide Plates X
Space Transformer X Interposer ?
PCB Design X (External?) X ? PCB Fab External ? ?
Mechanical H/W ? X ? Electronics ? ? ? Metrology X X ? Packaging X ?
Outgoing Metrology
June 12 to 15, 2011 IEEE SW Test Workshop 10
Interposers
June 12 to 15, 2011 IEEE SW Test Workshop 11
www.ksdk.co.jp ISC
ISC
InterCon Systems
Spring Pin Elastomeric Molded Frame
Small Area NRE $.5 - 1 K $2 - 3 K $20 - 30 K
$ / contact $1 - 10 $.50 - .60 < $.20 - .40
Large Area (1/4 wafer +)
NRE $10 - 15 K $100 - 150 K
$ / contact $.40 - . 50 < $.10 - .20
Sequential Punch
Material & Processing
Space Transformers
June 12 to 15, 2011 IEEE SW Test Workshop 12
Material & Processing
Sequential Punch
Advanced Process Technology
June 12 to 15, 2011 IEEE SW Test Workshop 13
Cost Drivers Process Steps Masks Substrates
Material Active Area
Yield Defect Density Layers
Equipment Rework / Repair
Whitespace
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FormFactor Harmony XP
Design 1
Design 1
Design 2
Design 2
Solution
June 12 to 15, 2011 IEEE SW Test Workshop 15
FormFactor Smart Matrix
Business Health
June 12 to 15, 2011 IEEE SW Test Workshop 16
FOR
M –
9 y
ears
; MJC
– 5
yea
rs; J
EM
- 5 y
ears
; VR
GY
- 7 y
ears
Costs Savings
June 12 to 15, 2011 IEEE SW Test Workshop 17
STANDARDS Input Data Formats
Probe Depth Testhead Configurations
Specifications
Summary • Understand true cost of architectures
– Beware of NRE – New architectures needed for cost reducEons
• Maintain sufficient Gross Margin – Company health – Funding for R&D
• Honest supplier – customer partnerships
June 12 to 15, 2011 IEEE SW Test Workshop 18
Acknowledgments • Amphenol InterCon Systems • BucklingBeam • FormFactor • ISC • Kern • Robin McAdams • MicroProbe • Sergio Perez • SV Probe • Frank Swiatowiec
June 12 to 15, 2011 IEEE SW Test Workshop 19
Thank You!
Ira Feldman [email protected]
Visit my blog
www.hightechbizdev.com for my summary of SWTW
June 12 to 15, 2011 IEEE SW Test Workshop 20