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In Circuit Test for Automotive Industry

By Sam Wong

Agilent Technologies

Business Development Manager

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1. The Automotive Electronics Industry

2. Challenges in the Automotive industry ICT

3. How did Agilent solved these Challenges

4. More of Agilent ICT Features to meet your needs

5. Questions and Answers

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Agenda

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1. The Automotive Electronics Industry

2. Challenges in the Automotive industry ICT

3. How did Agilent solved these Challenges

4. More of Agilent ICT Features to meet your needs

5. Questions and Answers

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Agenda

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Automotive Electronics in Cars Today

Body Electronics - Comfort / Convenience

- Instrument Cluster

- Remote Keyless Entry

- Climate Control

Power Train & Hybrid - Engine Management

- Braking System

- Power Steering

- EV and HV

Infotainment &

Communications - Audio Systems

- Multimedia Systems

- Rear Seat Entertainment

Safety and Driver

Assistance - Adaptive Cruise Control

- Collision Warning

-Tire pressure Monitoring

- Airbag Time to market and market penetration periods

are becoming shorter , example ABS started in

1970s and take 20 years for mass acceptance.

It’s typically accepted to be 2 to 7 years today

Agilent Restricted

1. The Automotive Electronics Industry

2. Challenges in the Automotive industry ICT

3. How did Agilent solved these Challenges

4. More of Agilent ICT Features to meet your needs

5. Questions and Answers

Page 5

Agenda

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INTENSE COST PRESSURE

• Fierce competition in the global market

• Customers expecting more functionality, better quality and at lower cost

• Lower equipment cost

• Lower deployment cost

• Lower cost of ownership

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General ICT Challenges in the Industry

LOST OF TEST ACCESS

• Increased board functionality

• Highly dense board and design complexity

• No layout space for targets

• Finer trace-spacing routing

• Higher frequencies

0%

20%

40%

60%

80%

100%

1990 1995 2000 2005 2010 2015

In Traditional ICT,

Lost of Access = Lost of

Test Coverage

Test Access (%) over the years

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ICT Challenges in Automotive Industry

Mandatory Programming of Serial Controllers and

Serial Protocol Testing (example CANBUS,

FlexRay, LIN)

Increase in IC functionality, Use of Boundary Scan

in Testing and Larger Memory devices

Reduction in Cycle Time with Increasing Nodes

Count, example 1200 nodes in Engine controllers

and Electric Car Modules.

1

2

3

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4 Global deployment with hardware / fixture support

– programs transportability and guarantee

protection of zero unauthorized change.

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Fast

Faster

Fastest

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Challenge #1: Larger Boards and Faster Cycle Time

Engine controllers modules have node counts that

are close to the limit of a single 3070 module.

In

Circuit

Test

Pretest

with/without

temperature

Final

Test

Programming

Station

Production

Challenges and

Concerns:

Quality, Product

Traceability,

Costs, etc

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Boundary Scan usage, IC BIST and IC embedded

measurement capability will increase and be

accessible through the boundary scan port.

Challenge #2: Larger IC with Increased functionality

Boundary scan usage

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Programmable Device Market Analysis

Technology Trends

ICT Flash Programming Solution

Challenge #3: Mandatory On Board Programming

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Challenge #4: Worldwide deployment Management

Software revision control

Local Support for fixtures

Local Application expertise

System configurations differences

Spare parts inventory management

Quality

Time

Cost

Agilent Restricted

1. The Automotive Electronics Industry

2. Challenges in the Automotive industry ICT

3. How did Agilent solved these Challenges

4. More of Agilent ICT Features to meet your needs

5. Questions and Answers

Page 12

Agenda

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Average price of a 3070 have steadily declined over 50% in the last

10 years, while test throughput has increased.

Advanced parallel testing capability with Throughput Multiplier and

Dual Well fixturing

2x throughput for CET and increased ICT throughput with ASRU-N

and VTEPv2.0 enhancements

Agilent’s respond to ICT Cost of Ownership

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By Bill Lycette & Duane Lowenstein, IEEE 2010 Paper, The

Real Total Cost of Ownership of Your Test Equipment

Continued R&D emphasis on

compatibility and upgradeability

with previous generation ICT, to

preserve your investments

Lower deployment costs and

lower cost of ownership

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Agilent’s Respond to Limited Access Challenges

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Suite of Test Point Accessibility Technology

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Agilent’s Response to challenge #1

Larger Boards and Faster Cycle Time

Build in Features • Panel Test

• Throughput Multiplier

• Dual Well Fixture

• Vacuum Fixture

• FPY Monitoring

Platform Scalability • S1, S2 to S5

• Expandable slots

• Module Activation

Throughput by bank

New ASRU-N cards will give

20% to 30% faster Tests Time by

using the Digitized Measurement

Circuits

Includes Power Monitoring

Circuit to prevent damage to ICs

during debug and testing

A 1259 node board with 1670 Analog and 44 Digital Components

Coming

Soon

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Agilent solutions provide full support and diagnostics for IEEE 1149.1

and IEEE 1149.6

Cover Extend Technology test devices connected to Boundary Scan

components.

Leading IEEE 1149.1 extensions for IC Initialization

Leading IEEE 1149.8.1 standard – Vectorless test extensions

Participating in IEEE 3D IC test study committee

IC Embedded Measurement technology

Multiple divisions contributing R&D, Marketing and Sales resources to

leverage Agilent’s expertise and technology to deliver embedded

measurements.

Participating with iNEMI working group to leverage IC BIST

Participating in IEEE P1687(IJTAG) working group

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Agilent’s Response to challenge #2

Larger IC and Increase in Boundary scan usage

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COMPLETE BUNDLE AVAILABLE.

• PC Controlled (Ethernet).

• Four TAP/IO.

- 1x TAP(TMS,TCK,TDI,TDO).

- 4x Digital input ports.

- 5x Digital output ports.

• One Diagnostic Clip.

• Add-on Cover-Extend Technology capability

- Vectorless testing of ICs or Connectors through boundary scan

• Scan Path Linker

- Connecting physically separate chains to test the interconnecting nets

NEW

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Agilent’s response to challenge #3:

Mandatory On Board Serial Programming

Lower Cost

Reduced inventory of pre-programmed device

Fewer devices damaged by handling

Increase flexibility in code or engineering

changes

Ease of implementation

A wide range of supported device protocols, with

extensive device coverage

Collaboration with programmer partners, end

users will have a significant source of competitive

advantage

Key benefits of Utility card flash programming

FlashProgFR

by

Essepie S.R.L

ISP3070

by

Xeltek

FR3070A

by

SMH

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Agilent’s Response to challenge #4

Worldwide Deployment Management

• Highest accuracy and signal fidelity

• Fast analog 2/4 wire Analog Stimulus Response Unit

• Power monitoring protection & per pin programmability

Stable, Reliable, Repeatable System

ONE supplier

NEW hardware upgrades

EXPERT help

SOFTWARE upgrades

TRACEABLE and trusted

calibration

ORIGINAL and qualified parts

PARTS availability worldwide

ONE

STOP SHOP

Agilent Restricted

1. The Automotive Electronics Industry

2. Challenges in the Automotive industry ICT

3. How did Agilent solved these Challenges

4. More of Agilent ICT Features to meet your needs

5. Questions and Answers

Page 20

Agenda

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Agilent Medalist ICT Family History

Series I Series II Series III 3070 Window/i5000 i3070/i1000

1989 1994 1998 2000/2005 2007

Continuous series of compatible upgrades to:

Preserve program and fixture investments

Extend the test capability and support life of the 3070

Continuous product improvement and features enhancement

Provide the best balance between compatibility and low cost

The introduction of i3070 Series 5 and i1000.

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Fuse Box Test – Stage 1 Hi-Potential Available in Agilent i1000

DUT PS-HV

150V, 50uA

DUT A Bus

(using

existing

Zener

channel)

B Bus

Volt Meter

Com

pare

Threshold

i R=4.7k

Test

Result

Objective is to measure Resistance between the pins to be > 3 Mohms

Method is to run a 150V through the nodes and make sure the current is <50uA

The boundaries are:

Test Method and Sequence don’t damage the components

Automated and integrated into the Test Flow

Start

Open Test

Shorts Test

Analog Test

150V Test

End

DUT

i1000 Test card

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Fuse Box Test – Stage 2 Hi-Current Test for Relays Available in Agilent i1000

Start

Open Test

Shorts Test

Analog Test

1Amp Test

End

Max 2Amps

Source

Measurement

Engine

DUT

Hi-Current

Relay Matrix

Objective is to make sure the

relays in red circles are not

misaligned

Method: Run 1A current thru the

relays to make sure the pins can

handle 1A

The boundaries are:

Reed relays normal range

is about 300mA

Automated and integrated

into Test Flow

Test terminal voltage without

turning on the relay

Test terminal voltage with the

relay turned on while 1A is

applied.

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LED Testing Available in Agilent i3070 Series 5 and i1000

LED Test modules

Using digital camera

Integrated with i1000D

powered test

Each module provides

154 LED tests

i1000D tests voltage and

current

LED module test color

and brightness

Flexibility on the ICT to

add external

functional circuits.

Software and

hardware support

included

FEASA LED Analyser

3rd Party Solution

Test up to 480 LEDs in 1

Utility card

www.feasa.ie

I3070 LED Test

Technology will test your

LEDs to

+/-3nm for color

Luminosity within +/-10%

Integrated

and 128 LEDs in <1.5

seconds

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High Voltage Zener Test Available in Agilent i3070 Series 5 08.20p

New High Voltage Power Supply provides one output from 0 to 50

volts @ 0 to 10 amps (500W).

Installed on Channel 3 or 4 of ASRU-N card, or can be installed on

Channel 7 or 8 on Utility card

Support up to 60V

Voltage references – shunt regulators

Surge protection - to limit transient voltage spikes

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Use of DLL Available in Agilent i3070 Series 5 08.30

The DLL Integration feature allows user to call external DLL functions from

within the BT-Basics.

New Commands:

Dllload “<dll-name>”, <dll-handle>

dllcall <dll-handle>, “<custom function name>”, [<return number>],

[“<return string>”]; [“<custom parameters>”]

dllunload [<dll-handle>]

Multiple DLLs are allowed to be loaded at the same time

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BT-Basic

dllcall Handle_1, “blank_check”, Var_1, ErrMsg$; “0, 0xffff”

External DLL

BTBasic_DLL_Call(“blank_check”, “0, 0xffff”, ErrMsg, Var_1)

External DLL

blank_check(0, 0xffff)

Calls Calls

Open up opportunities to integrate external third party devices for testing of

standards (such as CANBUS, FlexRay and LIN )

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Other Key Features: 4U Rack box

RLC analog measurement

Voltage measurement

Frequency measurement

Boundary Scan, Cover Extend Technology

On Board Programming

Digital Library Test and SPI or I2C

Client-Server Software API

Diagnostic Test System Available in Functional Test Rack

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Diagnostics Test Solution Concept

+ Just enough test 4-256 points ICT

+ Boundary scan (4 test points) for IC interconnect

+ CETBSCAN for devices connected to Boundary Scan devices

+ Utilize board-level test software for CETBIST

+ Opportunistic ICT during NPI for limited access boards

+ Standalone Repair Station or Integrated to functional tester

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Automation Ready Available in Agilent i3070

Complete Solution from Agilent

Built on industry leading i3070

ICT Platform

Short Wire Fixture – preserving

core value of TRS

Small Footprint, better mobility

Easy maintenance and fixture

change

Lower Upgrade costs

Card cage can be rotated 110 deg

anti-clockwise to access blower door

Video Link NEW

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Automation Ready Available in Agilent i1000

Off-line System In-line System

Complete Solution from Agilent

Smallest Foot Print ICT

Convertible between Inline and

Offline

Highest Top and Bottom

Clearance

Solution for Test Access on the

Edge

ICT with full powered testing

capabilities, with simple fixtures

Video Link NEW

In-circuit Test

Technology To Meet

Future Challenges

and Trends

Measurement Systems Division

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Back Up

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In-line Flash

Programming In-line ICT

Stretch $

In-line Test

(CAN & Functional)

Test coverage

Modular &

Compatible

Manufacturing Line – Test Strategy

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Boundary Scan

device Connector or

other device

TDI TCK

TMS

TD0

VTEP

sensors

to ICT

tester …

Test Access

pins

Cover Extend Technology (VTEP + Boundary Scan)

Remove Test Access

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CET : NOW on ICs! Greater Throughput

Greater Coverage

Greater Usability

Greater Stability

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Bead Probe Technology (adopted by >70 companies)

Conventional Test

points and probes

Bead probes

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ABPT is a patented innovation,

To be used in Agilent Testers only.

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Features of our i3070 over the decade Throughput Coverage Ease of Use

i30

70

S5

2012 Rel 8.30P LED Test Ext DLL

Windows 7

2011 Rel 8.20P 60V Zener

N5747A Pwr Supp Unit

2010 Rel 8.10P DC test for big Caps

RP5700 PC 100KHz & 200KHz for small Caps

CET on IC

2009 Rel 8.00P ASRU N "AS" Utility card Pwr Monitor

High Pwr Channels

TestPlan Analyzer Flexible Pwr Channels Fixture Pwr Supp

i30

70

2008 Rel 7.20P VTEP v2.0 CET VTEP enhanced guarding

2008 Rel 7.10P VTEP speed up 1149.6 Enhanced Log record

2007 Rel 7.00P IPG enhanced Auto Optimizer

VTEP v2.0 NPM Switch btw Mux : Unmux Browser Pin locator

i30

70

S3

2006 Rel 6.00P XW4200 PC

New GUI FPY, Worst Probe AutoDebug WinXP

2005 Rel 5.40P iYET iVTEP

2003 Rel 5.30P

NAND/XOR Tree Pattern VTEP

Coverage Analyst User Fixture Component

Scanworks GUI Localization

2001 Rel 4.00P-5.20P 50% faster in sys diag ISP suite

ControlXTP - SW5.0 Auto Si nails Windows NT

< 2001 < Rel 4.00 Panel Test

Throughput Multiplier Testjet

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Agilent Restricted

for business continuity

after 22nd Oct 2011

Is Is not

supported on Win XP/Win 7 32-bit OS supported on Win 7 64-bit OS

the same as 08.20pb with additional

feature to support Win 7 OS

developed based on new

CR/enhancement

available on new system, controller

upgrade & one-time software update

available via software update

subscription (SUS)

Note:

1. Board test program developed in earlier Win XP software releases is transportable to 08.21p

Windows 7

2. 08.30p will support Windows 7 32/64-bit OS

3. 08.21p WinXP and 08.21p Win 7 are compatible

4. Old PCs prior to RP5700 are not supported for Win 7.

5. Version 8.21p has the same functionality as 8.20pb

6. 08.20p or earlier are not supported for Win 7

7. Microsoft does not allow Agilent to downgrade to WinXP.

Window 7 migration

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