1. HANOI UNIVERSITY OF SCIENCE ANDTECHNOLOGY Center for Training of Excellent Students Advanced Training ProgramSEMINAR:IC-PACKAGINGCASE STUDY: ENCAPSULATIONgroup: Hong Vn Tin Nguyn nh Trung Phm c ThnhClass :MSE-K54

2. The IC- packaging :In electronics manufacturing, integratedcircuit packaging is the final stageof semiconductor device fabrication, in whichthe tiny block of semiconducting material isencased in a supporting case that preventsphysical damage and corrosion.-Last step : Encapsulation 3. Several options for encapsulation, providingthe level of protection or accessibility,include: Fully closed Partially closed Open 4. Fully closed (fully encapsulated) Flattened/remolded : fully encapsulated with filled organicsubstrate : epoxy, liquid epoxy resin, thin-film Packages are returned to their original mechanical state andproviding test socket compatibility. Top glob : fully encapsulated with filled epoxy domed topsurface. Suitable for chip-on-board applications Clear encapsulant: Packages are fully encapsulated with non-filled epoxy and have a domed surface, for bondingverification, visual samples and optical applications. 5. Partial open cavity(partially encapsulated) - Encapsulated with filled epoxy in selected areas - ideal for circuit repair , visual inspection , emission studies - wires partially protected from mechanical damage 6. Open cavity Open cavity with frames or lids : noencapsulation, custom frame aroundperimeter of package with removable lid toprotect die and bond wires Open Cavity: No encapsulation, die isexposed for total accessibility . easy ofbrobing die and chip. 7. Thank for your listening