ibm special announcement session intel #idf2013 september 10, 2013

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© 2013 IBM Corporation New Innovation in x86 Computing from IBM System x September 10, 2013

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Nice IBM System x announcement overview presentation from Intel IDF2013 held on September 10, 2013. IBM NeXtScale System is a new dense offering from IBM. It is based on our experience with IBM iDataPlex and IBM BladeCenter along with a tight focus on emerging and future client requirements. Today we announced two components: IBM NeXtScale n1200 enclosure – a 6U enclosure that can hold up to 12 NeXtScale System servers IBM NeXtScale nx360 M4 server – a half-wide server with up to 2 processors, 8 DIMMs (256 GB), 2 PCIe 3.0 adapters, and 2 HDDs or 4 solid-state drives Watch our North America webcast replay here: http://event.on24.com/r.htm?e=670225&s=1&k=FC5CD17AB42385B40BCED29B8B61E2E8&partnerref=IBM09

TRANSCRIPT

Page 1: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation

New Innovation in x86 Computingfrom IBM System x

September 10, 2013

Page 2: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation2

Today’s Speakers

Brian ConnorsVice PresidentSystem x Development & Lab Services

Roland HaganVice President of MarketingIBM System x

Scott TeaseDirector & Product Line ManagerSystem x Technical Computing

Dr Adrian WanderDirectorScientific ComputingDepartment of SFTC

Cliff BreretonDirectorHartree Centre

Shannon PoulinVice President, Datacenter Marketing GroupIntel Corporation

Page 3: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation3 1) Facebook Second quarter 2013 results 2) Economist: stats from Morgan Stanley 3) IBM research

Shifts in IT are happening fast, bringing a new era of IT

1.15 Billion Facebook

users today1

Social Media

90% of data in the world today created in last two years alone.3

Big Data

10 billion devices by

20202

Mobile

Need to analyze and extract value from

massive amounts of data

… provide insight and drive business outcomes

Page 4: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation4

High-end systems

Broad portfolio to meet a wide range of client needs from infrastructure to technical computing

4 socket+ enterprise-class x86 performance, resiliency and security

Integration across IBM assets in systems and SW for maximum client optimization and value

Optimize space-constrained data centers with extreme performance and energy efficiency

IBM PureSystemsIBM eX5 Systems

IBM System x iDataPlex IBM NeXtScale

IBM System x Rack & Tower

IBM Flex SystemIBM BladeCenter

IBM Strategy delivers a leadership systems portfolio

Blades/Integrated systems

Volume systems Dense systems

Page 5: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation5

AnalyticsCloud

Application ready solutions to improve insight, reduce risk, speed deployment

Solutions based on key ISVs such as SAP HANA & integrated IBM offerings

Powerful and innovative Improve outcomes through a better understanding of business environments

Designed for flexibilityCost effective cloud deployment with leadership x86 scalability

Workload optimizedIBM innovation in x86 for maximum performance and scalability

Technical Computing

Meet public, private and hybrid cloud for clients & service providers

Client focus delivers solutions clients require to win

Performance & resiliency in x86 mission critical, memory intensive workloads Scalability of compute, network and I/O to efficiently meet growing needs Consolidation & virtualization of infrastructure to reduce cost, increase agility Over $1 billion planned investment in x86 over three years

Page 6: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation6

New & optimized architectures are needed for new workloads

Cloud

Web 2.0

TechnicalComputing

Page 7: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation

Brian ConnorsVice PresidentSystem x Development and Lab Services

Page 8: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation8

Mainframe,Mini ComputerTerminals

LAN/Internet Client/ServerPC

Mobile Cloud Big Data SocialMobile Devices

Source: IDC, 2012

The Shifts are occurring rapidly, according to IDC we are at the 3rd platform

Page 9: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation9

Industry Partnering

NeXt generation systems

High performance storage– IBM GPFS Storage Server

Flash/Networking– eXFlash, Virtual Fabric

Energy efficiency– Water cooling – Energy aware scheduling

Open industry standards – Chair, actively participate

Deep relationships

– Lead validation partner– Strong architecture

influence– Over 100 industry suppliers

Optimization– Algorithms– OS’s, hypervisors, systems– Solutions - e.g. SAP HANA

Solution Provider– Technical Computing– Big Data, Cloud & Analytics– Virtual Desktop– MSP, CSP’s

Involved with client– Trusted advisor– Data center efficiency– Proof of concepts– Learn and apply to

new products

IBM System x – Systems engineered for a changing landscape

$1BInnovation

Investment

ClientEngaged

Page 10: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation10

Performance Optimized SystemsWorld Records:

4 socket TPC-C and TPC-E benchmarks 2 and 4 socket TPC-E price/performance 2 socket blade SPECvirt performance 4 and 8 socket servers for two-tier SAP

#1 in installed aggregate supercomputer performance

IBM Technology Leadership

Enterprise X-Architecture Leadership 36 #1 eX5 benchmarks since 2010 launch

IBM #1 in patents for 20 consecutive years >6400 patents in 2012

X-Architecture5

Generations

World Records

#1TPC, SAP, Spec

Benchmarks

IBM System x – Great Today, Engineered for Tomorrow

Client Benefits and Trust

As little as three months ROI for technology refreshes Leading x86 energy-efficient systems Simplified workload and resource management

Client Satisfaction

TBR

#1

Page 11: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation11

IBM SmartCloud Entry IBM Application Ready Solutions IBM Intelligent Cluster™ IBM GPFS™ Storage Server IBM Platform Computing™

IBM System x 3650 M4 HDBig data and

dense storage server

High Density, 2 socket

x3500 M4Business Critical 2 socket

iDataPlex® dx360 M4 HPC, 2 socket

x3550 M4Business Critical2 socket

x3650 M4Business Critical 2 socket

Platform HPC

Platform LSF

Platform Symphony

Hyperscale, density, flexibility, 2 socket

GPFSStorage Server

17%3

GreaterMemory Speed

50%1

More Cores& Cache

50%2

GreaterPerformance

1 Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB 2 Intel E5-2690 vs E5-2697 v23 Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz

IBM System x – New innovation

EnhancedSystems

Software and Solutions IBM NeXtScale System™

9/10

New system for

scale-out computing

9/10

Page 12: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation

Scott TeaseDirector & Product Line ManagerSystem x Technical Computing

Page 13: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation13

IBM NeXtScale SystemTM – Guiding principles

IT Your Way

PowerfulYet Simple

FLEXIBILITY

SIMPLICITY

SCALEScale Enabled for everyone

Page 14: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation14

Compute

Chassis

Storage

Acceleration

More Coming

Standard Rack

Primary Target Workloads

Architected for now and the future Better density and flexibility Compatible with standard racks Optimized for top of rack switching Software Defined Networking

(SDN) ready Intel® Xeon® Processor E5-2600 v2

product family Powerful roadmap

2013 – Introducing IBM NeXtScaleA superior architecture for scale-out computing

PublicCloud

High Performance Computing

Private Cloud

Page 15: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation15

IBM NeXtScale – Simplicity Native eXpansion – Adding Value, not Complexity

Base node delivers robust and dense raw compute capabilities NeXtScale’s Native Expansion capability allows seamless upgrades

of the base to add common functionalities– Storage– Graphics Acceleration or Co-Processing

What is Native Expansion?

No Exotic Components. No Mid-plane Dependencies.

+

nx360 M4

IBM NeXtScale nx360 M4 with Storage NeX

Storage NeX

+

RAID Card +SAS Cable + HDDs

+

nx360 M4

PCI NeX

+GPU Riser Card +

GPU/Phi

IBM NeXtScale nx360 M4 with Accelerator NeX

Page 16: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation16

6U Chassis, 12 bays

Half width component support

Up to 6 900W power supplies N+N or N+1 configurations

Up to 10 hot swap fans

Fan and power controller

Mix and match compute, storage, or GPU nodes

No built in networking

No chassis management required

IBM NeXtScale n1200

Fan and power controller

Front view

6 x 900W power supplies

10 x 80mm

fans

Rear view

NeXtScale – Dense ChassisO

ptim

ized

sha

red

infra

stru

ctur

e

Page 17: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation17

Sim

ple

arch

itect

ure

Power button and information LED

Dual-port mezzanine card (IB/Ethernet)

KVM connector

Labeling tag

1 GbE ports

IMM v2 port

PCIe 3.0 Slot

x24 PCIe 3.0 slot

x8 mezz. connector 2 x CPU 8 x DIMMs

Power Interposer

Flexible Drive bay(s)

x16 PCIe 3.0 slot

NeXtScale – The Compute Node

New ½ Wide 1U 2 socket server

Intel® Xeon® Processor E5-2600 V2

Flexible slot-less I/O design

Generous PCIe capability

Open design, works with existing x86 tools

Versatile design with flexible Native Expansion options

32TB local storage (November)

GPUs/Phi adapters (2014)

IBM NeXtScale n360 M4Hyperscale Server

Page 18: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation18

Number of part numbers needed for the entire

solution – no matter the brand of component

SAVEFaster Time from arrival to production readiness

75% 1£ ¥ €

$

IBM NeXtScale – FlexibilityHow Do You Want Your IT to Arrive?

NeXtScale can be shipped fully configured and ready to power on

– Fully racked and cabled– Labeling with user supplied naming– Pre programmed IMMs and addresses– Burn in testing before shipment at no added cost

Prefer to receive systems in boxes – no problem

IBM Intelligent Cluster

1Per Rack

105 lbs of cardboard1

54.6 ft3 of styrofoam 288 linear feet of wood

21,730 less paper inserts

Customer Benefits

Page 19: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation

IBM NeXtScale SystemWorkload Optimized Stack for Cloud and Technical Computing

19

Cloud Technical Computing

Page 20: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation20

IBM NeXtScale – Flexible Designed on Open Standards = Seamless Adoption

IBM ToolsCenter OpenStack Ready• Consolidated, integrated suite of mgmt tools• Powerful bootable media creator, FW updating

• Deploy OpenStack with Chef or Puppet• Mirantis Fuel, SuSE Cloud, IBM SmartCloud

UEFi and iMM IPMI 2.0 Compliant• Standards-based hardware that combines

diagnostic and remote control; No embedded SW• Richer management experience and

future-ready

• Use any IPMI compliant mgt. software – Puppet, Avocent, IBM Director, iAMT, xCAT, etc.

• OpenIPMI, ipmitool, ipmiutils, FreeIPMI compatible

xCAT System Monitoring• Provides remote & unattended methods to

assist with Deploying, Updating, Configuring, and Diagnosing

• Friendly with open source tools like Ganglia, Nagios, Zenoss, etc.

• Use with any RHEL/SuSE (and clones) or Windows based tools

Platform Computing SDN Friendly• Workloads managed seamlessly with

Platform LSF• Deploy clusters easily with Platform HPC

• Networking direct to system; no integrated proprietary switching

• Support for 1/10/40Gb, Infiniband, FCoE, and VFAs

Page 21: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation21

IBM NeXtScale – SimplicityNeXtScale will keep you in front (of the rack that is)

Cold aisle accessibility to most components Tool-less access to servers Remove a server without touching it’s power Approved for 40OC operation to lower

operating costs

Front-access to networking cables & switches Simple cable routing

(front or traditional rear rack cabling) Power and LEDs all front facing

Which aisle would you rather be working in?Know what cable you are pulling!

Service NeXtScale from the front of the rack

65-80ºF>100 ºF!

Page 22: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation22

IBM NeXtScale – Scale Start at any size. Grow in any increment you want.

Growing node by node?

Available direct from IBM Optimized for availability through our partners Install the chassis today, grow into it tomorrow

Single nodesand chassis

Configured racks or chassis

Complete clusters and containers

Want to speed how quickly you can grow?

Shipped fully assembled Client driven, choice optimized “Starter Pack” solutions are appliance easy, yet flexible

Growing by leaps and bounds?

NeXtScale can arrive ready to power on – ‘personality’ applied Racks at a time or complete infrastructure ready containers

Single Nodes

Rack (s)Chassis or Departmental Solutions

Containers – ‘NeXtPods’

Page 23: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation23

MORE servers/rack6

2X16%Amount of power

saved with Platform LSF

Energy Aware4

15%

One nx360 with SSDs delivers

same IO perf as

355Hard Disks

3X

35%

Maximize the capability of your data center floor with dense and essential IT More servers per floor tile Easy front access serviceability Choice of rack infrastructure Light weight + high performance can

reduce floor loading

Race Car Design – performance and cost point ahead of features/ functions Fastest Xeon E5 2600 v2 processors Fast memory running at 1866Mhz Choice of SATA, SAS, or SSD on

board Open ecosystem of high speed

IO interconnects

40%Less weight per

system5More High

Frequency Cores1

50%Processing

More cores per U than a Xeon E-5

2600 1Us7

Lower power per TFLOP of

performance8

IBM NeXtScale – Scale Maximum impact per $. Per ft 2. Per rack.

Customer Benefits

Memory Runs

FASTER2

Page 24: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation24

Announce: Sep 10 2013

Shipping: Oct 28 2013

6U Dense Chassis

1U tall 1/2 Wide Compute

Departmental HPC

and Cloud Computing Solution

PCI Native Expansion(PCI NEX)

1U (2U tall 1/2 Wide)

GPU or Xeon Phi

Support

Storage Native Expansion (Storage

NEX)

1U (2U tall 1/2 Wide)

Up to 32TB total capacity

6U Chassis will support mix-match nodes

IBM NeXtScale Product Roadmap

Announce: Sep 10 2013

Shipping: Nov 29 2013

Shipping: 2014

More Storage

More IO Options

Next Gen Processors

MicroServers

A Lot MoreComing!

Page 25: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation25

Primary Target Workloads

>60% more drive bay capacity vs x3650 M4 for higher throughput & ample storage Flexible offering of SSDs & HDDs - up to 41.6 TB storage

*50% more cores & cache, 50% greater performance, 17% greater memory speed 12 Gb RAID on board for optimized RAID performance & data protection

*Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB. *Intel Test SPECjbb*2013 benchmark, 07/13. *Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz

Introducing System x3650 M4 HD Ultimate high density storage server, optimized for analytics and business critical workloads

High Performance & Availability Flexible IO & storage options Easy Setup & Serviceability Energy Star compliance Advanced security

Data Management

BigData

SAP / Analytics

Page 26: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation26

50%1 More Cores & Cache50%2 More Performance

17%3 Faster Memory40%4 Lower Power

Better Price Performance

System x3500 M4

1 Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB 2 Intel E5-2690 vs E5-2697 v2 3 Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz 4 Intel Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP, 8/13.

Improved systems with Intel Xeon processorsUnlock New Performance from a Family of Trusted Systems

Analytics, database,cloud, VDI

iDataPlex dx360 M4

High performance & cloud computing

System x3550 M4

Cloud, VDI, analytics, big data, HPC

System x3650 M4

Cloud, VDI, Analytics, Database, HPC

Virtualization, Cloud, Big Data

Flex System x240

BladeCenter HS23

Cloud, VDI, Analytics, Database, HPC

Page 27: IBM Special Announcement session Intel #IDF2013 September 10, 2013

Re-Architecting the Data CenterFor a Services Oriented WorldShannon PoulinVice President, Datacenter and Connected Systems GroupGeneral Manager, Datacenter Marketing GroupIntel Corporation

Page 28: IBM Special Announcement session Intel #IDF2013 September 10, 2013

Intel + IBM: Rich History of Innovation

28

System SolutionsSoftware SolutionsNetworkingStorage

New Business + Opportunities

Technology DevelopmentBluetooth, Infiniband,

PCIeG3, Xen, KVM, Java, Linux Kernel, Hadoop

Industry EnablementBlade.orgPCI.orgOpen Source

Joint CollaborationeX5, BladeCenter, IBM Flex Systems & NeXtScale

Page 29: IBM Special Announcement session Intel #IDF2013 September 10, 2013

IT: Period of Transformation

Focused onProductivity

through automation

Focused onRapid Service

Deliverythrough cloud & devices

Focused onCost Reduction

through connectivity

Computer-Centric Network-Centric Human-Centric‘90s ‘00s Today

Page 30: IBM Special Announcement session Intel #IDF2013 September 10, 2013

INTEL CONFIDENTIAL

Re-architecture of the Datacenter Needed

1: Source: Intel IT internal estimate

Datacenter Today Software-defined Infrastructure

Time to Provision New Service: Minutes1

Time to Provision New Service: Months1

Idea for service

IT scopes Needs

Balance user

demands

Idea for service

Internet of things

PrivatePublic

Self service orchestration Infrastructure

resources composed

Service running

Manually configure Manually configure devicesdevices

Set up service Set up service componentscomponents

Service running

SW components assembled

Page 31: IBM Special Announcement session Intel #IDF2013 September 10, 2013

INTEL CONFIDENTIAL

Software Defined Infrastructure on Intel

OPEN: Standards basedEFFICIENT: Intelligent and scalable

AGILE: Software on high volume servers

Storage ServerNetwork

Page 32: IBM Special Announcement session Intel #IDF2013 September 10, 2013

Launched Today: Intel® Xeon® Processor E5-2600 v2 Product FamilyAt the Heart of a Modern Data Center

Energy EfficientUp to 45% greater energy efficiency1

High PerformanceUp to 50% more performance2

50% more cores and cache (up to 12C, 30MB)Faster DDR3 memory (up to 1866 MTS)

Datacenter ClassUp to 1.5 TB memory support (in 2S system)Improved PCI Express* 3.0 to unleash 10GbEVirtualization and Security innovationWorkload OptimizedAdvanced Vector ExtensionsIO optimized for Intel ® Xeon Phi ™ ProcessorsBalanced for Big Data & Intel® Distribution for Apache Hadoop* software IA Software CompatibilityLeverages Existing SW Ecosystem

IN PRODUCTION NOW!Intel Xeon Processor E5-2600 v2

1Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. *Other names and brands may be claimed as the property of others. Configuration - Server-Side Java* Energy Efficiency: E5-2690 (32GB), E5-2697 v2 (32GB)

Versatile Datacenter Processor powering

IBM’s NeXtScale

System

32

Page 33: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation

Adrian WanderDirector Scientific Computing Department of STFC

Cliff BreretonDirector Hartree Centre

Page 34: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation

Page 35: IBM Special Announcement session Intel #IDF2013 September 10, 2013

© 2013 IBM Corporation35

IBM NeXtScale – Scale Maximum impact per $. Per ft 2. Per rack.

1. Intel Xeon E-5 26xx v2 versus current Intel Xeon3-5 26xx 2. Memory DIMMs running at 1866Mhz versus 1600Mhz in current platforms3. 4 nx360 M4 includes 4 x 1.8” SSDs run which run faster than traditional 2.5” SAS HDDs. SSDs deliver peak performance of 40,000 IOPS versus HDDs at peak of 450

IOPS. 4 x 50,000 = 200,000 IOPS which is equivalent to 355 2.5” HDDs 4. Based on A 1000 node cluster with 2 x86 sockets, 8 core 2.7 GHz, consumes about 340 KW. No hardware changes – optimization of power useage at rest and at peak

utilization.5. Europe (0.15€ per KWh) = 441K€ per year 6. US (0.10$ per KWh) = US$ 295K per year 7. Asia (0.20$ per KWh) = US$ 590K per year 8. As compared to a traditional 1U server like HP DL360 Gen 8 – needs weights for each9. As compared to a traditional 1U server like HP DL 360 Gen 8 in a 42U rack – DL 360 = 42 system max, NeXtScale = 84 systems max10.As compared to a traditional 1U server like HP DL360 Gen 8 with Intel E-5 2600 processors. NeXtScale nx360 M4 with E-5 26xx v2 = 24 cores/system and 48 cores/U, HP

360 Gen8 with top bin E-5 2690 at 16 cores per system and per U.11. Need to get from Intel – v1 compare to v212.As compared to a a traditional 1U server like HP DL360 Gen 8 Weight (maximum config) 17.69kg (39lbs) versus NeXtScale nx360 M4 (6.05kg) + apportioned chassis

(39kg/12 or 3.25kg) = 9.30kg. 9.30 v 17.69 = 47% less weight.13.Calculation based on typical Intel E5 2600 2.6Ghz 8C top bin processor system compared to typical Intel E5 2600 v2 2.7Ghz 12C top bin processor system. 2 sockets.

TFLOPs/2S 2600 v1 = 332.8GFLOPs . TFLOPs/2S 2600 V2 = 518GFLOPs. To achieve 1TFLOP we need 3 v1 systems at 450W each versus 2 v2 systems at 440W each

MORE servers/rack6

2X

3X

35%

40%Less weight per system5

More cores per U than a Xeon E-5 2600 1Us7

Lower power per TFLOPof performance8

16%Amount of power saved with Platform LSF Energy Aware4

15%

One nx360 with SSDs delivers same IO perf as

355Hard DisksMore High Frequency Cores1

50%Processing

Memory Runs

FASTER2

Page 36: IBM Special Announcement session Intel #IDF2013 September 10, 2013

36

Legal DisclaimersLegal Disclaimers

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. other products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. performance of systems available for purchase. Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported. each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported. SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. for more information. Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading. . Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/ or contact your Intel representative for more information. or contact your Intel representative for more information. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: http://www.intel.com/products/processor_number Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice. are for planning purposes only and are subject to change without notice. Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps. product roadmaps. Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. subsidiaries in the United States and other countries. All dates and products specified are for planning purposes only and are subject to change without noticeAll dates and products specified are for planning purposes only and are subject to change without notice*Other names and brands may be claimed as the property of others.*Other names and brands may be claimed as the property of others.

* Other names and brands may be claimed as the property of others.

Page 37: IBM Special Announcement session Intel #IDF2013 September 10, 2013

37

Legal DisclaimersLegal Disclaimers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm4725, or go to: http://www.intel.com/design/literature.htm

* Other names and brands may be claimed as the property of others.

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All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.notice.Intel processor numbers are not a measure of performance.  Processor numbers differentiate features within each processor family, not across Intel processor numbers are not a measure of performance.  Processor numbers differentiate features within each processor family, not across different processor families.  Go to: http://www.intel.com/products/processor_number different processor families.  Go to: http://www.intel.com/products/processor_number

Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.from published specifications. Current characterized errata are available on request.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM).  Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM).  Functionality, performance or other benefits will vary depending on hardware and software configurations.  Software applications may not be Functionality, performance or other benefits will vary depending on hardware and software configurations.  Software applications may not be compatible with all operating systems.  Consult your PC manufacturer.  For more information, visit http://www.intel.com/go/virtualization compatible with all operating systems.  Consult your PC manufacturer.  For more information, visit http://www.intel.com/go/virtualization

No computer system can provide absolute security under all conditions.  Intel® Trusted Execution Technology (Intel® TXT) requires a computer No computer system can provide absolute security under all conditions.  Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE).  Intel TXT also requires the system to contain a TPM v1.s.  For more information, visit compatible measured launched environment (MLE).  Intel TXT also requires the system to contain a TPM v1.s.  For more information, visit http://www.intel.com/technology/security http://www.intel.com/technology/security

Intel, Intel Xeon, Intel Atom, Intel Xeon Phi, Intel Itanium, the Intel Itanium logo, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo Intel, Intel Xeon, Intel Atom, Intel Xeon Phi, Intel Itanium, the Intel Itanium logo, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

Other names and brands may be claimed as the property of others.Other names and brands may be claimed as the property of others.Copyright © 2013, Intel Corporation. All rights reserved.Copyright © 2013, Intel Corporation. All rights reserved.

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Baseline Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2690   (2.9GHz, 8-core , 20MB L3 cache, 8.0GT/s, 135W), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled;  Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score: 4,033. Source: Intel TR#1299 as of 12 Aug 2013.New Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2  (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled;  Hyper-threading: Enabled; Turbo: Enabled; Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score : 5,670. Source: Intel TR#1299 as of 12 Aug 2013. Baseline Configuration and Score on SPECpower*_ssj2008 benchmark: IBM System x3650 M2Baseline Configuration and Score on SPECpower*_ssj2008 benchmark: IBM System x3650 M2 with with two Intel® Xeon® Processor two Intel® Xeon® Processor X5570 (2.93 GHz, 4-core, 8MB L3 cache, X5570 (2.93 GHz, 4-core, 8MB L3 cache, 6.4 GT/s, 6.4 GT/s, 95W)95W), , 8GB memory (4 x 2048MB DDR3-10600R CL9 ECC), 32 GB SATA SSD, Microsoft* Windows Server 2008 Enterprise Edition x64 SP1, IBM J9 VM (build 2.4, J2RE 1.6.0 IBM J9 2.4 8GB memory (4 x 2048MB DDR3-10600R CL9 ECC), 32 GB SATA SSD, Microsoft* Windows Server 2008 Enterprise Edition x64 SP1, IBM J9 VM (build 2.4, J2RE 1.6.0 IBM J9 2.4 Windows Server 2008 amd64-64 jvm pwa6460sr5-20090406_01(SR5) (JIT enabled, AOT enabled). Source: Windows Server 2008 amd64-64 jvm pwa6460sr5-20090406_01(SR5) (JIT enabled, AOT enabled). Source: http://www.spec.org/power_ssj2008/results/res2009q2/power_ssj2008-20090519-00165.html as of June 2009. Score:1,977. Score:1,977New Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2  (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled;  Hyper-threading: Enabled; Turbo: Enabled; Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score : 5,670. Source: Intel TR#1299 as of 12 Aug 2013.

Baseline Configuration and Score on SPECint*rate_base2006 Benchmark: BL265 using two Intel® Xeon® Processor X5570 (2.93 GHz, 4-core, 8MB L3 cache, 6.4 GT/s, 95W), 48GB memory (12x 4GB 2Rx4 PC3-10600R-9, ECC), 73 GB SAS 10 K RPM, SUSE Linux Enterprise Server 11 (x86_64) SP1, Kernel 2.6.32.12-0.7-default. Compiler version: Intel C++ Compiler XE for applications running on IA-32 Version 12.0.1.116 Build 20101116. Source: http://www.spec.org/cpu2006/results/res2011q1/cpu2006-20110215-14599.html as of Feb 2011. Score: 264.New Configuration and Score on SPECint*rate_base2006 Benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping) , EIST Enabled, Turbo Boost enabled, Hyper-Threading Enabled, 128GB memory (8x16GB DDR3-1866), Red Hat* Enterprise Linux Server 6.3. CPU2006-1.2 with Intel compiler IC13.1 Source Intel TR#1270 as of 11 June 2013. Estimated Score: 906. Baseline Configuration and Score on Benchmark: Intel® Server Board S2600GL platform with two Intel® Xeon® Processor E5-2690 (2.9GHz, 8-core, 20MB L3 cache, 8.0GT/s, 135W, C2-stepping), Virtualization Technology Enabled, Turbo Enabled, HT Enabled, NUMA Enabled, MLC Spatial Prefetcher Enabled, DCU Data Line Prefetcher Enabled, 256GB memory (16x 16GB DDR3-1333 DR REG ECC), 128GB SATA SSD, ESXi4.1u1 (build 348481). Source: Intel TR#1359 as of 24 July 2013. Score: 1723 @ 108VMs.New Configuration and Score on Benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping), Virtualization Technology Enabled, Turbo Enabled, HT Enabled, NUMA Enabled, MLC Spatial Prefetcher Enabled, DCU Data Line Prefetcher Enabled, 256GB memory (16x 16GB DDR3-1866 DR REG ECC), 128GB SATA SSD, ESXi 5.1(build 799733). Source: Intel TR#1359 as of 24 July 2013. Score: 2246 @ 144VMs