China Semiconductor Technology International Conference

SEMICON China 2011

SEMI 2011

A-1

An Electronic Material Supplier’s perspective on Challenges and

Opportunities in 3D Packaging

Mr. Leo Linehan

Global Business Director of Advanced Packaging Technologies, Dow Electronic

Materials

Biography （（（（up to 100 words））））

Leo Linehan has more than 20 years of experience in the semiconductor packaging and manufacturing.

Prior to joining Dow, he held several roles in materials development, process engineering, R & D, and

business development at both Rohm & Haas and the IBM Microelectronics Division. Leo has authored

numerous papers in semiconductor applications and holds more than 20 patents.

Abstract: (200 – 500 words)

3D packaging is a competitive market with an ever expanding diversity of package designs and

manufacturing processes. The rapid growth in 3D packaging is largely driven by strong consumer demand

for ultraportable electronics with higher performance and more functionality. A review and discussion of

the significant challenges and opportunities in 3D packaging for material suppliers will be presented.