ht summary slides. high temperature complete high-temp (ht) signal-chain solutions for harsh...

HT SUMMARY SLIDES

High Temperature

Complete High-Temp (HT) signal-chain solutions for harsh environments

Unique Die and Packaging optimized for HT

Thermal shut-down removal

HT products offerings:

HT Plastic -55C to 175C

HT Ceramic -55C to 210+C

HT Die -55C to 210+C

Two HT Product Types• High Temperature (HT) 200°C parts

• -55°C to +210°C - 1000 hours• Ceramic & KGD packaging

• 175°C Plastic Parts• -55°C to +175°C operation• Plastic surface mount packaging

The are 3 areas TI has developed expertise to guarantee reliability on our released HT products

• Initial qualification of process, package and silicon across temperature

• Silicon, Package Material set and Process modifications

• On-going production quality monitors

TI High Temperature Products

TI Enhanced Industrial Packaging

Up to 175°C Plastic Packaging

Complete signal chain solutionsRuggedized Packages

Widest Package Type OptionsSmallest Footprint

Bare Die/WafersSolutions

• Smallest size

• Most Integration

• Multiple options

• 25°C tested wafers to

• -55°C to 210°C Known Good

Die (KGD)

• Broad portfolio

Up to 150°C Plastic Packaging

• Ruggedized Applications

• Enhanced Qualification

• Extended Temperature

• Up to -55°C to 175°C

• Multiple Package types

• Special High

Temperature Material Sets

• Ruggedized Applications

• Enhanced Qualification


• Up to -55°C to 150°C


Up to 210°C Ceramic Packaging

Hermetic Packages

• Extreme Applications

• HT Qualification


• Up to -55°C to 210°C


• Most rugged hermetic

material option

Down HoleSignals

Temperature

Pressure

Position

Speed

Flow

Resistivity

Rock Density

SignalConditioning

OPA2333-HTOPA211-HTINA129-HT

INA271-HTTHS4521-HT

INA333-HT

OPA820-HT

ADS1278-HTADS1282-HTADS1243-HTADS8320-HTADS8509-HT

A to D

SM470R1B1M-HT SM320F2812-HTSM320F28335-HTMSP430F2619-HTOMAPL137-HT

DSP/MCU

TPS76901-HTTPS62000-HTTPS62110-HTTPS40200-HT

REF5025-HT

TPS40210-HT

Power

SN65HVD233-HTSN65HVD11-HTSN65HVD1040-HT

Interface

High Temperature Offering

Legend

150/175C Plastic

210C Ceramic/KGD

SM28VLT32-HT

Memory

TPS50301-HT

ISO7221-HT

TPS54363-HT

ADS6142-HT TPS7H1201-HT


HT Webpage: http://www.ti.com/ht

TI HiRel Contact:Mont Taylor

[email protected]

(903) 868-6316

Comments/Feedback

Please Visit : www.ti.com/ht

7

Full TI High Temperature Products Presentation

HiRel Business SegmentsHigh TemperatureEnhanced Products

Complete signal chain solution for Space environments

QMLV-certified wafer fabs

RHA certification

Radiation hardening IP

TID/SEE testing on products

Space Bare Die

Complete High-Temp (HT) signal-chain solutions for harsh environments

Unique Die and Packaging optimized for HT

Thermal shut-down removal

HT products offerings:

HT Plastic -55C to 175C

HT Ceramic -55C to 210+C

HT Die -55C to 210+C

Commercial-of-the-shelf (COTS) plastic solution for long life-cycle applications

Controlled baseline, traceability

Extended Product Change Notification (PCN)

Extended Temperature (-55C to 125C)

Additional test coverage and characterization

Ability to support complete signal chain solutions in die form

Full Known-good die (KGD) for military, space and high temp applications

Tested die (TD) for commercial applications

Wafer support and small quantity waffle pack support

HiRel Products Life Cycle

IntroPhase OutDeclin

eMaturityGrowt

h

ConsumerLife Cycle

As short as 9 months

As long as 30 years

ProductLongevityAssured

ProductLongevityAssured

Extended product life cycles• Obsolescence mitigation • Supply beyond commercial availability• Product resurrection

Leading-edge technology and manufacturing• HiRel approved fabs (certified by Defense &

Aerospace standards)• Access to latest process technologies (HPA07, BiCom, etc.)• Broad packaging capabilities

Market expertise• Baseline control and qualification per unique

market requirements: TID, SEU, high-temp, ceramic, QML –Q/V, EP, die solutions, etc.

Commitment

TI HiRel Advantage

• 30+ years of experience working with HiRel customers • Largest dedicated organization in the industry • Worldwide sales and support infrastructure

High temperature and harsh environments markets

Heavy Industrial• Chemical

Processing• Sensors• Actuation/

Control

Avionics• Jet Engines• Brakes

Geothermal• Drilling• Well monitoring

Down hole• Drilling• Logging• Well monitoring

Medical• Autoclave• Sterilization

• Low power• Qualified operation >150°C

• Ruggedized packages• Small size

Market requirements

10

11

TI HiRel High Temperature Products

Two HT Product Types

• High Temperature (HT) 200°C parts• -55°C to +210°C - 1000 hours• Ceramic & KGD packaging

• 175°C Plastic Parts• -55°C to +175°C operation• Plastic surface mount packaging

HT Reliability

• There are 3 areas TI has developed expertise to guarantee reliability on our released HT products1. Initial qualification of process, package and silicon

across temperature

2. Silicon, Material set and Process modifications

3. On-going production quality monitors

13

Parametric Characterization done for each HT Release

Operational Mode Idd in mA vs. Temp

240

250

260

270

280

290

300

310

320

330

340

25 125 160 185 220 250MeanStdDevMinMaxQ3Q1

249.3034 254.0111 259.4265 265.0004 279.1381 296.36564.0199 3.4564 4.2324 3.7693 4.9385 23.7235

243.8160 248.9640 253.4000 260.4060 273.5630 259.7050255.9840 258.9500 266.4850 270.3570 287.7660 339.9770252.8040 257.2870 262.3755 267.6970 281.8740 306.9300246.4630 251.6250 256.1458 261.5813 274.8520 280.7270

Vmin in Volts Core DSP 150Mhz vs. Temp in DegC

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

25 125 160 185 220 250MeanStdDevMinMaxQ3Q1

1.5000 1.5333 1.5778 1.6111 1.6111 1.67500.0000 0.0500 0.0667 0.0333 0.0333 0.07071.5000 1.5000 1.5000 1.6000 1.6000 1.60001.5000 1.6000 1.7000 1.7000 1.7000 1.80001.5000 1.6000 1.6000 1.6000 1.6000 1.70001.5000 1.5000 1.5000 1.6000 1.6000 1.6000

• Functionality• AC and DC Parametrics• Speed / Performance• Leakages & Power Analysis• IO Peripheral timing / performance

14

High Temperature 210°C Quality and Reliability

• Package Qualification– Bond Strength– Die Attach Strength– Mechanical Shock (1.5K g)– Constant acceleration (30K g)

• Technology Verification– Electromigration Design Rule Verification – Voltage Box Characterization– Negative Bias Temperature Instability Rules Verification– Operational Characterization (from three lots)

• Life Test (1000Hours/200°C)– By technology node (function, wafer fabrication process, and feature size)– 2,000 hours at 200°C, 1000 hours to release– Static (e.g., Analog) or Dynamic (e.g. DSP/MCU)– Sample size is 15 units minimum (3 lots) with no failures

– Variable Frequency Vibration (20 g peak 20Hz to 2KHz)– Temperature Cycle (-65°C/+150°C 1000 cycles)– Hermetic test (Fine and Gross Leak)– Thermal Shock (-65°C/+150°C 100 cycles)

These qualification tests are typically preformed for each new 210°C HT Ceramic product release

New Leadform Packages

84-pin Ceramic QFP

8-pin Ceramic FP

Leadformed ReleasesADS8320SHKQ Released

OPA2333SHKQ Released

SN65HVD1040SHKQ Released

OPA211SHKQ Released

REF5025SHKQ Released

INA271SHKQ Released

INA129SHKQ Released

TPS76901SHKQ Released


INA333SHKQ Released

THS4521SHKQ Released


ADS1278SHKP Released

SM470R1B1MHKPS Released

175°C Plastic Packages

• There are several ways TI provides a ruggedized plastic package for our 175C offerings

• We have a different material set than the commercial/industrial devices to improve reliability at temperature

• Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch

• Special bonding wires and processes to minimize Kirkendall voiding causing degraded bond strength

17

Material Set

Material Set

Material Set Material Set

WaferFab

WaferFab

WaferFab

One Wafer Fab

Differences in Flows

AT Site

Commercial IC Flow - Cost Driven

EP Flow- Quality Driven

AT Site AT Site AT Site

Commercial products can be built in multiple FABs, AT sites and may use various material sets for each product build

EP products are built in one FAB, one AT site and

use one material set for product build

HTMaterial Set

One Wafer Fab/HT Die

AT Site

HT Plastic Flow- Quality and Temp Driven

HT products are built in one FAB, one AT site and

use one material set optimized for HT

19

175°C Plastic Package Qualification

• Preconditioning (surface mount packages)• HTSL (Bake): 2000 hours at TA = TJ, where TJ is the maximum

recommended operating temperature for the device type• Temperature Cycle: 500 cycles at -65°C to +150°C• Electrical Test: per datasheet at +125°C minimum with additional pin-to-pin

leakage testing.• CSAM: 5 units/lot• TSAM (PowerPad packages only): 5 units/lot• Bond Pull: 5 units/lot - 15 wires/device• Bond Shear: 5 units/lot - 15 bonds/device• Cross section: 1 unit/lot - 1 bond/unit or 1 bump/pad

The following high temperature plastic package qualification test sequence is required for each pin/package and die technology combination in addition to the EP standard qualification requirements. Data can be combined from different device types from the same pin/package and die technology.

HT Plastic QualificationInitialX-Ray

CSAM Bond Cross Section Bond Pull

Before

After

Commercial plastic failing HT Qual• Delamination• Bond degradation

175°C Plastic Package Summary

• TI HT Plastic parts use special leadframes, mold compounds, die attach, and bonding

• We have a material set different from the commercial/industrial devices to improve reliability at temperature

• Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch

• Special bonding wires and pad processes to mimimize Kirkendall voiding causing degraded bond strength

21

High Temperature Wafer Lot Qualification

• New qualification test performed on each HT wafer lot• 45 units from every wafer lot used for HT products will be

subjected to:– 210C burn in for 240 hours then,– End point electrical testing at operating temperature of -55C t o

210C– Requirement for all to pass standard HT tests– Allows any parametric drifts to be observed

• Requirement for all new HT products beginning in 2Q’12.• Allows HiRel to keep a tight monitor on all HT products to

control process variations that might affect performance across temperature.

22

High Temperature ProductsHigh Temperature Products

ProcessorProcessor CommunicationInterface

CommunicationInterface

DC/DCController

DC/DCController

PowerFET

PowerFET

PowerDriverPowerDriver

Power FETs

or BJTs

Power FETs

or BJTs

Point OfLoad

Power

Point OfLoad

Power

FlashMemory

FlashMemory

TI HT Roadmap

HT Advantage & Qual

Digital To Analog

Converter

Digital To Analog

Converter

VoltageReference

VoltageReference

Analog to Digital Converter H.E.A.T. EVM

High Temperature Qualified Data ConvertersHigh Temperature Qualified Data Converters

Released

DevelopmentDevelopment

Sample Rate (SPS)

Res

olu

tio

n (

Bit

s)

14

16

DAC

<1 100K

Planned

ADS1243-HTOctal Low Power

24-bit ΔΣ ADC24

ADS8320-HT16-bit 2.7V to 5V

µ-Power Sampling ADC

250K128K

ADS1278-HTOctal Simult. Sampling

24-bit, 128KSPS ΔΣ

65M

ADS6142-HT14-bit, 65 MSPS ADC w/

selectable outputs

4K

ADS1282-HTHigh Resolution ΔΣ,

250SPS to 4KSPS ADC

210

210 175

210 175

ADS8509-HT16-bit 250kHz CMOS ADC

175

210

210 175

210

175

DIE

PFLC

210 °C Ceramic175 °C PlasticDiePre-formed lead ceramic

DIEDIE

DIE

DIE

DIE PFLC

PFLC

175

High Temperature Qualified Instrumentation AmplifiersHigh Temperature Qualified Instrumentation Amplifiers

Released


Inp

ut

Off

set

(µV

)

50

25

130

Planned

500200 1,000

Bandwidth (kHz) for G=100

INA333-HTLow Power Single Supply

Instrumentation Amp

INA271-HTVoltage Output Wide

Common-Mode Shunt Monitor

10K

INA128-HTLow Power Wide-Supply

Instrumentation Amp

210

210 175

210

210

175

DIE

PFLC


DIE

PFLC

DIE

PFLC

High Temperature Qualified AmplifiersHigh Temperature Qualified AmplifiersHigh Temperature Qualified AmplifiersHigh Temperature Qualified Amplifiers

Released


TemperatureSensors

DifferentialAmplifiers

StandardOp-Amps

Planned

THS4521-HTSingle-Channel

Rail-to-Rail Output Differential Amp

LM9517213 to 16-bit Digital

Temperature Sensor

OPA2333-HTVery Low PowerZero-Drift Series

OPA211-HT1.1nV/√Hz

45MHz +/-10V

OPA820-HTUnity-Gain Low-Noise

Voltage Feedback Op-Amp

210

210 175

210 175 210 150 210

210

175

DIE

PFLC


DIE PFLC

DIE PFLC DIE PFLC

DIE PFLC

High Temperature Qualified AmplifiersHigh Temperature Qualified AmplifiersHigh Temperature Qualified Power ManagementHigh Temperature Qualified Power Management

Released


VoltageReferences

DC-DC POL Converter

Planned

REF5025-HT2.5V Precision

Voltage Reference

TPS50301-HT3Amp, 3V to 7V

Step-Down SWIFT DC/DC Converter

DRV8332-HTMotorDriver

LM5116WG-HTWide Range 100V

Synchronous Buck Controller

LDOTPS76901-HT

Single-Output 100mA Adjustable LDO

MotorDriver

DC/DC Controllers

TPS40200-HTWide Input, Low-pin

Buck Controller

TPS40210-HT4.5 to 52V Input

Current-Mode Boost Controller

DC-DC POL Converter

TPS62110-HTAdjustable,

Step-Down Converter

210 175

210 175

210

175

210 175

210

TPS54362-HT1Amp, 48V Step-Down

SWIFT DC/DC Converter

210 175

210

210

175

DIE

PFLC


TPS7H1201-HTSingle-Output 500mA

Adjustable LDO

210

DIE PFLC

DIE

PFLC

DIE

DIE DIE

PFLC

DIE

DIE

High Temperature Qualified AmplifiersHigh Temperature Qualified AmplifiersHigh Temperature Qualified Processors and MemoryHigh Temperature Qualified Processors and Memory

Released


Planned

SM320F28335-HTDigital Signal Controller

EmbeddedProcessors

EmbeddedControllers

MSP430-HT16-bit Ultra Low Power

MCU

SM470R1B1M-HTARM 7 Microcontroller

OMAPL137-HTC674x DSP + ARM9

Processor

Memory SM28VLT32-HT

4MByte FLASH Storage Device Memory

210

175

SM320F2812-HTDigital Signal Controller

150 210 150 210 150 220

DIE PFLCDIEDIEDIE

DIE

DIE PFLC

High Temperature Qualified AmplifiersHigh Temperature Qualified AmplifiersHigh Temperature Qualified Interface ProductsHigh Temperature Qualified Interface Products

Released


RS485

Planned

SN65HVD1040-HTLow-Power CAN

Transceiver with BUS Wake-Up

Isolators

CAN

SN65HVD233-HTCAN Transceiver

with Diagnostic Functions

ISO7221C-HTDual High-Speed Digital

Isolator

SN65HVD11-HT3,.3V RS485 Single Half-

Duplex Transceiver

210 175 210

175

210 175

DIE PFLC

DIE PFLCDIE PFLC

Introducing the H.E.A.T. EVMHarsh Environment Acquisition Terminal (H.E.A.T.) EVM

Features and benefits

•Full high-temperature data acquisition system utilizing TI’s comprehensive signal-chain product portfolio

• Eight Analog Input Channels– Six channels optimized for temperature, pressure sensors

and accelerometers

– Two general-purpose channels (fully differential and single-ended)

• Comprehensive set of TI components qualified for– Operating temperatures from -55ºC to 210ºC

– Minimum 1,000 hours operating life

• Board is made with polyimide material, and incorporating high-temperature rated passive components and solder materials

• EVM is test oven ready and can withstand temperatures up to 200°C for 200 operating hours.

H.E.A.T. EVM high-temperature components

• SM470R1B1M-HT – ARM7 microcontroller

• ADS1278-HT – octal simultaneous sampling 24- bit 128KSPS ADC

• OPA211-HT – low-noise operational amplifier

• SM470R1B1M-HT – ARM7 microcontroller

• ADS1278-HT – octal simultaneous sampling 24- bit 128KSPS ADC

• OPA211-HT – low-noise operational amplifier

• OPA2333-HT – low power zero-drift series operational amplifier

• INA333-HT – zero drift, low power, single supply instrumentation amplifier

• THS4521-HT – low-power fully differential amplifier

• OPA2333-HT – low power zero-drift series operational amplifier

• INA333-HT – zero drift, low power, single supply instrumentation amplifier

• THS4521-HT – low-power fully differential amplifier

• REF5025-HT – 2.5V precision voltage reference

• SN65HVD233-HT – CAN transceiver

• SN65HVD11-HT – RS485 transceiver

• REF5025-HT – 2.5V precision voltage reference

• SN65HVD233-HT – CAN transceiver

• SN65HVD11-HT – RS485 transceiver

New HT Design Support for 2013

• H.E.A.T. Power Reference Design – Demonstrating TI HT power solutions– Sequencing

• TPS50301-HT POL Evaluation Board– Standard temperature board and evaluation

– Spot for TPS7H1201-HT LDO when available

• HT FLASH EVM• Generic HT Op Amp Board

PowerHEAT EVM w/ Voltage Sequencing

+3.3V uP

120msec

POR

500 usec

1.8V uP

1.8V Adc

+3.3V Adc

+5.0V Adc

Sequencing Timing Diagram

500 usec

120msec

• Output Voltages:• 3.3V uP• 3.3V Adc ( Analog)• 1.8V uP• 1.8V Adc (Analog)• 5.0V Adc (Analog)

Vin = 6V - 52V Reverse

Protection

Bias

TPS40200-HT

Buck

Converter

+5V @ 250mA

+5V Bus

+5V Analog

TPS40200-HT

TPS40200-HT

TPS40200-HT

TPS50301-HT

Buck Converter

Buck Converter

Buck Converter

3.3V @ 100mA3.3V uP

3.3V Analog3.3V @ 100mA

1.8V @ 50mA

1.8V Analog

InputFilter

InputFilter

InputFilter

InputFilter

Switched

+5V Analog

uP power

uP power

Analog Power

Analog Power

1.8V uP

1.8V @ 200mA

Sequencing logic(using REF5025-HT

& OPA211-HT)

Input Current

sense

INA271-HT

Input Current Sense signal

TPS76901-HT

LDO

uP power

Buck Converter

TPS40210-HT

Boost

-+8V @ 20mAInputFilter

Converter

Bias Voltage

Generator

TPS7H1201-HT

+5V Analog+1.8V @ 250mA

6V Input

HIGH TEMP POL EVM

TPS50301-HTBuck Converter 2.5V @ 3A

PVin = 1.6V - 6.3V

Vin = 3V - 6.3V

TPS7H1201-HT +1.8V @ 250mALDO

Iout Max = 3A

Optional

With External Overload Protection

Generic HT Op Amp Board• Unpopulated HT board for oven evaluations• Options for multiple configurations

4MB HT Flash EVM Board

• Simple HT board allowing oven testing of 14-pin ceramic package




[email protected]

(903) 868-6316

Comments/Feedback


HT PRODUCT ONE PAGE OVERVIEW SLIDES

ReleasedReleasedADS1278-HT Octal Simultaneous Sampling 24-Bit 128KSPS ADC

• Simultaneous Sampling of 8 inputs up to 128KSPS Data Rate @ 103 dB SNR

• Low-Power: 52 kSPS, 57 mW/ch• SPI or Frame-Sync Serial Interface• AC Performance:

• -96 dB THD• 101 dB SNR (High Resolution Mode)

• Linear Phase Digital Filter • Modulator Output Option (digital filter bypass) • ENOB = 16.9 bits at 210C

• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Selectable Operating Modes:

Mode Data Rate SNR Power Diss.

High Speed 128kSPS 96dB 985mW

High Resolution 52kSPS 101dB 985mW

Low Power 52kSPS 97dB 455mW

Low Speed 10kSPS 98dB 120mW

• -55°C to +175°C (64-pin Plastic QFP (PAP) – 1Q13• -55°C to +210°C (84-pin Ceramic QFP (HFQ) & KGD)• -55°C to +210°C (4Ceramic Lead-formed FP (HKP))

• Down-Hole Drilling• High Temperature Environments• Vibration Analysis• Pressure Sensors• Acoustics


ADS1282-HT Ultra-High Performance ΔΣ ADC with Low-Noise PGA

• -55°C to +175°C (28-pin Plastic TSSOP (PW)) – Released• -55°C to +210°C (28-pin Ceramic DIP (JDJ) & KGD) – Released

• Extremely High Resolution• 122-dB SNR (250 SPS, High-Res. Mode)• 119-dB SNR (250 SPS, Low-Power Mode)

• Ultra-Linear – THD: –101 dB, INL: 0.5ppm• Flexible Data Rate: 250SPS to 4KSPS• Onboard High Performance Digital Filter:

• SINC + FIR + IIR (selectable)• Linear or Minimum Phase • 0.5Hz to 7.5Hz High Pass• Filter Bypass Mode

• Low Power: 56.1 mW (High-Res. Mode) and 46.1 mW (Low-Power Mode)

• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability

4th order∆Σ

Mod.

ProgrammableDigital Filter & Calibration

SPIPGA

MUX

In1

In2

AVDD VREF

AVSS DGND

DVDD

Over-Range

Mod. Out

CLKSYNCPWDNRESET

ADS1282

Serial InterfaceI/O

1 to 643

ReleasedReleased


ADS1243-HT Octal Low Noise Low-Power 24-Bit ADC

• -55°C to +210°C – Released• -55°C to +175°C – Potential

• 24-Bits No Missing Codes• Up to 8 Inputs Channels and Eight Data I/Os• Programmable 15SPS Data Output Rates• Internal Input Buffer and PGA• 21-Bits Effective-Resolution (PGA=1)• On-Chip Calibration• Highly linear (no linearity below 15ppm) • Simultaneous 50 Hz and 60 Hz Rejection• Single-Cycle Settling• External Differential Reference of 0.1V to 5V• SPI Interface Compatible• 1ppm of full-scale Noise Performance• 600 µW/ch power consumption • 20-pin Ceramic FP (SJD), KGD and PW packages

• Multiple transducer signals can be easily sampled using the internal multiplexer

• Allows user to measure input signals from 20mV (full-scale) to VDD

• Allows user to easily correct for off-set errors by issuing a calibration command

• Enables high accuracy measurements throughout entire input range

• Excellent 50 and 60Hz Rejection• Controlled Baseline• One Assembly/Test Site & Fabrication Site• Extended Product Life Cycle• Product Traceability

AIN4 / D4

AINCOM

AIN5 / D5

AIN6 / D6

AIN7 / D7

AIN0 / D0

AIN1 / D1

AIN2 / D2

AIN3 / D3

MU

X

ClockGenerator

SPISerial

Interface

ADC

Control

BUF PGASCLK

POL

DIN

DOUT

CS

RESET

SYNC

DRDY

VREF+ VREF-

PWDN

Offset DAC

1:128

XIN

XOUT

AVDD AGND DVDD DGND

ADS1240/41

ReleasedReleased


ADS8320-HT 16-Bit High-Speed, 2.7 to 5V microPower Sampling ADC

• -55°C to +210°C (8-pin Ceramic FP (HKJ) and KGD) – Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

• 16-Bit, 100kHz Sampling Rate• MicroPOWER:

• <4mW at 100kHz and 2.7V• Power-Down: <60 uW• Serial SPI and SSI Interface• 8-pin Ceramic FP (HKJ) Package and KGD

• Pin-out compatible with ADS7816 and ADS7822

• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability

ReleasedReleased


ADS8509-HT 16-Bit 250KSPS True Bipolar Serial ADC

• -55°C to +175°C – Released

• 250-kHz Sampling Rate• 4V, 5V, 10V, ±3.33V, ±5V, ±10-V Input

Ranges• SPI Compatible Serial Output • Daisy-Chain (TAG) Feature• On board reference, reference buffer & Clock• Internal or External Reference• Low Power Dissipation at 250 KSPS• Simple DSP Interface• 20-pin Plastic (DB) Package

• Pin Compatible With ADS7809• Low Off-Set• Very Low Off-set Drift• Data can be read during device power-down• Highly Integrated- with onboard reference,

reference buffer and conversion clock • Long-term stability from No Probing Laser

Trim• Controlled Baseline• One Fabrication and Assembly/Test Sites• Extended Product Life Cycle• Product Traceability• Selectable Operating Modes:

R1IN SB/BTC-

BUSY-

Data

Dataclk

R/C-SAR

COMPARATOR

Serial Data Out &

Control

BU

F

ClockREF2.5V INTERNAL

REFERENCE4K

4.9K

9.8K

2.5KR3IN

R2IN

CAP

EXT/INT-

CS-

PWRD

CDAC

10K

ReleasedReleased

ReleasedReleasedADS6142-HT Low-Power High-Performance 14-bit, 65 MSPS ADC w/ Selectable outputs

• -40°C to +210°C KGD – Released• -55°C to +175°C (Plastic) – RTM 2H13

• 14-bit resolution with No Missing Codes• Maximum Sample Rate: 125 MSPS• Selectable LVDS or CMOS outputs• No External Decoupling required for Reference• 74.7 dBFS SNR, 95 dBc SFDR at 50MHz IF• Internal coarse and fine gain settings

• 73.5 dBFS SNR, 96 dBc SFDR @ 50MHz IF• 70.4 dBFS SNR, 80 dBc SFDR @ 170MHz IF

• Low power dissipation: 285mW (CMOS)• Programmable Output Clock Position and Drive

Strength to Ease Data Capture• 32-pin plastic package and KGD

• Highest performance 14-bit available gives best performance in extended temperatures

• Better dynamic performance, Gain, and programmability enables more margin

• Low power enhances battery life and reduces thermal effects

• Gain and other programmable settings allow device to be optimized to your needs

• Controlled Baseline• One Fabrication and Assembly/Test Site• Product Traceability• Extended Product Life Cycle• Extended Product-Change Notification

• Down-Hole Drilling• High Temperature • Vibration Analysis• Pressure Sensors• Acoustics

ReleasedReleasedLM95172 13-Bit to 16-Bit 200°C Digital Output Temperature Sensor with 3-Wire Interface

• -40°C to +200°C

• Analog and Digital Supply Voltage: 3.0V -5.5V• Total Operating Supply Current: 400 μA (Typ)

• Shutdown −40°C to +175°C → 12 μA• Shutdown −40°C to +200°C → 28 μA

• Temperature Accuracy:• +175°C to +200°C → ±3.0°C (max)• +160°C to +175°C → ±2.0°C (max)

• Temperature Resolution:• 13-bit: 0.0625°C/LSB• 16-bit: 0.0078125°C/LSB

• Conversion Time:• 13-bit: 43 ms (Max)• 16-bit: 350 ms (Max)

• 10-pin Ceramic Dual Flat-Pack Package

• Shutdown mode saves power yet wakes up for one-shot temperature update

• Integrated linear ΔΣ ADC produces high accuracy, fast conversion rates and extremely low output noise which improves system performance

• Universal SPI and MICROWIRE Bus interface standards provides flexibility

• High noise immunity of the Serial I/O (SI/O) output is ideal for challenging electromagnetic environments

• Controlled Baseline• One Fabrication and Assembly/Test Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification

• Down-Hole Drilling• Automotive high temperature applications • Heavy Industrial Power Controllers • Heavy Industrial motors, gear boxes• Geothermal instrumentation • High Temperature Test Equipment

ReleasedReleasedINA129-HT Precision, Low Power Instrumentation Amplifiers

• Low Offset Voltage• Low Drift: 1μV/C max• Low Input Bias Current: 50nA max• High CMRR: 110dB min• Inputs Protected To 40V• Wide Supply Range: 2.25V to 18V• Low Quiescent Current: 2mA• 8-pin Ceramic Dual FP (HKJ) and Ceramic DIP

(JDJ) Packages and KGD

• Ideal for Bridge, Thermo-couple, and RTD Sensor, Amplifier and Data Acquisition applications

• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


Bridge Amplifier

INA129

• -55°C to +210°C (8-pin Ceramic Dual FP (HKJ)) – Released• -55°C to +210°C (8-pin Ceramic DIP (JD) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

ReleasedReleasedINA333-HT Micro-Power, Zero Drift, Low Power, Single Supply Instrumentation Amplifier

• -55°C to +210°C (8-pin Ceramic Dual FP (HKJ)) – Released• -55°C to +210°C (8-pin Ceramic DIP (JD) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released• -55°C to +175°C (8-pin Plastic SOIC (D)) – Potential

• Low Offset Voltage: 15uV• Low Drift: 0.2uV/C• Low Input Bias Current: 2044pA max• Input Voltage Noise: 55nV/rt-Hz, 1kHz• Supply Current: 345uA max• Wide Supply Range: 1.8V to 5.5V• RFI Filtered Inputs• 8-pin Ceramic Dual FP (HKJ), Ceramic DIP (JD)

Packages, KGD, and Plastic SOIC (D)

• Creates excellent accuracy• Ideal for maximum power efficiency• Easy compatibility for battery powered apps• Great for high impedance applications• Low Noise • Enables high accuracy • Enhances noise immunity• Controlled Baseline• One Fabrication and Assembly/Test Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


ReleasedReleasedINA271-HT Voltage Output High-Side Current Shunt Monitor

• -16V to 80V common-mode range• Extended Bandwidth: Up to 130kHz • Split stages for filtering• Two gain option family

• INA270: 20 V/V (potential)• INA271: 14 V/V

• Eliminates need for additional protective components in the event of supply reversals

• Buffered output with filtering for simplified use in current control loops

• Preserves buffered voltage output • Saves using an additional Op-Amp• Controlled Baseline and Product Traceability• One Fabrication and Assembly/Test Site• Extended Product Life Cycle• Extended Product-Change Notification


• -55°C to +210°C (8-pin Ceramic Dual FP (HKJ) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released• -55°C to +175°C (8-pin Plastic SOIC (D)) – Potential

THS4521-HT One Channel RRO Ultra Low Power Fully Differential Amplifier

• Low Iq, Power-Down mode• Bandwidth: 145 MHz, Slew Rate: 490 V/μs• Low Input Voltage Noise• Negative rail input & output Common-Mode

Control • RRO – Rail-to-Rail Output• Single, Dual and Quad options• 2.5 to 5.5 (or ±1.25V to ±2.75) Supply Operation• 8-pin Ceramic Dual FP (SHK) and KGD

• Low quiescent current• Delivers high accuracy for 24-bit conversion• Allows easy DC coupling to ADC• Larger outputs with low voltage applications• Flexible supply for power sensitive apps• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification

THS4521 Driving a 24-bit Delta Sigma ADC


• -55°C to +175°C (8-pin Plastic SOIC (D)) • -55°C to +210°C (8-pin Ceramic Dual FP (SHK) and KGD) – Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

ReleasedReleased

INA128-HT Precision, Low Power Instrumentation Amplifiers


• Low Offset Voltage• Low Drift: 1μV/C max• Low Input Bias Current: 30nA• High CMRR: 120dB min• Inputs Protected To 40V• Wide Supply Range: 2.25V to 18V• Low Quiescent Current: 2mA• 8-pin Plastic SOIC (D) Package

• Ideal for Bridge, Thermo-couple, and RTD Sensor, Amplifier and Data Acquisition applications



Bridge Amplifier

INA128

ReleasedReleased

ReleasedReleasedOPA2333-HT Very Low Power Zero-Drift Series Operational Amplifier

• Ultra-Low Quiescent Current: 80µA (max)• Low Offset Voltage: 26µV (max)• Offset Voltage Drift: 0.05µV/°C• Low Voltage Noise: 1.5 µVP-P

• Bandwidth: 350kHz• Rail-to-Rail Input and Output • Single-Supply Operation• 1.8V to 5.5V Supply Voltage

• Low Offset and Drift Removes Need for Calibration in Application

• RRIO Increases Dynamic Range• 1.8V Supply Excellent for Battery Devices• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


• -55°C to +175°C (8-pin Plastic SOIC (D)) - Released• -55°C to +210°C (8-pin Ceramic DIP (JD), Ceramic

FP (HKJ) and KGD) – Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP

(HKQ)) – Released

ReleasedReleasedOPA211-HT Lowest Power 1.1nV/√Hz 36V Operational Amplifier

• -55°C to +210°C (8-pin Ceramic QFP (HKJ) and KGD)–Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

• Low Noise Bipolar Input: 1.1nV/√Hz at 1kHz• Low Offset Voltage: 260µV (max)• Low Offset Voltage Drift: 2µV/°C (max)• Low Quiescent Current: 7.5mA (max)• Wide Gain Bandwidth: 80MHz @ G=100• Wide Supply Range: ±2.25 to ±18V• Slew-Rate: 27V/μs• 16-Bit Settling: 750 ns• Output Current: 30 mA• Rail-to-Rail Output (unique in industry)• 8-pin Ceramic QFP (HKJ) Package and KGD

• Provides Minimal Signal Distortion• Very High Signal Accuracy• Very Wide Dynamic Range• Spans 5V to Full Industrial Range• Maximum Amplification at any VCC Range• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability


50

4.5

50

4.5

OPA2211-HT Dual Lowest Power 1.1nV/√Hz 36V Operational Amplifier

• -55°C to +175°C

• Low Noise Bipolar Input• Low Offset Voltage• Low Offset Voltage Drift• Low Quiescent Current• Wide Gain Bandwidth• Wide Supply Range: ±2.25 to ±18V• Slew-Rate: 27V/μs• Output Current: 30 mA• Rail-to-Rail Output • 8-pin Plastic SOIC (D) Package

• Provides Minimal Signal Distortion• Very High Signal Accuracy• Minimal Offset Change Over Temperature• Lowest Power at this Noise Level• Very Wide Dynamic Range• Spans 5V to Full Industrial Range• Maximum Amplification at any VCC Range• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability



ReleasedReleasedTPS40200-HT Wide Input, Low Pin Count Buck Controller

• 5.5V to 52V operation• Voltage Mode Control with Feed Forward

Compensation • 753mV Voltage Reference• Internal Under-Voltage Lockout• Programmable Frequency (35kHz-500 kHz) • Programmable Over-current Protection• Frequency Synchronization• Closed Loop Soft Start• Integrated Driver

• Many Applications w/ Wide input range• Voltage feed forward – great line regulation,

fast transient response• Programmability allows frequency, over-

current protection under voltage lockout• Softstart enables smooth controlled power up• Minimal external components needed• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification• Down-Hole Drilling

• High Temperature • Vibration Analysis• Pressure Sensors• Acoustics 7

6

5

8

2

3

4

1 RC

SS/SD

COMP

FB GND

GDRV

ISNS

VIN

TP

S40

20

0

VIN

VOUT

Rsense

• -55°C to +175°C (8-pin Plastic SOIC (D))–Released• -55°C to +210°C (8-pin Ceramic FP (HKJ) and KGD)

– Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP

(HKQ)) – Released

ReleasedReleasedTPS40210-HT 4.5 to 52V Input Current Mode Boost Controllers

• -55°C to +210°C – Released • -55°C to +175°C (Plastic TBD) – Potential

• Soft Start• Enable function• Externally compensated• Low ISENSE threshold (150mV)• Supports Boost, Flyback, and SEPIC topologies• 10-pin Ceramic DFP (HKK) Package, KGD, and

Plastic TBD

• Prevents inrush current• Enables use of small ISENSE resistors with

lower power dissipation• Design and implementation flexibility• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


Freq adj., 35KHz-1MHzSoft

Start prevents

inrush current;

has time-out

timer when in

OCP

ENABLE for

on/off control

External compensation for design

flexibility

VIN = 4.5V-52V; UVL

Provides current feedback in the

control loop; detects an OC based on

150mV threshold

Senses switch current and sets OC threshold; low Isense threshold enables use of small resistor, and lower power dissipation

N-channel FET gate driver; 500mA drive

current

57


• -55°C to +210°C – 16-pin Ceramic DIP – RTM 3Q13

• Emulated peak-current mode• Wide Input Operating Range up to 100V• Low IQ shutdown (<10µA)• Programmable Soft Start• Free-run or synchronous operation: 50kHz-1MHz• Optional diode emulation mode• Drives standard or logic level MOSFETs• Robust 3.5A peak gate drive• Programmable output from 1.215V to 80V• Precision 1.5% voltage reference• Programmable current limit• Programmable line under-voltage lockout• Automatic switch to external bias supply• 16-pin Ceramic DIP (HKK), KGD, Plastic TBD

• Reduces PWM circuit noise sensitivity found in peak-current mode controllers - allowing reliable control of very small duty cycles

• Supports high-voltage or wide-varying input supply applications

• Provides Low standby mode “dark current”• Enables smooth well controlled power-up• Slow Switching-Frequency allows higher

efficiency and smaller duty-cycles while Fast Switching-Frequencies enable smaller space

• Enables discontinuous mode operation for improved efficiency at light loads

• Controlled Baseline• One Fabrication and Assembly/Test Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


LM5116WG-HT Wide Range 100V Synchronous Buck Controller

RESET_ARESET_A

RESET_BRESET_B

RESET_CRESET_C

DRV8332-HT Three Phase PWM Motor Driver

• -55°C to +175°C – RTM 7/30/13

• Highest power integrated drive on the market• Supply Voltage up to 50V (70V abs max)• Output Current 8A RMS/13A peak/Bridge

• Advanced arch. with high efficiency up to 97%• PWM operation frequency up to 500kHz• Low RDSON MOSFETs (80mΩ)

• Intelligent gate drive and cross conduction prevention

• Short dead time (5ns)• Spike voltage control to reduce overshoot

• Integrated Protection Features• Programmable cycle-by-cycle current limit• Two stage thermal protection

• 44-pin plastic DDV Package

• High linearity of output signals to guarantee precise and smooth operation

• No external snubber & schottky diodes• Unmatched on-chip protection reduces

design complexity and enables higher system reliability

• Controlled Baseline and Product Traceability• One Fab site and Assembly/Test Site• Extended Product Life Cycle• Extended Product-Change Notification

• Down-Hole Drilling• Brushless DC Motors • Vibration Analysis• Pressure Sensors• Actuators and Pumps


ReleasedReleasedREF5025-HT 2.5V Precision Voltage Reference

• -55°C to +210°C (8-pin Ceramic DFP (HKJ) and KGD)–Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released• -55°C to +175°C (8-pin Plastic (DGK)) – Potential

• Low Noise• High Accuracy• Low Temperature Drift: 40 ppm/°C• High output Current: ±7mA• 2.5V Voltage Output• Wide Supply: 3.25V to 18V• Thermal Shutdown Removed• 8-pin Ceramic DFP (HKJ) Package, KGD, and

Plastic (DGK)

• High Accuracy and Low Noise for High Resolution Precision Applications

• Minimize system error over temperature• Directly provide accurate voltage reference

to ADC without additional op amp buffer• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


ReleasedReleasedTPS62000-HTAdjustable, High Temperature Step-Down Converter

• -55°C to +210°C

• 2V to 5.5V input voltage range• High Efficiency• 300-mA output current• Output voltage : adjustable(0.9V to 5V)• 1.4-mA quiescent current (typ)• 500 KHz switching frequency• Thermal Shutdown Removed• 10-pin Ceramic DFP (HKK) Package and KGD

• Robust general purpose DC/DC converter • Low quiescent current• Supports low voltage DSPs and processors• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


TPS62110-HT 17Vin, 700 mAOUT Step-Down Converter

• -55°C to +175°C

• High Efficiency • Input Voltage: 3.1V to 17V• Output Voltage: 1.2V to 16V(TPS62110)• Output Current: 700 mA• Low Quiescent Current• Switching Frequency: 1.0MHz• Thermal Shutdown Removed• 16-pin Plastic TSSOP (PWP) Package

• Highest integration (FETs and Diode integrated)

• Smallest foot-print with only a small Inductor needed

• High efficiency and easy-to-use functionality!



Wide Input Voltage

ReleasedReleased

TPS54362-HT 1Amp, 48V Step-Down DC/DC Converter With Low IQ Buck Converter

• -55°C to +175°C

• Wide Inp Voltage Range: 4.8V to 48V• 60V Load Dump protection• Max. Load Current: 1A• Adjustable Output Voltage: 0.9V to 18V• Shutdown current: <5 μA typical• Adjustable Frequency 200kHz to 2.2MHz• Synchronization to external clock • Soft start controlled with external capacitor• Output Switch slew rate control• Reset function with de-glitch timer• Reset threshold and delay programmable• Over voltage detect – Programmable• Thermal Shutdown Removed • 20-pin Plastic HTSSOP (PWP) Package

• Low “dark current” in standby mode• Wide input voltage range, no external

protection required• Integrated Voltage supervisor• Smaller LC Output filters• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


ReleasedReleased

TPS50301-HT 3V to 6.3V Input, 3Amp Synchronous Step-Down SWIFT™ Converter


• Split Power Rail: 3V to 6.3V on PVIN• Integrated Power MOSFETS• Load Current of 3-A at 210°C• Monotonic Start-Up into Pre-Biased Outputs• Flexible Switching Frequency Options:

• 300kHz – 1MHz Adjustable Internal Oscillator

• External Sync capability from 100KHz – 1MHz

• Sync pin can be configured as a 500KHz output for Master/Slave applications

• Low 100-μA Shutdown Quiescent Current• Adjustable Under voltage Lockout• 20-pin Ceramic FP (HKH) Package

• 90% Peak Efficiency; Optimized for Low Output Voltages

• Minimal external RCL components• Easy On/Off Control• Self-Protected from Fault Conditions• Supported by SwitcherPro™ Software tool• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


ReleasedReleased

ReleasedReleasedTPS76901-HT Single Output LDO, 100mA, Adjustable

• 100 mA output current• Adjustable output voltage• Vin up to 10V Max• Family includes numerous voltage options• Logic enabled shutdown puts the LDO in

standby and reduces supply current• Thermal Shutdown Removed

• Ultra-low quiescent current LDO• Extends Battery Life and saves space in

portable designs• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


• -55°C to +175°C (5-pin Plastic SOT (DBV)) – Released• -55°C to +210°C (8-pin Ceramic DFP (HKJ) and KGD) – Released• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

Prev

ReleasedReleasedMSP430F2619S-HT 16-Bit Ultra-Low-Power MCU

• -55°C to +150°C

• 120KB+256B Flash Memory • 4KB RAM• 12-Bit ADC• Dual DAC• 2 USCI • Thermal Shutdown Removed• 64-pin Plastic QFP (PM) Package



ReleasedReleasedSM320F2812-HT Digital Signal Controller

• -55°C to +220°C

• Processor Performance• 110-120 MIPS with Flash Acceleration Tech• 150 MIPS out of RAM for time-critical code

• Memory• 128Kw Flash• External memory interface (XINTF)

supports systems w/ larger memory models

• Control Peripherals• PWM outputs interfaces for three

3-phase motors• 12-bit ADC

• 172-pin Ceramic QFP (HFG) Package and KGD



McBSP

CAN 2.0B

SCI-A

SCI-B

SPI

Memory Bus

128Kw Flash+ 2Kw OTP

4Kw Boot ROM

18Kw RAM

Code security

XINTF

32-BitRegister

FileReal-Time

JTAG

32-bitTimers (3)

150MIPs C28xTM 32-bit DSP

32x32 bitMultiplier

RMWAtomic

ALU

Interrupt Management

Event Mgr A

Event Mgr B

12-Bit ADC

Watchdog

GPIO

Pe

riph

era

l Bu

s

ReleasedReleasedSM320F28335-HT Digital Signal Controller

• -55°C to +210°C

• Processor Performance• 200 MFLOPS@100MHz, Single-cycle MAC• 6-ch DMA support for EMIF, ADC, McBSP

• Memory• Up to 512KB flash and 68KB RAM• Configurable 16- or 32-bit EMIF

• Control Peripherals• PWM outputs interfaces • 6 High-resolution PWM outputs• Highest-speed on-chip ADC

• Communications Ports• Each McBSP configurable as SPI, CAN

2.0b with 32 mailboxes, I2C at 400 Kbps• Development Tools

• Code Composer Studio™IDE• 181-pin Ceramic PGA (GB) Package and KGD



SM320F28335

Real-TimeJTAG

32-bitTimers (3)

C28xTM 32-bit DSC

32x32-bitMultiplier

RMWAtomic

ALU

Interrupt Management

Memory Bus

Code security

12-bit ADC

SPI

2 CAN

3 SCI

2 McBSP

512 KBFlash

68 KB RAM

6 CAP

12 PWM(6 HRPWM)

DMA

32-bitFloating-Point Unit

88 GPIO

I²C

Boot ROM

16/32-bitEMIF

2 QEP

Pe

riph

era

l Bu

s

ReleasedReleasedSM470R1B1M-HT Arm 7 Microcontroller

• -55°C to +220°C (84-pin Ceramic QFP (HFQ) and KGD) – Released• -55°C to +175°C (144-pin Plastic LQFP (PGE)) – RTM 4Q’12

• ARM7TDMI™ Compatible• Thumb extension• Debug module• Multiplier with JTAG Interface

• Performance Enhancements• ARM7 CPU Accelerator• 60 MHz RISC Co-Processor• High Performance DMA

• TMS470R1B1M • 1024 HB Flash and 64 KB RAM• 12-Channel ADC• 16 Channel DMA

• 84-pin Ceramic QFP (HFQ) and 144-pin Plastic LQFP (PGE) Packages & KGD

• Open-Architecture w/ Full 3rd Party Support• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification


Memory

SYSTEM Module

PeripheralLibrary

CAN

J1850 Digital

MibADC 10-bit

SPI

CPU BusOscillator

PLL

Program Flash

DataRAM

WatchdogRTI

SCI

I2C

High End Timer

DMAI/Os / EBM

ECPIEM

SystemDecoder

MemoryProtection

ARM7TDMI

16-b

it T

hu

mb

In

stru

ctio

n S

etD

eco

mp

ress

ion

Registers

ShifterD

ebu

gM

od

ule

Addr. Registers

32-bit ALU32-bit ALU

INC

MultiplierJT

AG

Iin

terf

ace

OMAPL137-HT C674x DSP + ARM9 Processor

• Dual CPU Cores:• ARM926EJ-S™ (MPU)• C674x DSP Core

• Memory:• ARM: 16K I$, 16K D$, 64K ROM• DSP: 32K L1D, 32K L1P, 256K L2 Cache,

128K RAM and 1MB ROM• Peripherals (1.8/ 3.3V IOs)

• 10/100 Ethernet MAC• EMIF1–Supports 133MHz SDRAM 16/32-bit• EMIF2–Supports Async/NAND Flash 8/16 bit• USB 2.0 • UHPI, McASP (3), UART(3), I2C(2), SPI(2),

RTC, Timers (3)

• Compatible with C6747 DSP• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification

• Down-Hole Drilling• High Temperature • Vibration Analysis• Pressure Sensors

• -55°C to +175°C (176-pin Plastic QFP (PTP)) – Released

• -55°C to +175°C (KGD)

ARM9 Subsystem

DSP Subsystem

ARM926EJ-S

CPU 300 MHz

C674x DSPCore

300 MHz

Switched Central Resource (SCR) / EDMA

Peripherals

SDRAM32-bit

Program/Data Storage

I2C(2)

Serial Interfaces

Connectivity

WDTimer

System

PWM(3)

UHPIUSB 2.0

UART (3)

McASP(3)

SPI(2) MMC/SD

L1P 16K L1D 16K

L1P 32K L1D 32KL2 256K

USB 1.1 EMAC

AsyncEMIF16-bit

LCD Controller

OMAP-L137 DSP + ARM

128KB RAM

ReleasedReleased

SM28VLT32-HT 4-Mbyte Flash Storage Device Memory

• -55°C to +210°C

• 32-Megabit Flash Memory Device• Serial Peripheral Interface (SPI) Compatible• 3.3-V Supply for IO, 1.8 V for Core• 2-M x 16-Bit Word Access• Synchronous Read/Write/Erase Operations• Sector Protection Through Programmable

Hardware Locks• 20-MHz Maximum Clock Frequency• Built-In-Self-Test (BIST)• Data Retention: 1000 hrs• 14-pin Ceramic FP (HKN) Package and

KGD


• Down-Hole Drilling• High Temperature • Vibration Analysis• Pressure Sensors• General Data Collection Applications at

Extreme High/Low-Temperatures

ReleasedReleased

• Down-Hole Drilling• High Temperature Environments• CAN Data Bus• Industrial Automation

SN65HVD233-HT CAN High-Temp Transceiver With Diagnostic Functions

• Bus pin short-circuit protection to ±36V• ESD protection exceed 16kV• Designed for signaling rates up to 1 Mbps• High Impedance• 3.3 V supply • Glitch free power up & power down protection• Thermal Shut-down removed

• Device is unharmed by shorts to these voltages

• Compatibility with existing signaling schemes

• Up to 120 nodes on bus• Ideal for microcontrollers and DSPs• Hot pluggable without data Corruption• Loopback for Diagnostic Functions Available• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability

ReleasedReleased

• -55°C to +175°C (8-pin Plastic SOIC (D)) – Released• -55°C to +210°C (8-pin Ceramic FP, Ceramic DIP (JDJ),

and KGD) – Released

• Down-Hole Drilling• High Temperature Environments• Industrial Controls (PLC, Servo, Motor Control,

Sensors)• Power Supply/Regulation Systems• Industrial Automation (Fieldbus, Modbus,

Profibus, Device Net Data Buses, Smart Distributed Systems (SDS), CAN, RS485, USB

• Automotive Electronics & Hybrid Vehicles

ISO7221C-HT Dual High-Speed Digital Isolator

• -55°C to +175°C

• Silicon Integrated SiO2 Dielectric Capacitor• 0–25 Mbps and DC Signal Pass with Fail Safe• 25 Mbps Signaling Rate• TTL Inputs• 1ns Skew, 1ns Jitter, 2ns Pulse Distortion• Input Threshold, Noise Filter• High Magnetic Immunity (1E6 > Inductive)• 3-KV HBM ESD on All Pins• 3.3V and 5V Supply Supported• Estimate 3000-V Max Isolation• 8-pin Plastic SOIC (D) Package

• Proven Reliability of SiO2 Dielectric• Low Skew, Jitter, & Pulse Width Distortion• Filters Noisy Signals before Entering System• High Immunity for Noisy Environments • High Reliable in Harsh Environments • Flexibility with Power Supplies• Highly Reliable in Harsh Environments • Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability

ReleasedReleased

• Down-Hole Drilling• High Temperature Environments• Digital Motor Control

SN65HVD11-HT 3.3V RS-485 High-Temp Single Half-Duplex Transceiver

• -55°C to +175°C (8-pin Plastic SOIC (D) Package – Released • -55°C to +210°C (8-pin Ceramic FP (HKJ) Package) – Released • -55°C to +210°C (8-pin Ceramic DIP SB (JDJ) Package) – Released• -55°C to +210°C (Known-Good-Die) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released

• Based on ANSI TIA/EIA-485-A• Operate with single 3.3-V supply• Speed of 10Mbps• Common-mode voltage range (-7V to +12V)• 16-kV HBM Bus I/O ESD protection• Failsafe receiver for open circuit, short circuit

and idle-bus conditions• >41mV receiver input hysteresis• Glitch free power up & power down protection• Industry standard SN75176 pinout • Thermal Shut-down removed• 8-pin Ceramic FP (HKJ), CDIP SB (JDJ), KGD, and

Plastic SOIC (D) offerings

• RS-485 standard versatile• Ideal for use with DSPs • Enables use in long cable networks• Extended ESD level of protection • Protected in all situations• Rejects spurious noise signals and prevents

false changes in the receiver output state• Hot pluggable without data Corruption• Controlled Baseline• One Assembly/Test Site• One Fabrication Site• Extended Product Life Cycle• Product Traceability

ReleasedReleased

SN65HVD1040-HT Low-Power CAN Transceiver with Bus Wake-Up

• -55°C to +210°C – Released• -55°C to +175°C – Potential

• Full compliant to the CAN standard• 5μA Standby Mode With Bus Wake-Up• Dominant time-out circuit• Bus-Fault Protection Bus fault, pin short-

circuit, cross-wire, overvoltage and loss of ground protection from -27 to +40V

• ±12kV ESD on Bus, Split pins and very Low Electro-Magnetic Emissions (EME)

• 1Mbps signaling rates meets ISO 11898-5• High 125mV of Hysteresis• Glitch-free Power-Up/Down protection• Thermal Shutdown Removed• 8-pin Ceramic Dual FP (HKJ), HKQ, KGD, and

Plastic SOIC (D)

• Enables quick wakeup for transmission• Prevents driver from blocking network

communications during HW and SW failures • Device is unharmed by shorts to these

voltages and during these scenarios• Ensures high ESD protection and minimal

interference with improved EMI• Existing signaling scheme compatibility • Hot pluggable without data corruption• Controlled Baseline, One Fabrication and

Assembly/Test site• One Fabrication Site• Extended Product Life Cycle and

Traceability• Extended Product-Change Notification


ReleasedReleased

ReleasedReleasedOPA820-HT Unity-Gain stable, Low Noise, Voltage-Feedback Operational Amplifier

• -55°C to +210°C KGD – Released• -55°C to +210°C (8-pin Ceramic Dual Lead-formed FP)• -55°C to +175°C (8-pin SOIC (D)) – Potential

• Small Signal Bandwidth: 240MHz, G = +2• Slew rate: 240V/µs• Offset Voltage: 4µV/˚C (max)• Low Input Voltage Noise: 2.5nV/Hz• Flexible Supply Voltage

• Dual ±2.5V to ±6V• Single +5V to +12V

• Excellent DC accuracy• ±750mV Input Offset Voltage • ±400nA Input Offset Current

• Low Quiescent Current: 6.4mA (max)• High Output Current (±110mA)• Low Supply Current (5.6mA/Ch.)• 8-pin Ceramic Dual Lead-formed FP, Plastic

SOIC (D) and KGD

• Enables the fast conditioning of high frequency signals with high linearity

• Low initial offset eliminates calibration need providing accuracy across full temp range

• Enabling high dynamic range and gain without distortion

• Enables both single or split supply voltages• High DC accuracy for pulse amplifier apps• Extends battery life s and ideal for portable

applications • Provides large drive capability• Controlled Baseline• One Fabrication and Assembly/Test Site• Extended Product Life Cycle• Product Traceability• Extended Product-Change Notification

• Down-Hole Drilling• High Temperature • Vibration Analysis, Pressure Sensors

TPS7H1201-HT 6.3V, 0.5A Low Drop-Out Regulator

• VIN = 1.5V to 6.3V• Ultra Low Dropout: 200mV (Max) at

500mA• PMOS Pass Device

• 2% Accuracy• Ultra Low Noise: (27x VOUT) μVRMS

• PSRR: >45db up to 1 KHz • Programmable SoftStart• Programmable OCP, with current reading • Power Good Output (for Sequencing)• Temperature Range: -55°C to 210°C• Packaged in Thermally Enhanced 16-pin

Ceramic Flatpack and Known-Good-Die (KGD) Packaged in Waffle Pak

Device VIN

(V)

IOUT

(A)

VOUT

(V)

IQ

(μA)PG NR/SS

Enable

VDO

(mV)

TPS7H2101 1.5 – 6.3 0.5 0.8 – 6.1 TBD YES YES YES 200

•Power Management – LDO•RF Components VCOs, Receiver, ADC’s

Amplifiers•High voltage, high PSRR, low noise and

Clean Analog Supply Requirement Applications

ReleasedReleased




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(903) 868-6316

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