hpe synergy 480 gen9 compute module user guide · 2017. 10. 31. · hpe synergy 480 gen9 compute...

HPE Synergy 480 Gen9 Compute ModuleUser Guide

*813169-002*Part Number: 813169-002Published: March 2017Edition: 2

AbstractThis document is for the person who installs, administers, and troubleshoots the HPE Synergysystem. Hewlett Packard Enterprise assumes you are qualified in the servicing of computerequipment and trained in recognizing hazards in products with hazardous energy levels.

© 2016, 2017 Hewlett Packard Enterprise Development LP

NoticesThe information contained herein is subject to change without notice. The only warranties for Hewlett PackardEnterprise products and services are set forth in the express warranty statements accompanying suchproducts and services. Nothing herein should be construed as constituting an additional warranty. HewlettPackard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

Confidential computer software. Valid license from Hewlett Packard Enterprise required for possession, use,or copying. Consistent with FAR 12.211 and 12.212, Commercial Computer Software, Computer SoftwareDocumentation, and Technical Data for Commercial Items are licensed to the U.S. Government undervendor's standard commercial license.

Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett PackardEnterprise has no control over and is not responsible for information outside the Hewlett Packard Enterprisewebsite.

Contents

Component identification........................................................................... 6Front panel LEDs and buttons.............................................................................................................6Front panel components......................................................................................................................7

Serial label pull tab information.................................................................................................7Drive numbering.................................................................................................................................. 7Hot-plug drive LED definitions.............................................................................................................8SFF flash adapter components and LED definitions........................................................................... 9NVMe SSD components....................................................................................................................10System board components................................................................................................................ 11

System maintenance switch................................................................................................... 11Mezzanine connector definitions............................................................................................ 12DIMM slot locations................................................................................................................ 13Components........................................................................................................................... 14LEDs.......................................................................................................................................14

Component and LED identification for HPE Synergy hardware........................................................ 15

Operations..................................................................................................16Powering up the compute module ....................................................................................................16Powering down the compute module ............................................................................................... 16Removing the drive blank..................................................................................................................16Removing the compute module.........................................................................................................17Removing the compute module end cap...........................................................................................18Removing the access panel.............................................................................................................. 18Removing the DIMM baffle................................................................................................................ 19Removing the front panel/drive cage assembly.................................................................................20Installing the compute module end cap.............................................................................................20Installing the access panel................................................................................................................ 21Installing the DIMM baffles................................................................................................................ 21Installing the front panel/drive cage assembly...................................................................................21

Setup...........................................................................................................23Installation overview.......................................................................................................................... 23Installing the compute module options.............................................................................................. 23Installing the compute module...........................................................................................................23Completing the configuration.............................................................................................................25

Hardware options installation.................................................................. 26Introduction........................................................................................................................................26Installing the drive option...................................................................................................................26Installing the SFF flash adapter option..............................................................................................28Installing the controller option............................................................................................................28Installing the HPE Smart Storage Battery option...............................................................................29Installing the mezzanine card options............................................................................................... 30

Installing the HPE Smart Array P542D Controller mezzanine option..................................... 31Memory options.................................................................................................................................32

SmartMemory......................................................................................................................... 33

Contents 3

Memory subsystem architecture.............................................................................................33DIMM ranks ........................................................................................................................... 34DIMM identification ................................................................................................................ 34Memory configurations........................................................................................................... 35

Advanced ECC memory configuration.........................................................................36Online Spare memory configuration............................................................................ 36

General DIMM slot population guidelines ..............................................................................36Advanced ECC population guidelines..........................................................................37Online spare population guidelines..............................................................................37Population order...........................................................................................................37

Installing a DIMM....................................................................................................................37Installing the processor option...........................................................................................................38HP Trusted Platform Module option...................................................................................................42

Installing the Trusted Platform Module board......................................................................... 43Retaining the recovery key/password.....................................................................................44Enabling the Trusted Platform Module....................................................................................44

Cabling........................................................................................................46Cabling resources..............................................................................................................................46HPE Smart Storage Battery cabling.................................................................................................. 46HPE Smart Array P542D Controller cabling......................................................................................46

Software and configuration utilities.........................................................47Management and diagnostic tools.....................................................................................................47

Removing and replacing the system battery.......................................... 48

Warranty and regulatory information.......................................................49Warranty information......................................................................................................................... 49Regulatory information...................................................................................................................... 49

Safety and regulatory compliance.......................................................................................... 49Belarus Kazakhstan Russia marking......................................................................................49Turkey RoHS material content declaration............................................................................. 50Ukraine RoHS material content declaration............................................................................50

Electrostatic discharge............................................................................. 51Preventing electrostatic discharge.....................................................................................................51Grounding methods to prevent electrostatic discharge..................................................................... 51

Specifications............................................................................................ 52Environmental specifications ............................................................................................................52Compute module specifications.........................................................................................................52

Documentation and troubleshooting resources for HPE Synergy....... 53HPE Synergy documentation............................................................................................................ 53

HPE Synergy Configuration and Compatibility Guide.............................................................53HPE OneView User Guide for HPE Synergy..........................................................................53HPE OneView Global Dashboard...........................................................................................53HPE Synergy Image Streamer User Guide............................................................................ 53

4 Contents

HPE Synergy Image Streamer GitHub................................................................................... 53HPE Synergy Software Overview Guide................................................................................ 53Best Practices for HPE Synergy Firmware and Driver Updates.............................................54HPE OneView Support Matrix for HPE Synergy.....................................................................54HPE Synergy Image Streamer Support Matrix.......................................................................54HPE Synergy Glossary...........................................................................................................54

HPE Synergy troubleshooting resources...........................................................................................54Troubleshooting within HPE OneView....................................................................................54HPE Synergy Troubleshooting Guide.....................................................................................54HPE Error Message Guide for HPE Synergy......................................................................... 55HPE OneView and HPE OneView REST API scripting help.................................................. 55HPE Synergy QuickSpecs......................................................................................................55

Support and other resources................................................................... 56Accessing Hewlett Packard Enterprise Support................................................................................56

Information to collect...............................................................................................................56Accessing updates............................................................................................................................ 56Websites............................................................................................................................................56Customer Self Repair ....................................................................................................................... 57Remote support.................................................................................................................................63

Acronyms and abbreviations................................................................... 64

Documentation feedback.......................................................................... 66

Contents 5

Component identificationFront panel LEDs and buttons

Item Description Status

1 UID LED Solid blue = Activated

Flashing blue (1 Hz/cycle per sec) = Remotemanagement or firmware upgrade in progress

Off = Deactivated

2 Health status LED Solid green = Normal

Flashing green (1 Hz/cycle per sec) = iLO is rebooting

Flashing amber = System degraded

Flashing red (1 Hz/cycle per sec) = System critical

3 Mezzanine NIC status LED Solid green= Link on any Mezzanine NIC

Flashing green= Activity on any Mezzanine NIC

Off = No link or activity on any Mezzanine NIC

4 Power On/Standby button and systempower LED

Solid green = System on

Flashing green (1 Hz/cycle per sec) = Performing poweron sequence

Solid amber = System in standby

Off = No power present*

*If all other LEDs are off, then no power is present to the compute module. If the health LED is flashing greenwhile the system power LED is off indicates that the Power On/Standby button service is initializing or that an

6 Component identification

iLO reboot is in progress.*Facility power is not present, power cord is not attached, no power supplies areinstalled, power supply failure has occurred, or the power button cable is disconnected.

Front panel components

Item Description

1 Drive bay 1*

2 Drive bay 2*

3 External USB 3.0 connector (behind the serial label pull tab)

4 Serial label pull tab

5 Compute module handle release latch

6 Compute module handle

*If uFF drives (the SFF Flash Storage Adapter) are installed in the drive bays, the drive bay numbering isdifferent. For more information, see Drive numbering.

Serial label pull tab informationThe serial label pull tab is located on the front panel of the compute module. To locate the serial label pull tab,see Front panel components. The serial label pull tab provides the following information:

• Product serial number• HPE HPE iLO information• QR code that points to mobile-friendly documentation

Drive numberingDepending on the configuration, this compute module can support hard drives, SSDs, NVMe drives, and uFFdrives (supported in dual SFF flash adapters) in the drive bays. Depending on the device installed, the baynumber might be different.

Front panel components 7

Item Hard drive/SSD baynumbering

uFF drive baynumbering

NVMe drive baynumbering

1 1 1 and 101 1

2 2 2 and 102 2

Hot-plug drive LED definitions

Item LED Status Definition

1 Locate Solid blue The drive is being identified by a host application.

Flashing blue The drive carrier firmware is being updated or requires an update.

2 Activityring

Rotating green Drive activity

Off No drive activity

3 Do notremove

Solid white Do not remove the drive. Removing the drive causes one or more ofthe logical drives to fail.

Off Removing the drive does not cause a logical drive to fail.

4 Drivestatus

Solid green The drive is a member of one or more logical drives.

Table Continued

8 Hot-plug drive LED definitions

Item LED Status Definition

Flashing green The drive is rebuilding or performing a RAID migration, strip sizemigration, capacity expansion, or logical drive extension, or is erasing.

Flashing amber/green

The drive is a member of one or more logical drives and predicts thedrive will fail.

Flashing amber The drive is not configured and predicts the drive will fail.

Solid amber The drive has failed.

Off The drive is not configured by a RAID controller.

SFF flash adapter components and LED definitions

Item Component Description

1 Locate • Off—Normal• Solid blue—The drive is being identified by a host application.• Flashing blue—The drive firmware is being updated or requires

an update.

2 uFF drive ejection latch Removes the uFF drive when released

3 Do not remove LED • Off—OK to remove the drive. Removing the drive does notcause a logical drive to fail.

• Solid white—Do not remove the drive. Removing the drivecauses one or more of the logical drives to fail.

Table Continued

SFF flash adapter components and LED definitions 9

Item Component Description

4 Drive status LED • Off—The drive is not configured by a RAID controller• Solid green—The drive is a member of one or more logical

drives.• Flashing green (4 Hz)—The drive is operating normally and has

activity.• Flashing green (1 Hz)—The drive is rebuilding or performing a

RAID migration, stripe size migration, capacity expansion,logical drive extension, or is erasing.

• Flashing amber/green (1 Hz)—The drive is a member of one ormore logical drives that predicts the drive will fail.

• Solid amber—The drive has failed.• Flashing amber (1 Hz)—The drive is not configured and predicts

the drive will fail.

5 Adapter ejection release latchand handle

Removes the SFF flash adapter when released

NVMe SSD componentsThe NVMe SSD is a PCIe bus device. A device attached to a PCIe bus cannot be removed without allowingthe device and bus to complete and cease the signal/traffic flow.

CAUTION:Do not remove an NVMe SSD from the drive bay while the Do Not Remove button LED is flashing. TheDo Not Remove button LED flashes to indicate the device is still in use. Removal of the NVMe SSDbefore the device has completed and ceased signal/traffic flow can cause loss of data.

1 2 3 4

Item Description

1 Release lever

2 Activity ring

3 Do Not Remove button

4 Power button

10 NVMe SSD components

System board components

Item Description

1 TPM connector

2 System battery

3 Internal USB 3.0 connector

4 Drive backplane connector

5 Processor 1 DIMM slots (12)

6 Processor 2 DIMM slots (12)

7 HPE Smart Storage Battery connector

8 Mezzanine connectors (M1, M2, and M3)

9 Management/power connector

10 System maintenance switch

11 microSD card slot

12 External USB 3.0 connector

System maintenance switchPosition Default Function

S1* Off Off = HPE iLO security is enabled.

On = HPE iLO security is disabled.

S2 Off Off = System configuration can be changed.

On = System configuration is locked.

S3 Off ReservedTable Continued

System board components 11

Position Default Function

S4 Off Reserved

S5* Off Off = Power-on password is enabled.

On = Power-on password is disabled.

S6* ** Off Off = No function

On = Restore default manufacturing settings

S7 Off Off = Set default boot mode to UEFI.

On = Set default boot mode to legacy.

S8 — Reserved

S9 — Reserved

S10 — Reserved

S11 — Reserved

S12 — Reserved

*You can access the redundant ROM by setting S1, S5, and S6 to On.

IMPORTANT:Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HPE Dynamic SmartArray B140i Controller is disabled. Do not use the B140i controller when the compute module is inLegacy BIOS Boot Mode.

Mezzanine connector definitions

12 Mezzanine connector definitions

Item Connector identification Supported card types Fabric Supported ICM bays

1 Mezzanine connector 1 (M1)* Type C and Type D 1 ICM 1 and 4

2 Mezzanine connector 2 (M2)** Type C and Type D 2 ICM 2 and 5

3 Mezzanine connector 3 (M3) Type C only 3 ICM 3 and 6

* When an NVIDIA Tesla M6 GPU FIO Adapter for HPE Synergy 480 Gen9 Compute Module is installed inmezzanine connector 1, mezzanine connector 2 is not available for additional mezzanine cards.

** When installing a mezzanine option on mezzanine connector 2, processor 2 must be installed.

DIMM slot locationsDIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use thealpha assignments for population order, and the slot numbers designate the DIMM slot ID for sparereplacement.

The colored slots indicate the slot order within each channel:

• White — First slot of a channel• Black — Second slot of a channel• Blue — Third slot of a channel

The arrow points to the front of the compute module.

DIMM slot locations 13

Components

Item Description

1 Cap

2 MicroSD card slot

3 SD1 card

4 SD2 card

LEDs

Item Description Status

1 Power LED Green: Device is on and at least one microSD card is functioning

Red: Both microSD cards have failed

2 SD2 LED On: microSD card has failed

Off: microSD card is healthy

3 SD1 LED On: microSD card has failed

Off: microSD card is healthy

14 Components

Component and LED identification for HPE Synergyhardware

For more information about component and LED identification for HPE Synergy components, see the product-specific maintenance and service guide or the HPE Synergy 12000 Frame Setup and Installation Guide in the Hewlett Packard Enterprise Information Library .

Component and LED identification for HPE Synergy hardware 15

http://www.hpe.com/info/synergy-docs

OperationsPowering up the compute module

To power up the compute module, press the Power On/Standby button.

Powering down the compute moduleBefore powering down the compute module for any upgrade or maintenance procedures, perform a backup ofcritical data and programs.

IMPORTANT:When the compute module is in standby mode, auxiliary power is still being provided to the system.

IMPORTANT:Always attempt a graceful shutdown before forcing the shutdown of applications and the OS with a non-graceful shutdown.

To power down the compute module, use one of the following methods:

• To perform a graceful shutdown of applications and the OS when powering down the compute module tostandby mode, use one of the following methods:

◦ Press and release the Power On/Standby button.◦ Select the Momentary press power off selection in HPE OneView.◦ Select the Momentary press virtual power button selection in HPE iLO.

Always attempt a graceful shutdown first before forcing the compute module to power off.• If a graceful shutdown fails to power down the compute module to standby mode when an application or

OS stops responding, use one of the following methods to force a non-graceful shutdown of applicationsand the OS:

◦ Press and hold the Power On/Standby button for more than four seconds.◦ Select the Press and hold power off selection in HPE OneView.◦ Select the Press and hold virtual power button selection in HPE iLO.

Application data can be lost when performing a non-graceful shutdown of applications and the OS.

Before proceeding, verify that the compute module is in standby mode by observing that the system powerLED is amber.

Removing the drive blankRemove the component as indicated.

16 Operations

1

2

CAUTION:To prevent improper cooling and thermal damage, do not operate the compute module unless all baysare populated with either a component or a blank.

Removing the compute module

Procedure

1. Identify the proper compute module.2. Power down the compute module.3. Remove the compute module.

4. Install the compute module end cap when the compute module is outside of the frame.5. Place the compute module on a flat, level work surface.

To replace the component, reverse the removal procedure.

WARNING:To reduce the risk of personal injury from hot surfaces, allow the drives and the internal systemcomponents to cool before touching them.

Removing the compute module 17

CAUTION:To prevent damage to electrical components, properly ground the compute module before beginningany installation procedure. Improper grounding can cause ESD.

Removing the compute module end cap

Procedure

1. Place the compute module on a flat, level work surface.2. Remove the compute module end cap.

Removing the access panel

Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Press the access panel release button.5. Slide the access panel towards the rear of the compute module, and then lift up to remove the panel.

18 Removing the compute module end cap

Removing the DIMM baffle

Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Remove the access panel.

IMPORTANT:When removing the right DIMM baffle, leave the Smart Storage Battery installed on the baffle. Usethe blue pull tab to disconnect the Smart Storage Battery cable from the system board.

5. Remove one or more DIMM baffles.

Removing the DIMM baffle 19

Removing the front panel/drive cage assembly

Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Remove the access panel.5. Remove all drives.6. Remove the front panel/drive cage assembly.

Installing the compute module end cap

Procedure

1. Place the compute module on a flat, level work surface.2. Install the compute module end cap.

20 Removing the front panel/drive cage assembly

Installing the access panelProcedure

1. Place the access panel on top of the graphics blade.2. Slide the access panel forward until it clicks into place.

Installing the DIMM baffles

Procedure

1. Install the DIMM baffles.

2. Install the access panel.3. Install the compute module .

Installing the front panel/drive cage assembly

Installing the access panel 21

Procedure

1. Install the front panel/drive cage assembly.

2. Install all drives.3. Install the access panel.4. Install the compute module.

22 Operations

SetupInstallation overview

This section provides instructions for installing an HPE Synergy 480 Gen9 Compute Module in a frame for thefirst time.

Installation of a compute module requires the following steps:

Procedure

1. Installing supported options in the compute module.2. Installing the compute module.3. Completing the compute module configuration.

Installing the compute module optionsBefore installing and initializing the compute module, install any compute module options, such as anadditional processor, drive, or a mezzanine card.

Mezzanine options are classified as Type C and Type D mezzanine cards. The type of mezzanine carddetermines where the card can be installed in the compute module. Some mezzanine cards require that aninterconnect module is installed in the associated ICM bay in the rear of the frame. Be sure to review themezzanine card mapping information in the HPE Synergy Configuration and Compatibility Guide on theHewlett Packard Enterprise website (http://www.hpe.com/info/synergy-docs).

For a list of supported options, see the product QuickSpecs on the Hewlett Packard Enterprise website(http://www.hpe.com/info/qs).

For compute module options installation information, see "Hardware options installation."

Installing the compute module

Procedure

1. Verify that the device bay is configured for a half-height compute module. For more information, see thesetup and installation guide for the frame on the Hewlett Packard Enterprise website.

2. Remove the compute module end cap.

Setup 23


http://www.hpe.com/info/qs


3. Prepare the compute module for installation by opening the compute module handle.

4. Install the compute module. Press the compute module handle near the release button to completely closethe handle.

24 Setup

5. Review the compute module front panel LEDs to determine the compute module status. For moreinformation on the compute module LEDs, see "Component identification."

Completing the configurationHPE OneView, hosted on the HPE Synergy Composer appliance installed within an HPE Synergy 12000Frame, enables you to comprehensively manage a Synergy system throughout the hardware life cycle. Toconfigure the compute module for the first time, log into HPE OneView from the frame. For more information,see the HPE Synergy 12000 Frame Setup and Installation Guide on the Hewlett Packard Enterprise website(www.hpe.com/info/synergy-docs).

When adding a compute module to an existing configuration, HPE OneView automatically detects the newhardware. Log into HPE OneView using your assigned user name and password to configure the hardware.See the HPE OneView User Guide on the Hewlett Packard Enterprise website (www.hpe.com/info/synergy-docs).

Completing the configuration 25

Hardware options installationThis chapter provides detailed instructions on how to install hardware options. For more information onsupported options, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

IntroductionIf more than one option is being installed, read the installation instructions for all the hardware options andidentify similar steps to streamline the installation process.


CAUTION:To prevent damage to electrical components, properly ground the compute module before beginningany installation procedure. Improper grounding can cause electrostatic discharge.

Installing the drive optionThe compute module supports up to two SFF SAS, NVMe, solid state, or SATA (supported only with the HPESynergy 480 Gen9 compute module backplane) drives.

CAUTION:To prevent improper cooling and thermal damage, do not operate the compute module or the enclosureunless all drive and device bays are populated with either a component or a blank.

To install the component:

Procedure

1. Remove the drive blank.2. Prepare the drive:

• SAS, SATA, or solid state

• NVMe—Press Do Not Remove to open the release handle.

26 Hardware options installation



3. Install the drive:

• SAS, SATA, or solid state

1

2

• NVMe

2

1

4. Determine the status of the drive from the drive LED definitions.

Hardware options installation 27

Installing the SFF flash adapter optionCAUTION:To prevent improper cooling and thermal damage, do not operate the compute module or the enclosureunless all drive and device bays are populated with either a component or a blank.

Prequisites

The SFF flash adapter option is supported when any of the following components are installed:

• HPE Dynamic Smart Array B140i Controller• HPE Smart Array P240nr Controller• HPE H240nr Host Bus Adapter• HPE Smart Array P542D Controller (with HPE Synergy 480 Gen9 compute module backplane installed)


Procedure

1. Remove the drive blank.2. Install the uFF drives in the SFF flash adapter.

3. Install the SFF flash adapter by pushing firmly near the left-side adapter ejection handle until the latchingspring engages in the drive bay.

Installing the controller optionFor more information about supported options, see the product QuickSpecs on the Hewlett PackardEnterprise website.

CAUTION:Hewlett Packard Enterprise recommends performing a complete backup of all compute module databefore performing a controller or adapter installation or removal.

28 Installing the SFF flash adapter option



CAUTION:In systems that use external data storage, be sure that the compute module is the first unit to bepowered down and the last to be powered back up. Taking this precaution ensures that the system doesnot erroneously mark the drives as failed when the compute module is powered up.


Procedure

1. Power down the compute module.2. Remove the compute module.3. Remove the access panel.4. Remove the front panel/drive cage assembly.5. Install the controller.

6. Install the front panel/drive cage assembly.7. Install the access panel.8. Install the compute module.9. Power up the compute module.

Installing the HPE Smart Storage Battery option

Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Remove the access panel.5. Remove the right DIMM baffle.6. Install the Smart Storage Battery.

Installing the HPE Smart Storage Battery option 29

7. Install the DIMM baffle.8. Connect the Smart Storage Battery to the system board. To locate the Smart Storage Battery connector,

see the "System board components."

9. Install the access panel.10. Install the compute module.11. Power up the compute module.

Installing the mezzanine card optionsIMPORTANT:For more information about the association between the mezzanine bay and the interconnect bays, seethe HPE Synergy 12000 Frame Setup and Installation Guide in the Hewlett Packard EnterpriseInformation Library. Where you install the mezzanine card determines where you need to install theinterconnect modules.


30 Installing the mezzanine card options



Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Remove the access panel.5. Locate the appropriate mezzanine connector. To locate the connector, see the "System board

components."6. Remove the mezzanine connector cover, if installed.7. Install the mezzanine card. Press firmly on the PRESS HERE label above the mezzanine connector to

seat the card.

When a GPU mezzanine adapter is installed in the compute module, an additional mounting bracket isrequired.

1

2

2

2Type D

1

2

2Type C


Installing the HPE Smart Array P542D Controller mezzanine option

IMPORTANT:

For more information about the association between the mezzanine bay and the interconnect bays, seethe HPE Synergy 12000 Frame Setup and Installation Guide in the Hewlett Packard EnterpriseInformation Library (http://www.hpe.com/info/synergy-docs). Where you install the mezzanine carddetermines where you need to install the interconnect modules.


Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Remove the access panel.5. Locate the appropriate mezzanine connector. To locate the connector, see System board components.6. Remove the mezzanine connector cover, if installed.

Installing the HPE Smart Array P542D Controller mezzanine option 31


7. Remove the front panel/drive cage assembly.8. Install the mezzanine card. Press firmly on the PRESS HERE label above the mezzanine connector to

seat the card.

9. Install and route the HPE Smart Array P542D SAS cable from the premium backplane to the HPE SmartArray P542D Controller mezzanine card.


Memory optionsIMPORTANT:This compute module does not support mixing LRDIMMs or RDIMMs. Attempting to mix anycombination of these DIMMs can cause the compute module to halt during BIOS initialization.

The memory subsystem in this compute module can support LRDIMMs and RDIMMs:

32 Memory options

• RDIMMs offer address parity protection.• LRDIMMs support higher densities than single- and dual-rank RDIMMs, and higher speeds than quad-rank

RDIMMs. This support enables you to install more high-capacity DIMMs, resulting in higher systemcapacities and higher bandwidth.

All types are referred to as DIMMs when the information applies to all types. When specified as LRDIMM orRDIMM, the information applies to that type only. All memory installed in the compute module must be thesame type.

The compute module supports the following DIMM speeds:

• Single- and dual-rank PC4-2400 (DDR4-2400) RDIMMs operating at up to 2400 MT/s• Dual- and quad-rank PC4-2400 (DDR4-2400) LRDIMMs operating at up to 2400 MT/s

Speed and capacity

DIMM type DIMM rank DIMM capacity (GB) Native speed (MT/s)

RDIMM Single 8 2400

RDIMM Single 16 2400

RDIMM Dual 16 2400

RDIMM Dual 32 2400

LRDIMM Dual 32 2400

LRDIMM Quad 64 2400

LRDIMM Octal 128 2400

Depending on the processor model, the number of DIMMs installed, and whether LRDIMMs or RDIMMs areinstalled, the memory clock speed can reduce to 1600 MT/s.

Populated DIMM speed (MT/s)

DIMM type DIMM rank 1 DIMM perchannel

2 DIMMs perchannel

3 DIMMs perchannel

RDIMM Single (8 GB) 2400 2133 1866

RDIMM Single (16 GB) 2400 2133 1866

RDIMM Dual (16 GB) 2400 2400 1600

RDIMM Dual (32 GB) 2400 2400 1600

LRDIMM Dual (32 GB) 2400 2400 2133

LRDIMM Quad (64 GB) 2400 2400 2133

LRDIMM Octal (128 GB) 2400 2400 2133

SmartMemorySmartMemory authenticates and unlocks certain features available only on Qualified memory and verifieswhether installed memory has passed Hewlett Packard Enterprise qualification and test processes. Qualifiedmemory is performance-tuned for ProLiant and BladeSystem servers and compute module, and providesfuture enhanced support through Active Health and manageability software.

Memory subsystem architectureThe memory subsystem in this compute module is divided into channels. Each processor supports fourchannels, and each channel supports three DIMM slots.

SmartMemory 33

Memory subsystemchannel

Population order Slot number (Processor1)

Slot number (Processor2)

1 A E I 12 11 10 1 2 3

2 B F J 9 8 7 4 5 6

3 C G K 1 2 3 12 11 10

4 D H L 4 5 6 9 8 7

For the location of the slot numbers, see "DIMM slot locations."

This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecturealso enables Lockstep and Online Spare Memory modes.

DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slotnumbers indicate the DIMM slot ID for spare replacement.

DIMM ranksTo understand and configure memory protection modes properly, an understanding of DIMM rank is helpful.Some DIMM configuration requirements are based on these classifications.

A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from thememory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only onerank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Onlyone rank is accessible at a time. The compute module memory control subsystem selects the proper rankwithin the DIMM when writing to or reading from the DIMM.

Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example,if current DRAM technology supports 8-GB single-rank DIMMs, a dual-rank DIMM would be 16 GB, and aquad-rank DIMM would be 32 GB, and an octal-rank LR DIMM would be 64 GB.

LR DIMMs are labeled as quad- and octal-rank DIMMs. There are four and eight ranks of DRAM on theDIMM, but the LR DIMM buffer creates an abstraction that allows the DIMM to appear as a logical dual-rankDIMM to the system. This is called Rank Multiplication. The LR DIMM buffer also isolates the electricalloading of the DRAM from the system to allow for faster operation. These two changes allow the system tosupport up to three LR DIMMs per memory channel, providing for greater memory capacity and highermemory operating speed compared to quad-rank R DIMMs.

DIMM identificationTo determine DIMM characteristics, see the label attached to the DIMM and refer to the following illustrationand table.

34 DIMM ranks

Item Description Definition

1 Capacity 8 GB

16 GB

32 GB

64 GB

128 GB

2 Rank 1R = Single-rank

2R = Dual-rank

4R = Quad-rank

8R = Octal-rank

3 Data width on DRAM x4 = 4-bit

x8 = 8-bit

4 Memory generation DDR4

5 Maximum memory speed 2400 MT/s

6 CAS latency P=15

T=17

7 DIMM type R = RDIMM (registered)

L = LRDIMM (load reduced)

For more information about product features, specifications, options, configurations, and compatibility, see theproduct QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

Memory configurationsTo optimize compute module availability, the compute module supports the following AMP modes:

• Advanced ECC—Provides up to 4-bit error correction and enhanced performance over Lockstep mode.This mode is the default option for this compute module.

• Online spare memory—Provides protection against failing or degraded DIMMs. Certain memory isreserved as spare, and automatic failover to spare memory occurs when the system detects a DIMM thatis degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory error(which would result in system downtime) to be removed from operation.

Advanced Memory Protection options are configured in the BIOS/Platform Configuration (RBSU). If therequested AMP mode is not supported by the installed DIMM configuration, the compute module boots inAdvanced ECC mode. For more information, see the HPE UEFI System Utilities User Guide for ProLiantGen9 Servers on the Hewlett Packard Enterprise website.

Maximum capacity

DIMM type DIMM rank Capacity (GB) One processor(GB)

Two processors(GB)

RDIMM Single 8 96 192

RDIMM Single 16 192 384Table Continued

Memory configurations 35


http://www.hpe.com/info/ProLiantUEFI/docs

DIMM type DIMM rank Capacity (GB) One processor(GB)

Two processors(GB)

RDIMM Dual 16 192 384

RDIMM Dual 32 384 768

LRDIMM Dual 32 384 768

LRDIMM Quad 64 768 1536

LRDIMM Octal 128 1536 3072

For the latest memory configuration information, see the QuickSpecs on the Hewlett Packard Enterprisewebsite (http://www.hpe.com/info/qs).

Advanced ECC memory configurationAdvanced ECC memory is the default memory protection mode for this compute module. Standard ECC cancorrect single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected usingStandard ECC, the error is signaled to the compute module and causes the compute module to halt.

Advanced ECC protects the compute module against some multi-bit memory errors. Advanced ECC cancorrect both single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM deviceon the DIMM.

Advanced ECC provides additional protection over Standard ECC because it is possible to correct certainmemory errors that would otherwise be uncorrected and result in a compute module failure. Using HPEAdvanced Memory Error Detection technology, the compute module provides notification when a DIMM isdegrading and has a higher probability of uncorrectable memory error.

Online Spare memory configurationOnline spare memory provides protection against degraded DIMMs by reducing the likelihood of uncorrectedmemory errors. This protection is available without any operating system support.

Online spare memory protection dedicates one rank of each memory channel for use as spare memory. Theremaining ranks are available for OS and application use. If correctable memory errors occur at a rate higherthan a specific threshold on any of the non-spare ranks, the compute module automatically copies thememory contents of the degraded rank to the online spare rank. The compute module then deactivates thefailing rank and automatically switches over to the online spare rank.

General DIMM slot population guidelinesObserve the following guidelines for all AMP modes:

• Install DIMMs only if the corresponding processor is installed.• When two processors are installed, balance the DIMMs across the two processors.• White DIMM slots denote the first slot of a channel (Ch 1-A, Ch 2-B, Ch 3-C, Ch 4-D)• Do not mix RDIMMs and LRDIMMs.• When one processor is installed, install DIMMs in sequential alphabetic order: A, B, C, D, E, F, and so

forth.• When two processors are installed, install the DIMMs in sequential alphabetic order balanced between the

two processors: P1-A, P2-A, P1-B, P2-B, P1-C, P2-C, and so forth.• When single-rank, dual-rank, and quad-rank DIMMs are populated for two DIMMs per channel or three

DIMMs per channel, always populate the higher number rank DIMM first (starting from the farthest slot).For example, first quad-rank DIMM, then dual-rank DIMM, and then lastly single-rank DIMM.

• DIMMs should be populated starting farthest from the processor on each channel.• For DIMM spare replacement, install the DIMMs per slot number as instructed by the system software.

36 Advanced ECC memory configuration


For more information about compute module memory, see http://www.hpe.com/info/memory.

DIMM speeds are supported as indicated in the following table.

Populated slots (perchannel)

Rank DIMM Speeds supported(MT/s)

1 Single, dual, or quad RDIMM or LRDIMM 2400

2 Single RDIMM 2133

2 Dual or quad RDIMM or LRDIMM 2400

3 Single RDIMM 1866

3 Dual RDIMM 1600

3 Dual or quad LRDIMM 2133

Advanced ECC population guidelinesFor Advanced ECC mode configurations, observe the following guidelines:

• Observe the general DIMM slot population guidelines .• DIMMs may be installed individually.

Online spare population guidelinesFor Online Spare memory mode configurations, observe the following guidelines:

• Observe the general DIMM slot population guidelines.• Each channel must have a valid online spare configuration.• Each channel can have a different valid online spare configuration.• Each populated channel must have a spare rank. A single dual-rank DIMM is not a valid configuration.

Population orderFor memory configurations with a single processor or multiple processors, DIMMs must be populatedsequentially in alphabetical order (A through L).

After installing the DIMMs, use the BIOS/Platform Configuration (RBSU) in the UEFI System Utilities toconfigure supported AMP modes.

Installing a DIMM

CAUTION:To avoid damage to the hard drives, memory, and other system components, the air baffle, drive blanks,and access panel must be installed when the compute module is powered up.

CAUTION:To avoid damage to the hard drives, memory, and other system components, be sure to install thecorrect DIMM baffles for your compute module model.


Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.

Advanced ECC population guidelines 37

http://www.hpe.com/info/memory

4. Remove the access panel.5. Remove the DIMM baffle.6. Install the DIMM.

1

2

2

7. Install all DIMM baffles.8. Install the access panelInstall the access panel.9. Install the compute module.10. Power up the compute module.

To configure the memory mode, use UEFI System Utilities.

Installing the processor optionWARNING:To reduce the risk of personal injury from hot surfaces, allow the drives and the internal systemcomponents to cool before touching them.

CAUTION:To prevent possible compute module malfunction and damage to the equipment, multiprocessorconfigurations must contain processors with the same part number.

CAUTION:The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removedfrom the processor after it has been installed.

CAUTION:To prevent possible compute module overheating, always populate processor socket 2 with a processorand a heatsink or a processor socket cover and a heatsink blank.

CAUTION:To prevent damage to electrical components, properly ground the compute module before beginningany installation procedure. Improper grounding can cause ESD.

IMPORTANT:Processor socket 1 must be populated at all times or the compute module does not function.

To install the processor:

38 Installing the processor option

Procedure

1. Update the system ROM.

Locate and download the latest ROM version from the Hewlett Packard Enterprise website at http://www.hpe.com/support. Follow the instructions on the website to update the system ROM.

2. Power down the compute module.3. Remove the compute module.4. Remove the access panel.5. Remove all DIMM baffles.6. Remove the heatsink blank. Retain the heatsink blank for future use.

7. Open each of the processor locking levers in the order indicated in the following illustration, and thenopen the processor retaining bracket.

1

2

3

8. Remove the clear processor socket cover. Retain the processor socket cover for future use.


http://www.hpe.com/support

CAUTION:THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoiddamage to the system board, do not touch the processor or the processor socket contacts.

9. Install the processor. Verify that the processor is fully seated in the processor retaining bracket byvisually inspecting the processor installation guides on either side of the processor. THE PINS ON THESYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.Install the processor. Verify that the processor is fully seated in the processor retaining bracket byvisually inspecting the processor installation guides on either side of the processor.

10. Close the processor retaining bracket. When the processor is installed properly inside the processorretaining bracket, the processor retaining bracket clears the flange on the front of the socket.

40 Hardware options installation

CAUTION:Do not press down on the processor. Pressing down on the processor might damage the processorsocket and the system board. Press only in the area indicated on the processor retaining bracket.

CAUTION:Close and hold down the processor cover socket while closing the processor locking levers. Thelevers should close without resistance. Forcing the levers closed can damage the processor andsocket, requiring system board replacement.

11. Press and hold the processor retaining bracket in place, and then close each processor locking lever.Press only in the area indicated on the processor retaining bracket.

12. Remove the thermal interface protective cover from the heatsink.

CAUTION:To avoid damage to the system board, processor socket, and screws, do not overtighten theheatsink screws.

13. Install the heatsink. A T-15 screwdriver is required to install the heatsink.


1

2

2

2

2

14. Install all DIMM baffles.15. Install the access panel.16. Install the compute module.

HP Trusted Platform Module optionWhen installing or replacing TPM, observe the following guidelines:

• Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system board.• When installing or replacing hardware, Hewlett Packard Enterprise service providers cannot enable the

TPM or the encryption technology. For security reasons, only the customer can enable these features.• When returning a system board for service replacement, do not remove the TPM from the system board.

When requested, Hewlett Packard Enterprise Service provides a TPM with the spare system board.• Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security

rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider thesystem compromised and take appropriate measures to ensure the integrity of the system data.

• When using BitLocker, always retain the recovery key/password. The recovery key/password is required toenter Recovery Mode after BitLocker detects a possible compromise of system integrity.

• Hewlett Packard Enterprise is not liable for blocked data access caused by improper TPM use. Foroperating instructions, see the encryption technology feature documentation provided by the operatingsystem.

For more information about product features, specifications, options, configurations, and compatibility, see theproduct QuickSpecs on the Hewlett Packard Enterprise website .

Use these instructions to install and enable a TPM on a supported compute module. This procedure includesthree sections:

1. Installing the Trusted Platform Module board.2. Retaining the recovery key/password.3. Enabling the Trusted Platform Module.

Enabling the TPM requires accessing BIOS/Platform Configuration (RBSU) in the UEFI System Utilities.

TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLockerDrive Encryption feature. For more information on BitLocker, see the Microsoft website.

42 HP Trusted Platform Module option


http://www.microsoft.com

CAUTION:Always observe the guidelines in this document. Failure to follow these guidelines can cause hardwaredamage or halt data access.

Installing the Trusted Platform Module board



Procedure

1. Power down the compute module.2. Remove the compute module.3. Place the compute module on a flat, level work surface.4. Remove the access panel.5. Remove all drives.6. Remove all drive blanks.7. Remove all DIMM baffles.8. Remove the front panel/drive cage assembly.9. Locate the TPM connector.

CAUTION:Any attempt to remove an installed TPM from the system board breaks or disfigures the TPMsecurity rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators shouldconsider the system compromised and take appropriate measures to ensure the integrity of thesystem data.

10. Install the TPM board. Press down on the connector to seat the board (System board components).

11. Install the TPM security rivet by pressing the rivet firmly into the system board.

Installing the Trusted Platform Module board 43

12. Install the front panel/drive cage assembly.13. Install all drives.14. Install the DIMM baffles.15. Install the access panel.16. Install the compute module.17. Power up the compute module.

Retaining the recovery key/passwordThe recovery key/password is generated during BitLocker setup, and can be saved and printed afterBitLocker is enabled. When using BitLocker, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker detects a possible compromise of systemintegrity.

To help ensure maximum security, observe the following guidelines when retaining the recovery key/password:

• Always store the recovery key/password in multiple locations.• Always store copies of the recovery key/password away from the compute module.• Do not save the recovery key/password on the encrypted hard drive.

Enabling the Trusted Platform Module

CAUTION:When a TPM is installed and enabled on the compute module, data access is locked if you fail to followthe proper procedures for updating the system or option firmware, replacing the system board, replacinga hard drive, or modifying OS application TPM settings.

Procedure

1. During the server startup sequence, press the F9 key to access System Utilities.2. From the System Utilities screen, select System Configuration > BIOS/Platform Configuration (RBSU)

> Server Security.3. Select Trusted Platform Module Options, and press the Enter key.4. To set the TPM operational state:

44 Retaining the recovery key/password

• If TPM 1.2 is installed, then select No Action, Enable, Disable, or Clear.• If TPM 2.0 is installed, then select No Action or Clear.

5. Select Visible to set the TPM Visibility, if necessary.6. Press the F10 key to save your selection.7. When prompted to save the change in System Utilities, press the Y key.8. Press the ESC key to exit System Utilities. Then, press the Enter key when prompted to reboot the

compute module.

The compute module then reboots a second time without user input. During this reboot, the TPM settingbecomes effective.

9. Enable TPM functionality in the OS, such as Microsoft Windows BitLocker or measured boot.

For more information on adjusting TPM usage in BitLocker, see the Microsoft website.

For more information on the UEFI System Utilities, see the UEFI System Utilities User Guide for HPEProLiant Gen9 and Synergy Servers in the UEFI Information Library.


http://support.microsoft.com

http://www.hpe.com/info/ProLiantUEFI/docs

CablingCabling resources

Cabling configurations and requirements vary depending on the product and installed options. For moreinformation about product features, specifications, options, configurations, and compatibility, see the productQuickSpecs on the Hewlett Packard Enterprise website .

HPE Smart Storage Battery cabling

HPE Smart Array P542D Controller cabling

46 Cabling


Software and configuration utilitiesManagement and diagnostic tools

<Will there be any SW overviews here?>

For more information, see the HPE Synergy Configuration and Compatibility Guide on the Hewlett PackardEnterprise website.

Software and configuration utilities 47



Removing and replacing the system batteryIf the compute module no longer automatically displays the correct date and time, then replace the batterythat provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING:The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkalinebattery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the riskof personal injury:

• Do not attempt to recharge the battery.• Do not expose the battery to temperatures higher than 60°C (140°F).• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.• Replace only with the spare designated for this product.

To remove the component:

1. Power down the compute module (Powering down the compute module).2. Remove the compute module (Removing the compute module).3. Place the compute module on a flat, level work surface.4. Remove the access panel (Removing the access panel).5. Remove the front panel/drive cage assembly (Removing the front panel/drive cage assembly).6. Locate the battery on the system board (System board components).7. Remove the battery.

1

2

IMPORTANT:Replacing the system board battery resets the system ROM to its default configuration. Afterreplacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities toreconfigure the system.

To replace the component, reverse the removal procedure.

For more information about battery replacement or proper disposal, contact an authorized reseller or anauthorized service provider.

48 Removing and replacing the system battery

Warranty and regulatory informationWarranty information

HPE ProLiant and x86 Servers and Options

HPE Enterprise Servers

HPE Storage Products

HPE Networking Products

Regulatory informationSafety and regulatory compliance

For important safety, environmental, and regulatory information, see Safety and Compliance Information forServer, Storage, Power, Networking, and Rack Products, available at the Hewlett Packard Enterprisewebsite.

Belarus Kazakhstan Russia marking

Manufacturer and Local Representative Information

Manufacturer information:

Hewlett Packard Enterprise Company, 3000 Hanover Street, Palo Alto, CA 94304 U.S.

Local representative information Russian:

• Russia:

• Belarus:

• Kazakhstan:

Local representative information Kazakh:

• Russia:

Warranty and regulatory information 49

http://www.hpe.com/support/ProLiantServers-Warranties

http://www.hpe.com/support/EnterpriseServers-Warranties

http://www.hpe.com/support/Storage-Warranties

http://www.hpe.com/support/Networking-Warranties

http://www.hpe.com/support/Safety-Compliance-EnterpriseProducts

http://www.hpe.com/support/Safety-Compliance-EnterpriseProducts

• Belarus:

• Kazakhstan:

Manufacturing date:

The manufacturing date is defined by the serial number.

CCSYWWZZZZ (serial number format for this product)

Valid date formats include:

• YWW, where Y indicates the year counting from within each new decade, with 2000 as the starting point;for example, 238: 2 for 2002 and 38 for the week of September 9. In addition, 2010 is indicated by 0, 2011by 1, 2012 by 2, 2013 by 3, and so forth.

• YYWW, where YY indicates the year, using a base year of 2000; for example, 0238: 02 for 2002 and 38 forthe week of September 9.

Turkey RoHS material content declaration

Ukraine RoHS material content declaration

50 Turkey RoHS material content declaration

Electrostatic dischargePreventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you must follow when setting up the system orhandling parts. A discharge of static electricity from a finger or other conductor may damage system boards orother static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.• Place parts on a grounded surface before removing them from their containers.• Avoid touching pins, leads, or circuitry.• Always be properly grounded when touching a static-sensitive component or assembly.

Grounding methods to prevent electrostatic dischargeSeveral methods are used for grounding. Use one or more of the following methods when handling orinstalling electrostatic-sensitive parts:

• Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist strapsare flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To provideproper ground, wear the strap snug against the skin.

• Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet whenstanding on conductive floors or dissipating floor mats.

• Use conductive field service tools.• Use a portable field service kit with a folding static-dissipating work mat.

If you do not have any of the suggested equipment for proper grounding, have an authorized reseller installthe part.

For more information on static electricity or assistance with product installation, contact an authorized reseller.

Electrostatic discharge 51

SpecificationsEnvironmental specifications

Specification Value

Temperature range* —

Operating 10°C to 35°C (50°F to 95°F)

Non-operating -30°C to 60°C (-22°F to 140°F)

Relative humidity (noncondensing)** —

Operating 10% to 90% @ 28°C (82.4°F)

Non-operating 5% to 95% @ 38.7°C (101.7°F)

Altitude† —

Operating 3050 m (10,000 ft)

Non-operating 9144 m (30,000 ft)

* The following temperature conditions and limitations apply:

• All temperature ratings shown are for sea level.• An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) up to 3048 m (10,000 ft) applies.• No direct sunlight is allowed.• The maximum permissible rate of change is 10°C/hr (18°F/hr).• The type and number of options installed might reduce the upper temperature and humidity limits.• Operating with a fan fault or above 30°C (86°F) might reduce system performance.

** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F).

† Maximum storage altitude corresponds to a minimum pressure of 70 kPa (10.1 psia).

Compute module specificationsSpecification Value

Height 63.50 mm (2.50 in)

Depth 600.00 mm (23.62 in)

Width 214.00 mm (8.43 in)

Weight (maximum) 8.16 kg (18.00 lb)

Weight (minimum) 6.57 kg (14.50 lb)

52 Specifications

Documentation and troubleshooting resourcesfor HPE Synergy

HPE Synergy documentationThe Hewlett Packard Enterprise Information Library (www.hpe.com/info/synergy-docs) is a task-basedrepository. It includes installation instructions, user guides, maintenance and service guides, best practices,and links to additional resources. Use this website to obtain the latest documentation, including:

• Learning about HPE Synergy technology• Installing and cabling HPE Synergy• Updating the HPE Synergy components• Using and managing HPE Synergy• Troubleshooting HPE Synergy

HPE Synergy Configuration and Compatibility GuideThe HPE Synergy Configuration and Compatibility Guide is in the Hewlett Packard Enterprise InformationLibrary (www.hpe.com/info/synergy-docs). It provides an overview of HPE Synergy management and fabricarchitecture, detailed hardware component identification and configuration, and cabling examples.

HPE OneView User Guide for HPE SynergyThe HPE OneView User Guide for HPE Synergy is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It describes resource features, planning tasks, configuration quick starttasks, navigational tools for the graphical user interface, and more support and reference information for HPEOneView.

HPE OneView Global DashboardThe HPE OneView Global Dashboard provides a unified view of health, alerting, and key resources managedby HPE OneView across multiple platforms and data center sites. The HPE OneView Global Dashboard UserGuide is in the Hewlett Packard Enterprise Information Library (www.hpe.com/info/synergy-docs). Itprovides instructions for installing, configuring, navigating, and troubleshooting the HPE OneView GlobalDashboard.

HPE Synergy Image Streamer User GuideThe HPE Synergy Image Streamer User Guide is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It describes the OS deployment process using Image Streamer,features of Image Streamer, and purpose and life cycle of Image Streamer artifacts. It also includesauthentication, authorization, and troubleshooting information for Image Streamer.

HPE Synergy Image Streamer GitHubThe HPE Synergy Image Streamer GitHub repository (github.com/HewlettPackard) contains sampleartifacts and documentation on how to use the sample artifacts. It also contains technical white papersexplaining deployment steps that can be performed using Image Streamer.

HPE Synergy Software Overview GuideThe HPE Synergy Software Overview Guide is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It provides detailed references and overviews of the various software

Documentation and troubleshooting resources for HPE Synergy 53





https://www.hpe.com/info/synergy-docs

https://github.com/HewlettPackard/


and configuration utilities to support HPE Synergy. The guide is task-based and covers the documentationand resources for all supported software and configuration utilities available for:

• HPE Synergy setup and configuration• OS deployment• Firmware updates• Troubleshooting• Remote support

Best Practices for HPE Synergy Firmware and Driver UpdatesThe Best Practices for HPE Synergy Firmware and Driver Updates is in the Hewlett Packard EnterpriseInformation Library (www.hpe.com/info/synergy-docs). It provides information on recommended bestpractices to update firmware and drivers through HPE Synergy Composer, which is powered by HPEOneView.

HPE OneView Support Matrix for HPE SynergyThe HPE OneView Support Matrix for HPE Synergy is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It maintains the latest software and firmware requirements, supportedhardware, and configuration maximums for HPE OneView.

HPE Synergy Image Streamer Support MatrixThe HPE Synergy Image Streamer Support Matrix is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It maintains the latest software and firmware requirements, supportedhardware, and configuration maximums for HPE Synergy Image Streamer.

HPE Synergy GlossaryThe HPE Synergy Glossary, in the Hewlett Packard Enterprise Information Library (www.hpe.com/info/synergy-docs), defines common terminology associated with HPE Synergy.

HPE Synergy troubleshooting resourcesHPE Synergy troubleshooting resources are available within HPE OneView and in the Hewlett PackardEnterprise Information Library (www.hpe.com/info/synergy-docs).

Troubleshooting within HPE OneViewHPE OneView graphical user interface includes alert notifications and options for troubleshooting within HPEOneView. The UI provides multiple views of HPE Synergy components, including colored icons to indicateresource status and potential problem resolution in messages.

You can also use the Enclosure view and Map view to quickly see the status of all discovered HPE Synergyhardware.

HPE Synergy Troubleshooting GuideThe HPE Synergy Troubleshooting Guide is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It provides information for resolving common problems and courses ofaction for fault isolation and identification, issue resolution, and maintenance for both HPE Synergy hardwareand software components.

54 Best Practices for HPE Synergy Firmware and Driver Updates








HPE Error Message Guide for HPE SynergyThe HPE Error Message Guide for HPE Synergy is in the Hewlett Packard Enterprise Information Library(www.hpe.com/info/synergy-docs). It provides information for resolving common problems associated withspecific error messages received for both HPE Synergy hardware and software components.

HPE OneView and HPE OneView REST API scripting helpThe HPE OneView Help, the HPE OneView REST API Scripting Help, and the HPE OneView API Referenceare readily accessible, embedded online help available within the HPE OneView user interface. These helpfiles include “Learn more” links to common issues, as well as procedures and examples to troubleshootissues within HPE Synergy.

The help files are also available in the Hewlett Packard Enterprise Information Library (www.hpe.com/info/synergy-docs).

HPE Synergy QuickSpecsHPE Synergy has system specifications as well as individual product and component specifications. Forcomplete specification information, see the HPE Synergy and individual Synergy product QuickSpecs on theHewlett Packard Enterprise website (www.hpe.com/info/qs).

HPE Error Message Guide for HPE Synergy 55





Support and other resourcesAccessing Hewlett Packard Enterprise Support

• For live assistance, go to the Contact Hewlett Packard Enterprise Worldwide website.• To access documentation and support services, go to the Hewlett Packard Enterprise Support Center

website.

Information to collect• Technical support registration number (if applicable)• Product name, model or version, and serial number• Operating system name and version• Firmware version• Error messages• Product-specific reports and logs• Add-on products or components• Third-party products or components

Accessing updates• Some software products provide a mechanism for accessing software updates through the product

interface. Review your product documentation to identify the recommended software update method.• To download product updates, go to either of the following:

◦ Hewlett Packard Enterprise Support Center Get connected with updates page◦ Software Depot website

• To view and update your entitlements, and to link your contracts and warranties with your profile, go to the Hewlett Packard Enterprise Support Center More Information on Access to Support Materials page.

IMPORTANT:: Access to some updates might require product entitlement when accessed through the HewlettPackard Enterprise Support Center. You must have an HP Passport set up with relevantentitlements.

Websites• Hewlett Packard Enterprise Information Library• Hewlett Packard Enterprise Support Center• Contact Hewlett Packard Enterprise Worldwide• Subscription Service/Support Alerts• Software Depot• Customer Self Repair• Insight Remote Support• Serviceguard Solutions for HP-UX• Single Point of Connectivity Knowledge (SPOCK) Storage compatibility matrix• Storage white papers and analyst reports

56 Support and other resources

http://www.hpe.com/assistance

http://www.hpe.com/support/hpesc


http://www.hpe.com/support/e-updates

http://www.hpe.com/support/softwaredepot

http://www.hpe.com/support/AccessToSupportMaterials

http://www.hpe.com/info/enterprise/docs


http://www.hpe.com/assistance

http://www.hpe.com/support/e-updates

http://www.hpe.com/support/softwaredepot

http://www.hpe.com/support/selfrepair

http://www.hpe.com/info/insightremotesupport/docs

http://www.hpe.com/info/hpux-serviceguard-docs

http://www.hpe.com/storage/spock

http://www.hpe.com/storage/whitepapers

Customer Self RepairHewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimizerepair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosisperiod Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners)identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will shipthat part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterpriseto replace these parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for customerself repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may ormay not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order tosatisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service providerreplace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery.Same day or four-hour delivery may be offered at an additional charge where geography permits. Ifassistance is required, you can call the Hewlett Packard Enterprise Support Center and a technician will helpyou over the telephone. Hewlett Packard Enterprise specifies in the materials shipped with a replacementCSR part whether a defective part must be returned to Hewlett Packard Enterprise. In cases where it isrequired to return the defective part to Hewlett Packard Enterprise, you must ship the defective part back toHewlett Packard Enterprise within a defined period of time, normally five (5) business days. The defective partmust be returned with the associated documentation in the provided shipping material. Failure to return thedefective part may result in Hewlett Packard Enterprise billing you for the replacement. With a customer selfrepair, Hewlett Packard Enterprise will pay all shipping and part return costs and determine the courier/carrierto be used.

For more information about the Hewlett Packard Enterprise CSR program, contact your local service provider.For the North American program, go to the Hewlett Packard Enterprise CSR website.

Réparation par le client (CSR)

Les produits Hewlett Packard Enterprise comportent de nombreuses pièces CSR (Customer Self Repair =réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des piècesdéfectueuses. Si pendant la période de diagnostic, Hewlett Packard Enterprise (ou ses partenaires oumainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HewlettPackard Enterprise vous l'envoie directement. Il existe deux catégories de pièces CSR :

• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez àHewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre duservice vous seront facturés.

• Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont égalementconçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez àHewlett Packard Enterprise de remplacer ces pièces, l'intervention peut ou non vous être facturée, selonle type de garantie applicable à votre produit.

REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au clientd'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard Enterprise exigeque le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par lamention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votresituation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jourmême ou dans les 4 heures, celle-ci vous sera facturée. Pour toute assistance, appelez le Centred’assistance Hewlett Packard Enterprise pour qu’un technicien vous aide au téléphone. Dans les documentsenvoyés avec la pièce de rechange CSR, Hewlett Packard Enterprise précise s'il est nécessaire de lui

Customer Self Repair 57


retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq(5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous neretournez pas la pièce défectueuse, Hewlett Packard Enterprise se réserve le droit de vous facturer les coûtsde remplacement. Dans le cas d'une pièce CSR, Hewlett Packard Enterprise supporte l'ensemble des fraisd'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre MainteneurAgrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HewlettPackard Enterprise.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, iprodotti Hewlett Packard Enterprise sono realizzati con numerosi componenti che possono essere riparatidirettamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica Hewlett Packard Enterprise (oun centro di servizi o di assistenza Hewlett Packard Enterprise) identifica il guasto come riparabile medianteun ricambio CSR, Hewlett Packard Enterprise lo spedirà direttamente al cliente per la sostituzione. Vi sonodue categorie di parti CSR:

• Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida lariparazione ad Hewlett Packard Enterprise, deve sostenere le spese di spedizione e di manodopera per ilservizio.

• Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componentiprogettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad Hewlett Packard Enterprise,potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte delcliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da uncentro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giornolavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costosolo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro disupporto tecnico Hewlett Packard Enterprise. Nel materiale fornito con una parte di ricambio CSR, HewlettPackard Enterprise specifica se il cliente deve restituire dei component. Qualora sia richiesta la resa adHewlett Packard Enterprise del componente difettoso, lo si deve spedire ad Hewlett Packard Enterprise entroun determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deveessere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzionedel componente può comportare la fatturazione del ricambio da parte di Hewlett Packard Enterprise. Nel casodi riparazione da parte del cliente, Hewlett Packard Enterprise sostiene tutte le spese di spedizione e resa esceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di assistenzadi zona. Per il programma in Nord America fare riferimento al sito Web.

Customer Self Repair

Hewlett Packard Enterprise Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeitenzu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HewlettPackard Enterprise (oder ein Hewlett Packard Enterprise Servicepartner) bei der Diagnose feststellt, dass dasProdukt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen Hewlett Packard Enterprise diesesBauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

• Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie denAustausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- undArbeitskosten für diesen Service berechnet.

• Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch fürCustomer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett PackardEnterprise vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produktvorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.





HINWEIS: Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um denGarantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard EnterpriseServicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.„Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einenAufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das Hewlett Packard Enterprise Support Centeranrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett PackardEnterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil anHewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil anHewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun,in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigenDokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie dasdefekte Teil nicht zurückschicken, kann Hewlett Packard Enterprise Ihnen das Ersatzteil in Rechnung stellen.Im Falle von Customer Self Repair kommt Hewlett Packard Enterprise für alle Kosten für die Lieferung undRücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten Sievon Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der Hewlett Packard Enterprise Website unter.

Reparaciones del propio cliente

Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puedereemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayorflexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase dediagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett PackardEnterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR,Hewlett Packard Enterprise le enviará dicho componente directamente para que realice su sustitución. Loscomponentes CSR se clasifican en dos categorías:

• Obligatorio—componentes cuya reparación por parte del usuario es obligatoria. Si solicita a HewlettPackard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de losgastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional—componentes cuya reparación por parte del usuario es opcional. Estos componentes tambiénestán diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HewlettPackard Enterprise realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipode servicio de garantía correspondiente al producto.

NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan serreparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone comocondición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichoscomponentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a sudestino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en elmismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro deasistencia técnica de Hewlett Packard Enterprise y recibirá ayuda telefónica por parte de un técnico. Con elenvío de materiales para la sustitución de componentes CSR, Hewlett Packard Enterprise especificará si loscomponentes defectuosos deberán devolverse a Hewlett Packard Enterprise. En aquellos casos en los quesea necesario devolver algún componente a Hewlett Packard Enterprise, deberá hacerlo en el periodo detiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolversecon toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuosorequerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución. En el caso de todas sustitucionesque lleve a cabo el cliente, Hewlett Packard Enterprise se hará cargo de todos los gastos de envío ydevolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Support and other resources 59


Para obtener más información acerca del programa de Reparaciones del propio cliente de Hewlett PackardEnterprise, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa paraNorteamérica, visite la página web de Hewlett Packard Enterprise CSR.

Customer Self Repair

Veel onderdelen in Hewlett Packard Enterprise producten zijn door de klant zelf te repareren, waardoor dereparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelengroter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als Hewlett PackardEnterprise (of een Hewlett Packard Enterprise Service Partner) bij de diagnose vaststelt dat de reparatie kanworden uitgevoerd met een CSR-onderdeel, verzendt Hewlett Packard Enterprise dat onderdeel rechtstreeksnaar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

• Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard Enterpriseverzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon inrekening gebracht.

• Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijnontworpen voor reparatie door de klant. Als u echter Hewlett Packard Enterprise verzoekt dezeonderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijkvan het type garantieservice voor het product.

OPMERKING: Sommige Hewlett Packard Enterprise onderdelen zijn niet ontwikkeld voor reparatie door deklant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partnerworden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met"Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op deeerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten wordenaangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie is gewenst, belt u het Hewlett PackardEnterprise Support Center om via de telefoon ondersteuning van een technicus te ontvangen. HewlettPackard Enterprise vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeelaan Hewlett Packard Enterprise moet worden geretourneerd. Als het defecte onderdeel aan Hewlett PackardEnterprise moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode,gewoonlijk vijf (5) werkdagen, retourneren aan Hewlett Packard Enterprise. Het defecte onderdeel moet metde bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u hetdefecte onderdeel niet terugzendt, kan Hewlett Packard Enterprise u voor het vervangende onderdeel kostenin rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voorhet vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programmavan Hewlett Packard Enterprise. Informatie over Service Partners vindt u op de Hewlett Packard Enterprisewebsite.

Reparo feito pelo cliente

Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo cliente(CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças comdefeito. Se, durante o período de diagnóstico, a Hewlett Packard Enterprise (ou fornecedores/parceiros daHewlett Packard Enterprise) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a HewlettPackard Enterprise enviará a peça diretamente ao cliente. Há duas categorias de peças CSR:

• Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett PackardEnterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

• Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para oreparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, podehaver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado aoproduto.





OBSERVAÇÃO: Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelocliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizadosubstitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após opedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode serfeita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnicoda Hewlett Packard Enterprise para que um técnico o ajude por telefone. A Hewlett Packard Enterpriseespecifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvidaà Hewlett Packard Enterprise. Nos casos em que isso for necessário, é preciso enviar a peça com defeito àHewlett Packard Enterprise, você deverá enviar a peça com defeito de volta para a Hewlett PackardEnterprise dentro do período de tempo definido, normalmente em 5 (cinco) dias úteis. A peça com defeitodeve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça,a Hewlett Packard Enterprise poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, aHewlett Packard Enterprise paga todas as despesas de transporte e de devolução da peça e determina atransportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise,entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site daHewlett Packard Enterprise.

Support and other resources 61



Remote supportRemote support is available with supported devices as part of your warranty or contractual supportagreement. It provides intelligent event diagnosis, and automatic, secure submission of hardware eventnotifications to Hewlett Packard Enterprise, which will initiate a fast and accurate resolution based on yourproduct's service level. Hewlett Packard Enterprise strongly recommends that you register your device forremote support.

If your product includes additional remote support details, use search to locate that information.

Remote support and Proactive Care information

HPE Get Connected

HPE Proactive Care services

HPE Proactive Care service: Supported products list

HPE Proactive Care advanced service: Supported products list

Proactive Care customer information

Proactive Care central

Proactive Care service activation

Remote support 63

http://www.hpe.com/services/getconnected

http://www.hpe.com/services/proactivecare

http://www.hpe.com/services/proactivecaresupportedproducts

http://www.hpe.com/services/proactivecareadvancedsupportedproducts

http://www.hpe.com/services/proactivecarecentral

http://www.hpe.com/services/proactivecarecentralgetstarted

Acronyms and abbreviationsAMP

Advanced Memory Protection

API

application program interface

ASR

Automatic Server Recovery

CSR

certificate signing request

HP SUM

HP Smart Update Manager

HPE SSA

HPE Smart Storage Administrator

iLO

Integrated Lights-Out

IML

Integrated Management Log

JSON

JavaScript Object Notation

KVM

keyboard, video, and mouse

PCIe

Peripheral Component Interconnect Express

POST

Power-On Self-Test

RBSU

ROM-Based Setup Utility

REST

representational state transfer

SAS

serial attached SCSI

SPP

Service Pack for ProLiant

SUV

serial, USB, video

TPM

64 Acronyms and abbreviations

Trusted Platform Module

UEFI

Unified Extensible Firmware Interface

USB

universal serial bus

VCA

Version Control Agent

VCRM

Version Control Repository Manager

Acronyms and abbreviations 65

Documentation feedbackHewlett Packard Enterprise is committed to providing documentation that meets your needs. To help usimprove the documentation, send any errors, suggestions, or comments to Documentation Feedback([email protected]). When submitting your feedback, include the document title, part number, edition,and publication date located on the front cover of the document. For online help content, include the productname, product version, help edition, and publication date located on the legal notices page.

66 Documentation feedback

mailto:[email protected]

hpe synergy 480 gen9 compute module user guide · 2017. 10. 31. · hpe synergy 480 gen9 compute...

Documents