HOW TO USE MICROCOOL’SMDT FIN TECHNOLOGY

1.) TRADITIONAL COLDPLATEStandard IGBTs are bolted to the coldplate with a thermal interface material between the baseplate and coldplate.

• 10 Standard form factors

• 2 Standard performance models. STD (12 FPI) and XP (20FPI)

• 6061-T6 Aluminum Manifold

• 1100-H14 Aluminum Fin plate

2.) CUSTOM BASE PLATE

MicroCool can supply base plates for an IGBT to be built upon and eliminate TIM material.• Silver plated 1100-H12 Aluminum which can have die

attached via silver sintering• Copper/Aluminum diffusion bonded Clad metal

• 1mm of Copper 110 material to solder DBC to

• 3mm of Aluminum 1100-H12 with 4mm tall fins

3.) MICROCOOL CAP• Size, Weight, Power

• Reduces thermal resistance by eliminating TIM and extra copper thickness

• No need for customer to purchase as cooling solution.

• Integrated baseplate with cover eliminates the need for customer to design a “tub” and customer designed o-ring seal.

• Since its all copper construction it eliminates the corrosion issues between copper baseplate and dissimilar metal covers.

• This design allows use of a hot fluid to solder die to the baseplate/coldplate.

• Bottom area of coldplate normally reserved as a cooling surface can now be used for power or other connections.

4.) LARGE CASTING INTEGRATIONMicroCool can integrate fin plates into an existing casting design to be friction stir welded into place to provide a leak proof high performance design.• RAW casting can be sourced my MicroCool or the customer• Casting and fin plates are joined via friction stir welding• Assembly is then vacuum impregnated to ensure water tight seal.• IGBTs are mounted into the finished assembly with a thermal

interface material between the parts.