high power igbt inverter design
TRANSCRIPT
© 2009 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary© 2009 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary
Marius Rosu PhD, EM Product ManagerScott Stanton, Technical DirectorLeon Voss PhD, Senior AEVincent Delafosse, Senior AE
Marius Rosu PhD, EM Product ManagerScott Stanton, Technical DirectorLeon Voss PhD, Senior AEVincent Delafosse, Senior AE
High Power IGBT Inverter DesignHigh Power IGBT Inverter Design
© 2009 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary
Objectives
• ANSYS Multiphysics Inverter Design Flow– High Power System Design Concept
• IGBT Electro-Thermal Model– Average– Dynamic
• IGBT Package Thermal Model– Extracted from CFD
– IGBT Package Mechanical Stress Analysis• Thermal Stress• Electromagnetic Forces
– EMC/EMI Analysis• Parameter Extraction: R, L, C, G• Radiated Emissions – Full Wave Effects
© 2009 ANSYS, Inc. All rights reserved. 3 ANSYS, Inc. Proprietary
Outline
ω+ω
+
ICA:
+Φ+ΦGAINGAIN
CONSTCONST
CONSTCONST
EQUBLEQUBL
EQUBLEQUBL
EQUBLEQUBL
ANGRA
57.3
-60+PWM_P
-30+PWM_P
EQUBLEQUBL
CONSTCONST -90+PWM_P
EQUBLEQUBL
CONSTCONST -120+PWM_P
EQUBLEQUBL
CONSTCONST -150+PWM_P
FEA
sourceA1
sourceA2
sourceB1
sourceB2
sourceC1
sourceC2
Magnet01
Magnet02
ECE - LINKECE - LINKECE - LINKECE - LINK
ECELink
W
+W
+
E
E
E
AA
IA
AA
IB
AA
IC
EQUEQU
Ix := Ixa +
Ixa :=
Iyb := IB.I
Iy := Iya +
Ixc := IC.I
Im := sqrt(Ix^
Iya
Iyc := IC.I
delta := at
Ixb := IB.I
DD
DD
DD
Ansoft SIMPLORERAnsoft SIMPLORERANSYS IcepackANSYS IcepackAnsoft Q3DAnsoft Q3D
ANSYS MechanicalANSYS MechanicalAnsoft SimplorerAnsoft SimplorerAnsoft HFSSAnsoft HFSS
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Ansoft SIMPLORERAnsoft SIMPLORER
High Power Inverter System Multiphysics Design Concept
ANSYS IcepackANSYS IcepackModel Order ReductionModel Order Reduction
Ansoft Maxwell/RMxprtAnsoft Maxwell/RMxprtModel Order ReductionModel Order Reduction
ANSYS MechanicalANSYS MechanicalModel Order ReductionModel Order Reduction
Ansoft SIMPLORERAnsoft SIMPLORER
Temperature profileTemperature profile
Current profileCurrent profile
© 2009 ANSYS, Inc. All rights reserved. 5 ANSYS, Inc. Proprietary
IGBT FamilyElectro-Thermal Model
DC core
A
Energy calculation
B
Thermal network
F
DC core
A C
Thermal network
F
Capacities C(V), C(I)parasitics L, R, Ccontrolled sources
E
Full parameter excess
Maximum simulation speed:• Accurate static behaviour
• Accurate thermal response
• No voltage and current transients
• Suitable for system design analysis
Average IGBT ModelAverage IGBT Model Dynamic IGBT ModelDynamic IGBT Model
Maximum simulation accuracy:• Sophisticated semiconductor based model
• Accurate static, dynamic and thermal behaviour
• Accurate gate voltage and current waveforms
• Suitable for drive optimization, EMI/EMC
© 2009 ANSYS, Inc. All rights reserved. 6 ANSYS, Inc. Proprietary
IGBT Device GenerationCharacterization Tool
Extraction of the IGBT Electro-Thermal ParametersExtraction of the IGBT Electro-Thermal Parameters
Tran
sfer
char
acte
ristic
cu
rve f
rom
dat
ashe
etFi
tted
curv
e vs
. mea
sure
d da
ta
Measured Data
Fitted Curve
Extracted parameter values
© 2009 ANSYS, Inc. All rights reserved. 7 ANSYS, Inc. Proprietary
The Average IGBT Model
• Three main parts– static core– thermal network– energy calculation section
• Parameters extracted through characteristic curves
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The Average IGBT Model (2)
• Switching V and I waveforms are square• Switching losses are calculated at each switching period• Turn-ON/OFF power pulses are injected into thermal network• Amplitude of the rectangular power pulses are calculated
• PON/POFF – Switching Power • EON/EOFF – Energy losses • PDC – Conduction power dissipation; • TON/TOFF – Power injection pulse durations• Vce,sat – Saturation collector-emitter voltage
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The Dynamic IGBT Model
• Dynamic IGBT shares the same static the Average model• The switching energy of the Dynamic IGBT model is the direct
integration of the switching voltage and current
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The Dynamic IGBT Model (2)
• Dynamic IGBT accurately captures the switching waveforms• Suitable for EMI/EMC analysis
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IGBT PackageThermal Model: Technical Background
• Temperature rise at any point in the system is the sum of the independently derived temperature increase attributable to each heat source in the system
• Assumptions:– Temperature assumed to be a linear function of heat sources– This requires that the fluid flow is constant (for each study) and density
and all properties are constants
ANSYS IcepackANSYS Icepack
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IGBT Package (2)Thermal Model: Technical Background
[ ]Tn21
nn2n1n
n22221
n11211
n
2
1
)t(h)t(h)t(h
)t()t()t(
)t()t()t()t()t()t(
)t(T
)t(T)t(T
L
L
MOMM
L
L
M
⎥⎥⎥⎥⎥
⎦
⎤
⎢⎢⎢⎢⎢
⎣
⎡
θϕϕ
ϕθϕϕϕθ
=
⎥⎥⎥⎥⎥
⎦
⎤
⎢⎢⎢⎢⎢
⎣
⎡
Δ
ΔΔ
Foster networkFoster network
Each matrix element is a complete thermal transient response curve
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IGBT Package Thermal Model Implementation
PTT
PT)t(Z ref
th−
=Δ
=
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IGBT Package Thermal ModelValidation
• Simple 4-node system• Air at a constant speed of 1 m/s
11
22
33
44
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Node 1 – self-heating Node 1 – Due to Source 2
Node 1 – Due to Source 4 Node 1 – Due to Source 3
IGBT Package Thermal ModelBlue-measurement data Red-fitted results
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IGBT Package Thermal ModelValidation
Temperature at Node 1 with time-variant heat fluxTemperature at Node 1 with time-variant heat flux
Temperature at Node 1 with constant heat flux applied at all 4 nodesTemperature at Node 1 with constant heat flux applied at all 4 nodes
© 2009 ANSYS, Inc. All rights reserved. 17 ANSYS, Inc. Proprietary
IGBT Inverter DesignHigh Power System Analysis
Line Current ProfileLine Current Profile
DC Current ProfileDC Current Profile
Ansoft SIMPLORER V8.1Ansoft SIMPLORER V8.1
© 2009 ANSYS, Inc. All rights reserved. 18 ANSYS, Inc. Proprietary
IGBT Inverter DesignMechanical Stress Analysis
Ansoft Maxwell V13.0 coupled with ANSYS Mechanical R12.1Ansoft Maxwell V13.0 coupled with ANSYS Mechanical R12.1
InputLine Current
Profile
InputLine Current
Profile
InputDC Current Profile
InputDC Current Profile
Mapping Electromagnetic ForceMapping Electromagnetic Force
Mapping Power LossMapping Power Loss Thermal-StructuralThermal-Structural
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IGBT Inverter Design (2)Mechanical Stress Analysis
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EMI/EMCElectrical Parasitics Extraction
• Extract the resistance, inductance, capacitance and conductance (RLCG) parameters of the entire package
Low FrequencyLow Frequency High FrequencyHigh Frequency
Ansoft Q3DAnsoft Q3D
Frequency can have a significant impact on the design performanceFrequency can have a significant impact on the design performance
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• Extracting parameters is straightforward as the nets are automatically assigned
EMI/EMCElectrical Parasitics Extraction
Negative BarNegative BarPositive BarPositive Bar
Phase APhase A
Phase BPhase B
Phase CPhase C
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EMI/EMCIGBT Mesh and Field Result
The structure is meshed using automatic and adaptive meshing
Current DistributionCurrent Distribution
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• How do we set up the frequency sweep?– Nyquist sampling: To capture a time step of Ts, obtain frequency domain
information up to:
– For a time domain waveform with a risetime of 80 ns, in order to capture the ringing in the time domain, we would want to capture at least 4 samples during this risetime. This implies a sampling time of 20 ns
• We need to solve up to 50 MHz (= 1/20ns)
stF
×=
21
max
EMI/EMCParasitics Extraction
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EMI/EMCParasitics Extraction
• The simulation outputs consist of the RLC matrices for different frequencies
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Circuit Design based on Parametrized IGBT and Frequency Dependent ModelCircuit Design based on Parametrized IGBT and Frequency Dependent Model
System Integration
© 2009 ANSYS, Inc. All rights reserved. 26 ANSYS, Inc. Proprietary
ω+ω
+
ICA:
+Φ
+ΦGAINGAIN
CONSTCONST
CONSTCONST
EQUBLEQUBL
EQUBLEQUBL
EQUBLEQUBL
ANGRAD
57.3
-60+PWM_PER
-30+PWM_PER
EQUBLEQUBL
CONSTCONST -90+PWM_PER
EQUBLEQUBL
CONSTCONST -120+PWM_PER
EQUBLEQUBL
CONSTCONST -150+PWM_PER
FEA
sourceA1
sourceA2
sourceB1
sourceB2
sourceC1
sourceC2
Magnet01
Magnet02
ECE - LINKECE - LINKECE - LINKECE - LINK
ECELink1
W
+W
+
-22.50
60.00
0
25.00
50.00
0 240.00m100.00m
2DGraphSel1 NIGBT71.IC
Extract Power LossExtract Power Loss
0
474.00m
200.00m
400.00m
100.00 1.00Meg1.00k 3.00k 10.00k 100.00k
2DGraphCon1
GS_I...FFT
EA
E
EC
AA
IA
AA
IB
AA
IC
EQUEQU
Ix := Ixa +
Ixa :=
Iyb := IB.I *
Iy := Iya + I
Ixc := IC.I *
Im := sqrt(Ix^2 +
Iya :
Iyc := IC.I *
delta := ata
Ixb := IB.I *
DD
DD
DD
System Integration (2)
© 2009 ANSYS, Inc. All rights reserved. 27 ANSYS, Inc. Proprietary
0
474.00m
200.00m
400.00m
100.00 1.00Meg1.00k 3.00k 10.00k 100.00k
2DGraphCon1
GS_I...
Freq. res.Freq. res.
Normalized S para.Normalized S para.MagE@10m byspecified inputsMagE@10m byspecified inputs
Multiplied magE plotsby Simplorer
Multiplied magE plotsby Simplorer
Emission TestEmission Test
Full Wave Effect
Ansoft HFSSAnsoft HFSS
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The Virtual TestThe Whole Car Body
© 2009 ANSYS, Inc. All rights reserved. 29 ANSYS, Inc. Proprietary
Conclusion
ω+ω
+
ICA:
+Φ+ΦGAINGAIN
CONSTCONST
CONSTCONST
EQUBLEQUBL
EQUBLEQUBL
EQUBLEQUBL
ANGRA
57.3
-60+PWM_P
-30+PWM_P
EQUBLEQUBL
CONSTCONST -90+PWM_P
EQUBLEQUBL
CONSTCONST -120+PWM_P
EQUBLEQUBL
CONSTCONST -150+PWM_P
FEA
sourceA1
sourceA2
sourceB1
sourceB2
sourceC1
sourceC2
Magnet01
Magnet02
ECE - LINKECE - LINKECE - LINKECE - LINK
ECELink
W
+W
+
E
E
E
AA
IA
AA
IB
AA
IC
EQUEQU
Ix := Ixa +
Ixa :=
Iyb := IB.I
Iy := Iya +
Ixc := IC.I
Im := sqrt(Ix^
Iya
Iyc := IC.I
delta := at
Ixb := IB.I
DD
DD
DD
Ansoft SIMPLORERAnsoft SIMPLORERANSYS IcepackANSYS IcepackAnsoft Q3DAnsoft Q3D
ANSYS MechanicalANSYS MechanicalAnsoft SimplorerAnsoft SimplorerAnsoft HFSSAnsoft HFSS