high performance silver polymer pastes for shj cells · cc ikts paste 21.8 % using ir curing...
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HIGH PERFORMANCE SILVER POLYMER PASTES FOR SHJ CELLS S. K örnera, A . W altingerb, U. Partscha, M . Ebersteina aFraunhofer IK TS, W interbergstraße 28, 01277 Dresden bM eyer Burger (Germany) A G, A n der Baumschule 6-8, 09337 Hohenstein-Ernstthal
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OUTLINE
IK TS: Paste Research Service (PRS) and Paste V endor for Niche M arkets (PV N)
SHJ: Low Temperature Pastes
Silver polymer paste
Experimental
Results and discussion
Summary
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OUTLINE
IK TS: Paste Research Service (PRS) and Paste V endor for Niche M arkets (PV N)
SHJ: Low Temperature Pastes
Silver polymer paste
Experimental
Results and discussion
Summary
![Page 4: HIGH PERFORMANCE SILVER POLYMER PASTES FOR SHJ CELLS · CC IKTS paste 21.8 % using IR curing benefit against convection of 0.1 % Fill factor constant higher than 80 % 21.00 21.25](https://reader035.vdocuments.us/reader035/viewer/2022070107/602255a322e73042b3081ef0/html5/thumbnails/4.jpg)
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IKTS Group Thick Film Technology, Photovoltaics: Paste Research Service PRS Paste Development , Manufacturing and Characterizat ion
• Functional phase
• Glass • Additives • Organics
(Binder, solvents…)
Composition
• Rheometry • Shrinkage • Thermal
Analysis • Particle Sizes
Paste Characterization
• Screen/ stencil
• M icro dispensing
• Gravure • Aerosol
Deposition
• Thick Film (min … h)
• Solar contact (sec)
Firing • Electrical • Topography • M icro
structure, phase content
Film Characterization
Funct ional Requi rem ent s
„ Ready f or Product ion“
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Paste Vendor for Niche Markets PVN: example AlN subst rates
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Future of crystalline silicon solar cell
ITRPV roadmap 2015 predicts eff iciencies for SHJ up to 25 % and market share of 10 % in the year 2025
BSF/PERC n-type mono Si
SHJ n-type mono Si
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OUTLINE
IK TS: Paste Research Service (PRS) and Paste V endor for Niche M arkets (PV N)
SHJ: Low Temperature Pastes
Silver polymer paste
Experimental
Results and discussion
Summary
![Page 8: HIGH PERFORMANCE SILVER POLYMER PASTES FOR SHJ CELLS · CC IKTS paste 21.8 % using IR curing benefit against convection of 0.1 % Fill factor constant higher than 80 % 21.00 21.25](https://reader035.vdocuments.us/reader035/viewer/2022070107/602255a322e73042b3081ef0/html5/thumbnails/8.jpg)
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Convent ional pastes for f ront side metallizat ion
800 °C, some seconds Cool down
A g
glass
Si 200 nm Li et al., J. Appl. Physics 110, 074304 (2011)
K ulushich, G., B. Bazer-Bachi, et al. (2012 A pril 03-05). Contact formation on 100 Ω/sq emitter by screen printed silver paste. SiliconPV , Leuven, Belgium.
K .-K . Hong, S.-B. Cho, J.S. Y ou, J.-W . Jeong, S.-M . Bea, J.-Y . Huh; M echanism for the formation of A g crystallites in the A g thick-f ilm contacts of crystalline Si solar cells, Solar Energy M aterials & Solar Cells 93 (2009) 898–90
e.g.
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SHJ cell concept
ITO
emitter: a-Si (p)
passivation: a-Si (i)
base: c-Si (n)
M aximum process temperature ≤ 200°C
silver
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Conductive phase A g
glass crucial for adhesion, reactive contact formation, and interface/f inger conductivty
Conductive phase A g or LM PA
polymer crucial for adhesion and interface/f inger conductivity
Low temperature thick f ilm pastes for solar cell metallizat ion
00:18.80 00:43.80 01:08.80 01:33.80 01:58.800
100
200
300
400
500
600
700
800
900
waf
er t
empe
ratu
re [°
C]
t ime [mm:ss.t t ]
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OUTLINE
IK TS: Paste Research Service (PRS) and Paste V endor for Niche M arkets (PV N)
SHJ: Low Temperature Pastes
Silver polymer paste
Experimental
Results and discussion
Summary
![Page 12: HIGH PERFORMANCE SILVER POLYMER PASTES FOR SHJ CELLS · CC IKTS paste 21.8 % using IR curing benefit against convection of 0.1 % Fill factor constant higher than 80 % 21.00 21.25](https://reader035.vdocuments.us/reader035/viewer/2022070107/602255a322e73042b3081ef0/html5/thumbnails/12.jpg)
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Processing of low temperature pastes
t
T
Thermal (IR or convection; air or nitrogen, 2400 wafers / h, manufactured 2015 by REHM , Germany)
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Low temperature thick f ilm pastes for solar cell metallizat ion
tuning of curable binder: polymer, solvent
40 µm 60 µm 80µm 100 µm conductive phases:
A g mono/polymodal Low M elting Point A lloys (LM PA ) Rsq = 25 mΩ/sq
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Experimental
IK TS paste
commercial paste
storage
fridge 7 °C or RT
f reezer -20 °C screen printing
convection
infrared
characterization
• 10 wafer per paste
• 74 f ingers with 100 µm width
• 5 wafer per kind of heat transfer
• 15 min at 200°C
• GridTouch system
• M easured at M eyer Burger (Germany) A G
• comparison with reference
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OUTLINE
IK TS: Paste Research Service (PRS) and Paste V endor for Niche M arkets (PV N)
SHJ: Low Temperature Pastes
Silver polymer paste
Experimental
Results and discussion
Summary
![Page 16: HIGH PERFORMANCE SILVER POLYMER PASTES FOR SHJ CELLS · CC IKTS paste 21.8 % using IR curing benefit against convection of 0.1 % Fill factor constant higher than 80 % 21.00 21.25](https://reader035.vdocuments.us/reader035/viewer/2022070107/602255a322e73042b3081ef0/html5/thumbnails/16.jpg)
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Elect rical performance
IK TS pastes provide slightly lower Jsc
Optimizing paste rheology will increase Jsc due to optimized f inger narrowing and decreasing shading
36.6
36.8
37.0
37.2
J sc [m
A*c
m²]
commercial IK TS
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Elect rical performance
36.6
36.8
37.0
37.2
J sc [m
A*c
m²]
0.725
0.730
0.735
0.740
V OC [V
]
commercial IK TS commercial IK TS
IK TS pastes provide slightly lower Jsc
Optimizing paste rheology will increase Jsc due to optimized f inger narrowing and decreasing shading
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Elect rical performance
Series resistances comparable for both pastes
Infrared curing provides lower series resistances as well as a lower standard deviation
Optimized heat transfer due to coupling of IR radiation
1.35
1.40
1.45
1.50
1.55
1.60
1.65
Rser
[Ohm
*cm
²]
0
5000
10000
15000
20000
Rshu
nt [O
hm*c
m²]
commercial IK TS commercial IK TS
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Elect rical performance
Eff iciency level higher than 21.5 %
CC commercial paste 22 % using IR curing benef it against convection of 0.25 %
CC IK TS paste 21.8 % using IR curing benef it against convection of 0.1 %
Fill factor constant higher than 80 %
21.00
21.25
21.50
21.75
22.00
22.25
Eta
[%]
0.790
0.795
0.800
0.805
0.810
0.815
0.820
fill
fact
or
commercial IK TS commercial IK TS
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Presence and future of crystalline silicon solar cell
2014 2016 2018 2020 2022 2024 202620.5
21.0
21.5
22.0
22.5
23.0
23.5
24.0
24.5
25.0
25.5
cell
effi
cien
cy [%
]
years
Predicted eff iciencies ITRPV Eff iciency reached today
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Performance forecast
Gen. 01 Gen. 02 Gen. 03
Gen. 01 Gen. 02 Gen. 030
5
10
15
20
25
30
Rsq@
25µm
[mO
hm/s
q.]
Ag composite with LM PA Polymodal A g composite
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Summary
1st generation IK TS paste curable at 200°C for SHJ solar cells is introduced
IR curing leads to better electrical performance of the reference paste as well as the own development, obviously due to improved microstructure formation
Electrical performance on cell level is comparable to industrial standard
Handling, storage and therewith processing of IK TS paste is much more easier than the commercial reference
Further improvement announced with next generations:
low melting point alloys with reduced silver amount
polymodal silver powders for minimal f inger resistances
2014 2016 2018 2020 2022 2024 202620.5
21.0
21.5
22.0
22.5
23.0
23.5
24.0
24.5
25.0
25.5
cell
effi
cien
cy [%
]
years
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Thanks t o t he germ an Federal M in ist ry o f Educat ion and Research (M WT+ #03SF0420)…
…and you f or your at t ent ion!
Further Information:
M arkus Eberstein
+49-351-2553-7518
[email protected] raunhofer.de
Fraunhofer Institut K eramische
Technologien und Systeme
W interbergstraße 28, 01277 Dresden