hardware management module
TRANSCRIPT
X64 Workshop
Hardware Management
Andy Harness
Systems-TSC Technical Community
Managing X64 Hardware
AMD CPU Types
System Upgrades - CPUs
System Upgrades - Memory
Identification of M2/Non-M2 Systems
Updating ILOM Firmware
System Board Replacement
Updating FRUID data
Current Issues
Single-core Opteron
AMD64
Direct Connect Architecture
Integrated DDR DRAM Memory Controller
HyperTransport Interconnect Technology
CPU1
1MB L2 Cache
MemoryController
HT0
HT1
HT2
Single Core AMD Opteron Design
CPU01MB L2 Cache
System Request Queue
Crossbar Switch
CPU01MB L2 CacheGo to slide 21 to show architectural differences between single and dual core
AMD Direct Connect Architecture
The AMD Direct-Connect Architecture eliminates traditional system bottlenecks created by Front Side Bus (FSB) architecture
Best approach of directly interconnecting CPU, memory, and I/O resources :
Direct connection of CPUs to each other using Coherent HyperTransport links
Direct connection of CPUs to I/O resources using HyperTransport links
Direct connection of CPUs to memory using integrated DDR memory controller
Direct connection between CPUs on the same die (Dual-core)
HyperTransport
HyperTransport
I/O
Direct Connect Architecture is the new terminology from AMD that regroups under one name all the technologies that differentiate AMD and Intel technology.
Dual-core Opteron
AMD64 was designed as CMP (Chip-level Multi-Processing) from the start with Crossbar Switch and System Request Queue (CPU1 uses 2nd port on SRQ)
Each core has dedicated 1MB L2 Cache
Both cores share the memory controller and HyperTransport interconnects
Performance characterization of single-core based systems have revealed that the Memory and HyperTransport bandwidths are under-utilized even while running high-end server workloads
CPU1
1MB L2 Cache
MemoryController
HT0
HT1
HT2
Dual-core AMD Opteron Design
CPU01MB L2 Cache
System Request Queue
Crossbar Switch
AMD64 processors designed from ground up to support multi-core
Seamless migration from single-core to multi-core
Same infrastructure
Same power envelope
Think about it. Higher performance. Same power envelope. Same infrastructure. Think about all the things you dont have to change:
Motherboard
Power supply
Cooling solutions
Heat sinks
All this requires is a processor swap and a BIOS update. This is an easy migration path for customers to increase their computing power in a cost-effective, non-disruptive manner.
Launched 21 April 2005
Leverage AMD Direct Connect Architecture to connect two CPUs on one die along with the memory, I/O which improves the overall system performance and efficiency
Socket compatible with existing AMD Opteron 940-pin sockets that support 90nm (95W/80A)
Only Rev E based systems are Dual-core upgradable with a BIOS update
Compatible with x86 and AMD64 applications
AMD CPUs - Next Generation Opteron (Rev F)
Continuity
Same 32/64-bit execution core
Same Power envelope
Same AMD Direct Connect Architecture w/ upto 3 HT links per CPU
Same 1 MB L2 cache per core
New Features
Second generation Opteron design
Dual-Core only
Seamless Dual-Core to Quad-Core upgradeability in same thermal envelope and socket
AMD Virtualization (AMD-V) hardware assisted support
Sockets F (LGA-1207) or AM2 (PGA-940)
AMD CPUs - Next Generation Opteron (Rev F)
Steppings F2 & F3
Rev F Opteron CPUs shipping in CY06Q4 are stepping F2
AMD were due to start production of F3 processors in November 2006 (Series 2000 & 8000) and December 2006 (Series 1000)
Stepping F3 has several Errata fixes
#133: Internal Termination Missing on Some Test Pins
#153: Potential System Hang in Multiprocessor systems with ? 14 Cores
#157: SMIs that are not Intercepted May Cause Unpredictable System Behaviour
Stepping F3 allows higher speed bins than F2
AMD has released BIOS code that ensures mixing of F2 & F3 CPUs in a single system. It is up to each Product Team to decide testing/qualification of such configurations Next Generation Opteron (Rev F)
AMD CPUs Opteron Rev F Model Naming
2 2 2 2
1/2/8
2
XX
3rd & 4th digits = relative performance
compared to other processors in the series
2nd digit = socket generation (Rev F = 2)
1st digit = scalability, max number of processors
supported (1, 2, or 8)
4-digit nomenclature
AMD Opteron Rev. E and Rev. F
Opteron Steppings & Sockets
Rev F Socket F
Rev F is the Processor Stepping
Socket F (1207) is the physical socket
Rev F Opteron uses different sockets
Opteron Series 2000 & 8000 use socket F (1207)
Opteron Series 1000 use Socket AM2
Socket F will be used by Opteron G (Quad Core)
AMD Opteron Rev F Model Naming
1200 Series
100 Series replacement
Single socket only
1 HT link, Not Cache Coherent
Socket AM2
2200 Series
200 Series replacement
Up to 2 sockets
3 HT links, 1 is Cache Coherent
Socket 1207
8200 Series
800 Series replacement
Up to 8 sockets
3 HT links, ALL are Cache Coherent
Socket 1207
System Upgrades
CPU Upgrade Options
Memory Upgrade Options
System Upgrades
Can I Upgrade from a Rev E CPU to a Ref F CPU?
Generally NO because...
CPU sockets are different
Memory Type is different
What about X4600?
ALL CPU/Mem boards including DIMMs need to be replaced
The BIOS/ILOM firmware must be updated to M2 version
during the upgrade procedure
System Upgrades - CPUs
CPU General Rules
All CPUs must be the same model
All CPUs must be the same clock speed
No Mixing of Single/Dual Core
All CPUs should be the same Stepping
May require specific firmware levels
Opteron Steppings
More info: http://www.amd.com/processorquickrefguide
Main differences between Opteron steppings
System Upgrades - CPUs
Sun Fire V20z Compatibility Between Components and Software for Each Server Version
System Upgrades - CPUs
Sun Fire V20z CPU Options and Part Numbers
System Upgrades - CPUs
Sun Fire V40z Compatibility Between Components and Software for Each Server Version
System Upgrades - CPUs
Sun Fire V40z CPU Options and Part Numbers
System Upgrades - Memory
General Memory Configuration Rules
Memory Types
Registered (Buffered) vs Unbuffered (Unregistered) DIMMs
DDR2 vs DDR1
Memory slots
Memory placement
Buffered vs. Unbuffered DIMMs
Registered DIMMs have additional registers placed between the CPUs and DIMMs
Improves signal integrity, allowing longer traces
and larger, more reliable memory subsystems
Up to 4GB per DIMM slot, 8 DIMM slots per CPU (4 typical)
Unbuffered DIMMs do not have these registers
Lower cost and slightly higher performance
Up to 4 DIMM slots per CPU
Sun Fire X2100 w/AMD Opteron 100 Series CPU
a stick of memory that contains registers will actually hold data for one full clock cycle before it's passed on. A small performance hit is generally incurred as a result. Registered memory is all about scalability and stability.
Memory Speed vs. DIMM Slots/CPU
4 DIMM slots per Opteron processor
Optimized for memory performance
Enables the use of higher performing DIMMs
4 DIMMs @ DDR400 outperforms 8 DIMMs @ DDR266
8 DIMM slots per Opteron processor
Trades memory capacity for performance
DDR400 DIMMs can only be used to populate 4 DIMM slots, leaving the remaining 4 unused
DDR333 DIMMs can only be used to populate 6 DIMM slots, leaving the remaining 2 unused
DDR266 DIMMs can be used to populate 8 DIMM slots but with a very noticeable performance impact
8 DIMMS slots per socket requires physically larger systems (X2200-M2)
Memory Placement
The AMD Opteron processors memory controller works in 64-bit (single channel) or 128-bit (dual channel) mode ECC operation.
For best memory performance, AMD recommends running in 128-bit mode ECC operation.
To enable 128-bit mode, DIMMs should be populated in 2 identical pairs such that they each occupy one-half of the AMD Opteron processors 128-bit memory controller interface.
This is a logical View at bus level which does not represent physical location of DIMMs on Motherboard.
64-bit
Pair 2
64-bit
Pair 1
This shows optimum memory placement in V20z and V40z for full capacity usage of 128 bit memory bus.
DDR2 vs DDR memory
240 pins vs 184 pins
Keyway in different Position
Label Description e.g PC2-5300 vs PC3200
Identification of M2/Non-M2 systems
Using the Service Processor
From the Operating System
Physical Identification
Identification of M2/Non-M2 systems
Common Differences
1/2/8000 Series CPUs v 1/2/800 series CPUs
Heatsinks
DDR2 v DDR1 memory
PCIexpress v PCI-X
Reference Documentation
http://www.sun.com/blueprints/1106/820-0373.pdf
Identification of M2/Non-M2 systems
Product Name
Shown in BIOS Boot Screen
BIOS Setup Utility
ILOM CLI under /SYS/MB
IPMItool fru output
CPU Information
Solaris - psrinfo -pv
Linux cat /proc/cpuinfo
Windows Look in Device Manager for Processors
Identification of M2/Non-M2 systems
Identification of M2/Non-M2 systems
Identification of M2/Non-M2 systems
Identification of M2/Non-M2 systems
-> show /SYS/MB
/SYS/MB
Targets:
BAT
NET0
NET1
P0
P1
Properties:
SEEPROM =
Product Information:
manufacturer name = SUN MICROSYSTEMS
product name = Sun Fire X4100 M2
version = (no information)
serial number = 0640BD0152
part number = 602-3482-01
T_AMB = 21.000000 degrees C
V0_VDD = No reading available
V0_VDDIO = No reading available
V0_VTT = No reading available
V1_VDD = No reading available
V1_VDDIO = No reading available
V1_VTT = No reading available
V_+12V = No reading available
V_+1V2 = No reading available
V_+1V5 = No reading available
V_+2V5 = No reading available
V_+3V3MAIN = No reading available
V_+3V3STBY = 3.252400 Volts
V_+5V = No reading available
V_-12V = No reading available
Commands:
cd
show
->
Identification of M2/Non-M2 systems
FRU Device Description : mb.fru (ID 2)
Chassis Type : Rack Mount Chassis
Chassis Part Number : 000-0000-00
Chassis Serial : 0226-0638LHF013N
Board Product : ASSY,MOTHERBOARD,X4600,REV F
Board Serial : 1762TH1-0625001244
Board Part Number : 501-7638-01
Board Extra : 01
Board Extra : G4F_MB
Product Manufacturer : SUN MICROSYSTEMS
Product Name : SUN FIRE X4600
Product Part Number : 602-3472-01
Product Serial : 0640AM0978
Output from ipmitool fru print command
Identification of M2/Non-M2 systems
Everyone and Everything Participating on the Network
X2100 M2
X2100
Identification of M2/Non-M2 systems
X4100 M2
X4100
Identification of M2/Non-M2 systems
Everyone and Everything Participating on the Network
X4200 M2
X4200
Identification of M2/Non-M2 systems
Ultra20 M2
Ultra20
Identification of M2/Non-M2 systems
Everyone and Everything Participating on the Network
Ultra40 M2
Ultra40
Updating ILOM Firmware
The upgrade of the ILOM firmware on the Galaxy range of systems should be carried out in a specific manner to avoid loss of system fruid data and to ensure the safe operation of the system
This is to confirm that upgrade in steps is still required contrary to some inferred messages circulating
SW1.0 ==>SW1.1==>SW1.2 or SW1.2.1-->SW1.3
==> has to pre-flash and flash upgrade in that order
--> no pre-flash needed.
Updating ILOM Firmware
The G12 (not G12F) step by step upgrade process, starting from a system with SW1.0a (ILOM build 6464) would look like below. Step #1 is only for early access systems with ILOM build 6169.Your entry point in this process will depend on what firmware level the system is running. For example, with a system with ILOM build 9306, start from step #4.
1. SW1.0a - ILOM build 6464 URL: http://www.sun.com/download/products.xml?id=436bd009
2. Pre-flash script: ilom.X4100-preflash_1.2.sh
3. SW1.1 - ILOM build 9306 URL: http://www.sun.com/download/products.xml?id=442f01f5
4. Pre-flash script ilom.X4100-preflash_1.2.sh
5. SW 1.2 - ILOM 1.0.5 build 12029c URL: http://www.sun.com/download/products.xml?id=44cfd445
6. SW 1.3 - ILOM 1.1.1 (or 1.1.1.1) build 15632 URL: http://www.sun.com/download/products.xml?id=45b94409
Updating FRUID data
After Service intervention or firmware update the FRUID information stored in the SEEPROM for the one or more parts may no longer be correct and may need to be re-entered manually
On Galaxy type systems, this can be accomplished using the service processor utility servicetool
Updating FRUID data
Example of Good Data
-> show /SYS/MB/SEEPROM
Properties:
SEEPROM =
Product Information:
manufacturer name = SUN MICROSYSTEMS
product name = SUN FIRE X4200
version = (no information)
serial number = 0550AN026D
part number = 602-3103-01
Example of Bad Data
-> show /SYS/MB/SEEPROM
Properties:
SEEPROM =
Product Information:
manufacturer name = SUN MICROSYSTEMS
product name = SUN FIRE X4100
version = (no information)
serial number = 0000000000
part number = 602-0000-00
Updating FRUID data
Example of Updating System Board FRUID data
Log in to Service Processor as user sunservice
ebusy>ssh -l sunservice va64-x4200c-sp-gmp03
sunservice@va64-x4200c-sp-gmp03's password:changeme
Issue the servicetool command, and answer the questions
[(flash)root@SUNSP00144F0E27BD:~]# servicetool --board_replaced=mainboard \
--fru_product_part_number --fru_product_serial_number
Updating FRUID data
Servicetool is going to update the mainboard FRU with product and chassis information collected from the removed mainboard.
The following preconditions must be true for this to work: * The new mainboard must be installed. * The service processor must not have been replaced with the motherboard. * The service processor firmware must not have been upgraded prior to the motherboard replacement; do firmware upgrades after component swaps!Do you want to continue (y|n)? yMainboard FRU configuration has been updated.
Servicetool is going to update the mainboard FRU product part number.Do you want to continue (y|n)? y
When entering values, do not use quotes; If you require embedded quotes, escape them with three backslashes; e.g. \\\"
Updating FRUID data
What is the new product part number? 602-3103-01The product part number has been updated.The new part number is: "602-3103-01"
Servicetool is going to update the mainboard FRU product serial number.Do you want to continue (y|n)? yWhen entering values, do not use quotes; If you require embedded quotes, escape them with three backslashes; e.g. \\\"
What is the new product serial number? 0550AN026DThe product serial number has been updated.The new serial number is: "0550AN026D"
Updating FRUs... done[(flash)root@SUNSP00144F0E27BD:~]#
Current Issues
FAB 102770 Galaxy power busbar connections
CR 6335741 X4100 PCI Riser causing reboots
CR 6515060 X4600 Randomly powers off
CR 6537731 X4600M2 DIMM slots labelled wrongly
FAB 102770 Thermal Issue on Galaxy
Failure to properly tighten the System/Motherboard or the DC Power Distribution Board bus bar connections on Galaxy may lead to thermal event
New Nut design
Screws should be torqued to 7.5in/lbs (0.847385 Newton Meters) and 18in/lbs (2.03372 Newton Meters) for nuts.
Busbar test to monitor 12v rail with and without load
http://nsgrelease.sfbay/galaxy12/releases/G12x-SW1.3-rc38/ops/061215/
http://sdpsweb.central/FIN_FCO/FAB/102770/SPE/busbar
FAB 102770 Thermal Issue on Galaxy
1) Copy the latest busbar tool to the service processor /coredump directory.
scp busbar sunservice@?sp_ip?:/coredump
(where ?sp_ip? is the target IP address)
.....continue conection (yes/no)? yes
password:changeme
2) ssh into the targeted system
ssh sunservice@?sp_ip?
password:changeme
# cd /coredump
FAB 102770 Thermal Issue on Galaxy
busbar
loopcnt - This is the number of time you wish busbar to run. If this value is 0 then busbar will run forever.
System name - This specifies the machine type to test. Below is a list of systems known to busbar. system name g1= Galaxy1g2= Galaxy2g1= Galaxy1eg2e= Galaxy2eg1f= Galaxy1fg2f= Galaxy2fcnst= Constellation
For example, to run busbar 3 time on Constellation I would use the following command:
./busbar 3 cnst
Description:
The busbar was designed to find systems with poor busbar
connections. This done by reading the 12 volt sensor twice. The
first time the 12 volt sensor is read with the system in reset and
the fans spun down so as to minimize the load on the system. The
second time the 12 volt sensor is read with the system running and
the fans at their highest rpm so as to maximize the load on the
system. The two numbers are compared, if the difference between the
two is greater than 5% then there may be a problem with the
bus bar connection and an error is generated.
FAB 102770 Thermal Issue on Galaxy
CR 6335741 X4100 PCI Riser causing reboots
Excessive ring-back noise during write cycles from the option card installed on the 133MHz Slot (slot 1)
Workaround only use slot 0 (100MHz)
Replace Riser Card, 501-6914-01with 501-6914-02
Engineering suggest replacing both risers
Until FCO is available raise CIC
CR 6515060 X4600 Randomly Powers Off
Small percentage of CPUs giving ThermTrip errors
BIOS 44 (SW1.3) available end of march, will log ThermTrip events as default. If applied, ThermTrip events will cause the system to shutdown. When the system is powered on, there will a message stating a ThermTrip event has occurred. This message is also logged and can be retrieved by ipmitool.
Further debugging using latest version of HDT required to isolate failing CPU. Requires debug BIOS which disables shutdown on ThermTrip so only Sun badged engineers allowed to use it
CR 6515060 X4600 Randomly Powers Off
Thermtrip detected by hdtl Example
[(flash)root@SUNSP00144F26E93F:/coredump]# ./hdtl -y
hdtDiag: Galaxy/Thumper HDT Diagnostics, Version 0.9.6
-------------------------------------------------------
hdtDiag: ThermTrip Diags
Stopping IPMI Stack....Done.
no dbdry cpu 00
hdtDiag: resetting system, hard reset
hdtDiag: waiting for power good
hdtDiag: Power on 01
stopped at reset vector
hdtDiag: Galaxy4: 8 - CPU Configuration mod 00ff
hdtDiag: Power is on
hdtDiag: relocating 8132
hdtDiag: ck08 : 0x005110de
CK08 System Control Register space 0x4400
00 : 0x09000000
04 : 0x00000000
CR 6515060 X4600 Randomly Powers Off
f8 : 0x00000000
fc : 0x00000000
TCO Status Register : 0x00410002
THERMTRIP_STS asserted : THERMTRIP detected by ck08
TCO Ctrl Register : 0x00ff0800
THERMTRIP_RST set : G2/S5 shutdown on THERMTRIP enabled
hdtDiag: reset to get to ASP's
hdtDiag: resetting system, hard reset
hdtDiag: exit HDT mode
hdtDiag: cpu 0 Slot A : 0x11510120 ENABLED
hdtDiag: cpu 1 Slot C : 0x104f0020 ENABLED
hdtDiag: cpu 2 Slot B : 0x0f570220 ENABLED
hdtDiag: cpu 3 Slot D : 0x0f4d0220 ENABLED
hdtDiag: cpu 4 Slot E : 0x104c0120 ENABLED
hdtDiag: cpu 5 Slot F : 0x0f4f0220 ENABLED
hdtDiag: cpu 6 Slot G : 0x10490120 ENABLED
hdtDiag: cpu 7 Slot H : 0x10460320 ENABLED
[(flash)root@SUNSP00144F26E93F:/coredump]#
CR 6515060 X4600 Randomly Powers Off
Hdtl output using engineering BIOS
f8 : 0x00000000
fc : 0x00000000
TCO Status Register : 0x00400000
THERMTRIP_STS de-asrt : No THERMTRIP detected by ck08
TCO Ctrl Register : 0x00fe1000
THERMTRIP_RST set : G2/S5 shutdown on THERMTRIP disabled
hdtDiag: cpu 0 Slot A : 0x115e0120 ENABLED
hdtDiag: cpu 1 Slot C : 0x105f0020 ENABLED
hdtDiag: cpu 2 Slot B : 0x0f63022a ENABLED THERMTRIP CORE0
hdtDiag: ===> CPU slot B : reset caused by THERMTRIP
hdtDiag: cpu 3 Slot D : 0x0f560220 ENABLED
hdtDiag: cpu 4 Slot E : 0x10590120 ENABLED
hdtDiag: cpu 5 Slot F : 0x0f5a0220 ENABLED
hdtDiag: cpu 6 Slot G : 0x10560120 ENABLED
hdtDiag: cpu 7 Slot H : 0x10500320 ENABLED
[(flash)root@SUNSP00144F26E93F:/coredump]#
CR 6537731/6538830 X4600-M2 DIMM slots labelled wrongly in service manual and on service label
G4's top cover service label, pn 263-2329-04-50, X4600 M2.
Step #10 "DIMM Insertion" the DIMM slot number information is
INCORRECT
Currently it shows: [Board top edge]
DIMM0 -White - Pair 0
DIMM1 -White - Pair 0
DIMM2- Black - Pair 1
DIMM3- Black - Pair 1
The label should read: [Board top edge]
DIMM3 -White - Load first - Pair1
DIMM2 -White - Load first - Pair1
DIMM1- Black - Pair 0
DIMM0- Black - Pair 0
SteppingC0CGE4Frequency1.4 2.2 GHz1.4 2.4 GHz1.6 2.6 GHzModelsX40 x48X40 x50X42 x52HyperTransport800 MHz1000 MHzSocket940940Manufacturing Tech.130 nm90 nmPackageCeramicOrganicL2 Cache1 MB1 MBMax Idd60 A80 AMax Power89 W95 W
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Sun Microsystems, Inc.
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SteppingRev. ERev. FGenerationFirst GenerationNext GenerationCoresSingle/DualDual/Quad ReadyFrequency1.6 3.0 GHz1.8 - 3.2 GHzModelsX40 - x85X210 - x224HyperTransport1000 MHz (2000 MT/s)Memory ControllerRegistered ECC DDR1-266/333/400 (200/800 Series) Unbuffered ECC DDR1-266/333/400 (100 Series)Registered ECC DDR2-400/533/667 (2000/8000 Series)Unbuffered ECC DDR2-400/533/667/800 (1000 Series)Memory BandwidthUp to 6.4 GB/sUp to 10.7 GB/s (2000/8000 Series)Up to 12.8 GB/s (1000 Series)L1 Cache64 KB (Data) + 64 KB (Instruction) per coreL2 Cache1 MB per coreMax Power95/120 W (200/800 Series) 104/110 W (100 Series)95/120 W (2000/8000 Series)103/125 W (1000 Series)Socket940-pin (200/800 Series)939-pin (100 Series)Socket F 1207-pin (2000/8000 Series)Process Tech.90 nm SOI
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???Page ??? (???)04/11/2007, 12:00:47Page / Chassis FRU P/NMotherboard P/NSingle/Dual CoreStepping VersionCPU VRM P/N Memory TypeMemoryVRM PNMinimum NSVMinimum BIOS380-0979370-6730SingleC0F370-6680DDR 333F370-66462.1.0.9f1.27.11380-1168370-7691SingleCGF370-6680DDR 333F370-66462.1.0.16b1.30.5380-1194370-7788SingleE6, E4,F370-7746DDR 333/400 F370-77472.2.0.6h1.32.7.2380-1194370-7788Single, DualE6, E4,F370-7746DDR 333/400 F370-77472.3.0.111.33.5.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.3.0.11c1.33.7.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.4.0.61.34.4.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.4.0.81.34.6.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.4.0.121.35.2.2
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???Page ??? (???)04/11/2007, 12:00:47Page / Single Core CPUX-optionsCustomer Replaceable Components PN
Opteron 844, 1.8 GHz, CG Stepping595-7482-xxF370-6902-xx
Opteron 848, 2.2 GHz, CG Stepping595-7483-xxF370-6904-xx
Opteron 850, 2.4 GHz, CG Stepping595-7577-xxF370-6939-xx
Opteron 848, 2.2 GHz, E4 Stepping594-1099-xxF370-7704-xx
Opteron 850, 2.4 GHz, E4 Stepping594-2941-xxF370-7705-xx
Opteron 852, 2.6 GHz, E4 Stepping594-2942-xxF370-7706-xx
Opteron 854, 2.8 GHz, E4 Stepping594-2943-xxF370-7961-xx
Opteron 856, 3.0 GHz, E4 Stepping594-2944-xxF371-1759-xx
Dual Core CPUOpteron DC 870, 2.0 GHz, E6 Stepping594-1623-xxF370-7796-xx
Opteron DC 875, 2.2 GHz, E6 Stepping594-1622-xxF370-7797-xx
Opteron DC 880, 2.4 GHz, E6 Stepping594-2532-xxF371-0291-xx
Opteron DC 885, 2.6 GHz, E6 Stepping594-2946-xxF371-1760-xx
???Page ??? (???)04/11/2007, 12:00:47Page /
???Page ??? (???)04/11/2007, 12:00:47Page / Single Core CPUX-optionsCustomer Replaceable Components PN
Opteron 242, 1.6 GHz, C0 SteppingNo longer availableF370-6695-xx
Opteron 244, 1.8 GHz, C0 SteppingNo longer availableF370-6670-xx
Opteron 248, 2.2 GHz, C0 SteppingNo longer availableF370-6672-xx
Opteron 244, 1.8 GHz, CG Stepping594-0368-xxF370-6783-xx
Opteron 248, 2.2 GHz, CG Stepping594-0369-xxF370-6785-xx
Opteron 250, 2.4 GHz, CG Stepping594-7579-xxF370-6786-xx
Opteron 244, 1.8 GHz, E Stepping594-0660-xxF370-7710-xx
Opteron 248, 2.2 GHz, E Stepping594-0661-xxF370-7711-xx
Opteron 250, 2.4 GHz, E Stepping594-0662-xxF370-7712-xx
Opteron 252, 2.6 GHz, E Stepping594-0371-xxF370-7272-xx
Dual Core CPUOpteron DC 270, 2.0 GHz, E Stepping594-1663-xxF370-7799-xx
Opteron DC 275, 2.2 GHz, E Stepping594-1664-xxF370-7800-xx
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???Page ??? (???)04/11/2007, 12:00:47Page / Chassis FRU P/NMotherboard P/NSingle/Dual CoreStepping Version CPU VRM P/N Memory TypeMemoryVRM P/NMinimum NSVMinimum BIOS380-1010370-6929SingleC0F370-6680DDR 333F370-66462.1.0.16b2.22.4380-1206370-7808SingleE6, E1F370-7746DDR 333/400 F370-77472.2.0.6h2.32.8.2380-1206370-7808Single, DualE1F370-7746DDR 333/400 F370-77472.3.0.112.33.5.2380-1206370-7808Single, DualE4, E1F370-7746DDR 333/400 F370-77472.3.0.11c2.33.7.2380-1206370-7808Single, DualE6, E4, E1, CG, C0F370-7746DDR 333/400 F370-77472.4.0.62.34.4.2380-1206370-7788Single, DualE6, E4, E1, CG, C0F370-7746DDR 333/400 F370-77472.4.0.82.34.6.2380-1378370-7788Single, DualE6, E4, E1, CG, C0F371-1463DDR 333/400 F371-14642.4.0.122.35.2.2
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