h-bridge drivers (vref series) -...

1/16 www.rohm.com 2011.2 - Rev.Dc 2009 ROHM Co., Ltd. All rights reserved.

H-bridge Drivers for Brush Motors

H-bridge Drivers (VREF Series) BD621Series,BD622Series,BD623Series

Description

These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow for PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.

Contents

1) Block diagrams 2

2) Control input pins 3

3) Reference voltage (VREF) input pin 3

4) Power supply and ground pin 3

5) Driver outputs 4

6) Heat sink fin 4

7) Thermal design 5

8) Thermal derating curve and transient thermal resistance 6

9) A.S.O. curve 7

10) Application circuit examples 8

11) Evaluation board 10 Line up matrix

Rating voltage Channels Maximum output current

0.5A 1.0A 2.0A

7V 1ch BD6210 HFP / F

BD6211 HFP / F

BD6212 HFP / FP

18V

1ch BD6220F BD6221F BD6222 HFP / FP

2ch BD6225FP BD6226FP

36V

1ch BD6230F BD6231 HFP / F

BD6232 HFP / FP

2ch BD6236 FP / FM

BD6237FM

*Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28

No.11007EDY01

Application Note

2/16

BD621Series,BD622Series,BD623Series

www.rohm.com 2011.03 - Rev.D© 2011 ROHM Co., Ltd. All rights reserved.

Block diagrams

SOP8 package

HRP7 package

HSOP25 package

Fig. 1 H-bridge driver block diagram

Pin description table

Pin name Function

VCC Power supply

FIN Control input (forward)

RIN Control input (reverse)

VREF Duty setting pin

OUT1 Driver output

OUT2 Driver output

RNF Power stage ground

GND Ground

VREF input pin (Page 3)

Control input pins (Page 3)

Heat sink fin (Page 4)

Power supply (Page 3)

Driver outputs (Page 4)

Ground pin (Page 3)

3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF DUTY

7

6 2

3

5

CTRL

PROTECT

FIN

RIN

VCC

OUT1 OUT2

4 GND

1 VREF DUTY

FIN

GND

21

22

12 1

20

19

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 RNF

17 VREF DUTY

6

GND

2 13

7

23

FIN

GND

Power ground (Page 3)

Application Note

3/16



Control input pins The input threshold voltage of the control pins are TTL level (H:2.0V, L:0.8V), with a hysteresis voltage of approximately 0.3V. The IC will accept input voltages up to the VCC voltage. The output bridge stage has a built-in "dead time" period of about 400ns (typ.) to protect against rush current; therefore, an "off" period when switching between modes is not necessary. The IC can accept a PWM input signal in the range of 20kHz to 100kHz. At frequencies less than 20kHz, the IC will enter standby mode (output: Hi-Z), and at frequencies higher than 100kHz, the output switching signal becomes unable to follow the input signal. When the system switches to standby mode from any other mode (except brake), the internal control logic remains active for at least 50µs before shutting down all other circuits. The control input pins are connected internally to pull-down resistors (100kΩ typ.). However, when operation is controlled via PWM or VREF, switching noise on the output stage may affect the input on these pins and cause undesired operation. In such cases, attaching an external pull-down resistor (10kΩ recommended) between each control pin and ground, or connecting each pin to an input voltage of 0.8V or less (preferably GND), is recommended.

Fig.2 Equivalent circuit Fig.3 Equivalent circuit with noise compensation Reference voltage input pin (VREF) pin

The VREF voltage input pin is connected to a MOSFET gate input and therefore has very high input impedance. Leaving this pin open will cause unstable operation; therefore, connect it to VCC when not using VREF control mode. As this pin is designed only to accept analog input signals, do not connect a PWM signal to the input. It can, however, be connected to a signal that switches between different voltages for IC control. When used in applications where variations on the VREF input voltage may occur, insert a capacitor between VREF and GND. However, make sure that the voltage across the capacitor does not become reverse-biased (i.e. VCC < VREF) when power is switched off.

Fig.4 Application without VREF control Fig.5 Application with unstable VREF input Power supply and ground pin

When used in applications where separate small- and large-signal power supplies are connected to the IC, the power supplies should be shorted together as close as possible to the IC’s input pins. The GND connection to the RNF pin should be shorted the same way. In the two-channel version of the device, there are separate pins for the power and ground of each channel; although they are electrically connected to each other within the device, ensure that both channels’ power and ground pins are connected externally to the power supply. When operating in VREF or PWM control mode, establish a current path for current recovery from the motor via a bypass capacitor between VCC and ground.

FIN

100k (Typ.)

RIN

PC

FIN

100k (Typ.)

RIN

PC

10k 10k

VREF

VCC VCC

GND

VREF

VCC VCC

GND

Application Note

4/16



Fig.6 Current path when ON (PWM mode) Fig.7 Current path when OFF (PWM mode)

Recommended value of the bypass capacitor is different depending on the armature resistance of the brush motor, the use power supply voltage and the output current of driver IC. It is important to conclusively confirm that the actual motor operation, referring to the following graphs.

Driver outputs

This IC features integrated over-current protection (OCP) circuitry in the output stage to protect the IC from sudden jumps in current. However, if an instantaneous amount of current with a high rise time (0.1A/µs or more) is encountered due to power supply or ground faults, for example, internal components of the IC may be damaged before the OCP engages due to the OCP activation window of 10µs (typ.). When the IC is used in applications with a low-impedance or high-output power supply, consider adding physical protection devices (such as fuses) to the input. Do not connect an external capacitor directly to the output pin as doing so may cause a rush current to flow from the output, damaging internal components. However, if an output capacitor is necessary, for example, to reduce noise on the output, connect it in series with a resistor to avoid output rush currents. Note that doing so may increase switching power consumption in VREF or PWM control modes.

Fig.11 Snubber circuit example Heat sink fin

HPR7, HSOP25 and HSOPM28 packages feature heat sink fins. As the fin is connected directly to the internal die, it should be mounted directly to as large a ground pattern as possible to maximize heat radiation. The ground plane should also be connected to the system GND potential. Connecting the fin to anything other than GND may cause the IC to malfunction.

M

ON

OFF

OFF

ON

M

ON

OFF

OFF

OFF

Fig.8 BD621X series Fig.9 BD622X series Fig.10 BD623X series (7V rating products) (18V rating products) (36V rating products)

0

5

10

15

3 4 5 6 7

Supply Voltage [V]

Ra

[o

hm

]

0.5A

1A

2A

0

10

20

30

6 9 12 15 18

Supply Voltage [V]

Ra

[o

hm

]

0.5A

1A

2A

0

10

20

30

24 27 30 33 36

Supply Voltage [V]

Ra

[o

hm

]

1A

3A

2A

Ceramic 10µF

Electrolytic 4.7µF + Ceramic 1µF

Electrolytic 10µF + Ceramic 1µF


+ Ceramic 1µF

Electrolytic 33µF


Ceramic 10µF



+ Ceramic 1µF

Electrolytic 47µF

Ceramic 10µF

+ Ceramic 1µF

Electrolytic 4.7µF

OUT1

OUT2

M

Application Note

5/16



Thermal design The IC must be operated below the maximum junction temperature (Tj) value of 150°C as specified in the operating conditions. The junction temperature Tj is determined by the following equation:

Tj ≈ Ta + θ j-a x Pc [°C] … (1)

Where, Tj: Junction temperature [°C], Ta: Ambient temperature [°C], Pc: Power consumption [W], θ j-a: Junction - ambient thermal resistance [°C/W]

The power consumption PC is determined by the following equation:

Pc [W] ≈ (IOUT

2 x RON) x (VREF / VCC) + IOUT x (VON(H) + VF(H)) x (1 - VREF / VCC) + VCC x ICC … (2)

Where, IOUT: Motor current [A], RON: Output on-resistance [Ω], VREF: VREF voltage [V], VCC: Supply voltage [V], VON(H): High side output on voltage [V], VF(H): High side output body diode voltage [V], ICC: Supply current [A] (Refer to the technical note about output on-voltage, body diode voltage and supply current.)

For pulse output, transient thermal resistance is used to calculate junction temperature:

Tj ≈ Ta + r(tw) x θ j-a x Pc [°C] … (3)

Where, tw: Pulse on-time [s], r(tw): Transient thermal resistance normalized by t = tw

If a single pulse is used, calculate the power dissipation by equation (3) above, using the corresponding transient thermal resistance taken from the graph on the next page. If a repeating pulse is used, calculate the normalized transient thermal resistance r’(t) using the following equation, then substitute for r(tw) in formula (3).

r’(t) ≈ θ j-a x D + (1 - D) x θ T+tw - θ T + θ tw / θ j-a [°C/W] … (4)

Where, tw: Power input time [s], T: Pulse period [s], D: Duty cycle (D=tw/T) θ T+tw, θ T, θ tw: Thermal resistance of the pulse width (T+tw), (T), (tw)

If the waveform is not rectangular in shape, its area can be approximated via the following simple waveforms:

a) Approximation of triangle wave b) Approximation of sine wave Approximate via a rectangular wave of Approximate via a rectangular wave of 0.71 x width, 0.7 x peak level. 0.91 x width, 0.7 x peak level.

Fig.12 Approximation of triangle wave Fig.13 Approximation of sine wave c) Complex wave 1 d) Complex wave 2

Approximate to a rectangular wave of Approximate to multiple rectangular blocks of similar area. similar area.

Fig.14 Complex wave 1 Fig.15 Complex wave 2

tw T

0.71 x t

t

Ppk

0.7 x Ppk

0.91 x t

t

Ppk

0.7 x Ppk

t

P

S = P x t

S

t1

P2

S P1

P3

t3 t2

Application Note

6/16



Thermal derating curve and transient thermal resistance (reference data)

Table 1 Thermal resistance

Package θ j-a [°C/W]

SOP8 182

HSOP25 86.2

HSOP-M28 56.8

HRP7 89.3

Mounted on a 70mmx70mmx1.6mm FR4 glass-epoxy board with less than 3% copper foil.

0

20

40

60

80

100

0.001 0.01 0.1 1 10 100 1000

Meas. time [sec]

θja

[°C

/W]

ROHM standard PCB(70mm×70mm×1.6mm)

0

20

40

60

80

100

120

140

160

180

200

0.001 0.01 0.1 1 10 100 1000

Meas. time [sec]

θja

[°C

/W]

ROHM standard PCB

(70mm×70mm×1.6mm)

0

20

40

60

80

100

0.001 0.01 0.1 1 10 100 1000

Meas. time [sec]

θja

[°C

/W]


0

10

20

30

40

50

0.001 0.01 0.1 1 10 100 1000

Meas. time [sec]

θja

[°C

/W]


0.0

1.0

2.0

3.0

0 25 50 75 100 125 150

AMBIENT TEMPERATURE [°C]

Pd

[W

]

i)0.85W

ii)1.45W

ii) Mounted on ROHM standard PCB

(70mm x 70mm x 1.6mm FR4 glass-epoxy board)

i) Package only

0.0

1.0

2.0

3.0

0 25 50 75 100 125 150


Pd

[W

]

i)1.80W

ii)2.20W



i) Package only

0.0

0.5

1.0

1.5

0 25 50 75 100 125 150


Pd

[W

]

i) 0.562W

ii) 0.687W



i) Package only

0.0

2.0

4.0

6.0

8.0

10.0

0 25 50 75 100 125 150


Pd

[W

]

iv ) 4 layers PCB(copper foil: 70mm x 70mm)

iii) 2 layers PCB (copper foil: 70mm x 70mm)

ii) 2 layers PCB (copper foil: 15mm x 15mm)

i) 1 layer PCB (copper foil: 10.5mm x 10.5mm)

i)1.4W

ii)2.3W

iii)5.5W

iv)7.3WMounted on ROHM standard PCB


Fig.16 Derating curve (SOP8) Fig.17 Derating curve (HSOP25) Fig.18 Derating curve (HSOP-M28)

Fig.19 Derating curve (HRP7)

Fig.20 Transient thermal resistance Fig.21 Transient thermal resistance Fig.22 Transient thermal resistance (SOP8) (HSOP25) (HSOP-M28)

Fig.23 Transient thermal resistance (HRP7)

data only; values are not guaranteed.

Transient thermal resistance is measured

Application Note

7/16



ASO curve (reference data)

Note: ASO curve is measured data only, values are not guaranteed.

Fig.24 ASO curve (Ta=25°C) Fig.25 ASO curve (Ta=25°C) Fig.26 ASO curve (Ta=25°C) (7V/0.5A class) (7V/1A class) (7V/2A class)



0.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON100ms

0.5

180.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON10ms

TON=100ms

180.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON10ms

TON=100ms

2

18

0.1

1

10

1 10 100

VDS [V]

I DS [

A] TON10ms

TON=100m

0.5

360.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON1msTON=10ms

36

TON=100ms

0.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON1msTON=10msTON=100ms

2

36

0.1

1

10

1 10 100

VDS [V]

I DS [

A] TON100ms

0.5

70.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON10ms

TON=100ms

2

70.1

1

10

1 10 100

VDS [V]

I DS [

A]

TON100ms

7

Application Note

8/16



Application examples

1) Regulated power supply application

VREF set via resistive voltage divider

The voltage across the motor equals VCC x R2/(R1+R2) during operation.

Fig.33 Application example 1

2) Unstable power supply or battery-driven application

VREF set via zener diode

Voltage across the motor equals the zener diode forward voltage during operation.


3) Reversible, variable-torque application

VREF controlled via switched zener diodes

VREF synchronizes with two different zener voltages, switched on or off by FIN or RIN signals. This application is useful when using lead-angle motors, or in applications where the load is different for forward and reverse directions.


3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF

DUTY

R1

R2

M

3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF

DUTY

R

ZD

M

3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF

DUTY

R

ZD1

M

ZD2

Application Note

9/16



Application examples - continued

4) Application to avoid current rush on startup

VREF controlled by RC time constant on feedback loop (soft-start)

Note, however, that motor torque on startup can be decreased if the RC time constant is too long.


5) Motor temperature-speed control

VREF set by thermistor

Useful in applications where motor speed needs to follow changes in temperature, or to protect the motor from overheating.


6) Direct PWM drive

Input PWM signal directly to control pins

Connect VREF to VCC. Control pins can accept PWM signals From 20kHz to 100kHz. This example allows for forward rotation. For reverse rotation, the input signals (PWM, L) should be switched.


3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF

DUTY

M

3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF

DUTY

TH

M

R

3

2

7 1

4

5

CTRL

PROTECT

FIN

RIN

VCC

VCC

OUT1 OUT2

8 GND

6 VREF

DUTY

M

PWM

L

Application Note

10/16



Evaluation board - 1ch / SOP8 package type 1 channel type, SOP8 package, common evaluation board Board size: 55mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm

Fig.39 Silk screen / Copper foil pattern (front)

Fig.40 Silk screen / Copper foil pattern (rear)

Fig.41 Evaluation board schematic

M

C2

C0

C1

RM

CC1

SW VRR1

RR2

CR

SW FSW R

RRC

RFC

FIN

4

GN D 8OU T11

OU T27

RIN

5

VCC

3

VM

2

VR EF 6U1

RM2

CM1

C2

C0

C1

OUT2

OUT1

VM

RM

VCC

VREF

SW VRR1

SW F

SW RRIN F IN

GND

GN DGN D

GND

OUT2

OUT1

OUT2

OUT1

GND

GNDGND1

GND2

GND

VCC

VCC

VCC VCC

VCC

VCC

VCC

RRC

RINGN D

GND

FINGN D

GN D

GND

Application Note

11/16



Evaluation board - 1ch / HRP7 package type 1 channel type, HRP7 package, common evaluation board Board size: 55mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm




C2

C1

CO

SW R

RRC

SW F

RFC

RR2

CR

RR1

SW V

CC1

CC2

FIN

3

GND

4

OU T12

OU T26

RIN

5

VCC

7

VR EF 1

U1

RRG RFG

GN D

GN D

GN D

VC C VCC

GN D G ND

GN D

GN D

GND1

GN D

VR EF

VC C

VC C

VR EF

OU T2

OU T1

OU T2

OU T1

RIN F IN

RIN F IN

GN D G ND

OU T2

OU T1

GN D G ND

VC C

GN DVC C

HRP 7_SMT

GND1

GN D

GN D GN D

Application Note

12/16



Evaluation board - 1ch / HSOP25 package type 1 channel type, HSOP25 package, common evaluation board Board size: 55mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm




VC CVC C

VC C

VC CVC C

C1

C2

CO

RM

CM1

CC1

RR1 SW V

RR2

CR

RN

SW F

RFC

SW R

RRC

OU T11

VM

22

VCC

21

FIN

20

RIN

19

VR EF17

OU T212

GN D6

RNF7

OU T213

OU T12

VM

23

GN DGN D

RNF8

U1

RM 2

CM2

CC2

GN D

GN D

GN D

GN D

GN D

GN D

GN DGN D

GN D

GN D

M

GN D

GN D

OU T2

OU T1

OU T2OU T2

VC C

VM

VCC

GN D1

GN D2

VC C

VR EF

FIN

FIN

GN D

RIN

RIN

GN D

OU T1OU T1

Application Note

13/16



Evaluation board - 2ch / HSOP25 package type 2 channels type, HSOP25 package, common evaluation board Board size: 110mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm




VC C VC C

VC C

VC C

VC C

VC CVC CVC CVC C

OU T2B19

GND

20

VMB

13

FINB

23

FINA

11

OU T2A6

OU T1A1

OU T1B14

VMA

25

VR EFA 9

VR EFB 21

GND

8

VCC

12

VCC

24

RNF B 16

RNF A 3

RINB

22

RINA

10

FINFIN

NC

7

U1

C0A

C1A

C2A

C0B

C1B

C2B

RM A

RM 2A

CMA RM B

RM 2B

CMB

CC1

CC2

RR2B

CRB

RR1 B SW VB

RR2A

CRA

RR1 A SW VA

RNB

RNA

SW FB

RFCB

RFGB

SW FA

RFCA

RFGA

SW RB

RRCB

RRGB

SW RA

RRCA

RRGA

BD62X6_SMT

OU T2A

OU T1A

OU T2B

OU T1B

GN D

GND3

GN D

GND1

GND2

VC C

VM A V MB

VR EFB

VC C

VR EFA

FINB

GN D

FINB

FINA

GN D

FINA

RINB

GN D

RINB

RINA

GN D

RINA

OU T2A

OU T1A

OU T2B

OU T1B

OU T2A

OU T1A

OU T2B

OU T1B

GN D

Application Note

14/16



Evaluation board - 2ch / HSOP-M28 package type 2 channels type, HSOP-M28 package, common evaluation board Board size: 110mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm




VCC VCC

VCC

VCC

VCC

VCCVCCVCCVCC

C0A

C1A

C2A

C0B

C1B

C2B

RMA

RM2A

RMB

RM2B

CC

1

CC

2

RR

2B

CR

B

RR1B SWVB

RR

2A

CR

A

RR1A SWVA

RNB

RNA

SWFB

RF

CB

RF

GB

SWFA

RF

CA

RF

GA

SWRB

RR

CB

RR

GB

SWRA

RR

CA

RR

GA

OUT2B20

GN

D8

VM

13

FIN

B25

FIN

A11

OUT2A6

OUT1A1

OUT1B16

VM

27

VREFA 9

VREFB 23

GN

D22

VC

C12

VC

C26

RNFB 17

RNFA 3

RIN

B24

RIN

A10

FIN

FIN

NC

19

OUT2A7

OUT1A2

OUT2B21

OUT1B15

VM

28

NC

5

VM

14

RNFB 18

RNFA 4

U1

OUT2A

OUT1A

OUT2B

OUT1B

GND

GND3

GND

GND1

GND2

RMVCC

RM2

CM

RM

RM2

VM

CM

VREFB

VCC

VREFA

FINB

GND

FINB

FINA

GND

FINA

RINB

GND

RINB

RINA

GND

RINA

OUT2A

OUT1A

OUT2B

OUT1B

OUT2A

OUT1A

OUT2B

OUT1B

GND

BD62XXFM_SMT

Application Note

15/16



Ordering part number

B D 6 2 1 0 F - E 2

Part No. Type

62XX

1X: 7V max.

2X: 18V max.

3X: 36V max.

X0: 1ch/0.5A X5: 2ch/0.5A

X1: 1ch/1A X6: 2ch/1A X2: 1ch/2A

Package

F: SOP8

FP: HSOP25

FM: HSOP-M28

HFP: HRP7

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/HSOP25/HSOP-M28)

TR: Embossed tape and reel

(HRP7)

∗ Order quantity needs to be multiple of the minimum quantity.

<Tape and Reel information>

Embossed carrier tapeTape

Quantity

Direction of feed The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

( )

Direction of feed

Reel1pin

(Unit : mm)

SOP8

0.9±

0.15

0.3M

IN

4°+6°−4°

0.17 +0.1-0.05

0.595

6

43

8

2

5

1

7

5.0±0.2

6.2±

0.3

4.4±

0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±

0.1

S

0.1 S

(Unit : mm)

HSOP25

7.8

± 0.

3

5.4

± 0.

2

2.75 ± 0.1

1.95 ± 0.1

25 14

1 13

0.111.

9 ±

0.1

0.36 ± 0.1

12.0 ± 0.2

0.3M

in.

0.25 ± 0.1

13.6 ± 0.2

0.8


S

0.1 S




Quantity

Direction of feed

The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand

2000pcs

E2

( )

Direction of feed

Reel1pin

Application Note

16/16






Quantity

Direction of feed

The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand

1500pcs

E2

( )

Direction of feed

Reel1pin

(Unit : mm)

HSOP-M28


0.8

7.5

±0.2

15

5.15±0.1

0.11

1.25

2.2

±0.1

1

18.5±0.2

0.5

±0.2

0.37±0.1

9.9

±0.3

4°+6°−4°

28

1.2

±0.1

5

14

0.27 +0.1−0.05

S

0.1 S

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.



Quantity

Direction of feed

The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand

2000pcs

TR

( )

(Unit : mm)

HRP7

S0.08

0.73±0.11.27

0.8875

1.905±0.1

0.83

5±0.

2

1.52

3±0.

1510

.54±

0.13

0.08

±0.0

5

(MAX 9.745 include BURR)9.395±0.125

S

1.01

7±0.

28.

0±0.

13

0.27+0.1-0.05

4.5°+5.5°−4.5°

8.82±0.1(6.5)

7654321

(7.4

9)

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