PUBLIC

NXP, THE NXP LOGO AND NXP SECURE CONNECTIONS FOR A SMARTER WORLD ARE TRADEMARKS OF NXP B.V.

ALL OTHER PRODUCT OR SERVICE NAMES ARE THE PROPERTY OF THEIR RES PECTIVE OWNERS. © 2021 NXP B.V.

M A R C H 2 0 2 1

Eduardo Montanez

IoT Marketing Manager for Personal Device & Wearables

Edge Processing Business

GROWING IMPACT OF

WEARABLE

TECHNOLOGY IN

HEALTH & WELL-BEING

1PUBLIC

TRENDS IN THE WEARABLES MARKET

• Longer Battery Life

− 2+ weeks – trackers, 1+ week – fitness watches, and ½ week – smart watch

• Always Connected

− BLE to smartphone

− Wi-Fi/LTE for cloud/streaming services

• Intuitive User Experience

− Smartphone-like display (OLED) and UX (vivid graphics/animations)

• Trending Features

− Voice/Audio, Location/Positioning, Sensing, etc.

• Reduced Form Factor

− More functionality in less space

Growing Impact of Wearable Technology

in Health & Wellbeing

Wearables are expanding beyond the common activity

tracking and fitness use cases that already claim almost

1-billion connected devices today. The evolution of

wearable technology can be attributed to improving

processor performance, sensors, wireless connectivity and

tracking capabilities, contactless payment/access,

extended battery life and the demand for richer user

experiences. All of this creates the ideal foundation for new

health and wellbeing use cases.

NXP’s broad portfolio of MCUs, applications processors,

Wi-Fi/BLE/NFC/UWB-enabled devices, as well as power

management ICs are driving new wearable applications

within the IoT, including SOS emergency calling, safe

zone alerts, contact tracing/social distancing and vitals

reporting (HR, SPO2, Body Temp, Sleep Patterns, etc.)

for elderly, cognitively impaired and high-risk patients.

2PUBLIC

THE EVOLUTION OF SMART WEARABLE APPLICATIONS

Longer battery life, improved compute acquisition and continuous wireless communication support the evolution of wearable

technology – expanding beyond the common activity and fitness use cases and shifting into IoT Health & Wellbeing space.

This shift has created applications including SOS emergency calling, safe zone alerts, contact tracing/social distancing and

vitals reporting (HR, SPO2, Body Temp, Sleep Patterns, etc.) for elderly, cognitively impaired and high-risk patients.

Longer

battery life

Improved

compute/data

acquisition

Continuous wireless

communication

3PUBLIC

EMERGING WEARABLE USE CASES & TECHNOLOGY

• Vitals, Motion and Sleep Monitoring

− Machine Learning

− Sensors

• SOS Emergency Calling

− LTE/CAT-M

− Voice & Audio

• Social Distancing, Contact Tracing & Tracking

− UWB

− Wi-Fi & BLE

− GNSS

• Hearing Enhancement

− DSP

• Contactless Access/Payment

− NFC

HearingSleepVitals Monitoring

Body T

em

pera

ture

Respira

tory

Monito

ring

Movem

ent, F

all D

ete

ctio

n

Card

iac M

onito

r (H

R, H

RV

, BP

, EC

G, S

pO

2)

Sle

ep

Monito

r

Hearin

g A

ids

Heara

ble

s

Sle

ep

Thera

py

HEALTH SERVICES

WEARABLE DEVELOPERS

4’6’

min

6’

min

6’

min

4’

4PUBLIC

WEARABLES IN LOCALIZATION

• Highly Accurate UWB Localization

− Door Access (w/secure element)

− Activity Monitoring

− Indoor Geofencing

− Wake GNSS Upon Indoor Exit

NEW TARGETED USERS

5PUBLIC

Functional Integration

Pe

rfo

rma

nce

Purpose-built, scalable

Compute platforms

NXP’S SCALABLE EDGE COMPUTING CONTINUUM

MARKET NEED FOR DIFFERENTIATED PLATFORMS TO ADDRESS BROAD RANGE

OF REQUIREMENTS

PUBLIC

Amplify market deployment with

comprehensive software, solutions

and product enablement

6PUBLIC

• Arm Cortex-A class

and Cortex-M cores

• DSP & Co-processors

• Performance up to

GHz

• Rich HMI (3D GPU)

• Full open-source OS

platforms

APPLICATIONS PROCESSORSi.MX ULP

MCUsi.MX RT

• Arm Cortex-M cores

• DSP & Co-processors

• Performance

up to 300 MHz

• Rich HMI (2D GPU)

• Embedded memory

• Easy to use tools

• RTOS support

i.MX

CROSSOVER

PROCESSORS

7PUBLIC

i .MX RT600 MCU FAMILY | H IGHLIGHTS

• High Performance, Real-time Processing

− Arm Cortex-M33 running up to 300 MHz with ultra-fast real-time

responsiveness

− Cadence® Tensilica® HiFi 4 DSP running up to 600 MHz with Quad

32x32 MAC

− Cryptography and Math Accelerators for security and complex

algorithms

− Up to 4.5 MB on-chip SRAM with zero wait-state access for critical

code and data

• Low Power

− 28nm FD-SOI process optimized for both active and leakage power

• Rich Integration

− Quad/Octal SPI Flash & PSRAM memory interface with on-the-fly

memory decryption

− USB 2.0 High-speed Host & Device interface with PHY

− Up to 8x FlexComms – configurable to SPI, I2C, UART and/or I2S

interfaces

− Up to 2x SD/eMMC memory card interfaces

− Digital microphone interface supporting up to 8 channels

• Advanced Security

− Secure boot with immutable hardware ‘root-of-trust

− SRAM Physically Unclonable Function (PUF) based unique key

storage

− Acceleration for symmetric (AES-256 & SHA2-256) and asymmetric

cryptography (ECC & RSA)

− Optional fuse-based root key storage mechanism

8PUBLIC

i .MX RT500 MCU FAMILY | H IGHLIGHTS

• Energy Efficient, Real-time Processing− Arm Cortex-M33 running up to 200 MHz with ultra-fast real-time

responsiveness− Cadence® Tensilica® Fusion F1 DSP running up to 200MHz with a

32x32 MAC− Cryptography and Math Accelerators for security and complex

algorithms− Up to 5 MB on-chip SRAM with zero wait-state access for critical

code and data

• Low Power− 28nm FD-SOI process optimized for both active and leakage power− Low leakage SRAM for extended battery life

• Rich Integration− 2D GPU with Display LCD Controller and MIPI DSI support− Quad/Octal SPI Flash & PSRAM memory interface with on-the-fly

memory decryption− USB 2.0 High-speed Host & Device interface with PHY− Up to 14x Flexcomms – configurable to SPI, I2C, UART and/or I2S

interfaces− 1x SD/eMMC memory card interfaces− Digital microphone interface supporting up to 8 channels

• Advanced Security− Secure boot with immutable hardware ‘root-of-trust− SRAM Physically Unclonable Function (PUF) based unique key

storage− Acceleration for symmetric (AES-256 & SHA2-256) and asymmetric

cryptography (ECC & RSA)− Optional fuse-based root key storage mechanism

9PUBLIC

WEARABLE SYSTEM BLOCK DIAGRAM

COMPUTE – LOW POWER – CONNECTED – SECURITY

POWER

ADAPTED CONNECTIVITY

MEMORYPOSITIONING

SENSORS INTERFACES

PAYMENT & SECURITY

WIRELESS CHARGING

UWB: NXP SR040

GNSS: SONY CXD5605AGF

PMIC: NXP PCA9420

NXP RT595SMART LOW POWER

DISPLAY

BLE: NXP QN9090OR

WLAN+BLE: NXP IW416 NFC/SE/eSIM: NXP SN110U

SERVICES

NXP: EdgeLock 2GO

NXP: mWallet 2GO

LTE M: SONY ALT1250

AUDIO

Accel/Mag: NXP FXOS8700

1 0PUBLIC

i .MX 7ULP APPLICATIONS PROCESSOR

Specifications:• CPU:

− Cortex-A7 @ 720MHz− Cortex-M4 @200MHz

• Process: 28nm FD-SOI• Package:

− 14x14 393BGA, 0.5mm pitch: Consumer & Industrial− 10x10 361BGA, 0.5mm pitch: Consumer Only

• Temp Range (junction): − Industrial: -40C to +105C− Consumer: 0C to +95C

Key Features:• Graphics

− GC7000 nanoULTRA GPU: OpenGL 2.0 / OpenVG− GC320 Composition Engine

• Ultra Low Power− Independent Real-time domain− Ultra Low Run Current

• Memory Options− QSPI (on the fly decryption)− 32-bit LPDDR2/3 @400MHz− eMMC 5.0 /SD3.0

• Connectivity− USB HS OTG with PHY− USB HS HOST HSIC − I2C X 8, SPI X 4, UART X 8, SDIO X 2, I2S X 2

• Security− High Assurance Boot− Crypto Acceleration: AES-128/256, SHA-1, SHA-224, SHA-256− RNG and Tamper Detection

Application Domain

Real Time Domain

i.MX 7ULP

A7 Connectivity

Security

Secure JTAG

Internal Memory

256K RAM

UART x 4

I2C x4

3.3V/1.8V GPIO

USB2.0 HOST (w/ HSIC)

Analog

2x 12-bit ADC

HAB – Secure Boot

Graphics

3D GPUNanoULTRA

External Memory

MMC5.0/SDIO x 2

16/32b LPDDR(2/3)

Power Manager

SPI x 2

ARM Cortex-A7

NEON

Trust Zone

32KB I-cache 32KB D-cache

FPU

ETM

256KB L2 cache

Analog Comparators

External Memory

QSPI (OTFAD/XIP)

Timers

Watch Dog

32 bit Timer x4

System timers

Crypto / TRNG

FPUMPU

M4 ConnectivityUART x 4

I2C x4

3.3V/1.8V GPIO

SPI x2

FlexIO

2x 12-bit DAC

256K RAM (TCM)

Timers

Watch Dog

32 bit Timer x4

System timers

CLK /RST

ARM Cortex-M4

DAP

DSP Extensions

USB2.0 OTG(w/ PHY)

8KB Cache

MIPI DSI – 2 lane

DisplaySecure Fuse

FlexBUS

I2S x 2

eFuses / OTP

SEMA4 / Msg Unit

DMA

Parallel I/F

Camera

FlexIO

2D GPU GC320

SecurityuHAB – Secure Boot

Clock & Power Management

Secure RTC

Tamper Detection

Security – Batt Domain

Secure Storage

Crypto / TRNG

Resource Domain CtlAccess & IPC

PLL/OSC

*Application and Real Time Domain separately shown with respective peripherals

1 1PUBLIC

HETEROGENEOUS LOW POWER USE CASE | BUILT FOR WEARABLE DEVICES

8:51

Power

time

Deep Sleep

Sensors

GPU: RUN

DSP: RUN

CPU: RUN

GPU: Periodic Refresh

DSP: Gated

CPU: RUNGPU: Gated

DSP: Gated

CPU: Gated

User Interaction

1 2PUBLIC

Longer Battery Life | Support 24/7 wristband operation for >1 week without the need for charging

• 28nm FD-SOI process optimized for active and leakage power supporting DVFS

• Ultra low-leakage SRAM with zero wait state access

Intuitive User Experience | Smartphone-like display (OLED) and UX (vivid graphics/animations)

• 2D GPU and MIPI-DSI for vivid graphics

• Integrated DSP to accelerate AI/ML/voice/audio processing

• Quad/Octal serial memory interface for expansion

• HS interfaces to attach wireless connectivity (UWB, BLE, Wi-Fi, etc.)

Advanced Security | Identity and Personal Data Protection

• Built-in secure boot, unique key storage and cryptographic engine

Reduced Form Factor | Critical Design Requirement of Small ‘Smart’ Devices

• Fan-out Wafer Level Package (FOWLP) for more functionality in small footprint

• Wafer Level Chip Scale Package (WLCSP) for tiny package option

NXP EDGE PROCESSING SOLUTIONS – BUILT FOR WEARABLES

i.MX 7ULP Applications

Processors

i.MX RT600 Crossover MCUs

i.MX RT500 Crossover MCUs

1 3PUBLIC

ENERGY EFFICIENT EDGE COMPUTE WITH ENERGY FLEX ARCHITECTURE

Heterogeneous Processing + Hierarchical fine-grained power partitioning and management

ENERGY FLEX IN APPS PROCESSORSMCUs ADVANCED ENERGY FLEX IN APPS PROCESSORS

Real Time

Domain

Application DomainReal Time

Domain

Application Domain Real Time

DomainFlex Domain

INCREASING INTEGRATION, PERFORMANCE, FUNCTIONALITY, AND ENERGY MANAGEMENT

Responder

DevicesGPUDDR

Cortex®-MCortex®-ACortex®-MCortex®-M Cortex®-A

Responder

Devices

Responder

Devices

Cortex®-A Cortex®-MCortex®-A

GPU DSP

VideoAudio

DDRResponder

Devices

1 4PUBLIC*Compared to Predecessor

Cadence® Tensilica®

Fusion DSP

*

*

Cadence® Tensilica® HiFi4® DSP

Power Management with

UNDER EMBARGO UNTIL MARCH 1, 2021

& ML

1 5PUBLIC

ENERGY EFFICIENT EDGE COMPUTE WITH

HETEROGENEOUS PROCESSING

Hierarchical fine-grained power partitioning and management

Power Management with

1 6PUBLIC