grant willson department of chemical engineering department of chemistry the university of texas...
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Grant WillsonDepartment of Chemical Engineering
Department of ChemistryThe University of Texas
Austin, Texas 78712
http://willson.cm.utexas.edu
Dual Damascene using Step and Flash Imprint Lithography
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S-FIL fluid dispenser – 126 ink jet system
Planarization layerSubstrateStep 1: Dispense drops
Step 2: Lower template and fill pattern
Step 3: Polymerize S-FIL fluid with UV exposure
Step 4: Separate template from substrate
Template
Substrate
Substrate
Template Step & Repeat or
whole wafer imprint
SubstratePlanarization layer
Planarization layer
Planarization layer
Photomask 6025 template, coated with release layer
Step and Flash Imprint Lithography
Template filling driven by capillary action – low imprint pressure and room temperature process
Template
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The First SFIL Tool
“Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning,” Proc. SPIE 3676 379-389 (1999)
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SFIL tool today
Resolution: Sub-32 nanometer half pitch Alignment: < 10nm, 3 sigma (single point, X,Y) Automation: Fully automated wafer and mask loadingFlexibility: 200mm and 300mm substrates (SEMI standard) Field size: 26mm x 32mm (step-and-scan compatible)
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Resolution of Imprint Lithography2nm Replication
(Rogers et al, Illinois)
20nm Replication
25nm vias
22nm logic (M1)
SFILSFIL
~130 atoms wide
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Imprints from the Imprio 250
32nm Logic
32nm half-pitch 24nm half-pitch
32nm Metal 1 25nm Contacts
22nm half-pitch
Thanks to Toshiba
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38 nm HP
Flash Memory Imprints Thanks to Samsung
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Non-CMOS Applications
Photonic Crystals
Patterned
Media
100nm 20 nm
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Multitiered Templates
Fabricated with alternating layers of ITO and PECVD Oxide
S. Johnson, et.al. Microelectron. Eng. (2003) 67, 221
SFIL Imprint
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Our Job!
Moore
You?
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Egyptian Damascene
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ATDF Dual Damascene Processresist
etch stop
substrate
ILD
ILD
initial stack trench litho trench etch
resist ashBARC / resistvia litho
via etch resist Ash plate
CMP
23 unit process steps/layer =184 steps for 8 layers of metal
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Direct Etch or Direct Imprint
Previous Metal Layer
Dielectric Layer
Sacrificial Imprint Material
Imprint Template
SIM
Previous Metal Layer
Imprint Template
DPD
DirectlyPatternableDielectric
SIM Process DPD Process
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SIM Damascene Process
M1
Copper Barrier
# of process steps: 0
◄ CVD ILD
12SFIL IMPRINT
PressFlashRelease
◄ Dispense SIM◄ Cured SIM
Multi-Tier Template
3
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3
SIM Damascene Process
M1
# of process steps: 4
Etch transfer
56x 8
64
184 – 64 = 120steps
Savings of
7
Barrier EtchCopper SeedCopper PlateCMP
8
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BEOL Multilevel Imprint Cost Saving
20% overall wafer cost saving at 30 wph Cost analysis by Sergei V. Postnikov, Infineon Technologies;
presented at Semicon Europa 2007, Stuttgart, Germany
0%
20%
40%
60%
80%
100%
120%
140%
wph = 5 wph = 10 wph = 20 wph = 30 wph = 40 wph = 50
V1/M2base line
DD:44steps
V1/M2 Dual Damascene by NIL in resist: 27 steps
rela
tiv
e c
os
t (%
)
20%
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Lloyd Litt, et. Al NNT 08
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Multi-level Templates
Vias
Lines
240 nm
360 nm
120 nm
125 nm
Features HeightCD
1 μm vias
Vias
Lines
125 nm
313 nm
50 nm
125 nm
Features HeightCD
Courtesy of Toppan Photomask
Courtesy of IMS Chips
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Multi-Level S-FIL Test Vehicle
M2 by SFIL M1 by Photolithography
IN OUT
Dummy lines
IN OUT
Dummy lines
Comb
CombSerpIN Serp
OUTComb
CombSerpIN Serp
OUT
Serp/CombSerp/Comb
Dense LinesDense LinesVia ChainsVia Chains
IN OUTIN OUT
Isolated LinesIsolated Lines
Comb 1
Comb 2
Comb 1
Comb 2
CombCombSerpSerp
IN OUTIN OUT
IN OUT
Dummy lines
IN OUT
Dummy lines
Comb
CombSerpIN Serp
OUTComb
CombSerpIN Serp
OUT
Serp/CombSerp/Comb
Dense LinesDense LinesVia ChainsVia Chains
IN OUTIN OUT
Isolated LinesIsolated Lines
Comb 1
Comb 2
Comb 1
Comb 2
CombCombSerpSerp
IN OUTIN OUT
Test StructuresTest Structures
Via chain
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SIM Via Chain StructuresSIM Via Chain Structures
100nm vias 100nm via100nm vias
M2 by SFIL M1 by Photolithography
Via chain
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Pattern Transfer Demonstration
TrenchDescum
N2/H2
TrenchDescum
N2/H2
Via EtchAr/C4F8/N 2
Via EtchAr/C4F8/N 2
SIM Material
ILD Material
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Pattern Transfer Demonstration
TrenchEtch
CF4/C4F8/N 2
TrenchEtch
CF4/C4F8/N 2
AshN2/H2
AshN2/H2
Both Coral® and Black Diamond® were processed
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Via Chain – 120 nm 1000 Contacts
Yield statistics (6 valid and identical chains tested)
• Overall yield of 1000-contact chains with via CD 120 nm (nominal) / 115 nm (final) – 96.83%
• Individual contact yield – 99.9968%
Template CD = 120 nm Final CD = 115 nm
Template CD = 120 nm Final CD = 115 nm
0
20
40
60
80
100
0 2 4 6 8 10 12 14 16
Via Chain Resistance (Ohm per contact)C
um
ula
tive
Pro
bab
ilit
y (%
)
Chain #1
Chain #2
Chain #3
Chain #4
Chain #5
Chain #6
Cu (M2)
CoralCu (M1)
Ta
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Directly Patternable Dielectric
Previous Metal Layer
Imprint Template
DPD
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DPD Property Requirements
Property
Viscosity
Photocurable
Cure shrinkage
Dielectric Constant
Thermal Stability
Mechanical Properties
CTE
Water Sorption
Requirement
Less than 20 cP
Chain reaction polymerization
Less than 15%
≤ 3
Less than 1% wt loss/hr @
400oC
Young’s Modulus ≥ 4 GPa
Less than 30 ppm/oC
Less than 1% wt
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SiOO
O
SiSi
OSi
O
OO
O
O
Sol-gel Design/Formulation
Sol-Gel
SiOO
O
SiOO
O
O
O
Si
O
O
O Si
OH2O, H+
Alkoxysilanes
ultrasonication, vacuum
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Sol-gel DPD Characterization
Property
Viscosity
Acrlyate conversion
Vertical shrinkage a
Dielectric Constant
Thermal Stability b
Mechanical Properties c
CTE
Measurement
9-17 cP
93% @ 1.2 J/cm2
~ 30%
≤ 2.3
364 °C
3-7 GPa
23.4 ppm/°Ca. Shrinkage is composite of UV cure bake at 300 °Cb. Measured after bake at 350 °C.c. Measured by both nanoindentation and SAWS.
??
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Metal Patterns (via chains) in Sol-gel DPD
Wires (M2)
“Dummy“ metal fill
Via chain
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Sol-Gel DPD Integration Study
Defect SourcesM1 defects (not expected)Particle defects (expected)
Imprintuniformityalignmenttemplate
BEOLetchmetalCMP
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Sol-Gel Via Chain Yield
120nm Via ChainsPoor Yield
Cause of FailureOpen at via bottom
Co
urt
esy
of
Bro
ok
Ch
ao
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O Si O Si
O Si O Si O
O
x
y
x+y=8
O Si O Si
O Si O Si O
O
x
y
x+y=8h
O Si O Si
O Si O Si O
Oy
x+y=8
x
POSS Design/Synthesis for DPD
O
SiO Si
O
SiOSi
O
SiO
Si
O
SiO
SiO O
OO
R
R
R
R
R
R
R
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POSS Characterization
a. Measured after bake at 250 °C.b. Measured by both nanoindentation and SAWS.
Property
Viscosity
Exposure
UV shrinkage
Thermal shrinkage a
Dielectric Constant
Thermal Stability a
Mechanical Properties b
CTE
Measurement
~640 cP
89 mJ/cm2 @ 80% conv.
17 ± 4%
5 ± 3%
2.84
344 oC
2-5 GPa ?
32 ppm/oC
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Issue: inkjet requires < 20 cP Solution: new viscous fluid dispense
technology is being implemented
Viscous Dispense System
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POSS Design/SynthesisPolyhedral Oligomeric Silsesquioxane (POSS)
Si
O
Si
O
O
O
O
Si SiO
SiO
Si
O
Si
O
O
SiO
O
OSi
OSi
OSi
OSi
n
O
O
8-n
Benzocyclobutane(BCB)
(Meth)acrylate
A
B
B
A
B
B B
A
O
O
Pt(dvs), Toluene
O
SiO Si
O
SiOSi
O
SiO
Si
O
SiO
SiO O
OO
O Si O SiH
8
Hydrosilylation chemistry
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Conclusions Multi-level S-FIL is a viable approach for Cu /
low-k dual damascene processing
• SIM Process has been demonstrated by good electrical yield in various via and line test structures
• Implementation does not involve reliability testing
• Lower cost DPD Process is making progress• Opportunity for materials design
• Some processing challenges remain
• Implementation of DPD requires reliability testing
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Brook H. Chao, Frank Palmieri, Wei-Lun Jen, and D. Hale McMichael
The University of Texas at Austin
Jordan Owens, Rich Berger, Ken Sotoodeh, Bruce Wilks, Joseph Pham, Ronald Carpio,
Ed LaBelle, and Jeff WetzelAdvanced Technology Development Facility, Inc.
These people did the work
These people paid for the work