global system on package market

8/9/2019 Global System on Package Market

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IndustryARC

Global System on Package (SOP) Market

(2014-2020)

By Technology Elements (Electrical Silicon Through-Vias, Fine Pitch, High

Bandwidth Wiring and Others), By Application (Consumers Electronics, Wireless

Communication) and By Geography

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TABLE OF CONTENTS

1. Global SOP (SOP) Market - Market Overview

2. Executive Summary

3. Global SOP Market - Market Landscape

3.1. Market Share Analysis

3.2. Comparative Analysis

3.2.1. Product Benchmarking

3.2.2. End user profiling

3.2.3. Patent Analysis

3.2.4. Top 5 Financials Analysis

3.2.5. Global SOP Market – Market Forces

3.3. Market Drivers

3.4. Market Constraints

3.5. Market Challenges

3.6. Attractiveness of the Global SOP Market

3.6.1. Power of Suppliers

3.6.2. Power of Customers

3.6.3. Threat of New entrants

3.6.4. Threat of Substitution

3.6.5. Degree of Competition

4. Global SOP Market – Strategic Analysis

4.1. Value Chain Analysis

4.2. Pricing Analysis

4.3. Opportunities Analysis



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4.4. Product/Market Life Cycle Analysis

4.5. Suppliers and Distributors

5. Global SOP Market – by Technology Elements

5.1. Electrical Silicon through-vias

5.2. Fine-Pitch

5.3. High Bandwidth Wiring

5.4. Fine-Pitch Solder Interconnection

5.5. Fine-Pitch Known-good-Die

5.6. Advanced Microchannel Cooling

6. Global SOP Market – by Application

6.1. Consumer Electronics

6.2. Wireless Communication

7. Global SOP Market– By Geography

7.1. Americas

7.1.1. US

7.1.2. Canada

7.1.3. Mexico

7.1.4. Brazil

7.1.5. Others

7.2. Europe

7.2.1. UK

7.2.2. Germany

7.2.3. Italy

7.2.4. France

7.2.5. Others



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7.3. Asia-Pacific

7.4. China

7.5. India

7.6. Japan

7.7. Russia

7.8. Others

7.9. ROW

7.9.1. Middle East

7.9.2. Africa

8. Global SOP - Market Entropy

8.1. New Product Launches

8.2. M&As, Collaborations, JVs and Partnership

9. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)

9.1. IBM Corporation

9.2. ABB Ltd.

9.3. Rockwell Automation, Inc.

9.4. Honeywell International Inc.

9.5. Cooper Industries plc

9.6. Emerson Electric Co.

9.7. Hollysys Automation Technologies Ltd

9.8. Thomas & Betts Corporation

9.9. Thales Group

9.10. R. STAHL, Inc.

9.11. NHP Electrical Engineering Products

9.12. E2S Warning Signals



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9.13. WERMA SIGNALTECHNIK GMBH + CO.KG

9.14. J. Auer Signalgerate GmbH

10. Appendix

10.1. Abbreviations

10.2. Sources

10.3. Research Methodology

10.4. Bibliography

10.5. Compilation of Expert Insights

10.6. Disclaimer



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LIST OF TABLES

Table1 Global SOP Market Revenue, 2014 – 2020 ($m)

Table2 Global SOP Market Revenue, By Technology, 2014 – 2020 ($m)

Table3 Global SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table4 Global SOP Market Revenue, By Geography, 2014 – 2020 ($m)

Table5 Electrical Silicon through-vias SOP Market Revenue, By Geography, 2014 – 2020 ($m)

Table6 Fine Pitch SOP Market Revenue, By Geography, 2014 – 2020 ($m)

Table7 High Bandwidth Wiring SOP Equipments Market Revenue, By Geography, 2014 – 2020($m)

Table8 Fine Pitch Solder Inetrconnection SOP Equipments Market Revenue, By Geography,2014 – 2020 ($m)

Table9 Fine Pitch Known-Good-Die SOP Market Revenue, By Geography, 2014 – 2020 ($m)

Table10 Advanced Microchannel Cooling SOP Market Revenue, By Geography, 2014 – 2020($m)

Table12 Electrical Silicon through-vias SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table13 Fine Pitch SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table14 High Bandwidth Wiring SOP Equipments Market Revenue, By Application, 2014 –2020 ($m)

Table15 Fine Pitch Solder Interconnection SOP Equipments Market Revenue, By Application,

2014 – 2020 ($m) Table16 Fine Pitch Known-Good-Die SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table17 Advanced Microchannel Cooling SOP Market Revenue, By Application, 2014 – 2020($m)

Table18 Americas SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table19 Europe SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table20 APAC SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table21 RoW SOP Market Revenue, By Application, 2014 – 2020 ($m)

Table22 Americas SOP Market Revenue, By Technology, 2014 – 2020 ($m) Table23 Europe SOP Market Revenue, By Technology, 2014 – 2020 ($m)

Table24 APAC SOP Market Revenue, Technology, 2014 – 2020 ($m)

Table25 RoW SOP Market Revenue, By Technology, 2014 – 2020 ($m)

Table26 Americas SOP Market Revenue, By Country, 2014 – 2020 ($m)

Table27 Europe SOP Market Revenue, By Country, 2014 – 2020 ($m)

Table28 APAC SOP Market Revenue, By Country, 2014 – 2020 ($m)

Table29 RoW SOP Market Revenue, By Country, 2014 – 2020 ($m)



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LIST OF FIGURES

Figure 1 Global SOP Market, 2014 (%)

Figure 2 Global SOP Market, by Type of Sensor, 2014 (%)Figure 3 Global SOP Market, by Technology, 2014 (%)

Figure 4 Global SOP Market, by Industry, 2014 (%)

Figure 5 Global SOP Market, by Application, 2014 (%)

Figure 6 Global SOP Market, by Geography, 2014 (%)

Figure 7 Global SOP Market, Value Chain Analysis

Figure 8 Global SOP Market, Porter’s Five Forces Analysis

Figure 9 Global SOP Market, Market Share Analysis, By Key Player, 2014 (%)

Figure 10 Global SOP Market, Patent Analysis by Year, 2014 – 2020 ($M)

Figure 11 Global SOP Market, Patent Analysis by Company, 2014 – 2020 ($M)

Figure 12 Global SOP Market, Financial Analysis, by Key Players, 2014

Figure 13 Global SOP Market, Life-Cycle Analysis, 2014-2020

Figure 14 Global SOP Market, New Product Launches, by Year, 2012-2015

Figure 15 Global SOP Market, Recent Developments, by Year, 2012-2015



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REPORT SCOPE

The Global SOP Market has been segmented by type of technology elements and by type of

applications. Each of these segments is further broken down into sub-segments give an in-depth analysis of the market.

The overall market is also presented from the perspective of different geographic regions andthe key countries for this industry. Competitive landscape for each of the product types ishighlighted and market players are profiled with attributes of company overview, financialoverview, business strategies, product portfolio and recent developments. Market shares ofthe key players for 2014 are provided. The report contains the most detailed and in-depthsegmentation of the Global Signaling Devices Market.

Stakeholders Product OEMs Contract manufacturers Service providers Component suppliers System Integrators

Maintenance Companies



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EXECUTIVE SUMMARY

SOP is a technology that places an entire system with computing, communications, andconsumer functions all in a single chip. This technology is forecast to enable lower cost, moreefficient and higher performance electronic systems. SOP saves interconnection time and heatgeneration by keep a full system with computing, communications, and consumer functions all ina single chip.

This report categorizes the market into three different segments, namely, market by type oftechnology elements, application, and geography. Based on the technology elements, themarket has been classified into Electrical Silicon through-vias, Fine-Pitch, High Bandwidth

Wiring, Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and AdvancedMicrochannel Cooling. The applications include Consumer electronics and wireless

communications. Based on the geography, the report has been segmented into North America, Europe, APAC, and RoW.

SAMPLE TABLE: GLOBAL SOP MARKET REVENUE, BY REGION, 2014-2020($M)

Region 2014 2015 2016 2017 2018 2019 2020 CAGR%(2015-2020)

Americas xx xx xx xx xx xx xx xx%

Europe xx xx xx xx xx xx xx xx%

APAC xx xx xx xx xx xx xx xx%

RoW xx xx xx xx xx xx xx xx%

Total xx xx xx xx xx xx xx xx%

Source: IndustryARC Analysis

Americas and Europe together hold major share of xx% in Global SOP market. Market sizeand forecast is provided for each of these regions. A detailed qualitative analysis of the factorsresponsible for driving and restraining growth of the Global SOP Market and futureopportunities are provided in the report. This report on the Global SOP Market identifies

many such insights and M&A opportunities, besides providing a detailed analysis of themarket.



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SAMPLE TABLE: GLOBAL SOP MARKET REVENUE, BY PRODUCT TYPE, 2014-2020 ($M)

Product Type 2014 2015 2016 2017 2018 2019 2020 CAGR%(2015-2020)

Electrical Siliconthrough-vias

xx xx xx xx xx xx xx xx%

Fine-Pitch xx xx xx xx xx xx xx xx%

High BandwidthWiring


Fine-Pitch SolderInterconnection


Fine-Pitch Known-good-Die


AdvancedMicrochannel Cooling


Total xx xx xx xx xx xx xx xx%

Source: IndustryARC Analysis

There are the various types of SOP technologies being worked upon currently. Market size andforecast are provided for each of these technology elements. A detailed qualitative analysis of thefactors responsible for driving and restraining growth of the global SOP market and futureopportunities are provided in the report.

This report on the Global SOP Market identifies many such insights and M&A opportunities,besides providing a detailed analysis of the SOP market.



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KEY MARKET INSIGHTS

System on Package (SOP) is the only way to reach the three-dimensional packageconcept where components will be placed in three-dimensional configuration

NANIUM renewed the co-operation contract with Georgia Tech 3D Systems PackagingResearch Center (GT PRC) till 2015 towards development and industrialization of newpackaging technologies, especially SOP

SOP provides a promising solution for integrating heterogeneous functions such as high-speed digital processing, memory, radio-frequency circuits, sensors, MEMS, andoptoelectronic devices

LTCC SOP Technology is presently the most effective method for realizing theminiaturization of wireless front-end applications



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RESEARCH METHODOLOGY

The quantitative and qualitative data collected for the SOP report is from a combination ofsecondary and primary sources. Research interviews were conducted with senior executivesand/or mangers in the SOP Industry. These Key Opinion Leaders (KOLs) were thenprovided a questionnaire to gather quantitative and qualitative inputs on their operations,performance, strategies and views on the overall market, including key developments andtechnology trends. Data from interviews is consolidated, checked for consistency andaccuracy, and the final market numbers are again validated by experts. The global market wassplit by product types and geography based on different factors like primary and secondarysources, understanding of the number of companies operating in each segment and also KOLinsights.

We have used various secondary sources such as directories, articles, white papers,newsletters, annual reports and paid databases such as OneSource, Hoovers and Factiva toidentify and collect information for extensive technical and commercial study of the SOPmarket.

The key players in the market and its value chain were identified through secondary researchand their market opinions were also gathered in a similar way through telephonic interviewsand questionnaires. We have also studied the annual reports of these top market players.Interviews with key opinion leaders such as directors, managers, and marketing personnel

were used extensively in understanding the need and emergence of SOP Energy Storage

market. We also have extensive database of contacts which were used to conduct primary interviewsand also to get their inputs using questionnaires.



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THE ARC ADVANTAGE

An analytical model lies at the core of our process, ensuring logical consistencythroughout our research. We complement the model with secondary data andinterviews with industry experts to reflect the latest trends. With our final expert

validation, we provide you with only the most accurate and actionable intelligence.

ABOUT US

IndustryARC was started by a group of young, passionate professionals along with

extensively experienced industry veterans across various business segments. Our focus and

THE ARC PROCESS

ANALYTICAL MODEL BASE MODEL CONSOLIDATED MODEL ARC MODEL

AnalyticalMethod

Base Method ConsolidationMethod

Delphi Verification

1. Granularbreakdown ofdrivers intofactors

2. Validate allfactors in termsof their presentimpact on themarket

3. Assign weightsto these factors interms of theirrelevance andimpact on themarket

4. Build the Analytical Model

1. Get a top-down estimate ofthe market

2. Follow it up with a bottom-upestimate of themarket

3. Checkforconsistencyand new growthfactors that arerelevant over thenext 10 Years

4. Build the Basemodel

1. Granularbreakdown ofdrivers intofactors

2. Validate allfactors in termsof their presentimpact on themarket.

3. Assign weightsto these factors interms of theirrelevance andimpact on themarket.

4. Build theConsolidatedModel

1. Verify thefindings of themodel withexperts fromacross the valuechain

2. Verify thefindings withplayers acrosssmall and largeenterprises

3. Tweak themodel and addnew factors

4. Finalize the ARC Model

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