gigabyte ocp proposal - hyperscale it€¦ · 2430w psu x 6 (208/230vac dual inputs) q1’2016 2.5u...

GIGABYTE OCP Proposal

May. 27th , 2016

GIGABYTE EMBEDDED SOLUTION UPGRADE YOUR LIFE At a Glance To “Upgrade Your Life” is the idea behind GIGABYTE which conveyed our core values of innovation and inspiration. Our unlimited passion for technology drives us to be a worldwide leader in ICT industry and achieve brilliant reputations from the media and the public.

Company Profile

Vision Become one of the IT Industry leaders

Mission

Provide the leading IT product and best service; meet and surpass market expectations through research and development of core technologies, product design innovations, and quality assurance.

GIGABYTE Vision and Mission

GIGABYTE Overview

GIGABYTE Executive Team

GIGABYTE NCBU Organization

Founded April 1986

IPO Listed on TSE since Sept. 24,1998 (Taiwan)

Capital US$ 200.47 million (NT$ 6.72 billion)

Gross Revenue US$ 1,717.2 million (NT$ 51.1 billion @ 29.77)

Certifications ISO9001:2008, TL9000-H R5.0/R5.0, OHSAS 18001:2007, ISO 14001:2004, IECQ QC 080000, ISO14064-1:2006 , PAS 2050:2008

Mfg. Capacity Motherboard 1,650 K/M、Graphics Card 570 K/M System Products 200 K/M、Server Solution 55 K/M、 Laptop 65 K/M、Mobile Phone 50 K/M

Purchasing Direct account of Intel、AMD、Nvidia & major ASIC

Technology Key vendor’s alpha & beta site: Intel、AMD、Microsoft….

RD Expenditure 3% of revenue per year (= 25% of net profit)

Patents Filed：3,007；Approved：1,614

GIGABYTE Profile

GIGABYTE Product Overview

GIGABYTE Alliance with Key Vendor

GIGABYTE Alliance with Key Customer

GIGABYTE has received numerous awards from prestigious organizations and industrial magazines all around the world.

GIGABYTE Creating Brand Value

http://www.tweaktown.com/awards/index.html

http://images.anandtech.com/doci/7409/A_EditorChoice_Silver smaller.png

http://www.pcper.com/image/view/35410?return=node/59209

GIGABYTE Global Operation & Support Center

GIGABYTE ODM Business Center

Logistic • BTO • CTO

• Distribution & Direct Fulfillment

• Outbound Logistics & Hubbing

Manufacturing • PCB/ Flex Circuits • SMT Assembly • LCD panel • Cables

• IQC & OQC

Design • Electronic Engineering • Mechanical Engineering

• Software • System Integration • Validation & Testing

Service • Marketing

• Retail Technical Service • Repair/ Refurbishment

and Warranty • Service Parts Logistics • Reserve Logistics

The most dependable partner for co-design, co-develop, manufacturing, assembly and after-sales

services to global computer leaders from PCs to industrial solutions.

GIGABYTE ODM/OEM Solutions

PC Systems

AIO

Mini-PC

Client

Server Boards

Single Socket

Dual socket

Workstation

Server Racks

1U 2U

High Density

HPC

Open Rack

NAS

4-Bay Tower

1U Racks

2U Racks

Boards

Thin Mini-ITX

Mini-ITX

Proprietary Industrial

IPC Boards

Set-Top Box

Kiosk POS

(ARM base)

GIGABYTE Datacenter & Storage

Open Rack Optimized rack-scale cabinet to fast deployment datacenter supporting Xeon E3-1200 V2 & E5-2400 series

2 & 4-bay NAS High Performance Atom NAS for Home/ SOHO usage supporting Windows Home SVR or Linux

Intel Micro-Server/ Storage CRB & reference bare-bone (MOHON PEAK)

GIGABYTE Enterprise Product

Gigabyte NCBU Milestone

Pure-player in delivering Collaboration Solutions

Server Motherboard, Server Barebone, Embedded Motherboard, Workstation, NAS, Wireless Products

Strong Focus on Customer Care, Execution & Service Delivery

60% of our workforce is customer-facing for project management / operating, Product Evaluation, Quality assurance, and Service availability in the area.

Key figures

Presence in 8 territories, 47 offices, 8 languages.

~600M USD revenue in 2014 @ NCBU

2014 : launch of a full Intel Grantley Series offer for our customers worldwide

Base on Intel Grantley Platform, Gigabyte had launched full range of Server Mainboard, Server Barebone System with Grantley Solution.

In parallel of Intel Solution, Gigabyte had also invest R&D resource for ARM architecture solutions – Interface, Storage, Computing.

2015/Q2 : launch of a full ARM Series offer for our customers worldwide

Gigabyte had launched ARM Platform solutions for WW customers in June.

- APM : w/Applied Micro ARM SOC, for interface / web hosting server.

- Annapurna : w/Annapurna Lab ARM SOC, for cold storage

- ThunderX : w/Cavium Thunder X, for high-performance-computing.

Gigabyte NCBU Milestone

GIGABYTE Alliance with Key Customer

Design and Manufacturing Services to customers worldwide:

All-inclusive, integrated solutions

Built on Existing Core Competency

Mature EE/ME design and professional system integration

Leveraging innovative technology & assembly expertise

Customer Driven Innovation

Brainstorming with customers from around the world

Extensive design experiences and wide design investigations to satisfy the needs of SI/ODM customers requests

Wide Customer Base & Product Lines

Diverse customers including ASP, ISP, IDC, film editing media, SI,ODM, etc.

Current product lines include network storage, servers, workstations, industrial computing, personal computing, IPTV/OTT/Hybrid STB, and all kind of wireless module products

GIGABYTE Innovation Design

Successful Story

- Yandex , Russia

Professional Experience in Data Center

Gigabyte Started to developd Open Rack for Yandex New Data Center in Russia from 2012 , as ODM project (Intel Romley Platform)

Started to delivery full Open Rack (with CPU, HDD, Memory…etc) to Yandex Russia in the end of 2012.

Started to delivery full Open Rack (with CPU, HDD, Memory….etc) to Yandex

Finland from year 2014.

Business with Yandex

Gigabyte developed the customized Open Rack 1.0 for Yandex Data Center:


Yandex’s Data Center:


The details of Open Rack design, from 2012 , Open Rack 1.0 as :


The details of Open Rack design, from 2015 , Open Rack 2.0 as :


For product delivery to Yandex, we’re doing the L10 Open Rack Shipment.

- Whole Open Rack with CPU, HDD, Memory, Switch –

- Gigabyte is doing manufacturing , testing, packaging, then deliver to Russia and

Finland.

- With the assembled Open Rack, Gigabyte will doing cabling management, and

install Linux for basic S/W application.

- Gigabyte will have technical on-site support when system installation.

- Provide 3 years warranty


USA

Russia

China Japan Taiwan

Over 58,000 Server Nodes Shipment (2013 2H~ 2015 1H)

85% Growth of Volume in Shipment (2014 ~ 2015 1H)

Widely adopted in Russia, USA and Asia countries

GIGABYTE Confidential

The Performance of Data Center Solution

2013 2014 2015

Year

Volume (Server Node)

10,000

30,000

50,000

Foresee a dramatic growth as the demand from CSP is getting increased

* Over 58,000 Nodes

* 85% Growth


The Volume Shipment of Data Center Solution

GIGABYTE OCP

Proposal

GIGABYTE Confidential P 35

Racklution-OP - System Overview

2430W PSU x 6 (208/230Vac Dual Inputs) 2.5U Power shelf system up to 12.5KW capacity with power supplies 5+1 redundant configuration.

2U 24 bays JBOD

2U 3 Compute Nodes 2U 36~45 bays JBOD Q1’2016

3 OU ToR Switch

2.5OU Power Shelf

18 OU rack mount

18 OU rack mount

Rack Dimension: 86.6 x23.6 x42 inch (2,200 x600 x 1067mm)

1U 3 Compute Nodes

GPGPU Node (Under Planning)

Multi Host Node (Under Planning)

1U-4 GPGPU

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Standard OCP Rack Selection

Key Features :

• Tool-free installation, easy deployment and maintenance.

• Proven solution with many data center customer.

• Containing 18sets tool-free support brackets per rack; brackets provides “2OU” space and adjustable in 0.5OU height.

Open Rack

Rack H x W x D Dimension 86.6 x23.6 x42 inch (2,210 x600 x 1067mm)

Power Zone 2 Power Zones

Bus Bar Cross Area Design 1.77 x 0.12 inch (45 x 3 mm)

Bus Bar Assemble Design 3 Pairs Bus Bar Assemble in each Power Zone

Bus Bar Clip 100A

PDU Design 4 x AC PDU Combined in Power Shelf

PSU Architecture 2500W PSU x 6 (208/230Vac Dual Inputs)

Stand OCP Rack Power Shelf Selection

Key Features : • 2.5U Power shelf system up to 12.5KW capacity with power

supplies 5+1 redundant configuration.

• Power shelf could equip maximum 6pcs 2.5KW power supply.

• Dual AC input (200~264Vac) with auto transfer switch function.

• >94% High power efficiency for cost-saving operation.

• PMBUS interface to provide power supply operating information.

• Power Shelf with 12.5Vdc nominal voltage and power from 220V AC line, provides two AC power inputs to Internet Switch through Power Cords.

• Power Shelf provides four power AC220 outputs to Internet Switch through Power Cords.

• Adapt and comply for Open Compute Project.

Power Shelf Solution

General

Efficiency > 94% @ 50% load ; 80Plus platinum

Protection Input: OVP, UVP Output: OCP, OVP, Short Circuit, OTP

Safety Regu. UL EN60950

Cooling Fan cooled by power supply

Power Input

Rating 200Vac~240Vac , 50/60 Hz

Number of Phase / Wire

3-phase 4-wires / L1,L2,L3, PE 3-phase 5-wires / L1,L2,L3, Neutral, PE

Power Factor > 0.98 (>20% of Max Load)

Current THD < 10% (>20% of Max Load)

DC Power Output

Main Power Main: 12.5±0.2V 1000A / 12.5KW max.

Standby Power Standby: 12±0.6V 2.5A / 30W max.

Comm. Interface PMBus

Mechanical

Dimension 19 x 23.6 x 4.6 inch (482.6 x 600 x 117 mm)

Input Power Cord Hubbell CS8365C (3Φ 4wires, L1/L2/L3/PE); Hubbell C532P6S (3Φ 5wires, L1,L2,L3, Neutral, PE)

Output Bus-bar 3 sets copper bus

Racklution-OP - 1U 3Nodes Server Chassis

• Half width Motherboard

• Support 1 x 2.5” easy swappable HDD

• HDD tray tool-less design for easy maintains

• 2 PCIe expansion slots for support more functions (1 standard PCIe MD2 & 1 Mezzanine)

Specifications

Form Factor 1U 3Nodes

Access Front

HDD / SSD Bays 1 x 2.5" Easy Swappable Tray

Racklution-OP – 2OU 3Nodes Computing Server Shelf

• 2 x 80mm fixed fan (reserved space on

sled) in each sled for better cooling efficiency.

• Tool-less fan module for easy maintains. • Complies with Open Rack Standard

V1.1 rack.

Specifications

Form Factor Standard OCP 2U 3Nodes

Access Front

Power Supply Each sled: 500W Total power for shelf: 1500W

Weight Rating 20Kg for sled bay Total maximum shelf weight : 60Kg

80mm FAN x2

Busbar Connector

Racklution-OP – 2OU 3 Nodes Sled (2.5” HDD SKU)

System Front View • Support up to 10 x 2.5” hot plug HDD tray • 2 PCIe expansion slots for support more functions (1 standard PCIe MD2 + 1 Mezzanine) • Tool-less design for easy maintains

Specifications

Form Factor OCP 2U 3Nodes

Access Front

Power Supply Each sled: 500W

Weight Rating 20Kg for sled bay

Racklution-OP – 2OU 3 Nodes Sled (3.5” HDD SKU)

System Front View

System Top View

• Support up to 2 x 3.5” + 4 x 2.5” hot plug HDD tray • 2 PCIe expansion slots for support more functions (1 standard PCIe MD2 + 1 Mezzanine) • Tool-less design for easy maintains

Specifications


Access Front



Racklution-OP - Server Chassis (2 x 2.5” HDD SKU)

Specifications


Access Front



• Support up to 2 x 2.5” hot plug HDD tray • 2 PCIe expansion slots for support more functions (1 standard PCIe MD2 + 1 Mezzanine) • Tool-less design for easy maintains

JBOD Design

OCP Storage Proposal – JBOD Enclosure Management • Large storage systems usually assume some redundancy:

– Redundant disks (RAIDs), – Redundant cooling (fans, blowers, etc.)

• To detect failure system should have number of sensors: – HDD Back Plane & Power Distribution board temperature – power voltage – power Consumption – fan speed, ...

• To detect HDD Status via Expander PHY: – Link status – SAS/SATA Configuration – HDD Link Speed

• To support maintenance system should allow: – identify components (UID LED/Button support) – disable failed component( power on/off respective tray) – provide status information (via LED display or IPMI) – FW update method ( in-band via HBA under Linux & IPMI via BMC through UART )

• To provide that functionality several enclosure management interfaces are standardized now: – SCSI Accessed Fault-Tolerant Enclosure (SAF-TE), – SCSI Enclosure Services (SES), – SAF-TE/SES over I2C, – Serial General Purpose Input / Output (SGPIO).

System Front View

UID LED/Button (Blue)

BMC Reset Button (at rear side)

Tray Status LED (Green/Red) Tray Power LED

(Green)

MLAN Access LED (Green)

Top view & introduction

• There are 3 Inner trays in system. • Support up to 15 hot swappable HDDs per

inner tray • Support up to 45 hot swappable HDDs per

system • Fan locate on rear side of the chassis for

support hot plug & redundant function • One BMC on PDB to control system

power and support management.

BMC

Racklution-OP – 2OU 45Bays JBOD Proposal

BMC

Power & I2C/UART Cables External miniSAS HD 4i Cables (1 or 2)

Front access when do HDD maintains

Main Board Design

Form Factor Proprietary half-width 169W x 492 mm (6.65” x 19.4”)

CPU Intel Xeon E5-2600 v3 Single Processor Socket (LGA 2011) Socket R3

Chipset Intel C610 (Wellsburg)

Memory

16 x DIMM slots support four channel,

1333 MT/s Single Rank or Dual Rank RDIMMs; 1866MT/s (2 DPC), 2133MT/s (1 DPC), 2133 MT/s w/LRDIMM (2 DPC),

RDIMM, LRDIMM (3DS w/Broadwell)

LAN Mellanox MT27514A1-FCCR-XE (1*10G SFP+ signal/SFP+ connector) (Default) Mellanox MT27518A1-FCCR-XE (2*10G SFP+ signal/SFP+ connector) (option) 1 x Intel I210 GbE LAN (NCSI) in front side, 1 x management LAN (internal connector)

Video Integrated in ASPEED2400 1920x1200@60Hz 32bpp

SATA 10 x SATA III 6Gb/s ports & 1 port support SATA DOM module

RAID Intel SW RAID 0/1/5/10

Expansion Slots

1 x Mezzanine I/F PCIe x8 (@Gen3 x8 bus) slot 1 x Low profile PCIe x16 (@Gen3 x16 bus) slot 1 x slim type PCIe x 16 connector for support NVME function (need riser card support)

Rear I/O 2 x USB 2.0, 2 x 10G SFP+, 1 x Gigabit RJ45, 1 x Serial (option), 1 x VGA, 1 x Power button, 1 x ID Switch button with LED 1 x NMI button, 1 x BMC reset button, 1 x Power status LED

Server Management ASPEED IPMI 2.0, iKVM

MH60-RE0/RE1

• Common using in GIGABYTE high density system (like 2U 4nodes, GPGPU….)

Gigabyte Half-Width M/B – Grantley Platform

Mezzanine @ x8 PCIE Gen3

VGA

COM (Option) No mounting

10*SATA 6G, 1 SATA connector support SATA DOM

Internal MLAN

2*USB 2.0(For Front USB2.0)

Standard x16 PCIE Gen3 (support MD2 Card)

1*RJ45(I210) (NCSI)

+2*USB3.0

Mallenox Single 10G SPF+

Dual 10G (option)

PCIe x16 for support 4 PCIe x4 NVME Drive

Grantley Half-Width MH60 M/B Placement

GIGABYTE Confidential P 51

Cavium DP – MT70-HD0 Specification

Feature Specification Form factor Halfwidth (492.76 x 168.9 mm; 19.4” x 6.65’’)

Processor Support

Cavium Thunder CN8890 Dual Processor (BGA 2601)

Chipset None

Memory

16 x DDR4 slots support four channel, UP to 1TB 2133 MT/s 2DPC for Single Rank or Dual Rank U/R-DIMMs 2133 MT/s 1DPC for Quad Rank U/R-DIMMs 2400 MT/s 1DPC for Single Rank or Dual Rank U/R-DIMMs

LAN Inphi Cortina Systems® CS4343 2 x QSFP+ 1 x Management LAN 10/100/1G

VGA / VRAM Integrated in BMC with DDR3 16MB VRAM 1920x1200@60Hz 32bpp

BMC ASPEED AST2400

Expansion Slot 1 x PCIe x16 (@Gen 3 x 8 ) from CPU0 1 x PCIe x8 Mezzanine (@Gen 3 x 8 ) from CPU0

Storage 4 SATAIII 6Gb/s (Port 0 support SATA DOM)

Rear IO Connector

1x VGA, 1x COM, 1x UID, 1x NMI, 1x BMC reset, 1x Status LED 1x RJ45(MLAN), 2x QSFP, 2 x USB 3.0, 2 x LAN LED

Internal Connector

2 x USB3.0, 1 x COM

Form Factor Proprietary half-width 165W x 492D mm (6.5” x 19.4”)

CPU Intel Xeon E5-2600 v3 Single Processor Socket (LGA 2011) Socket R3

Chipset Intel C610 (Wellsburg)

Memory

16 x DIMM slots support four channel,

1333 MT/s Single Rank or Dual Rank RDIMMs; 1866MT/s (2 DPC), 2133MT/s (1 DPC), 2133 MT/s w/LRDIMM (2 DPC),

RDIMM, LRDIMM (3DS w/Broadwell)

LAN Dual Gigabit Ethernet LAN ports (Intel I350-AM2) 1 x Management LAN

Video Integrated in ASPEED 1920x1200@60Hz 32bpp

SATA 6 x SATA III 6Gb/s ports

RAID Intel SW RAID 0/1/5/10

Expansion Slots

1 x Mezzanine I/F PCIe x8 (@Gen3 x8 bus) slot 1 x Low profile PCIe x16 (@Gen3 x16 bus) slot

Rear I/O 2 x USB 2.0, 2 x RJ45, 1 x 10/100/1000 management LAN, 1 x Serial, 1 x VGA, 1 x Power button, 1 x ID Switch button with LED 1 x NMI button, 1 x BMC reset button, 1 x Power status LED

Server Management

ASPEED IPMI 2.0, iKVM

MH70-HD1

MH70-HD1

• Common using in GIGABYTE high density system (like 2U 4nodes, GPGPU….) which ship to many customer (US, EU, China…) for using now


MLAN+ USB3.0

Dual Gbit Ethernet

Status LED

VGA COM

GBT Half-Width MB Solution – Grantley Platform

Intel V3 MB

Use special power & signals connector on rear side of MB. Need connect to PDB board by board to board connector. FAN locate behind of PDB board.

GIGABYTE Grantley MB

Use cable connect between MB & PDB. FAN locate close to CPU for better cooling efficiency.


GBT MB Benefit Compare with OCP Standard

Mezzanine Card Comparison

Mezzanine Pros Cons Note

GIGABYTE

1. Size is bigger and support more different typ

es functions like LAN, storage , Infiniband….

2. The height of Riser is adjustable for more

feasibility on onboard component

3. Low cost connector compare with OCP type

1. Support PCIe x8 only

2. No support 4 x 40G QSFP+

OCP Type 1. Support up to x16 PCIe bus 2. Support up to 4 x 40G QSFP+ card

1. Use 4 expansive board to board connectors to support PCIe x16 signals

2. Only LAN solution


MB & Mezzanine Card Comparison

Broadcom 10G SFP+ Intel 10G SFP+ Mezz. Intel 10G BaseT Mezz. Infiniband (FDR) ports

GC-MLBZ1 GC-MLIZS GC-MLIZ GC-MNXE2

GC-MSLZ1

LSI 6G SAS HW RAID GIGABYTE Confidential

Accessories – Mezzanine Card Solution

PMC 12G 16Ports (Internal) SAS/SATA HBA Card

LSI 6G 8Ports (Internal) SAS/SATA

Firmware RAID Card

LSI 6G 8Ports (external) SAS/SATA

Firmware RAID Card


Firmware RAID Card


Hardware RAID Card

GC-MSLZ2 GC-MSLZ3,4 GC-RA200-8

GC-RA201-A CRA333-8

PMC 12G 16Ports (8 Internal, 8 External)

SAS/SATA HBA Card


Firmware RAID Card

CSA413G CSA313G

GC-MLBZ1

Broadcom 10G SFP+ Mellanox 10G SFP+

GC-MNXE21

CSA323G

LSI 12G 16Ports (Internal) SAS/SATA HBA Card

2015.Q4 2015.Q4 2016.Q1


Accessories – PCIe Card Solution

Power Consumption

Power consumption Comparison

System Load 1 Server node 1U Rack Mounted Server Power consumption improvement

DC Power FAN duty DC Power FAN duty

100% Load 221.39W 60% 270.58W 4056: 60% 4028: 30%

-18.18%

20% Load 85.30W 30% 114.72W 4056: 30% 4028: 30%

-25.65%

Naver OCP Node R180 system

Device Spec. Q'ty

CPU E52630 V3 85W 2

Memory DDR4 8GB 2

HDD 200G SSD 1


Power Consumption Comparison

Thermal Solution

& Simulation

Thermal Simulation

• Select low power consumption (1.2A) FAN for power saving, 8038 mm system fan


Thermal Simulation – FAN Selection

Thermal Simulation

System Configuration Power Consumption Quantity Note

CPU 145W 2

Memory DDR3 9W 16

PCIe Card 13.3W 2

PCH 8W 1

2.5” SSD 5.2W 6

3PCS PCIe Cards

145W CPU1 145W CPU0 8038 fan 2PCS

16 PCS DImm 2.5” HDD x 6

CPU 0 Heat-sink CPU 1 Heat-sink

Aluminum Fin add Copper Base add 3 heat pipes :106*70*63.5mm


Thermal Simulation - System Config.

35C-Full-Config : Temperature Profile

35C-Full-Config : Speed Profile


Thermal Simulation - Temperature & Speed Profile

System Configuration Power Consumption Quantity Thermal Spec Result Note

CPU 145W 2 78゜C CPU0 : 70゜C

CPU1 : 68゜C

Memory DDR3 9W 16 85゜C

DIMM1 : 64゜C

DIMM2 : 63゜C

DIMM3 : 64゜C

DIMM4 : 66゜C

DIMM5 : 59゜C

DIMM6 : 59゜C

DIMM7 : 59゜C

DIMM8 : 61゜C

DIMM9 : 64゜C

DIMM10 : 64゜C

DIMM11 : 64゜C

DIMM12 : 63゜C

DIMM13 : 61゜C

DIMM14 : 61゜C

DIMM15 : 60゜C

DIMM76 : 60゜C

2.5” SSD 5.2W 6 55゜C

HDD1 : 46゜C

HDD2 : 46゜C

HDD3 : 44゜C

HDD4 : 45゜C

HDD5 : 45゜C

HDD6 : 46゜C


Thermal Simulation - Simulation Result

Business Management

• Business management • Coordinate fulfillment and

logistics

• Production management • Manufacturing and vendor

quality control

• Local RMA service • Maintenance support • Technical Training

• System design, integration and validation • Development control and management

• Technical analysis and support

• Feasibility evaluation of SPEC requirement and solution proposition

Development

Team

FAE Team

Service Team

QA Team Sales Team

Product

Marketing


GIGABYTE Business and Support Team


Quality Assurance Plan

• Specify product review stage/ process

• State Cpk value (Process Capability Index) • M/B: SPI (solder paste inspection)

*Measurement timing: 2pcs / every two hours

Measure Point

SPI Report

SPI Machine



• State Cpk value (Process Capability Index) • System: Torque of Electric Screwdriver

*Measurement timing: Before Each Working order

*References: Each model SOP

torsion meter Record the torque on the screwdriver Torque Record list



GIGABYTE Design Capability

GIGABYTE R&D Strength

P.76

Your needs!

High quality standards

Customization Expertise Speed and

flexibility

Reliability

WORKING WITH US

Middle East & Africa

• Dubai • Egypt • Iraq • South Africa

Taiwan

North America

• USA • Mexico

South America

• Brazil

• Australia • Bangladesh • Hong kong • India • Indonesia • Japan

Asia & Oceania

• Korea • Singapore • Sri Lanka • Thailand • Viet Nam

Europe

• France • Germany • Holland • Italy

• Spain • Turkey • UK

East Europe

• Czech • Poland • Russia • Ukraine

• Romania • Serbia

• Shenzhen • Shijiazhuang • Suzhou • Taiyuan • Wenzhou • Wuhan • Wulumuqi • Wuxi • Xiamen • Xian • Xujiahui • Zhengzhou • Zhongguancun • Zhuhai

• Baotou • Beijing • Changsha • Changchun • Chengdu • Chungking • Dalian • Dongguan • Foshan • Fuzhou • Guangzhou • Guiyang • Haikou • Hangzhou

• Harbin • Hefei • Nanchang • Nanning • Nanjing • Ningbo • Jinan • Kunming • Lanzhou • Liuzhou • Qingdao • Shanghai • Shantou • Shenyang

China

WHERE WE ARE

• Hsinchu • Hsintien • Junghe • Kaoshiung

• Taipei • Taoyuan • Taichung • Tainan

gigabyte ocp proposal - hyperscale it€¦ · 2430w psu x 6 (208/230vac dual inputs) q1’2016 2.5u...

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