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F U T U R E T E C H N O L O G Y M A G A Z I N E

I S S U E 1 3 0 5

Design Note: page 12Understanding safety-agency test methods for optocouplers

Technical View: pages 22-23 Better M2M design by thinking outside the bit-pipe

Application Spotlight: pages 13-20NXP power transistors dedicated to RF-heatingapplications

Component Focus: pages 2-11 Fairchild motor controller implements FOC indedicated coprocessor

In association with www.my-boardclub.com

Application Spotlight on

RF & Wireless

Multi-Tech strengthens medical industrycredentialsMulti-Tech says its recent certification according tothe ISO 13485: 2003 medical industry quality-management system validates the company’scontinued commitment to quality and will deliverextra value for all customers.

Multi-Tech’s external and embedded modems,routers and gateways are used in a variety ofindustries, and all customers can benefit from thechanges the company has made to its internalprocesses along the road to ISO 13485certification. Applications in the medical field, inparticular, include transmitting patient data fromhomes or emergency vehicles. A white paper,‘Integrating M2M in Medical Devices’, explainsmore about Multi-Tech’s solutions for medical OEMsand can be downloaded from www.multitech.com.

Microchip speeds-up embedded GUIdevelopmentMicrochip has released Graphics Display DesignerX (GDD X), a visual design tool that acceleratescompletion of Graphical User Interface (GUI)screens for applications using Microchip’s 16- or32-bit PIC® MCUs. To streamline the GUI-designprocess, GDD X provides a WYSIWYGenvironment, and saves valuable design time byautomatically generating the C code needed forthe user interface.

GDD X enables development using Microchip’sGraphics Library. It can be used as a stand-alonetool or as a plug-in to Microchip’s free MPLAB® XIntegrated Development Environment (IDE), and isavailable to run on Windows®, Linux or Mac OS®

operating systems.

Lowest-cost MCUs enhance touchscreen-interface designThe PIC12LF1552, part of the 8-bit PIC12/16F15XXfamily, is Microchip’s smallest and lowest-costPIC® MCU with hardware I2C support. Offered inthe 2mm x 3mm UDFN package, its featuresinclude a 4-channel 10-bit ADC and a hardware-based Capacitive Voltage Divider (CVD).

The hardware CVD enables a more efficientimplementation of capacitive sensing for touchapplications. As a core-independent peripheral, itimplements control logic that enables automatedsampling that effectively reduces software size andminimises CPU usage. It also provides automaticcontrol of guard-ring drive and a programmablesample-and-hold capacitance, to better matchlarger touch or proximity sensors.

Award for ON Semiconductor recognisesinnovation in automotiveON Semiconductor has won an InnovativeAutomotive Semiconductor Technology Supplier2012 award for its NCV78663 power ballast anddual LED driver for automotive front-lightingapplications. The prestigious award is part ofAutomobil Industrie magazine’s programme torecognise the leading companies pushing back theboundaries of automotive electronic technology.ON Semiconductor and the NCV78663 wereselected from among companies and productsspanning automotive semiconductor, sensor andconnector solutions.

S TA R P R O D U C T

2 E M A I L I N F O @ M Y- F T M . C O M F O R S A M P L E S A N D D ATA S H E E T S

Further options available include two input-voltage range configurations, providing the choiceof a 40V DC to 60V DC input for datacomapplications or a 36V DC to 75V DC input fortelecom applications. The NEB 1/8-brick seriesis offered with power ratings ranging from 264Wto 300W, while the NQB ¼-brick series isavailable in 420W to 468W configurations.

The default output voltage for all models ispreset at 12V DC. In addition, the NEB-D

and NQB-D digital-interface variantsprovide the flexibility to adjust the

output voltage dynamically viaPMBus for dynamic busapplications. The NEB-D

output voltage can beadjusted from 6.9V DC to13.2V DC, while the NQB-

D allows adjustment from 4.0V DC to13.2V DC. For higher power requirements,optional droop load sharing is offered in bothseries.

Additional features include insulation meetingEN 60950 standards, 2250V DC isolationvoltage, and remote sensing. To address high-temperature applications, both series offer anoptional baseplate for improved thermalperformance. The converters are pin andfunction compatible with the Ericsson powermodules BMR456 and BMR457 series basedon the FRIDA II platform.

CUI INC.

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©Copyright 2013 Future Electronics Ltd. All trademarks contained herein arethe property of their respective owners. Applications for product samples,badge boards, demonstration boards, Future-Blox Boards and otheradvertised materials from Future Electronics are subject to qualification.

Newsin brief Advanced bus converters maximise

efficiency across load range

NQB and NEB smart converters are available in 1/4-brick or 1/8th-brick form factors

CUI’s NQB and NEB series advanced busconverters achieve typical efficiency as high as96.4% and are able to optimise efficiency from20% to 100% of full load. This makes themideal for use in applications where loadingconditions can vary greatly. In addition, thefirmware is designed to handle input-voltagetransients with slew rates of up to 0.5V/µs,while keeping the output voltage within ±10%and preventing unwanted triggering of over-voltage protection.

The NQB series is housed in a ¼-brick57.9mm x 36.8mm x 11.3mm package, and theNEB series is housed in a 1/8-brick packagemeasuring 58.4mm x 22.7mm x 10.2mm. Twoversions are available in each series. The NQB-D and NEB-D variants feature a PMBus 1.2digital interface, while the NQB-N and NEB-Nseries are offered without digital-communicationpins for conventional IBC requirements.

The PMBus interface allows designers toconfigure and store parameters in the device’son-chip USER_STORE memory block.Configurable parameters include output voltage,voltage margining, fault management, precisiondelay ramp-up, and start/stop, as well assettings for features such as over-temperature,over-current, and over-voltage protection.

The latest fully regulated DC/DCintermediate-bus converters from CUI Inc., feature a 32-bit ARM®-basedMCU and power-optimising firmwareto ensure peak performance across awide range of loading conditions.

APPLICATIONS• Telecom and networking equipment• Enterprise servers• Mainframes• Storage equipment• Video switching

FEATURES• Fully regulated• Industry-standard 5-pin package• Optional digital PMBus interface• Power-good indicator• High power density• Fast feed-forward regulation• 2.9 million hours MTBF

SECURITYAUTOMOTIVEMEDICALLIGHTINGINDUSTRIALENERGY CONSUMER TELECOMMS


Series Power Input Voltage Output Voltage Output Voltage Range Package

NEB-264 264W 36V-75V 12V 6.9V-13.2V 1/8-BrickNEB-300 300W 40V-60V 12V 6.9V-13.2V 1/8-BrickNQB-420 420W 36V-75V 12V 4.0V-13.2V ¼-BrickNQB-468 468W 40V-60V 12V 4.0V-13.2V ¼-Brick

APPLICATIONS• Fans and blowers• Pumps• Power tools• e-bikes• Compressors

FEATURES• 12kbyte microcontroller Flash memory• Three external microcontroller interrupts• Power-saving idle, stop and sleep modes• In-system programming• On-chip debug support


3V I S I T T H E O N L I N E F T M M A G A Z I N E AT: W WW . M Y- F T M . C O M

EVALUATIONBOARDS AT my-boardclub.com/ftm

DETAILSON PAGE

21

C O M P O N E N T F O C U S

Rugged high-commutation triac operatesat high voltage and temperature

NXP's high-quality triacs help OEMs to offer end-users a lower cost ofownership

NXP SEMICONDUCTORS

Dedicated motor controller cuts system developmenttime and software demands

The FCM8531 ensures consistent performance of both the motorand the application

FAIRCHILD SEMICONDUCTOR

The NXP Semiconductors BTA420-800BT 20A/800V triac joins NXP’shigh-commutation BTA series triacs,featuring an innovative designimplementation ensuring high staticstability, high resistance to fast currenttransients, and very robustcommutation performance.

The BTA420-800BT combines three-quadrant operation for improved noiseimmunity, planar-passivated technologyfor ruggedness and reliability over awide operating-voltage range, and highcommutation capability at highoperating temperatures. It willcommutate the full RMS current of 20Aat the maximum rated junctiontemperature of 150°C without the aid ofa snubber. This helps to simplifycircuitry, leading to increased reliability inheating controls, white goods and

The IC features an Advanced MotorController (AMC), comprising a configurableprocessing core and peripheral circuitsspecifically designed for motor control. TheAMC processes the tasks dedicated formotor controls, such as the FOC and‘Sensorless’ motor-control algorithms, PWMcontrols, current sensing, real-time over-current protection, and motor-anglecalculations. The AMC also supportsprogrammable deadtime and current-leadingphase control.

The embedded microcontroller coreprovides motor-control commands to theAMC through a communication interface.System-control, user-interface,communication-interface, and input/output-interface functions are also programmedthrough this core for different motorapplications. The two processors workindependently and complement each other.

The FCM8531 also integrates a power-management unit and clock generator tocontrol low-power modes and housekeepingfunctions, a protection block implementingshort-circuit and open-circuit protection, a10-bit ADC with multiplexer and an 8-bit DAC.

The FEBFCM8531_B01H300Adevelopment board is available for use with

general high-power switching applications.The high repetitive peak off-state voltage of800V and maximum off-state voltage slope of1800V/µs ensure high static stability withimmunity to false turn-on by dV/dt. A highmaximum on-state current slope of 100A/µsenhances resistance to fast current transients.By also allowing a high commutating-currentslope of up to 25A/ms, as well as a highcommutating voltage, the BTA420-800BTdelivers superior commutation capability. Thegate-trigger current of 50mA and optimisedgate sensitivity ensure high noise immunity.


APPLICATIONS• Heating controls• High-power motor control• High-power switching• Applications subject to high temperature

FEATURES• 200A non-repetitive peak on-state current• 1.5V maximum on-state voltage• 60mA holding current• 1mA maximum off-state current• TO-220AB (SOT78) package



Fairchild's Motor-Control Development System(MCDS) IDE and MCDS Programming Kit.

The Fairchild Semiconductor FCM8531motor-control IC simplifies systemdesign and reduces processoroverhead by executing critical motor-control tasks in a dedicated motor-control processor and providing anMCS®-51 (8051) compatible MCU forapplication-level tasks.

APPLICATIONS• Computing• Consumer electronics• Domestic appliances• Building controls• Industrial automation

FEATURES• Suitable for low-voltage or 5V operation• Reduced noise sensitivity• Low power consumption• Enhanced ESD classification• Modern process technology


APPLICATIONS• Navigation devices• Mobile-device protection• Context-sensitive user interfaces• Gaming devices• Shock and vibration monitors

FEATURES• 42µA-250µA normal-mode current• ±2g/±4g/±8g selectable full-scale range• I2C digital output interface• Self-test capability• Included in Freescale’s product-longevity

programme




CMOS logic families extend package choices,deliver modern process advantages

Intelligent MEMS accelerometers savepower and processor cycles

State-of-the-art logic can provide efficient solutions to circuit-design challenges

DIODES INCORPORATED

Diodes Incorporated has added extrapackage options for its HC, HCT, AHCand AHCT CMOS logic families, givingdesigners a choice of ten popular logicfunctions, in quad and hexconfigurations, in SO14or TSSOP14 packages.

The quad devices includedual-input AND, NAND, ORand XOR gates and tri-statebuffers with Output-enablelow or high. The hexarrangements comprisesingle-input inverters,unbuffered inverters, inverterswith open drains andinverters with Schmitt-triggerinputs. These are directreplacements for matureindustry-standard logicdevices, and utilise modernprocess technology to create

up-to-date logic functions offering an improvedpower-to-performance ratio and enhancedESD classification.

The new logic families cover a wide supply-voltage range from 2.0V to 5.5V, allowing usein legacy 5V applications or in more modernlow-voltage, low-power designs. HCT andAHCT versions provide TTL compatibility andcan replace 74LS bipolar devices. In addition,all devices include optimised inputs with



hysteresis to help eliminate noise issues due toslow-rising or slow-falling signals. Drawing lessthan 10µA at an ambient temperature of 25ºC,the products also meet the needs of energy-sensitive designs.


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21

Freescale’s MMA845xQintelligent MEMSaccelerometers are tiny3mm x 3mm low-power,low-noise motion sensorsfeaturing integrated digitalsignal processing and flexibleuser options that enhancecontrol and help to minimisesystem power consumption.

Four devices are available, offering designers achoice of 8/10-bit, 8/12-bit, 8/14-bit or 12-bitoutput resolution on an I2C bus and up to eight

user-configurable interrupt sourcessuch as data ready, motion/freefall,

tap (pulse) and orientation. Inertialwake-up interrupt signals canbe generated from anycombination of these functionsand mapped to two external

pins, which enables designers toachieve overall power savingsand relieve the host processorfrom continuously polling data.The accelerometer can remain

in a low-power mode duringperiods of inactivity, drawingless than 1µA in shutdown or4µA in standby.

All devices provide access tohigh-pass filtered data as wellas non-filtered data in real-time,which minimises the dataanalysis required for functionssuch as jolt detection andenables faster transitions.

Part Number OutputResolution

InterruptSources

OutputData Rate

SupplyVoltage

NominalOutput Noise

MMA8450Q 12-bits 8 1.56Hz to400Hz

1.71V to1.89V 400µg/√Hz

MMA8451Q 14-bit/8-bit 7

1.56Hz to800Hz

1.95V to3.6V 99µg/√HzMMA8452Q 12-bit/8-bit 6

MMA8453Q 10-bit/8-bit 6

FREESCALE

APPLICATIONS• Car clocks• Car radios• Climate control• Instrument clusters

FEATURES• 1µA maximum standby current• Noise filter on SCL/SDA inputs• No glitch on power-up• Internal power-on reset• 0Hz to 400kHz clock frequency• ESD protection: 2kV HBM, 1kV CDM • Latch-up testing to JEDEC Standard

JESD78


APPLICATIONS• Motor-control inverters • Industrial inverters• Induction heaters• Isolated IGBT drivers• General high-performance power systems

FEATURES• Supply voltage range: 15V to 30V• Operating-temperature range:

-40°C to 100°C• 500ns maximum propagation delay over

full operating-temperature range• Safety and regulatory approvals:

• UL1577 (4243VRMS for 1 min.)• DIN EN/IEC 60747-5-5:

1414VPEAK working insulation voltage8000VPEAK transient isolation voltage




Gate-drive optocoupler protects IGBTs to enhancesystem safety and reliability

The active Miller clamp, plus desaturation detection and UVLO, protect the IGBTto maximise system reliability


Automotive-qualified I2C I/O expander enhancescontrol of in-car electronics

NXP SEMICONDUCTORS

Fairchild Semiconductor’s FOD8318 isan advanced optocoupler for IGBT orMOSFET gate-drive applications, with2.5A output-current capability enablingfast switching of most IGBTs rated upto 1200V/150A.

Integrated features of the FOD8318include CMOS transistors of 1Ω typicalon-state resistance capable of drivingthe IGBT from rail to rail, and high-speedisolated feedback circuitry for faultsensing.

IGBT-protection features are also builtin, including an active Miller-clampfunction to shut off the IGBT during largeover-voltage spikes without the need fora negative supply voltage. Desaturationdetection is also provided, whichprotects the IGBT at short-circuit bymonitoring its collector-emitter voltage.When the voltage at the detection pinincreases above the threshold voltage,the driver output stage executes a soft

IGBT turn-off. Under-Voltage Lockout (UVLO)protection is also provided.

In addition, the FOD8318 uses Fairchild’sproprietary Optoplanar® coplanar packagingtechnology and optimised IC design to achievehigh noise immunity. This is reflected in highcommon-mode rejection of 35kV/µs and highpower-supply rejection.

The device is housed in a compact 16-pinsmall-outline plastic package that meets the8mm creepage and clearance requirements forinternational safety-agency approvals.



The PCA9538PW/Q900joins NXP’s large familyof I²C I/O expanders thatprovide numerous choicesfor designers seekingadditional I/Os to controlloads such as AdvancedConfiguration and PowerInterface (ACPI) switches,sensors, push-buttons, LEDs orfans.

Internally, thePCA9538PW/Q900 has an 8-bitconfiguration register for assigning inputs and

outputs, 8-bit input-port and output-portregisters, and an 8-bit polarity-inversionregister allowing control of the input-portregister polarity. The PCA9538PW/Q900 issimilar to the PCA9554 but does not have an

internal I/O pull-up resistor, therebyreducing power consumption when

I/Os are held low. ThePCA9538PW/Q900 also has a

Reset pin and a differentaddress range.

Other features include anopen-drain Interrupt output

pin, which is activatedwhen any input state

differs from thecorresponding input-port register stateand therebyindicates to thesystem master thatan input state has

changed. The power-on reset sets the registers to

their default values and initialises thedevice state machine. The Reset pin allowsreset or initialisation without de-powering the device.

The NXP SemiconductorsPCA9538PW/Q900 I2C-bus I/Oexpander provides eight GPIOswith interrupt and reset,and is AEC-Q100qualified for usein automotiveapplications.

APPLICATIONS• Decorative lighting• General low-power LED lighting

FEATURES• 0.85mA operating current• Programmable LED current• Precise internal reference: ±3%• Integrated protection features• Compact, low-cost 8-pin package• Under-Voltage Lockout (UVLO) with 5V

hysteresis


APPLICATIONS• Home-multimedia devices• Human-machine interface controllers• Office or studio equipment• Industrial networking and automation

FEATURES• S/PDIF optical connectivity• USB/OTG• Camera interface• Serial port




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Simple LED-lamp driver simplifies design,enhances efficiency

FREESCALE

Computing system-on-moduleoptimised for commercial projects

Power Supply WebDesigner provides the assurance of optimumperformance when using the FL7701



Unlike many open-communitysupported embedded-computingboards, the Wandboard ultra low-power computer is conceived for usein commercial projects. It provides theflexibility and documentation designersneed to customise their designs andbuild production units from individualparts if required.

Wandboard is based on Freescale’s i.MX61GHz ARM® Cortex™-A9 processor. WBSOLOand WBDUAL variants allow development oneither a single-core or dual-core processor.The board can be used with theAndroid Jelly Bean, Ubuntu orLinux operating systems.

Developers can take fulladvantage of the processor’smultimedia capabilities byleveraging up to 1Gbyte ofDDR3 DRAM on-board, as wellas the HDMI display interfaceand Gigabit Ethernet port which

are also provided. In addition, the WBDUALboard features built-in support for Wi-Fi andBluetooth®. An enclosure and antenna kit arealso available.As a System-on-Module (SOM) based on theopen EDM standard, the Wandboard featuresa standardised EDM connector for connectionto a carrier board and also has expansion pinheaders for miscellaneous power, I/O andsecondary-card connections. A separate 5Vpower supply and micro-SD card are requiredfor a complete working system.

To aid commercial production of designsbuilt using Wandboard, the datasheets for thechips and also for the board itself are allpublished. Complete schematics, source codeand documentation can be found onwww.FutureElectronics.com/FTM.

The Fairchild Semiconductor FL7701LED-lamp driver ensures high efficiencyunder all operating conditions byautomatically detecting when an ACinput is applied and activating Power-Factor Correction (PFC) or keeping thePFC turned off when a DC input isdetected.

The special ‘adopted-digital’ technique usedto detect the input-voltage conditions detectsvoltage fluctuation on the main Power-input pinto establish a time reference and generate aninternal Zero-Crossing Detection (ZCD) signal.This helps to save cost and PCB space byeliminating any need for a bulk electrolyticcapacitor to maintain supply-rail stability oradditional detection pins for detecting input-phase information.

The FL7701 is a basic PWM controller forbuck-converter topology, and operates inContinuous-Conduction Mode (CCM). Adedicated Analogue-dimming pin is provided,

which accepts a 0V-to-10V signal for controllingthe LED brightness.

By integrating a self-biasing circuit that usesthe high-voltage switching device, the FL7701does not need an auxiliary powering path tothe supply-voltage pin. This simplifies PCBdesign compared to other flyback control ICs,which typically require an auxiliary path. Theself-biasing function guarantees similar start-up



Rohm’s ML7105: page 14PARTNERWORKING

times across the entire input-voltage range,from 80V to 308V AC. The controller also hasan internal soft-start function to limit inrushcurrent during start-up.

WandboardVersion Processor DDR3

DRAMMicro-SDCard Slots

Wi-Fi/Bluetooth

WBSOLO Freescalei.MX6 Solo 512Mbyte 2 No

WBDUAL Freescalei.MX6 DualLite 1Gbyte 2 Yes

Top and bottom views of the Wandboard illustrate its ease of useand versatile connectivity



NXP Semiconductors hasexpanded its Breakthrough InSmall-Signal (BISS) transistorfamily by adding thePBSS4260PANP dual-transistordevice containingcomplementary NPN/PNP 60V,2A low-VCEsat transistors.

With the PBSS4260PANP, and similarPBSS4260PAN with NPN/NPN transistorsand PBSS5260PAP PNP/PNP alternative,NXP now offers a full series of dual low-VCEsat BISS devices in the leadless mediumpower DFN2020-6 (SOT1118) SMD plasticpackage, with collector-emitter voltage of 60Vand rated collector current of 2A. They deliveradvantages such as reduced PCB area, lowpower losses and reduced heat generationallowing increased reliability and simplifiedthermal management. Besides the 60V/-2Aseries, the devices are also available with a

collector-emitter voltage of 30V or 120V aswell as a rated collector current of 1A or 2A.

The PBSS4260PANP and other dual-BISSdevices are suitable for various power-switching duties in high-volume consumer,communication and computing equipment.AEC-Q101 qualified devices are also availablefor automotive applications.

60V, 2A dual transistors target efficiency-conscious power-control applications

APPLICATIONS• Load switching• Battery-driven devices• Power management• Charging circuits• Power switches• Motor or fan controls

FEATURES• Very low collector-emitter saturation

voltage (VCEsat) • 3A peak collector current• High collector-current gain (hFE) at high

collector current • Low collector-emitter saturation resistance• High reliability due to low heat generation



NXP SEMICONDUCTORS

APPLICATIONS• e-compass• Enhanced user-interface control• Augmented reality• Location-based service applications

(static geographic heading)• Inertial-navigation systems• Medical patient monitoring/fall detection

FEATURES• Supply-voltage range: 1.95V to 3.6V• Magnetic vector-magnitude and threshold

detection interrupt modes• Five acceleration-based interrupt modes• Auto-wake/sleep capability• Footprint compatible with Xtrinsic

MMA8451/2/3 accelerometers


APPLICATIONS• Battery management• Battery protection• Load switching

FEATURES• >2kV HBM ESD protection• 1.7nC gate-drain Miller charge• -1µA drain current at zero gate-voltage• Maximum on-state resistance:

• 140mΩ at VGS = -4.5V, ID = -2A• 315mΩ at VGS = -1.5V, ID = -1A




DETAILSON PAGE

21


6-axis MEMS inertial sensor supports smartfunctionality and system power savings

Competing devices are 84% larger than Fairchild's FDZ661PZ


20V MOSFETs deliver 140mΩ on-stateperformance in 0.64mm2

FREESCALE

The Fairchild SemiconductorFDZ661PZ P-channel MOSFET takesadvantage of the latest 1.5VPowerTrench® processtechnology to deliver voltageand current ratings of 20V and2.6A respectively as well as lowon-state resistance within anextremely small and low-profileWLCSP package.

Using a state-of-the-art, fine-pitch,Thin-WLCSP packaging process, theFDZ661PZ combines excellentthermal-transfer characteristics with anultra-low profile of 0.4mm and tinyfootprint of 0.8mm x 0.8mm.Occupying only 0.64mm2 on the PCB,this MOSFET is less than 16% of thesize of competing devices in 2mm x2mm BGA packages.

With maximum on-state resistance as low as140mΩ, at gate-source voltage of 4.5V, as wellas low maximum gate charge of 8.8nC, theFDZ661PZ can be used in applications thatrequire a combination of low conductionlosses and high switching efficiency.



Rohm’s ML7105: page 14PARTNERWORKING

The Freescale FXOS8700CQ sensorcombines a 3-axis MEMS accelerometerand 3-axis magnetometer, and hasadvanced embedded functions fordetecting both acceleration andmagnetic events, allowing sensor-interrupt signals to determineapplication-processorpower modes therebyenabling significantsystem-power savings.

Part of Freescale’s Xtrinsicsensor portfolio, theFXOS8700CQ 6-axis sensor ishoused in a small 3mm x 3mm x1.2mm QFN plastic package. It combines a14-bit accelerometer and 16-bit magnetometerwith an optimised ASIC, which supports thesensor’s smart embedded functionality. Withdynamically-selectable accelerometer full-scaleranges of ±2g, ±4g or ±8g, and a fixedmagnetic-measurement range of ±1200µT, it

enables a high-performance e-compasscapable of typical orientation resolution of 0.1°and compass-heading accuracy of better than0.5° for most applications. The Output DataRate (ODR) is selectable from 1.563Hz to800Hz by the designer, for each sensor.Interleaved magnetic and acceleration data isavailable at ODR rates of up to 400Hz.

Designers can also build an e-compasseffectively using discrete components if

required, by combining the Freescale’sMAG3110 magnetometer with an

accelerometer from theMMA845xQ series. The

MAG3110 is housed in a 2mmx 2mm x 0.85mm packageand has full-scale magneticrange of ±1000µT.

The FXOS8700CQ can beused in a wide variety of portable

and mobile products, from personaldevices to robots and unmanned air

vehicles. In addition, Freescale has developeda 12-axis Xtrinsic sensor platform forWindows® 8, which facilitates integration of theFXOS8700CQ or other sensors from theXtrinsic portfolio into tablets, slates, laptopsand other portable devices.

APPLICATIONS• IGBT and power-MOSFET gate drivers• AC and Brushless-DC (BLDC) motor

drives• Renewable-energy inverters• Industrial inverters• Switched-Mode Power Supplies (SMPS)

FEATURES• 300ns maximum propagation delay over

temperature range• LED input-current range:

6.0mA to 10.0mA• Operating-voltage range: 15V to 30V• UL recognised 5000VRMS for 1min.• CSA, IEC, EN and DIN safety approvals


APPLICATIONS• Low-voltage rectification• High-efficiency DC/DC conversion• Switched-mode power supplies• Reverse-polarity protection• Low power-consumption applications• Ultra high-speed switching• LED-backlight drivers

FEATURES• 0.5A/20V forward-current/reverse-voltage

ratings• 390mV maximum forward voltage• Ultra-small, leadless DFN1006D-2

package• 0.37mm typical package height• Solderable side pads• AEC-Q101 qualified




Tiny Schottky barrier rectifier is efficient, robustand reliable

The PMEG2005BELD is housed in a tiny leadless package designed to facilitatepost-reflow inspection

NXP SEMICONDUCTORS

Optocoupler and development board speed-up creationof scalable driver designs

AVAGO TECHNOLOGIES

The NXP SemiconductorsPMEG2005BELD is a planar Maximum-Efficiency General-Application(MEGA) Schottky barrierrectifier encapsulated in aleadless ultra-smallDFN1006D-2 (SOD882D)surface-mount plastic package.

The device is rated for maximumreverse voltage of 20V, and iscapable of carrying average forwardcurrent of up to 0.5A and repetitivepeak forward current of 3A. Itsmaximum forward voltage of 390mVhelps to preserve efficiency in avariety of switching and power-conversion applications.

Reliability and ruggedness arefurther attributes of thePMEG2005BELD, which has anintegrated guard ring for stressprotection.

The solderable side pads of the DFN1006D-2package ensure that reflowed solder joints arevisible, enabling automatic optical inspectionto verify satisfactory assembly. The devices arequalified according to AEC-Q101 for use inautomotive end-products.




The Avago Technologies ACPL-339JMOSFET gate-drive optocouplerfeatures a unique design thatallows engineers to supportdifferent system powerratings using onehardware platform byinterchanging onlythe driver buffers andIGBT or MOSFETpower switches.

As a dual-output devicecapable of driving externalNMOS and PMOS buffers, theACPL-339J can be used to isolatethe entire upper or lower arm of ahalf-bridge inverter. Its ability tosupport buffers of various currentratings allows a single driver design tobe scaled for different power-conversionor motor-control applications withoutredesigning critical circuit-isolation andshort-circuit protection features.

The supporting ACPL-339J Evaluation Boardallows rapid evaluation of the ACPL-339J in anisolated half-bridge inverter-driver circuit. Theboard takes advantage of the desaturation-detection feature of the ACPL-339J to provideprotection for an IGBT power switch. Usingtwo of these boards together, engineers canimplement both upper and lower arms of the

inverter. Each board provides the flexibility toconnect an IGBT or MOSFET power switch

in either a TO-220 or TO-247 package.The ACPL-339J optocouplercontains an AlGaAs LED, which is

optically coupled to an integratedcircuit having two power-output

stages with active timingcontrol to prevent cross

conduction in the externalMOSFET buffer stage.

Additional ACPL-339Jfeatures include

Under-Voltage Lockout(UVLO), ‘soft’ IGBT turn-off,

and isolated open-collector faultfeedback to provide maximum

design flexibility and circuit protection.The insulation voltage of 1414VPEAK is

equivalent to the highest level specified in IEC/ EN/DIN EN 60747-5-5.

APPLICATIONS• Broadband-distribution systems• TV-signal amplifiers• Return-path amplifiers• Combined TV and satellite frequency-

band amplifiers

FEATURES• 20dBm single-tone input-power capability• 22dB output power at 1dB gain

compression (P1dB)• 75Ω input and out impedances• Supply-voltage range: 5V to 8V• 2kV ESD-withstand capability

(HBM and CDM)


APPLICATIONS• Smart energy meters• Smart-building and home-automation

equipment• Energy generation and distribution• Industrial-relay drivers

FEATURES• Under-Voltage Lockout (UVLO)• Usable with 12V, 24V or 48V relays• Ability to break through welded contacts• Suitable for isolated or non-isolated meters• 3.3V or 5V square-wave logic-input

signals




TV and satellite extreme-broadband amplifiersoutperform GaAs alternatives

The FAN324x relay drivers provide the features needed for ultra-reliable smart-power control


Dual-coil relay drivers ensure reliable switchingfor smart-power applications

NXP SEMICONDUCTORS

Fairchild Semiconductor FAN324xdrivers for dual-coil relays in smart-power applications are designed tominimise component count and boardspace, while enhancing systemreliability and the noise immunity ofthe circuitry driving the relay coils.

The FAN3240 and FAN3241 feature afilter/timer block that prevents inadvertentswitching from noisy input signals by providinginput-pulse qualification enabling pulsesshorter than the minimum preset qualificationtime to be ignored. The devices also limit themaximum output pulse width, and so are ableto deactivate the output if a system faultoccurs resulting in the input being heldcontinuously high. The output can operate infollow-input mode or maximum-width mode.These parameters are factory adjustable. TheFAN3240 is set with a qualification time of 15ms,maximum pulse width of 150ms, and theoutput operates in follow-input mode.

FAN3241 settings are a qualification time of1ms, maximum pulse width 30ms, and outputin maximum pulse-width mode.

An important feature common to bothdrivers is XOR protection at the input, whichprevents both coil-driver outputs from beingon at the same time and so helps to avoidexcessive drain on the system power supply.



The BGA3012, BGA3015 andBGA3018 from NXPSemiconductors are extreme-broadband amplifiers capableof delivering 12dB, 15dB or18dB of gain across a widefrequency range, while providingoutstanding linearity and alsooutperforming competing GaAs devices at lowfrequencies.


DETAILSON PAGE

21

At the low end of thefrequency band, the amplifiersdeliver 5dB better noiseperformance and more than20dB better input-power ratingcompared to GaAs devices. They also offer a superior ESDrating of 2kV and a wide supply-voltage range of 8V to 5V.

The amplifiers are very well suited to variousbroadband TV-distribution system applications,such as Fibre-To-The-Home (FTTH).

equipment, home gateways and set-topboxes. They can also be

used as a return-pathamplifier in applicationsoperating from 5MHz to300MHz, or incombined TV andsatellite systems overthe frequency range

40MHz to 2600MHz.All devices feature

internal biasing, whichsimplifies design and saves external

components. They have a flat gaincharacteristic, and provide highlinearity with a third-orderintercept of 40dBm and second-order intercept of 60dBm.

The drivers have two separate driver channelswith non-inverting logic. A single Enable pincontrols shutdown of both channels,independently of the input signals. An internalthermal-shutdown function is provided forthermal protection.

APPLICATIONS• Horizontal and vertical versions• 1A current rating• 100V AC/DC voltage rating• Accepts AWG28 – AWG30 wire gauge

FEATURES• LCD panels• Networking and office equipment• Industrial controllers• Automotive infotainment devices• POS terminals• Gaming machines


APPLICATIONS• Industrial systems• Test and instrumentation• Gaming machines• Office equipment• Building automation

FEATURES• Non-shorting contact operation• High resistance to humidity, vibration and

shock• 10,000 detent operations rated lifetime• UL94V-0 flammability-rated housing, base

and actuator• Compatible with infrared-convection reflow




Ultra low-profile rotary switches optimised for clearand convenient operation

The FR02 shaft-actuated rotary switches are extremely compact yet easy to use forconfiguring system settings

NKK SWITCHES

Tough, reliable 1mm connectors target industrial applicationsHIROSE

The Hirose DF50 series 1mm wire-to-board positive-lock connectors featurea thick and durable housing that hashigh resistance to wrenching forces,providing space-saving connectivityfor industrial applications that requirehigh strength and reliability.

NKK Switches has added a shaft-actuated option to its FR02 series of10mm x 10mm ultra-thin, surface-mount, DIP rotary switches, allowingconvenient operation by hand.

These latest shaft-actuated versions join theexisting screwdriver-actuated FR02 switches,and can also be adjusted with a flat-tipped

The DF50 range consists ofsingle-row and double-rowcompact receptacles andheaders. The double-rowconnectors are availablewith 20, 30, 40 or 50contact positions, whilesingle-row connectors havefrom 2 to 16 contactpositions.

The low-profile connectordesign with surface-mountcontacts and contact pitchof 1mm allows for maximumspace-saving on the board,reducing the mounting areaneeded. The metal lockprovides a consistent andpositive tactile click even

with repetitive mating. This ensures theconnector is fully engaged guaranteeingcomplete electrical and mechanicalconnection. Unlike connectors that have a sidelock, the DF50 lock is centred on the housingand effectively prevents uneven locking andcable entanglement.

Designed with thicker housing walls toprevent cracking, the connectors feature along insertion depth and have blade contactsto prevent damage by wrenching forces. Thereceptacle features a robust and reliable lance

screwdriver if required. All FR02 shaft orscrewdriver actuators are fully rotational andcan be operated either clockwise oranticlockwise.

With a height of 3.8mm, the FR02 seriesswitches deliver the lowest profile in theindustry and allow close stacking of circuitboards. The switches feature a detentmechanism that gives a crisp, positive actionenabling accurate switch setting.

Ten-position decimal and sixteen-positionhexadecimal configurations are available in realor complement codes. Highly visible legendswith an arrow to indicate position provide

trouble-free code setting, andcolour-keyed actuators help toidentify code types. Orange-coloured actuators signify real-coded switches, while a yellowactuator indicates complementcoding.

The internal structure features acam-activated movable contactand gold contact plating, whichensure high reliability and continuitywith low contact resistance. Theelectrical rating is 100mA at 5V DCwhen switching, and 100mA at50V DC when not switching.

structure that permits visual confirmation andkeeps the contacts securely in place evenwhen high forces are applied to the cable. Acombination of gold plating and a longeffective mating length ensure high contactreliability with low specified contact resistanceof 30mΩ.

Hirose DF50 connectors are compact and space-efficient while offering high durability and reliability



P.I.E.S E C T I O N

The switches are designed for straightmounting on the PCB and feature gullwingterminals that ensure mechanical stabilityduring soldering and also simplify solder-jointinspection.

D E S I G N N O T E


This Design Note from Avago Technologies discusses how thetest methods used to certify optical isolators should not beapplied to other types of isolation devices using magnetic orcapacitive coupling. In particular, differences between the ageingmechanisms of the insulation materials used in the alternativecouplers can produce an inaccurate prediction of sustainableworking voltage, which is an important safety-critical parameter.

Optocouplers are currently regulated bycomponent-level safety standards such as IEC60747-5-5, European DIN/EN 60747-5-2 (basedon an earlier revision of IEC 60747-5-5), and thedraft standard VDE0884-10. These covervarious aspects such as isolation construction,insulation material, ageing mechanism anddefect-screening tests, and hence are only fullyapplicable to optical-type isolators.

Despite their apparent incompatibility,alternative isolators using magnetic or capacitivecoupling technologies are sometimes certifiedusing the same test methods as opticalisolators. This is not satisfactory, as the qualityand characteristics of the ultra-thin spin-coatedpolyimide or silicon-dioxide insulation layersused in these devices are not well understood.Moreover, the partial-discharge principle used topredict safe, continuous high-voltage lifetimes of optical isolators can beshown to produce inaccurate predictions when applied to magnetic orcapacitive devices.

The prediction-reality gapThe IEC, DIN/EN and VDE standards use the partial-discharge methodto test the homogenous quality of solid insulation. In this test, voltagesup to 1.875 times the rated working voltage are applied between inputand output of the device for one second. A discharge of less than 5pC(picocoulombs) must be satisfied in order to pass this test. This not onlyprovides an assurance of high-quality insulation, but also effectivelyeliminates devices with manufacturing defects capable of causingreduced lifetimes and safety hazards.

A simple experiment can verify the correlation between partial-discharge capability and continuous working voltage. Samples wereselected from different technologies,including opto, magnetic and capacitiveisolators in SOIC packages with 8mmcreepage and clearance. Since solid insulation is capable of200Vrms/1mm, a test voltage of 1.6kVrmsis selected for all devices to acceleratethe test time.

Before starting the lifetime stress test,all isolators are subjected to partialdischarge at 3kVrms (1.875 x 1.6kVrms).All the devices are able to pass this testwith a discharge of less than 5pC,indicating that 1.6kVrms is a practicablecontinuous working voltage.

Figure 1 shows the experimental set-up for lifetime stress testing.

Five units of each optocoupler, magnetic and capacitive isolator areplaced together in an air-circulating oven at 125°C, and 1.6kVrms/60HzAC test voltage is applied continuously. The leakage current is constantlymeasured. An alarm sounds when the current meter detects more than100µA leakage. When a breakdown scenario occurs, the test is haltedand all devices are bench measured for leakage current to identify faileddevices.

The final test results reveal that the magnetic isolator and capacitiveisolator break down after 12 hours and 21 hours respectively. The testwas continued for the optocoupler and halted after 4000 hours. Theoptocoupler did not fail any current-leakage test during or after the test.

Table 2 compares the partial-discharge/life-test results with theprojected lifetime predicted by respective manufacturers.

Implications for isolation designOptocouplers have demonstrated good consistency and agreementbetween partial-discharge test capability and actual lifetime-stressperformance.

The insulation of both magnetic and capacitive isolators broke downafter a very short period of time, which was far shorter than theprediction of partial discharge, as well as the manufacturers’ ownpredictions.

In proving a safe continuous working-voltage rating, this test resultreaffirms that partial discharge is the relevant test method foroptocouplers. However, if applied to alternative isolators the partial-discharge test suggests that the device can be exposed to a muchhigher continuous operating voltage than is actually practicable. This canlead to a potentially dangerous over-rating of the device.

The experiment shows that optocoupler standards should not beused to predict the performance of alternative magnetic or capacitive

isolators. Further in-depth study of suchtechnologies and their limitations should becarried out before widespread marketadoption. Moreover, the use of such alternativeisolator devices in safety-related applicationsmay present significant risks to equipmentusers. Careful examination is required, toensure thorough qualification and certificationfor regulatory compliance and long-termreliability of the end equipment.

AVAGO TECHNOLOGIES

Ensuring safe system operation withcertified isolator devices


IsolationTechnology Insulation DTI

(mm)

PartialDischarge

TestVoltage

Working VoltageCapability

Based on PartialDischarge

AgeingMechanism/Life

Protection Model

LifetimePrediction

Time to Failureunder 1.6kVRMS

Bias atTa = 125°C

OptocouplerPolyimide

tape +silicone

0.4 3kV 1.6kVRMS Partial discharge Nodegradation >4,000 Hours

Magnetic Polyimide 0.017 3kV 1.6kVRMSSpace chargedegradation/

thermodynamic80 Hours 12 Hours

Capacitive SiO2 0.008 3kV 1.6kVRMS TDDB/E-Model 2,500 Hours 21 Hours

Table 2: Partial-discharge and life-test results

Fig. 1: High-voltage life-test set-up

APPLICATIONS• Wireless power amplifiers• Wireless modems• Solid-state drives• Mobile audio equipment

FEATURES• Designed specifically for pulsed operation• High capacitance• Small footprint• 100% surge-current tested



A P P L I C AT I O N S P O T L I G H T – R F & W I R E L E S S

RF & WirelessThe immense popularity of wire-free living continues to drivedemand for numerous wireless technologies such as simplepoint-to-point signalling, Internet OfThings applications, personal-areanetworking, and fixed or cellularbroadband data services to name afew. All of these sectors, and more,are supported by Future Electronics.This month’s Application Spotlightcovers the latest advances to helpyou deliver market-leading productsahead of your competitors.

With continued emphasis onsaving power and maximisingbattery life in today’s miniaturisedand feature-rich unwired devices,new protocols such as Bluetooth®

4.0 Low Energy (LE) help meet end-user demands. Rohm’s ML7105Bluetooth LE SoC, on page 14,saves even more energy with itsinnovative low-power architecture and proprietary RF circuitry.Offering the industry’s lowest active current, it enables smallform-factor devices powered from tiny batteries.

Semtech is focussing on long-range communication with itsSX1272/3 transceivers, on page 19. Patented LoRa™ modulation

allows a high link budget using low-costcomponents.

The Internet of Things continues to offerattractive promises, and NXP’s JenNetopen-standard software should ease thepath to a world in which all devices have anIP address. The JN5168 wireless MCU, onpage 17, supports JenNet, as well asZigBee® Smart Energy and ZigBee LightLink, to bring that world even closer. Forcellular M2M applications, page 17 showshow the latest embedded and pluggablemodems from Multi-Tech can help cutpower consumption and time to marketwhile supporting the latest wireless standards.If embedded Wi-Fi® is your target, turn topage 21 for our board offer with Microchip.

We also report on intriguing new advancesfor wireless-energy applications from Vishay

and NXP, on pages 18 and 19, and showcase dedicated RFpower transistors, modules, passives and interconnectsthroughout this Application Spotlight.

Miniature high-capacitance tantalum chipcapacitors optimised for pulsed applications

The 592W series delivers the industry's highest capacitance inrelation to voltage rating and case size

VISHAY

The Vishay 592W series of solid tantalumchip capacitors features a robust designspecific for pulsed operation in wirelessmodems, and is the first to achievecapacitance of 750µF at 10V in the7.5mm x 6.3mm M-type case size.

The 592W series offers very high capacitancefrom 330µF to 2200µF in voltage ratings from6.3V to 10V, and in three low-profile casesizes. The capacitors feature stable electrical

performance over temperature, pulse repetitioninterval, and voltage. They are used as bulkcapacitors for pulse loads in Power-Amplifier(PA) circuits and energy storage in wirelessmodems, solid-state drives, and mobile stereoaudio.

Three compact case sizes are available,offering various capacitance values in 7.1mm x3.2mm, case code C, 7.5mm x 6.3mm, casecode M, or 14.5mm x 7.37mm, case code Xsizes. The 6.3V variants have 1.6mm caseheight, while 8.2V and 10V devices are 2.0mmhigh. The 592W series are the first suchdevices. Their small footprint and highcapacitance enable designers to reduce


Ratings and Case Codes

Capacitance 6.3V 8.2V 10V

330µF C 2.0mm

470µF C 1.6mm C 2.0mm

750µF M 2.0mm

1000µF X 2.0mm

1500µF M 2.0mm

2200µF X 1.6mm

component count and save PCB space inwireless applications.

The capacitors are 100% surge-currenttested, have an operating temperature rangeof -55°C to 125°C, with voltage derating, andhave ±20% capacitance tolerance.

APPLICATIONS• Healthcare and fitness devices• Security equipment• Home entertainment products• PC peripherals• Industrial equipment

FEATURES• Supply-voltage range: 1.6V to 3.6V• 64kbyte ROM, 16kbyte RAM, 12kbyte

SRAM• Built-in protocol stack• Multiple standard serial interfaces• GPIO and I2C connectivity• Ultra low power consumption


APPLICATIONS• Light barriers• Optical switches• Photointerrupters• Shaft encoders• Infrared touch panels• Control and drive circuits• 3D televisions

FEATURES• Clear, untinted plastic package• High reliability• Suitable for high pulse-current operation• Package-matched to selected detectors



14 F R E E D E V E L O P M E N T K I T S AT W WW . M Y- B O A R D C L U B . C O M

Space-saving infrared emitters deliverhigh-speed, high-power performance

VISHAY The devices are available in compact top-view2.3mm x 2.3mm x 2.5mm gullwing or reverse-gullwing packages, or 2.3mm x 2.55mm x2.3mm side-view packages, and feature anadapted lens radius. This enhanced lensshape allows the devices to provide wideangles of half intensity of ±25° or ±28°. Theresulting typical radiant intensities range from20mW/sr to 35mW/sr at a drive current of100mA. The emitters offer fast switchingspeed down to 10ns, low forward voltagedown to 1.35V at 100mA, and operate overthe temperature range of -40°C to 85°C.


The ML7105's innovative low-power design enhances the energysavings achievable with Bluetooth LE

ROHM SEMICONDUCTOR

Ultra low-power Bluetooth LE System-on-Chipenables smaller form factors

The Rohm Semiconductor ML7105 is adedicated Bluetooth® v4.0 Low Energy(LE) wireless SoC which not onlyensures ultra-low power consumptionand low latency but also enables tinyform factors by allowing a smallbattery and simplified power supply.

The ML7105 integrates the Bluetooth RFstage, modem and a Bluetooth LE controllerbased on the low-power ARM® Cortex™-M0processor, with on-chip voltage regulatorsand low-power logic, in a 32-pin 5mm x5mm WQFN package. The device will beBluetooth-SIG compliant with Bluetooth LEsingle mode, and is able to perform theswitching between master and slavefunctionality without needing to reboot.

A combination of proprietary RF circuitry, apartial-off mode, and low-power technologyare key factors allowing the ML7105 toachieve the industry’s lowest current draw inactive modes, with transmit current of 9.8mAand receive current of 8.9mA. This allowsapplications to be powered from very smallbatteries such as the CR2032 coin cell, whichtypically has capacity of around 230mAh.Conventional transmitters, which demandactive current of tens of milliamps, usuallyprevent use of such a small power source.

In addition, the ML7105 has multiple low-power modes, including an idle mode thatcan be used during short time intervalsbetween connection events, a deep-sleepmode, and application-sleep and application-shutdown modes.


Freescale’s WBSOLO/DUAL: page 6Fairchild’s FDZ661PZ: page 8PARTNERWORKING


DETAILSON PAGE

21

Part Number Package Peak EmissionWavelength

RadiantIntensity@ 100mA

Angle ofHalf

Intensity

OpticalPower

@ 100mA

VF @100mA

SwitchingTime

VSMB2943GX01* Gullwing 940nm 20mW/sr ±25° 40mW 1.35V 15nsVSMB2943RGX01* Reverse gullwing 940nm 20mW/sr ±25° 40mW 1.35V 15nsVSMB2943SLX01* Side view 940nm 20mW/sr ±25° 40mW 1.35V 15nsVSMB2948SL Side view 940nm 20mW/sr ±25° 40mW 1.35V 15nsVSMF2893GX01* Gullwing 890nm 20mW/sr ±25° 40mW 1.4V 30nsVSMF2893RGX01* Reverse gullwing 890nm 20mW/sr ±25° 40mW 1.4V 30nsVSMF2893SLX01* Side view 890nm 20mW/sr ±25° 40mW 1.4V 30nsVSMY2853G Gullwing 850nm 35mW/sr ±28° 55mW 1.65V 10nsVSMY2853RG Reverse gullwing 850nm 35mW/sr ±28° 55mW 1.65V 10nsVSMY2853SL Side view 850nm 35mW/sr ±28° 55mW 1.65V 10ns

*AEC-Q101 qualified

Vishay VSMY2853, VSMF2893,VSMB2943, and VSMB2948 seriesinfrared emitters are high-power, high-speed 850nm, 890nm, and 940nmdevices that save space compared toalternatives in PLCC2 packages forapplications such as remote controls,touch panels, 3D televisions andindustrial proximity sensing.

The devices are fabricated using a variety oftechnologies, such as GaAIAs surface-emitterchip (VSMY2853), double hetero (VSMF2893),and multi quantum-well (VSMB2943/8), andcomprise variants optimised for tablet infraredtouch panels, shutter-glass synchronisation in3D-TV applications, remote controls, lightcurtains, light barriers, metering systems, andexternal emitter sources for proximityapplications. For automotive applications, theVSMB2943 and VSMF2893 are AEC-Q101qualified.

APPLICATIONS• Smart energy and metering• Building automation• Medical monitors• Tele-health devices

FEATURES• Kinetis development ecosystem• Comprehensive Freescale free protocol-

stack offering• Transceiver power-management modes• Fast antenna diversity (KW20)• Flexible RF-configuration options (KW01)


APPLICATIONS• RF power amplifiers for:

• W-CDMA basestations• Multi-carrier applications

FEATURES• High efficiency in broadband range• Decoupling leads for enhanced video

bandwidth• Excellent ruggedness• Excellent thermal stability• Low output capacitance for improved

performance in Doherty applications




NXP SEMICONDUCTORS

LDMOS amplifiers support video bandwidth inhigh-efficiency Doherty configuration

This performance comes with a peak power of54dBm (250W) and average power of46.5dBm (45W). Similar performancebenchmark levels can be reached in alternativeDoherty configurations.


Advanced wireless MCUssupport future smart applications

The KW20 combines the advanced ARM Cortex-M4 core with anIEEE 802.15.4 transceiver and extensive peripherals

FREESCALE

Freescale has revealed two wirelessMCUs that enable developers to achievea highly integrated solution whendeveloping advanced smart-energy,metering, building-control and medicalapplications. The KW20, operating at2.4GHz, is featured for advancedperformance and security, while theKW01, due later in 2013, will target low-power sub-1GHz applications.

The KW20 combines a 50MHz ARM® Cortex™

-M4 processor, up to 512kbyte Flash and64kbyte SRAM, and Freescale’s MC13242IEEE 802.15.4 RF transceiver. These resourcesmeet the increased processing and memoryrequirements associated with advanced ZigBee®

Smart Energy 2.0 and ZigBee IP (InternetProtocol) specifications, and enable developersto fulfil future smart-energy, metering, building-control and medical applications. Robustanalogue peripherals, communication portsand security features including a memory-mapped cryptographic acceleration unit, key


generation, secure memory and tamperdetection are also provided on-chip.

The integrated radio combines -100dBreceive sensitivity and +10dBm transmit outputpower with energy-efficient operation, drawingtypical peak current of 15mA in transmit modeand 16.5mA in receive mode. A class-leadinglink budget of 110db reduces demand forexternal power amplifiers. A further uniquefeature is dual Personal Area Network (PAN)support, enabling a single device tocommunicate wirelessly on two ZigBeenetworks. This helps to eliminate the need formultiple radios to connect different home-automation and smart-energy networks.

The KW01 features the ultra low-power ARMCortex-M0+ 48MHz core, 128kbyte Flash and16kbyte RAM, and a radio that provides a highlink budget when operated in 290-340MHz,424-510MHz or 862-1020MHz frequencybands. With versatile analogue, timing andcommunication peripherals also integrated, theKW01 enables developers to reduce solutionsize and cost compared to a conventionaltwo-chip or three-chip implementation.


DETAILSON PAGE

21

The V series is a dedicated family withinNXP Semiconductors’ Gen8 final-stagebroadband amplifiers, created to deliverextended Video Bandwidth (VBW) inDoherty architectures. They enablemulti-mode, multi-carrier basestationsto meet the growing data demands ofusers and applications withoutsacrificing efficiency.

Traditional Dohertysolutions work best innarrowband applications,with amplifiers performingwell over a few MHz, eachside of the optimumfrequency. Now, NXP’sdedicated video-bandwidthfamily of Gen8 LDMOS powertransistors answers the market’sdemand for solutions that cover anextended VBW to accommodate multi-mode,multi-carrier applications.

The improved VBW performance is achievedthrough a combination of NXP’s 8th generationLDMOS technology and enhanced outputmatching, both inside and outside the transistorpackage. External matching is throughadditional leads that allow connection of adecoupling capacitor to the transistor’s drain.

In addition to delivering improved videobandwidth without sacrificing efficiency, the V series also allows increased systemruggedness. The devices are easy to use and

include nine family members, sooffering enhanced flexibility. With the

added benefit of expert supportfrom NXP’s application engineers,they enable a quick turnaroundfor a working Doherty solutionthereby helping to reduce systemcosts and time to market.

Designed for broadbandoperation, the devices offerhigh-efficiency performanceover a broad range of up to

110MHz each side of the targetfrequency. As an example, the BLF8G27LS-100V achieves industry-leading efficiency of43.8% over the full 2500MHz-to-2700MHzband in a symmetrical 2-way Doherty system.

my-ftm.com/130527FOR MOREINFORMATION

APPLICATIONS• Smart-energy systems• Lighting and home automation• Wireless-sensor networking• Remote controls• Gaming peripherals• Self-powered light switches

FEATURES• Operating-voltage range: 2.0V to 3.6V• 2.5dBm transmit power• -95dBm receive sensitivity• 20 digital I/O pins• Supply-voltage monitor


APPLICATIONS• Mobile computing• Metering applications• Vending or point-of-sale• Telematics devices

FEATURES• Built using Telit HE910-D penta-band

HSPA+ module• Fallback capability to UMTS, EDGE,

GPRS networks• Universal IP® and UDP/TCP/FTP/SMTP

stacks• USB, serial, Ethernet and GPIO

connectivity• Customised development boards available

for use with embedded modules




Low-power wireless microcontroller supports widestrange of networking stacks

MULTI-TECH SYSTEMS

M2M cellular modems and routers support HSPA+high-speed data connectivity

NXP SEMICONDUCTORS

Multi-Tech HSPA+ cellular modemsand routers offer faster communicationspeeds with the newest networktechnologies. Penta-band frequencies,allow for true global connectivity andimproved performance for mission-critical high-bandwidth M2Mcommunications applications.

But not all applications need HSPA+ connectivityor the increased monthly carrier cost that oftenaccompanies it. With more cellular optionsfrom which to choose, such as 2G, 3G, GSMor CDMA option for deployments inNorth America, designers can secure the mostcost-effective product for their solution.

All of Multi-Tech’s cellular solutions arecarrier approved as end devices and offerlonger product lifecycles with backwardcompatibility to legacy 2G networks. Knownfor reliability and dependability, Multi-TechSystems offers a full range of interfaces,including Ethernet and Wi-Fi®. The pre-approvedmodems and routers ensure faster, more cost-effective development and significantlyminimise risk.

The JN5168provides a compactand cost-effectiveplatform for Internet-of-Things applications bycombining a 2.4GHz IEEE 802.15.4 radio, a highlyfeatured 32-bit RISC processor,on-chip memory, communicationports and analogue peripherals.

Designers can achieve highsystem integration by takingadvantage of 256kbyte of Flash,32kbyte of RAM and 4kbyte of EEPROMintegrated on-chip. The JN5168 is the largestdevice in NXP’s JN516x family, which also


DETAILSON PAGE

21



includes the JN5161 with 64kbyte Flash,8kbyte RAM and 4kbyte EEPROM, and theJN5164 with 160kbyte Flash, 32kbyte RAMand 4kbyte EEPROM.

With its enhanced 32-bit RISC processor,the JN5168 offers high coding efficiency

through variable-width instructions. Inaddition, a multi-stage instruction

pipeline enables high executionspeeds, while support for

programmable clock speedsallows low-power operation.

The radio stage providesfeatures such as in-packet

antenna diversity, whichallows systems to

choose the bestantenna on everypacket received, and

also has a time-of-flightengine for ranging, as well as

a 128-bit AES security processor.Analogue and digital peripherals

include a two-wire I²C port, SPI master orslave ports, a four-channel 10-bit ADC, andsensors for battery condition and temperature.The ADC can support a large switch matrix ofup to 100 elements, or alternatively a 20-keycapacitive touch pad.

There currently are three Multi-Tech embeddedproducts with HSPA+: the SocketModem® Cellembedded cellular modems with a universalsocket form factor, the QuickCarrier USBembedded USB cellular modems and theMultiConnect® Open CommunicationsGateways-Embedded (OCG-E), akin to aSystem-on-a-Module (SOM).

Three models of external devices are alsoavailable: the MultiModem® rCell intelligentwireless routers, the MultiModem® iCellintelligent cellular modems and MultiConnect®

Open Communications Gateways-Device(OCG-D), which features an open Linuxdevelopment environment and a fully certifiedhardware offering.

Applications based on the JN5168 canachieve long operating lifetimes and operatefrom a small power source such as a singlecoin cell, or ambient energy, thanks to themicrocontroller’s best-in-class operatingcurrent of 15mA and power-saving modessuch as the 0.6µA timer-controlled sleep mode.

The NXP Semiconductors JN5168 is amember of the industry’s onlywireless-microcontroller family tofeature support for JenNet-IP, ZigBee®

Smart Energy, ZigBee Light Link,RF4CE and IEEE 802.15.4 networking stacks.

APPLICATIONS• Portable navigation devices• Point-of-sale terminals• Cameras• Smartphones

FEATURES• Optimised for 5V charging circuitry• 1.37mm maximum height• High-permeability shielding• 15-turns 26AWG copper coil• 10MΩ resistivity at 100V


APPLICATIONS• Picocell/enterprise-femtocell final-stage

power amplifiers

FEATURES• 27.2dBm linear output power @ -50dBc

Adjacent-Channel Leakage Ratio (ACLR)• 33.7dB gain• 15% power-amplifier efficiency• 20dB detector range




Smaller wireless-charging receiver coil delivershigh efficiency and shielding

The MGA-43428 delivers low-power performance for next-generationinfrastructure equipment

AVAGO TECHNOLOGIES

High-linearity 5V power amplifier enhances picocelland femtocell performance

Efficient charging of mobiles with the IWAS-3827EC-50 delivers true freedom from wires

VISHAY

The Vishay IWAS-3827EC-50 is areceiving coil for charging 5V portableelectronics, and offers efficiency ofgreater than 70% for receiverapplications up to 10W combined witha 33% size reduction compared to thestandard IWAS-4832FF-50 coil.

The Avago Technologies MGA-43428power amplifier delivers outstandingperformance in picocell andfemtocell applications bydelivering high output powerwith high linearity and highefficiency when operating froma 5V supply.

The MGA-43428 is designed forapplications in the 851MHz-894MHzfrequency band, and features fullymatched inputs and outputs. Itshighly linear output power at 5V isachieved through the use of AvagoTechnologies’ proprietary 0.25µmGaAs enhancement-mode pHEMTprocess. In addition, low operatingcurrent of up to 690mA in activemode and 345mA quiescent currentensures low overall powerconsumption and simplifies systempower design.

The device is housed in a 5.0mm x 5.0mmMoulded-Chip-on-Board (MCOB) modulepackage. This compact footprint, combinedwith the high gain, linearity and efficiency,makes the MGA-43428 an ideal choice as apower amplifier for basestations used in smallcells such as picocells and femtocells.

The IWAS-3827EC-50 has dimensions of38mm x 27mm, features a high-saturationpowdered-iron base, and is compliant with theWireless Power Consortium (WPC)specification which seeks to establish aninteroperable global standard for wirelesscharging.

For wireless-power basestations andreceivers, the IWAS-3827EC-50’s high-saturation powdered iron is not affected bypermanent locating magnets, and helps to

prevent charging flux fromaffecting sensitive componentsor batteries. As an alternativeto ferrite-based solutions,which can saturate in thepresence of a strong magneticfield, the IWAS-3827EC-50offers a magnetic saturation of50% at 4000 gauss.

The IWAS-3827EC-50receiving coil has inductanceof 10.7µH at 200kHz with a±5% inductance tolerance, DCResistance (DCR) of 183mΩ at25°C, and typical Q of 30 at200kHz. Lead length is 50mmand tinned length is 10mm.

Other integrated features include an on-chippower detector and automatic shutdowncapability, which help to simplify design andminimise demand for external components.



APPLICATIONS• Automated Meter-Reading (AMR) systems• Industrial monitoring and control• Home and building automation• Wireless alarm and security systems

FEATURES• Programmable bit rate up to 300kbit/s• 100dB blocking immunity• Fully integrated synthesiser with 61Hz

resolution• Sync-word recognition• Preamble detection




Semtech's patented LoRa modulation enables a high link budgetusing lower-cost components

SEMTECH

Transceivers leverage design innovations forlonger range and ultra-low power

NXP SEMICONDUCTORS

The Semtech SX1272 and SX1273 are860MHz-1050MHz ultra low-power,long-range transceivers that provide avery high link budget of up to 158dB bycombining a +14dBm high-efficiencypower amplifier with a receiverdisplaying extremely high sensitivity of-138.5dBm.

Semtech’s patented LoRa™ modulationtechnique allows the receiver to achieve its highsensitivity using a low-cost crystal and bill ofmaterials, allowing high-performance from acompetitively priced design. The modulationtechnique also provides significant advantagesin blocking and selectivity over conventionalFrequency-Shift Keying (FSK) modulation. Inaddition, the devices support high-performance GFSK modulation for WMBus,IEEE 802.15.4g, and legacy wirelessstandards. Minimum Shift Keying (MSK),GMSK and On-Off Keying (OOK) modulationare also supported.

Semtech’s technology also supports ultralow-power design by overcoming typical trade-offs between performance and operatingcurrent. The devices deliver exceptional phasenoise, selectivity, receiver linearity, and third-order intercept (IIP3) allowing equipment usingthis transceiver to draw significantly lowercurrent than others based on competingdevices. The SX1272 and SX1273 have verylow receive current of 10mA, and supportpower management by providing a 200nApower-save mode with register retention.

Both devices provide built-in features thatsimplify circuit design and minimise external


The portfolio includes devices rated foruse in Continuous-Wave (CW)amplifiers operating up to 140W,180W or 250W maximum power.The devices achieve best-in-classefficiency exceeding 50% in final-stage amplifiers, are able to drive thedynamically variable load impedancesfound in these challenging RF applications,and provide the assurance of field-provenruggedness. All are packaged in high-performance thermally enhanced ceramicpackages, and are available in eared or earlessversions.

The range comprises the BLF2425M7L140,BLF2425M6L180P and BLF2425M7L250P inthe eared package for bolt-down assembly, andthe BLF2425M7LS140, BLF2425M6LS180Pand BLF2425M7LS250P as earless variants.

components, including a Received Signal-Strength Indicator (RSSI) with dynamic rangeof over 115dB, automatic RF sensing withultra-fast Automatic Frequency Control (AFC)and a packet engine with up to 64bytescapacity and Cyclic Redundancy Check (CRC),as well as a temperature sensor and low-battery indicator.

Part Number FrequencyRange

OperatingVoltage

OutputPower Efficiency Power

GainTest

Signal Package

BLF2425M7L(S)140

2400MHz to2500MHz 28V

140W 52% 17.5dB

CW

SOT502

BLF2425M6L(S)180P 180W 55% 12dB SOT539

BLF2425M7L(S)250P 250W 55% 15dB SOT539

NXP Semiconductors BLF2425 seriesis the industry’s first dedicated RFpower transistor portfolio designed toreplace magnetrons as a solid-statepower source for high-power RFheating and lighting applications in the24GHz to 2.5GHz Industrial, Scientific,and Medical (ISM) frequency band.

NXP’s latest LDMOS technology enables theBLF2425 series to satisfy demands for greatersystem efficiency and improved dynamiccontrol in applications using RF power as anenergy source, delivering the energy in anoptimised and reliable manner.

LDMOS power transistors replace magnetronsin RF-energy applications

APPLICATIONS• Solid-state cookers• RF lighting• RF plasma generators• RF heaters• RF dryers

FEATURES• High stability• Broadband operation• Internal matching• Integrated ESD protection



APPLICATIONS• Wi-Fi (IEEE 802.11) and

WiMax (IEEE 802.16) infrastructure• VolP networks and cellular basestations• Broadband wireless-communication

equipment• Subscriber-based wireless devices• Satellite communication equipment

FEATURES• High-frequency capability• Ultra-stable dielectric material• Capacitance ranges:

• 0402: 1.0pF to 82pF• 0603: 1.0pF to 470pF• 0805: 1.0pF to 1.5nF


APPLICATIONS• Test and measurement equipment• Basestation and subsystem components• Smart-grid meters• Broadband equipment• Routers• Mobile radio handsets• Industrial wireless systems• Commercialised equipment for military or

aerospace uses

FEATURES• Up to 500 cycles mating durability• Bright-nickel cosmetic plating• Low contact resistance, per EIA-364• Voltage Standing Wave Ratio (VSWR) of

1.05 +0.007 x f (GHz) up to 18GHz (SR cable)

• 5000MΩ insulation resistance


R F & W I R E L E S S


High-Q MLCCs are optimisedfor RF applications

TE's KOAXXA product line provides competitively priced SMA connectors for usein a variety of wireless equipment

TE CONNECTIVITY

Innovative SMA connectors trimcost, maximise performance

VJ HIFREQ capacitors deliver high efficiency and stability in satellite and Internet-accessapplications

VISHAY

The Vishay VJ HIFREQ series ofMultilayer Ceramic Capacitor (MLCC)chips offers high self-resonance, Q factor greater than 2000, anddissipation factor better than 0.05%for operation in high-frequencycommercial RF applications.

The connectors deliver highperformance at lower cost through acombination of techniques such as theuse of TE’s proven competencies instamping and forming, and a modulardesign that allows for the use ofcommon components across producttypes. In addition, TE has applied itsproprietary selective-plating technologyto selectively plate precious and non-precious metals only where neededwithout sacrificing performance.Mating durability is 500 cycles.

By offering a low dissipation factor, the VJHIFREQ series delivers strong performance infilter and matching networks, as well asamplifiers and DC-blocking circuits. TheMLCCs reduce signal loss and energyconsumption in power-amplifier modules, VoIPnetworks, cellular basestations, GPS systems,and satellite, IEEE 802.11WiFi® and IEEE802.16 WiMAX® wireless-communicationequipment.

Allowing designers to meet the sizerequirements of their specificapplication, the VJ HIFREQseries is offered in 0402, 0603,and 0805 case sizes, with broadworking voltages from 25V DC to250V DC and wide capacitanceranges from 1pF to 1.5nF. Thedevices offer tight tolerances to±0.1pF, an excellent ageing rateof 0% per decade, and anoperating temperature range of -55°C to 125°C.

Manufactured using Vishay’sNoble-Metal Electrode (NME)technology with a wet-buildprocess, the capacitors areavailable with various RoHS-

The connectors are fully compatible with IEC169-15 interface standards, and are qualifiedaccording to EIA-364 test standards.

For more information and downloads,please go to www.KOAXXA.com and scrolldown to Knowledge Center.



The stamping-and-forming process used forthe centre contacts is faster and lessexpensive than traditional screw machining,allows optimal performance, and is well suitedto selective plating. The contacts can besoldered for best performance, or crimpedusing a hand applicator.

TE’s KOAXXA connectors are available inpopular configurations including a straightcable plug, right-angle cable plug, straightcable jack, bulkhead-mounting cable jack, andstraight and right-angle board-mount jacks.

KOAXXA™ SMA RF interconnects fromTE Connectivity™ (TE) meet growingmass-market demands for accessiblewireless solutions and services byproviding cost-effective connectors thatare inter-mateable with all standardSMA interface products and deliver high performance up to 18GHz.

P.I.E.S E C T I O N

compliant termination finishes. Availableoptions are: code X devices for nickel barrierwith 100% matte tin plate for reflow assembly;code E for silver palladium for conductiveepoxy assembly; and code N for non-magnetic terminations for applicationssensitive to magnetic interference. In addition,code L products are available featuring atin/lead termination finish.

Board of the Month

The RN-131 and RN-171 PICtail™/PICtail Plusdaughter boards are the first two productsdeveloped by Microchip, utilising modules byRoving Networks.

The new boards allow designers to add Wi-Fi®

Future Electronics’ Board Club: supporting innovative electronics designEurope’s electronics industry thrives on the application of innovation and creativity, and anessential innovator’s tool in design projects is the development board. The Board Club website is aFuture Electronics resource for users of development boards. Here, and only here, Board Clubmembers can gain access to exclusive free development boards and development board offers.If you would like to register for membership, please visit: www.my-boardclub.com/register.php

To apply for these free boards go to: www.my-boardclub.com/ftmTerms and conditions apply. Visit www.my-boardclub.com/about_us for details

D E V E L O P M E N T B O A R D S I N T H I S I S S U E

21

Development boards simplifyWi-Fi enablement


connectivity to the entire portfolio of PIC®

microcontrollers, without integrating a TCP/IPstack and whilst using standard developmenttools, which speeds time to market andreduces demands on engineering resources.

Microchip’s RN-171 and RN-131 are fully-certified modules that provide comprehensivenetworking capabilities and include a true IEEE802.11b/g radio, baseband processor, TCP/IPstack and a host of networking-applicationfeatures. No external processor drivers arerequired and the modules are compatible with4-, 8-, 16- and 32-bit PIC microcontrollers.The on-board-stack approach significantlyreduces integration time and developmenteffort in a small form factor. Furtheradvantages for developers include ultra-lowpower consumption, with current as low as4µA in sleep, 35mA in receive and 120mA intransmit mode.

my-boardclub.com classifiedsFairchild SemiconductorMotor control

Evaluation board featuring the FairchildSemiconductor FCM8531 motor-controlIC, plus AC/DC rectifier stage, DC/DCconverter, control interface, debugginginterface, and motor-drive circuits to helpspeed-up application development.

Board Reference:FEBFCM8531_B01H300A

Response Number: 04

Fairchild SemiconductorSolid-state Lighting

Evaluation board for basic PWM LED-lamp controller with intelligent AC-inputdetection for automatic PFC activation.

Board Reference:FEBFL7701_L30U003A

Response Number: 10

FreescaleWireless-MCU development

Freescale Towerdevelopment kit forKW01 and KW20wirelessmicrocontrollers.

Board References:TWR-KW21D256TWR-KW24D512

Response Number: 26

Multi-Tech SystemsM2M application development

Universal Socketdevelopment kitsupporting Multi-TechSocketModem®

embedded cellularM2M modems,including universalpower supply, antennas, cables andsoftware.

Board Reference: MTSMI-UDK

Response Number: 28

NXP SemiconductorsBroadband amplifiers for TV andsatellite

Wideband-amplifier, variable-gain amplifierand reverse-amplifier demo boards forNXP Semiconductors BGA3012/15/18extreme-broadband amplifiers for 5MHzto 2600MHz applications.

Board References:OM7858/BGA3012 wideband amplifierOM7859/BGA3015 wideband amplifierOM7860/BGA3018 wideband amplifierOM7861/BGA301x variable-gain amplifierOM7862/BGA3012 reverse amplifierOM7863/BGA3015 reverse amplifier

Response Number: 18

Rohm SemiconductorBluetooth® LE ApplicationDevelopment

Reference board with sample programmesfor ultra low-power Rohm ML7105Bluetooth v4.0 compliant system on chip.

Board Reference:ML7105_Eval Kit

Response Number: 23

FreescaleMotion-sensitive applications

Sensor ToolboxAccelerometerboard forFreescaleMMA845x 3-axis high-performance,high-functionalitylow-g accelerometers.

Board Reference:LFSTBEB845X

Response Number: 05

Freescalee-compass sensor fusion

Sensor interface board andFXOS8700CQ daughter card for sensorfusion combining advancedaccelerometer and magnetometerfunctionality.

Board Reference:LFSTBEB8700

Response Number: 14

APPLICATIONS• Wireless office equipment• Home-networking products• Portable internet devices

FEATURES• FCC/CE/IC certified 2.4 GHz

IEEE 802.11b/g transceiver• Configurable transmit power• PCB trace antenna (RN-171-PICtail)• On-board ceramic chip antenna

(RN-131-PICtail) • Plugs into Microchip’s Explorer 16 and

PIC18 Explorer development boards

The modules use a simple serial interface toconnect with any PIC microcontroller, andexpand Microchip’s wireless portfolio with theindustry’s lowest power consumption combinedwith an integrated TCP/IP stack in a certifiedWi-Fi solution.

New boards from Microchip enable Wi-Fi connectivity to be addedquickly to small, low-power applications

By Kevin PriceBusiness Development Manager – RF & WirelessFuture Electronics (EMEA)

T E C H N I C A L V I E W

It is rare for electronic designers to prefer older technologyover later generations, but factors such as geographicalreach, cost and complexity mean GSM or 3G modules are abetter choice for M2M applications than the latest 4Gproducts.

Cellular technology has developed rapidly to satisfy consumer-mobiledemands, mainly for increased connection speeds. One downside ofthis progress, however, has been a significant increase in the number offrequency bands used. For GSM equipment there are six mainfrequencies to support. 3G uses an additional four frequency bands,while the latest 4G/LTE networks operate on some 47 differentfrequencies. No single M2M module covers all of these frequencies.

Moreover, the diverse range of cellular technologies now in operationworldwide require designers to choose their cellular technology verycarefully if the product must be capable of operating anywhere in theworld; a track-and-trace device for asset management is a typicalexample. As Figure 1, shows:

• A US dual-band module will not work in Europe, Asia or Australia. • A European dual-band module will not work in the US, Canada or

Mexico.• A tri-band phone supports three GSM bands: 900/1800/1900MHz or

850/1800/1900MHz, the second better suited to North and SouthAmerica, and the first to the rest of the world.

• A quad-band world phone supports all four main GSM frequencygroups.

• A similar profusion of frequencies in 3G has led to the development of1900/2100MHz, 900/2100MHz and 850MHz modules aimed atdifferent regions.

The situation is even tougher for designers targeting 4G/LTE networktechnology. The large number and wide range of frequencies means thatno module manufacturer can provide a single globally applicableproduct. Within each country or region, each carrier chooses whichfrequency or frequencies their network equipment will use. Thiseffectively requires device manufacturers to choose their carrier(s) at theoutset of a design project to be sure the equipment will operate at thefrequencies that are supported by the carrier.

In addition, different transmission protocols are also used in differentregions. Currently, the systems that are in general use are: GSM, GPRS,EDGE, HSPA+, HSDPA, HSUPA, UMTS, TDMA, CDMA2000 and CDMA.

To provide for a given geographical coverage, the designer mustchoose a module that not only supports the various frequency orfrequencies used by the chosen carrier(s), but that also supports thevarious protocols used in the countries or regions in which the end-product must operate.

The next criteria to examine are equally critical: the type and amountof data to be transmitted. The question for the system designer is not,‘what can the technology offer?’ but rather, ‘what does the systemneed?’ While the price of cellular modules has reduced significantly sincethe turn of the century, module buyers will still pay a premium foradvanced functionality and a high data rate. It is therefore important,early in the design process, to consider ways to make the datarequirement as small as possible, and then to match the technologychoice to this data requirement.

Additional non-cellular functionsFor any given frequency band and protocol type, a basic cellular moduleis a simple modem or ‘bit-pipe’. Used in conjunction with a systemprocessor or microcontroller, all of the data manipulation is performedoutside the module. A basic module has a low price. But a moreexpensive module with additional functions can actually help thedesigner to achieve a lower system cost.

Using new technology is not al cellular communications…

READ THIS TO FIND OUT ABOUT• Cellular-network standards in use globally• Assessing connectivity, data rate and functionality demands of M2M

applications• Choosing cellular modules to meet M2M-application requirements

Fig. 1: Frequency bands used by GSM and 3G networks


GSM / GPRS 3G

850MHz 900MHz 1800MHz 1900MHz 850MHz 900MHz 1700MHz 1900MHz 2100MHz

North America

South America exc. Uruguay and Mexico

Uruguay and Mexico

Africa

Australia/New Zealand

Nordics

Europe

Asia

T E C H N I C A L V I E W


ways the right choice for M2M

Among the extra features commonly found are: • GPS (satellite positioning)• Flash memory • Processor functions, such as software and firmware for internal

calculation, storing and forwarding and for implementing user codingscripts

• Bluetooth®, Wi-Fi® and ZigBee® radios

Figure 2 presents a guide to the impact of adding functions or capabilitieson the cost of a module.

Implementing the chosen moduleSo far this article has described general principles affecting the choice ofcellular module. The next step is to integrate the module into the OEMsystem design. How this is done largely depends on the skills andknowledge available to the design team.

Modules are supplied either with a board-to-board connector andtypically a 50Ω matched antenna co-axial cable, or as a surface-mounted unit.

A module with a connector will be supplied with the relevantcertification for the region(s) it supports. Providing no changes are madeto the module or its interface, a construction file showing the details of theproduct’s assembly, and incorporating these documents, will be sufficientto qualify the product for self-certification. This approach is ideal for designteams with little knowledge of the certification process and its requirements,or those operating under tight time-to-production constraints.

The surface-mount versions typically feature either Ball-Grid Array(BGA) or castellation package technology. The OEM will normally needto implement antenna-matching and power-supply functions, and thismeans that the design will be required to pass RF-approval tests. Thesetests are not trivial, and should only be undertaken by those with thetime to study the requirements carefully beforehand, or with previousexperience of steering a product through them.

Options for worldwide deploymentFrom the above, it will be clear that the implementation of an end-product with M2M communications capability that can operateanywhere in the world is a difficult technical exercise. But the rightapproach depends very much on the system requirements.

For example, an OEM designing an asset-tracking device for Europeand Asia should choose a basic quad-band cellular modem operatingon GSM networks. OEMs with limited design resources could benefitfrom a fully certified module such as the Q26 series from Sierra Wireless.

This comes with connectors for both the processor interface andantenna: with the addition of a simple 8-bit microcontroller, the system isalmost complete.

For products facing extreme cost pressure, the surface-mountedWS6318 from Sierra Wireless may be suitable, provided coverage is notrequired in certain Nordic and Asian territories.

It is true that even cheaper modules are available. Future Electronics,however, recommends to choose a module from a reputablemanufacturer such as Sierra Wireless, and to avoid the potentialproblems with dubious warranties and intellectual property infringementsthat users can encounter when embedding ultra-cheap cellular modems.For truly global operation, a very low-cost module is unlikely to be suitable.

At the other extreme, LTE network standards are unlikely ever toconverge to a globally applicable set of specifications and frequencies.In any case, for the asset-tracking example discussed here, and formany other M2M applications, the high data rates available from LTEequipment are unnecessary.

A module featuring quad-band GSM and single-band 3G, on the otherhand, will operate across the vast majority of territories worldwide andappears to fit well with the requirements of an application such as assettracking. Two potential candidates are the Sierra Wireless Q26 series,which are fully certified devices with board-to-board connector, or the SLseries featuring additional on-board GPS capability and a clear migrationpath to LTE.

Conclusion: application over technologyThe most suitable choice for asset tracking is also likely to be the rightchoice for other applications, such as vehicle monitoring, smart meteringand medical devices.

Other end-products such as security video systems, handheld dataterminals and routers may demand a higher data rate than quad-bandGSM and single-band 3G can provide. In such cases, an HSPA 3Gmodule can be an effective choice for local and even regional operation.

The field of M2M communications still has vast untapped potential,which can best be accessed through careful use of established GSMand 3G technologies rather than the most advanced 4G/LTE technology.


Europe Asia America SMS Voice FTP Video DVT

COST

UART USB Processor Memory PCMCIA GPS Wi-Fi Bluetooth

COST

Fig. 2: Cost impact of enhancing the feature set in a cellular module (assuming Europe is the home region for the end-product).

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