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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
Future Technology
Devices International
Datasheet
ME810A-HV35R Display
Module
General Purpose Multi Media Controller
1 Introduction
The ME810A-HV35R is a development module for FTDI’s FT810, Embedded Video Engine (EVE)
graphics controller IC. This module behaves as an SPI slave, and requires a SPI Master for proper micro-controller interface and system integration.
The ME810A-HV35R module includes a 3.5 inch 320*480, portrait TFT LCD panel with resistive touch screen and buzzer for audio output. Users
can also connect to different LCD screens which meet the FT810 technical specification and fit with the ME810A-HV35R LCD interface connector.
1.1 Features
The ME810A-HV35R utilises the FTDI FT810 Embedded Video Engine. Graphic, audio and touch
features of the FT810 can be accessed with the ME810A-HV35R. For a full list of the FT810’s features, please see the FT81x datasheet. The ME810A-HV35R has the following features:
Ready to use LCD module.
Supports resistive touch with pressure sensing.
Supports portrait and landscape display mode.
Supports mono audio output.
On board LCD backlight LED driver.
On board buzzer with a transistor control.
+3.3V single power supply.
Supports configurable LCD with 4-line SPI.
Direct connect with MM900EV module series as a display module.
Bezel with four mounting holes for system assembly.
2
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
2 Ordering Information
Part No. Description
ME810A-HV35R-BK FT810 module, with FPC/FFC 50 LCD connector, 3.5 inch TFT LCD display panel preinstalled with resistive touch. Black bezel.
ME810A-HV35R-PL FT810 module, with FPC/FFC 50 LCD connector, 3.5 inch TFT LCD display panel preinstalled with resistive touch. Pearl bezel.
Table 2-1 – Ordering information
Note: This module is recommended as an accessory to the MM900EV series (due Nov 2015) for development purposes. For more information on the MM900EV series, refer to:
http://www.ftdichip.com/Products/ICs/FT90x.html.
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
Table of Contents
1 Introduction .................................................................... 1
1.1 Features .................................................................................... 1
2 Ordering Information ...................................................... 2
3 Board Interface Description ............................................ 4
3.1 Board Profile ............................................................................. 4
3.2 J1- SPI interface and control signals ........................................ 5
3.3 JP1- On board buzzer enable .................................................... 5
4 Application Example ........................................................ 6
4.1 Getting Start With an MM900EV Module .................................... 6
4.2 Hardware Setup ........................................................................ 6
4.3 Software Setup ......................................................................... 7
5 Mechanical Dimensions ................................................... 8
5.1 J1 Pin Header Dimensions ......................................................... 8
5.2 Bezel Mechanical Drawing......................................................... 9
5.3 Board Schematics ................................................................... 10
6 Specifications ................................................................ 11
6.1 Electrical Specification ............................................................ 11
6.2 Display Specification ............................................................... 11
6.3 Optical Specification ............................................................... 12
7 Contact Information ...................................................... 13
Appendix A - References ................................................................. 14
Appendix B - List of Figures and Tables ........................................... 15
Appendix C – Revision History ......................................................... 16
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
3 Board Interface Description
The ME810A-HV35R module is intended for direct use into existing applications that require a display.
This module is suitable for interfacing with an external microcontroller (e.g. MM900EV series) that has a
SPI Master channel.
3.1 Board Profile
Figure 3-1 – ME810A-HV35R board bottom view
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
3.2 J1- SPI interface and control signals
Pin No. Name Type Description
1 J1_SCK I SPI clock input
2 J1_CS0# I FT810 SPI chip select, active low
3 J1_MISO I/O SPI master input, slave output or QSPI IO1
4 J1_MOSI I/O SPI master output, slave input or QSPI IO0
5 J1_IO3 I/O FT810 GPIO1 or QSPI IO3
6 J1_IO2 I/O FT810 GPIO0 or QSPI IO2
7 J1_DCX I
LCD panel data / command selection pin
Low: Command
High: Parameter
8 J1_CS1# I LCD panel SPI chip select, active low
9 J1_3V3 P 3.3V power supply input
10 J1_5V P NC
11 GND P Ground
12 GND P Ground
13 J1_PD# I FT810 powers down input, active low.
Connect to 3.3V if not used.
14 J1_INT# O FT810 interrupts output, active low. On
board 10kΩ pull-up to 3.3V.
15 J1_AUDL O FT810 PWM audio output
16 J1_DISP I LCD display reset. Connect to GND if not
used.
Table 3-1 – J1 Pinout
3.3 JP1- On board buzzer enable
Jumper fitted by default. Remove the jumper to disable the buzzer.
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
4 Application Example
4.1 Getting Start With an MM900EV Module
As a quick start with the ME810A-HV35R development board, connecting to an MM900EV module development platform is recommended. Demo applications are provided for users to experiment and experience the FT810 in the ME810A system. The following paragraphs provide a short description for development procedures.
The MM900EV series of FT900 MCU evaluation platforms allows user to develop various applications with rich peripheral interfaces. The following MM900EV modules are compatible:
MM900EV1A: with a 32-bit high performance FT900 MCU, 10/100Mbps Ethernet, USB2.0 Host, USB2.0 Device, SD3.0, Audio Codec, SPI Master Quad Interface, and 40-pin external GPIOs.
MM900EV-Lite: Tiny board with a 32-bit high performance FT900 MCU, USB2.0 Device, SD3.0, SPI Master Quad Interface, and 40-pin external GPIOs.
Detailed information of MM900EV module can be found at:
http://www.ftdichip.com/Products/ICs/FT90x.html
4.2 Hardware Setup
Figure 4-1 shows the ME810A-HV35R module connected to an MM900EV-Lite module.
Figure 4-1 – ME810A-HV35R connects to MM900EV Module
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
The ME810A-HV35R J1 pin header connects to the MM900EV module J2 dual-enter socket (See Table
4-1 for pin mapping).
Connect a USB cable or Power Supply to the MM900EV module to power the system.
Pin number J1 Signal J2 Signal
1 J1_SCK SPIM_SCK
2 J1_CS0# SPIM_SS0
3 J1_MISO SPIM_MISO
4 J1_MOSI SPIM_MOSI
5 J1_IO3 SPIM_IO3
6 J1_IO2 SPIM_IO2
7 J1_DCX DCX
8 J1_CS1# CS1#
9 J1_3V3 VDD_3V3
10 NC VDD_5V
11 GND GND
12 GND GND
13 J1_PD# PWD#
14 J1_INT# INT#
15 J1_AUDL AUD_LIN
16 J1_DISP DISP Table 4-1 – ME810A-HV35R J1 and MM900EV module J2 connection
4.3 Software Setup
Download the FT90x toolchain and sample application for ME810A-HV35R from the FTDI website at http://www.ftdichip.com/Products/ICs/FT90x.html.
Install the FT90x toolchain on a Windows PC.
Download the sample application binary file to the MM900EV module.
The sample applications will demonstrate display, touch and audio functions of the ME810A-HV35R module. Refer to AN_381_ME810A_HV35R_Sample_Application for more details.
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
5 Mechanical Dimensions
5.1 J1 Pin Header Dimensions
J1 pin header is a 2x8 way, 2.54mm pitch vertical pin. The Figure 6-2 illustrates the first pin dimensions and pin header parameters (in millimeters).
Figure 5-1 – J1 Pin Header Dimensions
9
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
5.2 Bezel Mechanical Drawing
Figure 5-2 – Bezel dimensions
10
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
5.3 Board Schematics
Figure 5-3 – Board Schematic
VC
OR
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1V
2
GN
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R2
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3
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900
GP
IO]
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810
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IO]
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5
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7
GP
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GP
IO2
10
INT
_N
11
PD
_N
12
X1/CLK13
X214
GND15
VCC16
VOUT1V217
VCC18
XP19
YP20
XM21
YM22
GND23
BACKLIGHT24
DE
25
VS
YN
C26
HS
YN
C27
DIS
P28
DC
LK
29
B7
30
B6
31
B5
32
B4
33
B3
34
B2
35
GN
D36
G737
G638
G539
G440
G341
G242
R743
R644
R545
R446
R347
R248
EP49
U1
FT
810
11
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
6 Specifications
6.1 Electrical Specification
Parameter Description Minimum Typical Maximum Units Notes
VCC VCC operating supply voltage
3.0 3.3 3.6 V J1 pin 9
Icc VCC operating current 110 mA Backlight LED on
Voh Output Voltage High VCC-0.4 - - V
Vol Output Voltage Low - - 0.4 V
Vih Input High Voltage 2.0 - - V
Vil Input Low Voltage - - 0.8 V
T Operating temperature
-20 - +70
Table 6-1 - Operating Voltage and Current
6.2 Display Specification
Item Spec Units Notes
Display area(AA) 49.0(H) * 73.4(V) mm 3.5 inch diagonal
Driver Element TFT active matrix mA
Display Colors 262K -
Number of Pixels 320(RGB)*480 dots
Pixel pitch 0.051(H) * 0.051(V) mm
Viewing Angle 6:00 o’clock
Display mode Transmissive/ Normally White -
LCD Luminance 100 cd/m2
Touch screen resistive - Table 6-2 - LCD and Touch Information
12
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
6.3 Optical Specification
Table 6-3 - 3.5” TFT Optical specification
13
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
7 Contact Information
Head Office – Glasgow, UK Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]
Branch Office – Taipei, Taiwan 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 E-mail (Sales) [email protected] E-mail (Support) [email protected]
E-mail (General Enquiries) [email protected]
Branch Office – Tigard, Oregon, USA 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) [email protected] E-Mail (Support) [email protected] E-Mail (General Enquiries) [email protected]
Branch Office – Shanghai, China Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 China Tel: +86 (0)21 6235 1596 Fax: +86 (0)21 6235 1595 E-mail (Sales) [email protected] E-mail (Support) [email protected]
E-mail (General Enquiries) [email protected]
Web Site
http://ftdichip.com
Distributor and Sales Representatives
Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country.
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance
requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other
materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer
confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI
devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold
harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without
notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole
nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material
or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2
Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640
14
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
Appendix A - References
For module documentations, please refer to URL below:
FT81x datasheet: DS_FT81x
FT81x software programming guide: FT81x_Programmer_Guide
15
Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
Appendix B - List of Figures and Tables
List of Figures
Figure 3-1 – ME810A-HV35R board bottom view ............................................................................... 4
Figure 4-1 – ME810A-HV35R connects to MM900EV Module ............................................................... 6
Figure 5-1 – J1 Pin Header Dimensions ............................................................................................ 8
Figure 5-2 – Bezel dimensions ........................................................................................................ 9
Figure 6-1 – Board Schematic ...................................................................................................... 10
List of Tables
Table 2-1 – Ordering information .................................................................................................... 2
Table 3-1 – J1 Pinout .................................................................................................................... 5
Table 4-1 – ME810A-HV35R J1 and MM900EV module J2 connection ................................................... 7
Table 7-1 - Operating Voltage and Current ..................................................................................... 11
Table 7-2 - LCD and Touch Information ......................................................................................... 11
Table 7-3 - 3.5” TFT Optical specification ....................................................................................... 12
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Copyright © 2015 Future Technology Devices International Limited
ME810A-HV35R module Datasheet Version 1.0
Document Reference No.: FT_001232 Clearance No.: FTDI# 468
Appendix C – Revision History
Document Title: ME810A-HV35R module
Document Reference No.: FT_001232
Clearance No.: FTDI# 468
Product Page: http://www.ftdichip.com/eve.htm
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Revision Changes Date
1.0 Initial Release 2015-09-29