full range embedded board+ solutions€¦ · 06/12/2010 · (2016) (2016) (2017) (2018) (initial)...
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![Page 1: Full Range Embedded Board+ Solutions€¦ · 06/12/2010 · (2016) (2016) (2017) (2018) (Initial) PCM-3365 AIMB-586 PCM-9365 SOM-4466 ... Project Assistant Manager, Advantech](https://reader034.vdocuments.us/reader034/viewer/2022050501/5f93ab665741ab53484254e5/html5/thumbnails/1.jpg)
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Full Range Embedded Board+ Solutions
Super Fast Time to Market with
New CPU
Cabling for IO Expansion
Full Range CPU Module
Carrier Board Integrates FPGA,
AISC and IOs
Extended Temp 3.5” / 2.5” Computer
MIOe Module for Vertical IO
Expansion
ARM Solution in All Form Factor
COM, SBC & Box Computer
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(1992)
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(2008)
(2010)
(2012)
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(2015)
(2016)
(2016)
(2016)
(2017)
(2018)
(2019)
(Initial)
PCM-3365
AIMB-586
PCM-9365
SOM-4466
AIMB-276
SOM-5788
MIO-2361
SOM-3569
MIO-5373
SOM-5899R
AIMB-U117
ROM-3310
SOM-2569
ROM-7720
WISE-1570
SOM-5962
AIMB-U233
RSB-3430
S0M-8990
Advantech Embedded Platform Innovation
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Bridge New Technology to Accelerate IoT Era COM-HPC x Thermal x Vertical-Oriented Modularized Design
Irene Wu, Product Assistant Manager, Advantech
Nick Lin, Project Assistant Manager, Advantech
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In 2025,
130 ZB data will be processed on the edge
150 billions devices will connect to the edge
-- IDC
Accelerate Huge Data Processing in IoT Era
Embedded Boards Wireless IoT Gateways Embedded PCs Fanless Embedded Computers Vertical Focused Solutions
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MI/O Extension - Satisfy All Your x86 Needs
Latest Server-grade Motherboard: AIMB-586
High Speed Connectivity & Expansion
• 14 USB with 4 ports USB 3.1 gen2 (10Gbps), 4 PCIe3 expansions • 4 ports 1000Base-T, M.2 M-key & E-key
Excellent Computing & Graphics • Intel 8th/9th Gen CFL-S Platform, up to 8 processor cores • Independent displays, support 4K2K with HDR
Reliable & Flexible Design • Dual power Design, ATX power input or 12V DC in • Level 4 ESD Protection Design
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MI/O Extension - Satisfy All Your x86 Needs
Latest Server-grade COM Express: SOM-5962
Super Speed Expansion & Scalability
• 4 ports 10GBase-KR & 1 port 1000Base-T integrated • Flexible I/O: PCIe gen3(8Gbps), USB3 & SATA3
Extreme Computing Performance • Intel C3000 Processor Families • Up to 16 Computer Cores & 128GB memory
Wide Range Operation Design • 8 ~ 20V power input for system design and stability • -40 ~ 85 °C operating temperature
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Low Latency Time-Sensitive Communication
Scalability & Easy Deployment Full Spectrum for Diverse Applications
Remote Management Easy Accessibility & Operations
High Network Bandwidth Reduce Data Transmission Time
Data Processing Capability Manage Mass Data at Edge
Next Generation Computer-on-Module
Super Speed
I/O Interface
More Expansion Bus
& Higher Bandwidth
Extreme CPU Performance
& Memory Capacity
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Breakthrough Computing Performance • 20 core/110W server grade capability • Max. 1TB reliable ECC memory
Wider Bandwidth and Faster Transmission • Max. 100 Gb LAN • PCI Express Gen5 (32GT/s) • USB4.0, Thunderbolt (40Gbps)
More Super Speed I/O Expansion • Max. 65 Lanes PCIe • 8x 10GbE
Computer-on-Module Revolution: COM-HPC
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Medical Application Industrial automation Gaming Application Digital Signage
CPU & Graphics integrated, and super speed I/O expansion for diverse requirements COM-HPC Client
COM-HPC Server
Communication Test Equipment Defense Networking
Server grade performance and 10G LAN integrated, better for system scalability
COM-HPC: Two Types for Diverse Applications
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512GB Memory ECC/non-ECC
45 pairs lanes 4 x 10GbE Intel® Xeon® D (Skylake-D)
16Core 110W
Prototype @ Q2 2020
SOM-8990 First COM-HPC Server Module
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SMARC Modules: Full Range Performance Offering
NXP i.MX8M Intel E3900 Intel Core U
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Efficiency Quiet Thinness 3 DNA
What a Good Thermal Solution Looks Like?
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QFCS
Mechanism • Twin-Fins • Two-Stages Spring
Screws
Heat Flow • Heat Dissipation for Key
Chips • Low Heat Resistance
Conduct
•Hard Contact •Heat Pipe
Simulation Result
Improvement on 3 Ways
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Hard Contact •Chip Heat Dissipation •Contact Copper Directly
Heat Pipe •Speed up Heat Diffusion •Flexible Mechanism
Mix Fin •Stacked & Extrusion Fins • Increase Airflow Exchange
Venting Hole •Cool Down Memory •15% Wight Reduced
QFCS
Quadro Flow Cooling System, QFCS
27mm THICKNESS 45dB DECIBEL 3axis AIRFLOW 45w DISSIPATION
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Quadro Flow Cooling System, QFCS
Computer on Module SOM-5898
Single Board Computer MIO-5393
Embedded Motherboard AIMB-506
Dec, 2019
High Efficiency Achieve 10°C+ Cooler Down
Silence Operating 45db required by Library
Ultra Thin Max 27mm w/ Weight 250g
Compatible Design Support Embedded STD FF.
Diverse Platforms for Extreme Computing Performance
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Efficiency Quiet Thinness
Quadro Flow Cooling System
What a Good Thermal Solution Looks Like?
What a Good Thermal Solution Looks Like?
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60%
30%
10% Fully Customization Tailored-Made for niche application
Market Share
Required for Difference I/O Small Custom based on Standard Product
Ready to Use Standard Product
The Challenges of Rich Demand for IoT
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MIO-5393 MIO-5373 MIO-5391 RSB-3430 RSB-3710 RSB-3720
Dec, 2019 Dec, 2019
UIO40-Express MI/O-Extension
Build Solution for Your Vertical Application
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MIO SBC Vertical MIOe Module Off-the-Shelf Enclosure
Smart Packing MIOe-210 6 UARTs
Surveillance MIOe-3674
4 PoE
Medical Equipment MIOe-3680
4 CAN w/ 15KV
Automation MIOe-220
3 GbE
AI MIOe-260
GbE, M.2, mPCIe
• Compact Size
• Rugged B/B Connection
• High Bandwidth PCIe
• Off-the-Self MIOe Module
MI/O Extension - Satisfy All Your x86 Needs
MI/O Extension - Satisfy All Your x86 Needs
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MI/O Extension - Satisfy All Your x86 Needs
High Performance SBC in Edge - MIO-5393
Advanced Interfaces
• LVDS/eDP + HDMI + DP Displays with 4K Decode. • M.2 Wireless & NVME SSD modules with Intel RST.
High Computing Power • Intel 9th Xeon & Core-I Processor Families. • Up to 6 Computer Cores.
Wide Range Operating • Power Input DC +12C with 10% tolerance. • Operating Temperature -40 ~ 85 °C.
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Step 1 Step 2 Step 3 Step 4 Step 5
2.5” Core Board Vertical I/O Board Vertical Application System AIM-Linux & AIM/Android
Modularized Framework
Value-added Industrial App & SDK
Longevity BSP Maintenance
IoT Devices Operation Management
Build Systems for Your Vertical Applications with Speed
RSB-3710 Rockchip RK3399 Cortex-A72/53 Dual/Quad Cores
RSB-3430 NXP i.MX6 Cortex-A9 Dual Lite Cores
UIO-4030 RS-485 x 1, RS-232 x 1, GPI x 4, GPO x 4
UIO-4032 USB 2.0 x 2, RS-232 x 2, GbE x 1
UIO-4034 CAN x 1, RS-232 x 2
EPC-R3430 with RSB-3430 2.5" SBC EPC-R3710 with RSB-3710 2.5" SBC
UIO40-Express
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MI/O Extension - Satisfy All Your x86 Needs
Take Your Device Everywhere - RSB-3430
Small but Complete
• Standard Pico-ITX 2.5” SBC. • HDMI, LVDS, GbE, Wireless Connectivity. • UIO 40-Express Expansion
Powerful but Fan-less • NXP i.MX 6 Coretex-A9 Processor Family.
• Max Power Consumption 2W.
Reliable Foundation • Longevity BSP Maintenance. • Remote Maintenance thru DeviceON.
UIO40-Express
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Empowers Edge Intelligence Device Management
Data Management
Connectivity Service
Rule Engine
Data Security
DeviceOn.Dev
DeviceOn.App
OTA • Device Monitoring and Diagnostics • Device Control & Updating
• Data Acquisition and Storage • Secure Data Access
• Device Connectivity • Plug-n-Play Peripherals
• Software & Firmware Updates • Advantech BIOS Updates
• Distributed Rule Monitoring • Flexible Trigger and Action
• McAfee Threat Protection • Acronis Backup Recovery
OTA • Software, firmware & configuration updates • Advantech BIOS updates
FaceView • Facial recognition • People counting • Behavior detection
E2I • Protocol conversion • Edge intelligence • Real-time virtualization
ePaper Manager • EPD device auto-discover • Fast transmission • Device association
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Co-Creating the Future of the IoT World
Co-Creating the Future of the IoT World