(FSE: AIX, ISIN DE0005066203; NASDAQ: AIXG, ISIN: US0096061041)

Credit Suisse 10th Annual European

Technology Conference 14-15 May, London

Credit Suisse 10th Annual European

Technology Conference 14-15 May, London

Paul Hyland – President & Chief Executive OfficerPaul Hyland – President & Chief Executive Officer

Slide: 2

Forward-Looking StatementsForward-Looking Statements

This presentation may contain forward-looking statements about the business, financial condition, results of

operations and earnings outlook of AIXTRON within the meaning of the “safe harbor” provisions of the United

States Private Securities Litigation Reform Act of 1995. Words such as “may”, “will”, “expect”, “anticipate”,

“contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate”, and variations of these words and similar

expressions, identify these forward-looking statements. The forward-looking statements reflect our current views

and assumptions and are subject to risks and uncertainties. You should not place undue reliance on the forward-

looking statements. The following factors, and others which are discussed in AIXTRON’s public filings and

submissions with the U.S. Securities and Exchange Commission, are among those that may cause actual and

future results and trends to differ materially from our forward-looking statements: actual customer orders

received by AIXTRON; the extent to which chemical vapor deposition, or CVD, technology is demanded by the

market place; the timing of final acceptance of products by customers; the financial climate and accessibility of

financing; general conditions in the thin film equipment market and in the macro-economy; cancellations,

rescheduling or delays in product shipments; manufacturing capacity constraints; lengthy sales and qualification

cycles; difficulties in the production process; changes in semiconductor industry growth; increased competition;

exchange rate fluctuations; availability of government funding; variability and availability of interest rates; delays

in developing and commercializing new products; general economic conditions being less favorable than

expected; and other factors. The forward-looking statements contained in this presentation are made as of the

date hereof and AIXTRON does not assume any obligation to update or revise any forward-looking statements,

whether as a result of new information, future events or otherwise, unless required by law.

Slide: 3

• Shanghai, China• Seoul, S. Korea• Tokyo, Japan• Hsinchu, Taiwan

Epigress AB,Lund

AIXTRON – Enabling Global SolutionsAIXTRON – Enabling Global Solutions

AIXTRON AG, Aachen

AIXTRON AG, Herzogenrath

AIXTRON Inc., SunnyvaleAIXTRON Ltd., Cambridge

Slide: 4

Gas Phase DepositionGas Phase Deposition

Material Engineering on an Atomic Scale

Slide: 5

AIXTRON Planetary Reactor ®AIXTRON Planetary Reactor ®

Wafer

Injector

Reactor Chamber

Slide: 6

Value Chain PositioningValue Chain Positioning

ProductionEquipment

Manufacturers

ElectronicDevice

Manufacturers

End User

Markets

Chip &Component

Manufacturers

� ConsumerCommunication

� Industrial

� Display

� Lighting

� Medical

� Automotive

Slide: 7

• LEDs/OLEDs for displays• LEDs/OLEDs for lighting• Optoelectronics for telecom/datacom

• Organic Electronics for flexible displays and RFID

• CD-, DVD-lasers• High frequency for wireless• High power SiC• III-V Compound and Organic solar cells

• Carbon Nanotube Structures

• Metal and oxide films for CMOS transistors

• Traditional NAND-Flash Memory

• Traditional, next generation DRAM Memory

• TFH – Thin Film Heads for data storage hard disk drives

Applications

Silicon Semiconductors AVD®, ALD, CVD

Compound SemiconductorsMOCVD, OVPD®Technology

Gas Phase DepositionNano Scale Material Engineering

Business

One Technology – Multiple SolutionsOne Technology – Multiple Solutions

Slide: 8

Planetary Reactor®

Close Coupled Showerhead®

Compound

Tricent® AVD®

SiliconSystem TechnologiesSystem Technologies

Hot Wall SiC CVD

Compound

OVPD®

Compound

NanoinstrumentsBlack Magic

Compound

Tricent® ALD

Silicon

Lynx CVD

Silicon

Slide: 9

Compound Platform SystemsCompound Platform Systems

Close CoupledShowerhead ®

CRIUS®, 31x2“

� Rapid adoption by customer base

� Established industry standard

� Production volume increased in 2007

� c.79% of Q1/08 Equipment Orders (72% in 07)

� c.66% of Q1/08 Revenues (48% in 07)

Planetary Reactor ®

AIX 2800G4, 42x2”

Integrated Concept (IC) System

Slide: 10

13%6%

64%17%

Source: VLSI RESEARCH Inc. 2008

14%4%

20%62%

Global MOCVD Market SharesGlobal MOCVD Market Shares

Veeco

Others

Nippon Sanso

AIXTRON

2007Total: $289m

2005Total: $156m

2006Total: $202m

10%2%

70%

18%

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� Consumer Electronics continue to drive the NAND flash and DRAM industry

� Comprehensive AIXTRON-portfolio:CVD, ALD, AVD®

� Fab ramp-up with established CVD customers

� ALD/AVD®: film qualifications for new materials in transistors & capacitors

� Combined ALD/AVD® technology (JDP with Asian Semicon leader) Lynx CVD

Reactor1 x 300mmALD/AVD ® System

Silicon Semiconductor SystemsSilicon Semiconductor Systems

Tricent ® ALD Reactor

1 x 300mm

Slide: 12

Global CVD Market Shares for WSi xGlobal CVD Market Shares for WSi x

based on VLSI RESEARCH Inc. 2008

2006Total: $109m

3%15%

34%

48%

2%12%

24%

62%

Tokyo Electron

Applied Materials

Others

AIXTRON

2007Total: $84m

Elpida-PSC

Qimonda

Micron Samsung

ProMos

Hynix

Slide: 13

15%

5%

32%

44%

2%0%

58%

13%61%

3%

22%

9%

5%

LED

Consumer/Optoelectronic

Display & Others

Silicon

2006: €143.1m2005: €113.4m Q1,2008: €62.6m

Equipment Revenues by ApplicationEquipment Revenues by Application

Diversification of Equipment Revenue Base (excl. spar es):

78%

5%

15%

0%2%

2007: €186.9m

Telecom/DatacomTelecom/Datacom

Slide: 14

High Brightness LED Market ForecastHigh Brightness LED Market Forecast

0

1.000

2.000

3.000

4.000

5.000

6.000

7.000

8.000

9.000

10.000

2006 2007 2008 2009 2010 2011

Mar

ket S

ize

(US

D m

illio

n)

Signs / Displays Mobile Appliances

Signals Automotive

Illumination Electronic equip. / Other

15%

48%1%

15%

5%

16%

40%

23%1%

12%

10%

14%

HB LED summary forecast by application 2006-2011 2006

2011

Source: Strategies Unlimited 2007

Slide: 15

AIXTRON Global PresenceAIXTRON Global Presence

Lund, Sweden

Inc.Sunnyvale, USA Aachen, D

Headquarters

AG

Seoul, South

Korea

cshsTokyo, Japan

KK

AGShanghai, P.R. China

Taiwan Co., Ltd.

Representation

Cambridge, UKLtd. ABAB

Slide: 16

14,3 14,321,9

6,6

2005 2006 2007 <Q1/08

Revenues by RegionRevenues by Region

22,1 22,218,8

4,1

2005 2006 2007 <Q1/08

Europe

(13%)

(7%)

(16%)(9%)

USA

(10%)

(8%)(10%)

(10%)

(€ million)

103

135,2

174,1

51,9

2005 2006 2007 <Q1/08

(81%)

(79%)

(74%)

(83%)

AsiaAsia

Slide: 17

Compound Semiconductors

(including Organics)Silicon Semiconductors

� €77.3m (+161% yoy)

� 90% of equip.order intake

� €8.2m (-25% yoy)

� 10% of equip.order intake

Business Development Q1/2008Business Development Q1/2008

Main drivers

� €47.8m equipment1)

revenues (+10% yoy)

� 76% of total2) revenues

� Industry preparation for LED-Backlighting applications continue

� More multiple scheduled orders received

� Current market conditions constrain capital spending

� Next-generation AIXTRON systems ready for launch in 2008

� €8.3m equipment1)

revenues (-40% yoy)

� 13% of total2) revenues

Revenues

Equipment1)

Order Intake

1) Excluding spares/services; 2) including spares/services1) Excluding spares/services; 2) including spares/services

Slide: 18

Q1/2008 Key FinancialsYear-on-Year Comparison (Q1/2008 vs. Q1/2007)Q1/2008 Key FinancialsYear-on-Year Comparison (Q1/2008 vs. Q1/2007)

(€ million, unaudited) Q1/2008 Q1/2007

Equipment Order Intake 85,5 40,5 111%

Equipment Order Backlog (end of period) 157,3 70,0 125%

Revenues 62,6 63,8 -2%

Gross Profit 24,5 24,2 1%

Gross Margin 39% 38% +1 pp

EBIT 8,7 8,2 6%

EBIT Margin 14% 13% +1 pp

Net Result 5,9 7,6 -22%

EPS (€) 0,07 0,09 -22%

Cash & Cash Equivalents (end of period) 68,6 43,7 57%

Free Cash Flow 12,9 (6,1)

Variance

Slide: 19

Q1/2008 Key FinancialsSequential Quarterly Comparison (Q1/2008 vs. Q4/2007)Q1/2008 Key FinancialsSequential Quarterly Comparison (Q1/2008 vs. Q4/2007)

(€ million, unaudited) Q1/2008 Q4/2007 Variance

Equipment Order Intake 85,5 86,9 -2%

Equipment Order Backlog (end of period) 157,3 132,0 19%

Revenues 62,6 54,1 16%

Gross Profit 24,5 22,6 8%

Gross Margin 39% 42% -3 pp

EBIT 8,7 4,3 102%

EBIT Margin 14% 8% +6 pp

Net Result 6,0 2,4 150%

EPS (€) 0,07 0,03 133%

Cash & Cash Equivalents (end of period) 68,6 71,9 -5%Free Cash Flow 12,9 22,1

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Euro/US-Dollar Exchange Rate 2007Euro/US-Dollar Exchange Rate 2007

US-Dollar vs. EURO: -12%

US-Dollar vs. EURO: -12%

Average Rate 2007: USD 1.37 per EuroAverage Rate 2007: USD 1.37 per Euro

0.66

0.68

0.70

0.72

0.74

0.76

0.78

0.80

Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

EUR/USD

US-Dollar falls by 12%

Average Rate 2007: 0.73 EUR/USD or 1.37 USD/EURFin

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81,298,3 85,1

70,0 80,3102,8

132,0157,3

81,2 98,3 85,1 70,0 80,3 102,8 132,0 157,3

Equipment (only)

Order Intake

24 - Month Business Development24 - Month Business Development(€ million)

Total Revenues(incl. equipment, service, spare parts)

49,5 52,3 44,5 40,550,3

70,086,9 85,5

35,7 40,9

63,1 63,8

45,2 51,7 54,162,6

Q2/2006 Q3/2006 Q4/2006 Q1/2007 Q2/2007 Q3/2007 Q4/2007 Q1/2008

Equipment (only)

Order Backlog

Slide: 22

2008 Guidance Model(€ million)2008 Guidance Model(€ million)

2008 Guidance:

� €270 - 300m Revenues

� 10-12% EBIT Margin

21

136

6350-80

2008 equipment revenue fromorder backlog (out of €157m)

Q1/2008 actual total revenue

Assumed Q2-Q4 2008 spares/non-system revenue

Equipment orders required for 2008 revenue

Slide: 23

Target Market OpportunitiesTarget Market Opportunities

Short -Term

� LED backlighting for next generation LCD screens

� LEDs for increasing automotive applications

� Emerging LED external/street lighting applications

Mid-Term

� Emerging Solid State Lighting device applications

� Silicon carbide (SiC) hybrid automotive & solar applications

� CVD/ALD: NAND/DRAM memory – next generation applications

� Concentrator solar cells, III-V photovoltaics

� Development of plastic electronics/flexible TFT Backplanes

Long-Term

� OLED: Promising longer term development technology

� III-V – Silicon material convergence

� Development of applications using Carbon Nanotubes CNT

Slide: 24

For further information please contact:

Investor Relations & Corporate CommunicationsGuido PickertAIXTRON AG � Kackertstr. 15 – 17 � 52072 Aachen, GermanyPhone: +49 241 8909-444 � Fax: +49 241 8909-445 � Email: invest@aixtron.com

� August 7, 2008 Q2/2008 Results conference in Frankfurt

� November 6, 2008 Q3/2008 Results, conference call

� March 12, 2009 Q4/2008 Results conference in Frankfurt

� May 7, 2009 Q1/2009 Results, conference call

� May 20, 2009 Annual General Meeting at Eurogress in Aachen

2008 Financial Calendar & Contact Data2008 Financial Calendar & Contact Data

Slide: 25

File:

Slide: 26

AIXTRON Share Price Development 2007AIXTRON Share Price Development 2007

3.00

4.00

5.00

6.00

7.00

8.00

9.00

10.00

Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

AIXTRON

TecDax indexed

2007: + 185%

Sha

re P

rice

and

Out

look

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and

Out

look

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(€ million)* Q1/2008 Q1/2007

Revenues 62,6 63,8 -2%

Cost of sales 38,1 39,7 -4%

Gross profit 24,5 24,1 2%

Gross Margin 39% 38% +1pp

Selling Expenses 8,0 6,9 16%

General Admin. Expenses 4,5 4,3 5%

R&D 6,8 7,1 4%

Other operating income (expense) 3,5 2,4 46%

EBIT 8,7 8,2 6%

EBIT Margin 14% 13% +1pp

Result before tax 9,4 8,5 11%

Pre-Tax Margin 15% 13% +2pp

Net result 6,0 7,8 -23%

Net Return on Sales 10% 12% -2pp

Variance

Q1/2008 Group Income Statement (IFRS)Year-on-Year Comparison (Q1/2008 vs. Q1/2007)Q1/2008 Group Income Statement (IFRS)Year-on-Year Comparison (Q1/2008 vs. Q1/2007)

* Quarterly numbers are unaudited

Slide: 28

Q1/2008 Group Balance Sheet (IFRS)Balance Sheet Development (Q1/2008 vs. Q4/2007)Q1/2008 Group Balance Sheet (IFRS)Balance Sheet Development (Q1/2008 vs. Q4/2007)

* Quarterly numbers are unaudited

(€ million)* Mar.31, 2008 Dec.31, 2007

Property, plant & equipment 36,5 35,1Goodwill 55,0 59,0Other intangible assets 11,3 12,5Others 8,7 10,9

Non-current assets 111,5 117,5Inventories 67,8 60,0Trade receivables 32,5 33,5Others 32,8 13,9Cash & Cash Equivalents 68,6 71,9

Current Assets 201,7 179,3Shareholders' equity 199,5 198,4Non-current liabilities 2,3 2,4

Trade payables 25,5 23,8Advanced payments from customers 61,4 50,0Others 24,6 22,2

Current liabilities 111,5 96,0Balance Sheet total 313,3 296,8

Slide: 29

New Technologies – New OpportunitiesNew Technologies – New Opportunities

Depositionwith

AIXTRON Gen 3.5

tool

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Development of New Tool for Plastic Logic – Plastic Elect ronics

Slide: 30

Unique Properties

� Very high thermal conductivity

� Very low resistivity

� Very high mechanical stability

Application Examples

� Electronics

� Heat Sinks

� Field Emission Display

Roll-up

Carbon Nanotubestructure

Acquisition of Nanoinstruments, Ltd. – Carbon Nanotubes

New Technologies – New OpportunitiesNew Technologies – New Opportunities

Graphene sheet

Slide: 31

Aspect ratio

Laye

r th

ickn

ess

[Å

]

1 10 100

1

10

100

1000 CVDWord Line DRAM

Metal Control Gate NAND

ALDMetal Electrode and

High-k Dielectric DRAM

AVDMetal Electrode and

High-k Dielectric eDRAM

Atomic Level Solutions

Advanced Technology RequirementsAdvanced Technology Requirements

Slide: 32

FeRAM CapacitorsAVD®

Stack DRAM CapacitorsALD (Dielectric)

ALD + AVD® (Electrode)

Flash Floating GateInterpoly & Tunnel Oxide

ALD + AVD®

Metal GateAVD®

Trench DRAMALD (Dielectric)

ALD + AVD® (Electrode)

Integrated Capacitors

AVD®

Metal / Metal Silicide on Poly GateCVD

eDRAMCapacitors

AVD®

High-k GateDielectrics

AVD®

Films for Logic and Memory TransistorsFilms for Logic and Memory Transistors

Sidewall SpacersALD + AVD®

Shallow Trench IsolationALD

Slide: 33

Slide: 34

Table of ContentsTable of Contents

�Financial Performance 2007

Sha

reho

lder

Mee

ting

2008

Sha

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lder

Mee

ting

2008

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Key Group Financials 2007Key Group Financials 2007

(€ million) 2007 2006

Equipment Order Intake 247.7 178.0 39%

Equipment Order Backlog (end of period) 139.8 85.1 64%

Revenues 214.8 171.7 25%

Gross Profit 85.0 63.4 34%

Gross Margin 40% 37% +3pp

EBIT 20.6 5.7 261%

EBIT Margin 10% 3% +7pp

Net Result 17.3 5.9 193%

EPS (€) 0.20 0.07 186%

Cash & Cash Equivalents (end of period) 71.9 46.8 54%

Free Cash Flow 22.3 15.6 43%

Variance

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Group Income Statement 2007 (IFRS)Group Income Statement 2007 (IFRS)

(€ million) 2007 2006 Variance

Revenues 214,8 171,7 25%Cost of sales 129,8 108,3 20%Gross profit 85,0 63,4 34%Gross Margin 40% 37% +3ppSelling Expenses 27,2 23,4 16%General & Admin. expenses 16,0 17,3 -8%R&D 26,5 23,9 11%Other operating income (expense) 5,3 6,8 -22%EBIT 20,6 5,6 268%EBIT Margin 10% 3% +7ppResult before tax 22,4 6,6 239%Pre-Tax Margin 10% 4% +6ppNet result 17,3 5,9 193%Net Return on Sales 8% 3% +5pp

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Group Cash Flow Statement (IFRS)Group Cash Flow Statement (IFRS)

(€ million) 2007 2006

Cash Flow from operating activities 32,9 20,8of which: net income (loss) after taxes 17,3 5,9

Cash Flow from investing activities (10,5) (5,1)Cash Flow from financing activities 2,9 (0,3)

[incl. exchange rate changes]Net change in Cash & Cash Equivalents 25,2 15,3Cash & Cash Equivalents at the end of period 71,9 46,8

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Group Balance Sheet 2007 (IFRS)Group Balance Sheet 2007 (IFRS)

(€ million) Dec 31, 2007 Dec 31, 2006

Property, plant & equipment 35.1 36.4Goodwill 59.0 65.1Other intangible assets 12.5 15.1Others 10.9 11.4

Non-current assets 117.5 128.0Inventories 60.0 53.1Trade receivables 33.5 27.7Others 13.9 7.9Cash & Cash Equivalents 71.9 46.8

Current Assets 179.3 135.5Shareholders' equity 198.4 183.9Non-current liabilities 2.4 3.1

Trade payables 23.8 29.9Advanced payments from customers 50.0 31.4Others 22.2 15.2

Current liabilities 96.0 76.5Balance Sheet total 296.8 263.5

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AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production

AIXTRON AG, Aachen-Herzogenrath/Germany

Slide: 41

AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production

AIXTRON AG, Aachen-Herzogenrath/Germany

Slide: 42

AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production

AIXTRON Ltd., Cambridge/UK

Slide: 43

AIXTRON Inc., Sunnyvale/USA

AIXTRON Group Worldwide ProductionAIXTRON Group Worldwide Production

Slide: 44