fsa8049 — audio jack detection and configuration, mic/gnd ... · fsa8049 — audio jack detection...
TRANSCRIPT
April 2012
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.1
FS
A80
49 — A
ud
io Jack D
etection
and
Co
nfig
uratio
n, M
IC/G
ND
Cro
ss po
int S
witch
FSA8049 Audio Jack Detection and Configuration, MIC / GND Cross Point Switch
Features
Detection Audio Plug GND & MIC Polarity
VDD 2.5 to 4.4V
THD (MIC) 0.002% Typical
ESD (IEC 61000-4-2) (Air Gap)
15kV
Operating Temperature -40°C to 85°C
Package 9-Ball WLCSP 3x3 Array, 0.4mm
Terminal Pitch, 250µm Ball
Top Mark M3
Ordering Information FSA8049UCX
Applications
Cellular Phones, Smart Phones
MP3 and Portable Multimedia Player
Description
The FSA8049 is an audio jack detection switch for 3- or 4-pole accessories. The FSA8049 detects the locations of ground (GND) and microphone (MIC) poles on the audio plug and automatically routes them to the appropriate connections. This allows the end user to plug accessories, such as headsets with different audio pole configurations, into the mobile device and have them operate correctly.
Detects 3- or 4-pole audio accessories
Detects polarity of GND and MIC on 4-pole plugs
Automatically routes GND and MIC to audio jack terminals
Related Resources
For evaluation boards and questions, please contact: [email protected].
Typical Application
Figure 1. Mobile Phone Example
Oscillator & Logic
100mΩ
MIC
GNDA
GND/MIC2
GND/MIC1
VDD
DetectionEN
Switch Enable Timing
CEXT
Audio Jack
LSPKR
RSPKR
3Pole
4Pole
To Audio Plug Detection Circuit
AudioSub System
MIC Bias
MIC
BasebandProcessor
GPIO
RMIC
CMIC 5Ω
tOn/Off
Capacitor
GND
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.1 7
FS
A8049 —
Au
dio
Jack Detectio
n an
d C
on
figu
ration
, MIC
/GN
D C
ross p
oin
t Sw
itch
Physical Dimensions
Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4mm Pitch, 250µm Ball
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
Ordering Information
Part Number
Operating Temperature
Range
Top Mark
Package D E X Y
FSA8049UCX -40 to +85°C M3 9-Ball, Wafer-Level Chip-Scale Package
(WLCSP), 3x3 Array, 0.4mm Pitch, 250µm Ball 1.16mm 1.16mm 0.18mm 0.18mm
0.03 C
2XB
A
0.03 C
2X
0.208±0.021
0.378±0.018
D
C
0.06 C
0.05 C
PIN A1INDEX AREA
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC009ABrev2
F
F
E
E
D
A1 Ø0.20Cu Pad
Ø0.30Solder Mask
0.40
0.40
SIDE VIEWS
Ø0.260±0.0209X0.40
0.40
(X)±0.018
(Y)±0.018
A
B
C
1 2 3
BOTTOM VIEW
TOP VIEW
0.6250.547
SEATING PLANE
LAND PATTERN RECOMMENDATION(NSMD PAD TYPE)
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.1 8
FS
A8049 —
Au
dio
Jack Detectio
n an
d C
on
figu
ration
, MIC
/GN
D C
ross p
oin
t Sw
itch
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.1 9
FS
A8049 —
Au
dio
Jack Detectio
n an
d C
on
figu
ration
, MIC
/GN
D C
ross p
oin
t Sw
itch
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.1 10
FS
A8049 —
Au
dio
Jack Detectio
n an
d C
on
figu
ration
, MIC
/GN
D C
ross p
oin
t Sw
itch