Yamamoto OverviewFebruary 2019

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What makes Yamamoto unique?

Japanese & China Manufacturing-Japanese OversightISP 9001, 14001 and TS-16949 approved

Worldwide support officesHigh Mix/Low-Med-High Volumes + Advanced Technologies

Low MOQStable Japanese Engineering

High Reliability & QualityFamily-Owned Sole Proprietorship since 1945

Large Form Factor to Small Form Factor support

World-Class Japanese Technology/Quality since 1945

Yamamoto welcomes Cisco to our SBRYamamoto began producing watch cases & dials and we still support this market to this day.

PCB Manufacturing since 1968.

Yamamoto WW PCB Organization SitesSales, Logistics, Technical Support: San Jose, CA, England, Japan [domestic only]PCB Manufacturing Locations [Japan & China]

San Jose, CA

England

Dongguan, China

Honjo &Tokorozawa.

Japan

Non-Domestic Japan Support• A. Mihara, President• C. Olin, Vice-President• S. Wakabayashi, Sr. Engineer, Project

Development• T. Okudera, Overseas Sales Mgr• K. Hirota, Sr. DFM Engineer• M. Ferem, North American Sales Support• D. Mansfield, Europe/Israel/Australia

Support

Responsibilities•DFM, Pre-Engineering•Sales Support – Logistics•Engineering - Quality•QTA Programs

Yamamoto USA, San Jose, CA

Honjo, Japan J. Uchida, Director350K sq ft.Advanced Technology02 – 52 layers

Tokorozawa, JapanT. Takei, Director350K sq ft.High Technology02 – 40 layers

Dongguan, ChinaT. Watanabe, CEO450K sq ft.Affordable 450K sq ft/mo.

Irumugawa, JapanS. Hirano, Director

350K sq ft.NiAu Electroplate, ENIG

IMAG

Yamamoto Metal, JapanT. Uchida, Director

300K sq ft.Drilling, Backdrill

Re-sharp

Yamamoto PCB GroupT. Murata, Executive Director

Y. Otobe, Worldwide Sales Director

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Yamamoto Japan – Honjo FacilityAdvanced Technology , Engineering, and Reliability

2 – 60 Layers [average 26L]Fine Line/SpaceSequential Lamination, Buried Via, Blind ViaLarge Panels, Thick PanelsSI Technologies – Hybrid Stackups, Backdrill, Advanced MaterialsHigh Aspect Ratio Plating; uDrillsPCB Design support out of the Tokorozawa Facility

50 min from Tokyo on Bullet Train

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Yamamoto Honjo ~ Technology Roadmap2018 2019

Standard PTH Design Production Advanced Production Advanced

Max Working Panel Size 660 x 1100 660 x 1100 660 x 1100 660 x 1100

Usable Area of Panel 620 x 1040 620 x 1040 620 x 1040 620 x 1040

Overall Board Thickness 8.13 8.4 8.4 8.9

Min. Core Thickness 0.050 0.025 0.050 0.025

Max. Layer Count 52 70 60 70+

Min. Core Thickness (sig-sig) 0.06 0.06 0.06 0.05

Min. Drill Size (Through Hole) 0.12 0.10 0.10 0.10

Min. Drill Size (Blind/Buried) 0.12 0.10 0.10 0.075

Backdrill (diameter) TH diameter + 0.15 TH diameter + 0.10 TH diameter + 0.10 TH diameter + 0.10

Backdrill (dielectric depth required) ±0.15 ±0.12 ±0.12 ±0.11

Aspect Ratio (Drill Size) 24:1 30:1 30:1 31:1

Trace Width/Space (IL) 0.050/0.070 0.040/0.060 0.050/0.060 0.040/0.050

Trace Width/Space (OL) 0.090/0.100 0.050/0.080 0.050/0.080 0.050/0.075

Min. Via Pad Size drill + 0.15 drill + 0.09 drill + 0.125 drill + 0.09

Min. Anti Pad Size drill + 0.33 drill + 0.15 drill + 0.33 drill + 0.12

Padless Yes Yes Yes Yes

Drill to Metal [D2M] 0.165 0.075 0.16 0.07

Registration 0.05 0.028 0.05 0.02

Impedance Control (SE) +/- 7% +/- 5% +/- 7% +/- 5%

Impedance Control (DI) +/- 7% +/- 5% +/- 7% +/- 5%

PTH fill, Pad on Via t4.0 - 0.20 drill t5.3 - 0.20 drill t4.0 - 0.20 drill t5.8 - 0.20 drill

Sequential Lamination 22L + 22L above prod level 24L + 24L above prod level

Buried/Blind Vias Mechanical & Laser Mechanical & Laser Mechanical & Laser Mechanical & Laser

Laser Via Design Production Proto Production Proto

HDI Type I, II, III Type I, II, III Type I, II, III Type I, II, III

Min. Laser Diameter 0.13 0.10 0.13 0.10

Max. Laser Diameter 0.35 0.35 0.35 0.35

Max. Laser Depth 0.15 0.26 0.2 0.26

Min. Laser Depth 0.04 0.03 0.04 0.03

Laser Via Aspect Ratio (depth:dia) 0.70:1 0.75：1 0.75:1 0.75：1

Laser Pad Size (IL) drill + 0.15 drill + 0.12 drill + 0.15 drill + 0.12

Laser Pad Size (OL) drill + 0.15 drill + 0.12 drill + 0.15 drill + 0.12

Max. Working Panel Size 610x510 610x660 610x510 610x660

Yamamoto Honjo Materials 2019

Yamamoto Honjo Materials 2019 (cont’d)

Advanced Technology Semiconductor Test [0.65 - 0.35 mm BGA]

Basic Common Attributes – Registration is critical1. Layer to Layer < 30 um [pass]2. Drill Deflection < 35 um [pass]3. Drill size 0.15 mm [6 mils]; & 0.1 mm [4 mils]4. AR = 25:15. 0.35 mm BGA Pitch in DOE now

Automatic Test Equipment – Semiconductor, Auto Market

Advanced Technology Semiconductor Test[< 0.65 mm BGA]

Basic Common Attributes – Registration is critical1. Layer to Layer < 30 um [pass]2. Drill Deflection < 35 um [pass]3. Drill size 0.15 mm [6 mils]4. AR = 25:15. 0.35 mm BGA Pitch in DOE now

HEROBU - Yamo 12.18.13

Type I Linecard/1.0 mm BGA ~ LinecardHigh Speed Router/Data Center Applications

uVia L1-L2 Skip Via L1-L3

uVia L29-L30 Skip Via L28-L30

VIPPO w/ Filled BDVIPPO

Basic Common Attributes1. 28 – 30 Layer typical; ~ .150 mil thick; M6, TU-872SLK2. 10 mil drill: 8 FHS, 20 ILP, 23.5 OLP, 28 AP, 15:1 AR3. uVia [4 mil drill; OL 20]; Skip Via [10 mil drill; OL 20, Capture 20]4. VIPPO, Backdrill both sides, BD Via Fill after BD5. Via qty ~ 55K [4-wire Kelvin testing for all vias]6. Backdrill qty ~ 9K7. Edge Plating8. 5 – 10 degree material rotations

Filled Via Post-BD

φ0.2 mm drill/VIPPO

Basic Common Attributes1. 28 – 30 Layer typical; ~ .128 mil thick; M6, TU-872SLK2. 16.5 x 21.5 in.3. 8 mil drill: 6 FHS, 16 ILP, 18 OLP, 26 AP, 18.75:1 AR4. VIPPO, Backdrill both sides, BD Via Fill after BD5. Via qty ~ 55K [4-wire Kelvin testing for all vias]6. Backdrill qty ~ 9K7. Edge Plating8. 5-10 degree material rotations

Type II Linecard/0.8 mm BGA [Linecard]High Speed Router/Data Center Applications

.008” Drill required

due to packaging

density and improved

SI performance

Design Rule [mm] [in]

Material Megtron 6

Board Size 443 x 752 17.45 x 29.63

10 Degree Rotation Yes

Layer 48

Thickness 7.62 0.300

Via Drill Size 0.45 0.018

FHS 0.356 0.014

Aspect Ratio 16.9

NPTH Air-Via 0.45 0.0158

NPTH Air-Via Qty 33874

Backdrill Depths 20

Backdrill Qty 15115

Z-Axis Control [+/-] 0.06 0.0025

Minimum D2M 0.34 0.013

Max Cu - Drill Shift 0.137Spec: 0.0054 [actual

< .003 ]

Signal Cu to NPTH 0.17 0.007

PTH to NPTH 0.25 0.010

SE Impedance 55Ω +/-10%

Diff Impedance 110Ω +/-10%

Advanced Technology BackpanelsHigh Speed Applications, High Aspect Ratio Plating, Advanced registration, Precision Z-Axis Control Backdrill

uDrill Sizes: .004 + .006 mils [resharpened at Yamamoto]

Yamamoto DongGuan Electronics Technology Co., LtdChina Lower Cost Model with Japan Oversight

450K sq’ft ~ New Facility opened in 2007• Located in Dongguan in between Guangzhou and Shenzen

Airports• 3 hrs North of Hong Kong• Std. Shipping every Tuesday & Friday• Current Capacity = 30K M2/month; ~100K working panels

High Mix-Low Volume OKFactory Automation - controllersMedicalAutomotive – LED Lighting

Yamamoto Dongguan Electronics ~ Technology Roadmap

Yamamoto Dongguan Materials 2019DongGuan Yamamoto Laminates

Category Manufacturer Material Name TypeDk Df Tg Td

UL1 Mhz 1 Ghz 2 Ghz 10 Ghz 1 Mhz 1 Ghz 2 Ghz 10 Ghz TMA DSC TGA

FR-4.0 &FR-4.1

FR-4.0FR-4.1

ShengYi

S1141 FR-4.0 UV Blocking(common) 4.55 4.21 4.17 4.09 0.014 0.017 0.017 0.019 130 140 310 Y

S1000H FR-4.0 Low CTE＆mid-Tg 4.9 - - - 0.011 - - - - 155 335 Y

S1150G FR-4.1 Halogen Free&mid-Tg 4.8 4.5 - - 0.009 0.011 - - - 155 355 Y

NanYa

FR-4-86(UV) FR-4.0 UV Blocking(common) 4.5-4.7 4.0-4.2 - - 0.015-0.020 0.012-0.014 - - - 135 310 Y

NP-140TL FR-4.0 UV Blocking(common) 4.2-4.4 3.8-4.0 - - 0.015-0.020 0.012-0.014 - - - 140 310 Y

Panasonic

R-1766 FR-4.0 UV Blocking(common) 4.6 4.3 4.3 - 0.016 0.016 0.016 - 140 140 300 Y

R-1755EFR-4.0 (Low CTE&Excellent heat resistance&Excellent CAF)

5.0 4.6 4.6 4.5 0.014 0.014 0.015 0.019 133 133 370 Y

R-1566W FR-4.1 Halogen Free&mid-Tg 5.2 4.6 4.6 4.6 0.010 0.010 0.012 0.018 145 148 350 Y

Hitachi

MCL-E-67 FR-4.0 UV Blocking(common) 4.7-4.8 4.2-4.3 4.0-4.2 - 0.013-0.017 0.018-0.020 0.019-0.021 - 120-130 125-135 300-320 Y

MCL-BE-67G FR-4.1 Halogen Free&mid-Tg 4.8-5.0 4.3-4.5 4.3-4.5 - 0.006-0.007 0.009-0.010 0.010-0.012 - 140-150 - 340-350 Y

ITEQ

IT-140TC FR-4.0 UV Blocking(common) 4.68 4.33 4.26 4.16 0.015 0.017 0.018 0.02 125 135 320 Y

IT-158TC FR-4.0 UV Blocking(common) 4.72 4.37 4.25 4.08 0.015 0.016 0.017 0.019 140 150 340 Y

FR-4.0 (High Tg）

FR-4.0

ShengYi S1000-2MFR-4.0 Low CTE,Excellent thermal resistance ＆Hi-Tg

4.8 - - - 0.013 - - - - 180 345 Y

Panasonic R1755VFR-4.0 Low CTE,Excellent thermal resistance ＆Hi-Tg

4.7 4.4 - - 0.015 0.016 - - 165 173 N/A Y

Hitachi MCL-E679FFR-4.0 Low CTE,Excellent thermal resistance ＆Hi-Tg

4.8-5.0 4.5-4.7 4.5-4.7 - 0.008-0.010 0.013-0.015 0.014-0.016 - 160-170 - 340-360 Y

ISOLA(No UL Approval)

370HRFR-4.0 Low CTE,Excellent thermal resistance ＆Hi-Tg

4.24 4.17 4.04 3.92 0.015 0.0161 0.021 0.025 - 180 340 N

FR-408HRFR-4.0 HSD ( Low CTE,Excellent thermal resistance ＆Hi-Tg)

3.72 3.69 3.68 3.65 0.0072 0.0091 0.0092 0.0095 - 190 360 N

CEM-3

CEM-3

ShengYi S2131 Conventional,UV Blocking 4.5 - - - 0.016 - - - - 130 300 Y

Matsushita R1786 High CTI-600 4.5 4.5 - - 0.015 - - - - - N/A Y

Sumitomo ELC-4972R＆S High CTI-600 4.5 - - - 0.02 - - - - 120 N/A Y

Thank you!