TaiSemi14-01E

A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering

WF6317

Features

Specifications

● Low viscosity and high tacking power stabilize ball holding 　 force and ensures excellent solder wettability● Easy to wash out water-soluble �ux which can be used for 　 Pb-free re�ow soldering at 250˚C● Prevents and inhibits contamination of re�ow ovens with 　 low-volatile �ux

● Mounts solder balls with good squeezing property and ball holding force

● No �ux residue after washing with 　 warm water at 40˚C

● Low-volatile �ux inhibits contamination of re�ow ovens

Solder ball

Flux printing Flux transfer Ball mounting Ball fusion and bondingFlux

Suction head

Suction head

Suction headSuction head

Package

Suction head

Package

Suction head

● Washing with water within 8 hours after mounting can remove �ux residue

Washed after 0h Washed after 4h Washed after 8h Washed after 12h

Residue

Washingwith water

No flux residue

● Excellent wettability even on Cu-OSP PBC

WF-6317 Conventional flux

Res

idue

(%)

100

50

0250Reflow temperature (˚C)

Low-volatile fluxWF-6317

Low-residue flux

Residue-free flux

Flux residue reinforces solder joints

TaiSemi14-02E

Joint Protect Flux JPK8

Features

Specifications

● Flux residue improves joint strength by approx. 50%● Even without cleaning, volatile components do not suppress a good under�ll injection property● Flux residue prevents cracks during long-term temperature cycle tests

● Process example

● Maintains good adhesion with acid anhydride-based under�ll agents

● Flux residue reinforces joints and increases joint strength by approx. 50%

● Flux residue reinforces joints and prevents cracks

● Maintains a good under�ll injection property regardless of the transfer amount

● JPK8

Temperature cycle -40°C ↔ 125°C/after 1000 cycles

Flux film formation Dipping

JPK8 JPK8

Transfer

Mount Reflow

JPK8 residue

Underfill injection

Join by transfer and reflow and inject underfill without cleaningFlux residue reinforces joints, and a low amount of volatile components does not contaminate joints

Initial stage After 250 cycles After 500 cycles

Ball diameter: 0.3 mmTemperature cycle: -4.0°C /30 min. ↔ 125°C/30 min.Results of a temperature cycle test

Flux residue

Result of a JEDEC Level 3 moisture sensitivity test

JEDEC Level 3; 30℃/60％RH 196ｈ

Comparison of joint strength after high temperature exposure

Result of a temperature cycle test

Transfer time : 50msec

Transfer time : 250msec

Transfer time : 1000msec

Small

Large

JPK8　Flux residueJPK8

Normal flux Cracks

JPK8Solder Ball

Before After

Storage time at 150°C (h)

Str

enb

th( N

)

0 1 2

6

5

4

3

2

1

0

Ball diameter : 0.3mm

Test speed : 30um/s

Test height : 15um

JPK8

Normal flux

JPCA14-03E

Realization of Highly Reliable Mounting with No-Residue / No-Cleaning

NRF SERIES

Features

Specifications

● Successful development of 　 halogen-free �ux with no-residue

● Delivers excellent solder wettability 　 under a rapid-heating pro�le

● Halogen-free and no-residue �ux keeps residue level 　at 1% or lower● Maintains excellent solder wettability under 　a rapid-heating pro�le● Highly compatible with under-�lling materials; 　leaves no void

The improved product offers even better wetting extendability than conventional product

● Highly compatible even with 　 under-�lling materials; no formation 　 of delamination or voids

100

80

60

40

20

0

-20

300

250

200

150

100

50

00 20 40 60 80 100 120

TG

[%]

Tem

p[d

egC

]

Time[sec]

TGA evaluation result Evaluation method

Evaluation results

Cross section picture

Under-filling

X-ray void check

Post re�ow solder ball with no �ux

Copper plate Copper plate

99% or more �ux

Rapid-heating

600µm

SAC305

NRF

1100µm

It’s measured 4 times per each bump,and they are averaged.

NRF-S13NRF-S14temp(degC)

Heating profile (TCB process)

Temp[degC]

300

250

200

150

100

50

00 20 40 60 80 100 120

Time[sec]

So

lder

sp

read

[um

]

Flux

1120

1100

1080

1060

1040Conventional

productNRF-S13 NRF-S14 NRF-S13

There is no delamination and void.Compatibility is good.

There is no void after flow UFalso after cure .

NRF-S14

Solder

Form 120µm-pitch bumps with Φ4μm alloy powder

LAS-M705/OZ63-BPS ser.

TaiSemi14-04E

Features

Specifications

● Excellent sticking characteristic forms �ne bumps in 　each process● Realizes excellent melting characteristic even when 　Type 7 or �ner powder● Good solder wettability enables bump formation with fewer voids

● Trend towards �ne pitch

● Pitch sizes and bump formation in various 　 supplying methods

● Excellent �ux prevents heat sags and forms 　 good bumps

● Even though �ne powder, still has good 　 wettability and forms bumps with fewer voids

● Forms good bumps even when using paste 　 with �ne powder because of excellent 　 melting property

● Forms 120 µm pitch bumps with φ4µm alloy powder

Metal mask Type 7 (φ1 to 10 μm) Type 7 or �ner (φ1 to 6 μm)

120 µm pitch printing

Opening size

Solder

Narrower and thinner

Mask opening size

Conventionalproduct

Conventional product

Preheating

180˚C-3min

Preheating

180˚C-3min

BPSseries

BPS series

After printing Bump formation after re�ow

Uniquely developed �ux prevents oxidation

MovementRolling

Movement

Stencil Pressurization

RollingMovement

Dry �lm

Type 7 or �ner90 to 150 mm pitch

Type7110 to 180 mm pitch

Type6160 mm pitch or more

Dry �lm methodCartridge methodOpen squeegee method

TaiSemi14-05E

Void-free soldering with residue-free paste

M705-NRB70

Features

Specifications

● Achieves void-free soldering of power devices 　 with the vacuum re�ow oven SVR-625GT

● Changing heat-evaporating materials decreases 　 the �ux residue ratio to 5% or less and realizes 　 no-clean solder paste

● Residue-free and excellent wettability 　 even with N2 re�ow oven

● Residue-free mounting of �ne pitch microscopic 　 components made possible with Type 5 powder 　 and NRB70H

● No interference with repletion of under�ll 　 in BGA mounting

Degree of vacuum (Pa)

ø200 µm dot printing part 0.4 mm pitch part 0603 -type component

20

15

10

5

0No vacuum 30000 20000 10000 5000

Paste: M705-NRB70

Void

are

a ra

tio %

The void area ratio is decreased to 1% by controlling the degree of vacuum

Resi

due

(%)

100

50

0250Reflow temperature (℃)

Low-volatile flux

Low-residue flux

Residue-free fluxNRB70

Residue-free = Residue ratio is 5% or less(defined by SMIC)

General-purpose paste

Residue-free paste

Oxygen density: 1500 ppm or less

φ200 µm dot printing part 1005 -type chip component

● Vacuum re�ow oven SVR-625GT realizes void-free 　 and residue-free soldering● Achieves highly reliable soldering with residue-free 　and no-clean solder paste● No cleaning liquid reduces environmental burden 　and realizes lower price

TaiSemi14-06E

Low-Ag/Ag-free solder pastes with lower void

LS720V Series

Features

Specifications

● Reduces voids by improving �uidity of �ux during solder melting● Reduces voids even in bottom surface electrode type 　components by improving solder wettability ● LS720V �ux which can be used for low-Ag/Ag-free alloys

● Main reason of void formation 　and the measure

● Comparison of crack progression 　 between Sn-Cu-Ni-Ge and M773

● The effect of LS720V is observed in 　 suppressing void formation

● Joint strength improved with the addition of 　 Bi and Ni (compared to 0% Ag material)

● Effect of Ni addition

Although voids are tend to occur when bottom surface electrode type components such as QFN frequently, it can be reduced by LS720V

100% Crack progression Approximately only 30% crack progression

Replacing Cu with Ni makes the construction of the bonding surface �ner and thus increases strength

Cycle conditions: -40℃ to +125℃, after 1000 cycles

Surface treatment: Cu-OSP

Bottom surface electrode

Conventional product LS720V product

Appearance of QFN

Improvement

Without Ni

Reflow: 1time

Reflow: 4times

With Ni

PWB

QFN

SolderVoid

Conventional product LS720V Conventional product LS720V

4mm QFN 8mm QFN

50

40

30

20

10

0

Void

are

a ra

tio (%

)

● Development of Ag-free/M773 alloy

M705M40M47M773

Price

Lowerprices

2000 2010 2013

Achieves Ag-free while confrming reliability

Solder paste

M705

M40

M47

M773

3.0% Ag

1.0% Ag

0% Ag

0.3% AgSn-3.0Ag-0.5CuSn-1.0Ag-0.7Cu-1.6Bi-InSn-0.3Ag-0.7Cu-0.5Bi-NiSn-0.0Ag-0.7Cu-0.5Bi-Ni

Stre

ngth

(N)

Number of temperature cycle (Cycle)

M705；SAC305M773

Sn-Cu-Ni-Ge

M773；Sn-Cu-Bi-Ni80

70

60

50

40

30

20

0 200 400 600 800 1,000 1,200 1,400 1,600

-40℃/30min ⇔ +85℃/30minEvaluation using chip resistors

Sn-Cu-Ni-Ge M773

Voids are caused by reducing gas from residual �ux and poor solder wettability

Achieves 10μｍ bump and 30μｍ pitch packaging

PPS

Features

Specifications

TaiSemi14-07E

● No need for masking or positioning, thanks to transfer process● Automatic ongoing production enabled by rolling ● Unlike plated coating, solder alloy structure can form bumps

● PPS structural diagram

Cu core ball facilitate 3D packaging and narrow-pitch mounting

Cu Core Ball

TaiSemi14-09E

Features

Specifications

● Ensures space to easily realize a highly-reliable component-built structure● Enables narrow-pitch mounting that can be performed through Cu pillar mounting using existing equipment● Promises high heat dissipation and electromigration countermeasures

● Ensures space through its multilayer structure with a Cu core

● Cu core ball facilitate 3D packaging

Cu ball

Solder plating

Cu ball

Ni plating

Solder plating

Cu core ball (spacer)

The Cu core ball ensure space to easily realize a highly-reliable component-built structure

Realizes good drop resistance Exhibits a temperature cycle equivalent to that of a conventional product

● Characteristics

● Enables narrow-pitch mounting without short circuit risk with existing equipment

● Drop test and temperature cycle test

PKG

PCBPCB

PKG

PCB

PKG

Solder ball

Cu core ball

Superior electromigration resistance

Temperature cycle test

Ensures appropriatespace

Inclination

Short

PCB

PKG

Cu has good thermal conductivity

PCB

PKG

PCB

PKG

Electromigration Ensures space Heat dissipation

Solder platingCu plating

Eliminates the plating processes required in Cu pillar mounting

Cu pillar mounting Cu core ball mounting

Cu core ball

Drop Number

Cum

ulat

ive

Freq

uenc

y

Drop testC-Cu M90M705 (conventional product )

C-Cu M90M705 (conventional product)

Cycle Number

Cum

ulat

ive

Freq

uenc

y

1

10

100

1 10 100 10001

10

100

1 10 100 1000

TaiSemi14-10E

A high-reliability WLCSP solder ball

M758

Features

Specifications

● Forms bumps with high joint strength on wafer electrodes

● Good wettability on copper plating such wafer electrodes

● Packaged M758 has excellent thermal fatigue resistance

● M758 forms bumps having high joint strength on wafer electrodes

● Good wettability on copper plating such wafer electrodes

● Packaged M758 shows good results in temperature cycle test

Failure mode5

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

SAC305 SAC405 M758

Shear height

CuPlating

Shear tool ShearFailure Mode Mode1

Pad Solder Solder & Interface Interface

Mode2 Mode3 Mode4

M758 forms bumps having high strength on the package level by the surface reforming effect of added Ni

The failure mode in every test is Mode 4: Interface failure

Stre

ngth

(N)

Shear Strength

1.3

1.2

1.1

1

0.9

0.8

SAC305 SAC405 M758M758 has good wettability for Cu plated package

M758 has excellent thermal fatigue resistance due to solid solution strengthening with Bi added compared to conventional products, such as SAC305 and SAC405.Also, M758 has drop impact resistance equivalent to or more than that of conventional products

Leng

th(m

m）

Spreadability test resultTesting method

Reflow oven（245℃） O₂;<200ppm

Flux

Cu plating

Measured location

Measuredlocation

99.9

10

1100 1,000 10,000 100 1,000 10,000

99.9

10

1

TCT Drop

Accu

mul

atio

n ra

te.%

Cycle number Drop number

Accu

mul

atio

n ra

te.%

ProductName Composition Melting

Point (%) Note

M705 SAC305 217-220 Pb-free Standard

M710 SAC405 217-229

M758 205-215 Suitable material for WLP

S/F : Cu WLCSP : Size 7 x 7mm

Simultaneously realizes high thermal fatigue resistance and drop impact reliability

M770

TaiSemi14-11E

Features

Specifications

● Material structures● Evaluation on Cu-OSP PCB

● Solves problems with contrary demands by means of technology controlling the separation strengthening and interface response● Excellent af�nity with all kinds of surface treatment materials (Cu, Ni, Au)● Optimized for mobile devices such as smart phones and in-vehicle ball packaging

● Material selection according to purpose and application

Interface Surface

Ni

Ni

M60

M61

Results from relative evaluation with M705 as basis.

Focus on thermal fatigue resistance: M60Focus on drop impact reliability : M61Satisfies both characteristics in a reliable manner: M770

M770

Ni

M60 M61 M770

Drop impact reliability

Thermal fatigue resistance

× ◎ ◎◎ × ○

● Evaluation on electrolytic Ni/Au plated PCB

99.9

10

11000 10000

Cum

ulat

ive

failu

re ra

te (%

)

Number of cycles (cycles)

Thermal fatigue resistance (electrolytic Ni/Au plated PCB)

M60

M61

M770

M705

99.9

10

110.10.01 10 100 1000

Cum

ulat

ive

failu

re ra

te (%

)

Number of drops (times)

Drop impact reliability (electrolytic Ni/Au plated PCB)

M61M770

M705

M60

99.9

10

11 10 100 1000

Cum

ulat

ive

failu

re ra

te (%

)

Number of drops (times)

Drop impact reliability (Cu-OSP PCB)

M60 M61M770M705

99.9

10

11000 10000

Cum

ulat

ive

failu

re ra

te (%

)

Number of cycles (cycles)

Thermal fatigue resistance (Cu-OSP PCB)

M60

M61

M770

M705

TaiSemi14-12E

M61 solder ball with high drop impact resistance

M61

Features

Specifications

For products with high risk of being dropped, such as mobile devices● Solder balls with excellent drop impact resistance● Accommodates �ne pitch connections, high density 　connections, and high-quality packaging● Accommodates every type of surface treatment material

● Composition

● Concentration of stress is avoided through property modi�cation of the joint interface by adding elements and optimizing the amount to be added.

● Drop test result

● Fracture surface observation

● Aims to achieve the stress absorption effect of bulk solder through material softening

µ

µ

Productname Alloy composition

Meltingtemperature(℃)

Solid phase Liquid phase

The diffusion layer has been made thin,fine and smooth by adding Ni.

Cum

ulat

ive

failu

re In

In (1

/[1-F

(t)])

Ag content : %

Sn-3.0AgSn-1.0Ag

2.3%

Eutectic phase (Ag3Sn Cu6Sn5 compound)Vickers hardness (0.49 N/30 sec)

Hard

Soft

20

17.5

15

12.5

10

7.5

50 1 2 3 4 5

Sn phase

Strength

Ag concentrationLow High

M61

M705

M705 fractures at the joint interface,and M61 fractures within the bulk solder

Drop NumberDrop Number Drop Number

Electrolytic Ni/Au Electroless Ni/Pd/AuCu-OSP

After 10 drops After 5 dropsAfter 20 drops

Electrolytic Ni/Au Electroless Ni/Pd/AuCu-OSP

After 170 drops After 330 dropsAfter 120 drops

Ｍ705（Sn-3.0Ag-0.5Cu） Ｍ61（Sn-1.0Ag-0.75Cu-0.07Ni）

Thick diffusionlayerThick diffusionlayer

M61M61Thin and smoothdiffusion layerThin and smoothdiffusion layer

M61M61

Thick diffusionlayerThick diffusionlayer

M705

M705M705

Large diffusionlayerLarge diffusionlayer

Reflow Cooling

Diffusionvelocity(vector)

Cu(PCB Side)

PKG Side(Cu,Ni/Au etc..) PKG Side(Cu,Ni/Au etc..)

Cu(PCB Side)

PKG Side(Cu,Ni/Au etc..)

Cu(PCB Side)

Sn

Cu

Ni

Schematic diagram of the joint process

Surface treatment: electrolytic Ni/Au PKG surface treatment: Cu-OSP PKG surface treatment: electroless Ni/Pd/Au

Cum

ulat

ive

failu

re (t

)(%)

Cum

ulat

ive

failu

re In

In (1

/[1-F

(t)])

Cum

ulat

ive

failu

re (t

)(%)

Cum

ulat

ive

failu

re In

In (1

/[1-F

(t)])

Cum

ulat

ive

failu

re (t

)(%)

The year 2003 The year 2013

● Various sizes from φ 30μm and structures are available

● Regions where processes are possible

Line-up

φ２０μｍThe year 2003 The year 2013

50

25

75

50

Bum

p he

ight

(μm

)

100 150 Pitch (μm)

Paste printingSolder ball

PPS (Precoated by Powder Sheets)

φ75

φ50

φ20φ15

● Balls with high sphericity and tight tolerance achieved by means of unique technique● Materials can be selected according to purpose, thanks to line-up of all kinds of alloys● Promise of high-quality connection, with balls that have few impurities and only a small dose of α

φ 20μm solder ball has been achieved (reference exhibition)

Sn-3.0Ag-0.5Cu217Melting point (℃) Solid 220Liquid

Sn-2.3Ag-Ni-CoMelting point (℃) Solid Liquid 222

Sn-2.0Ag-Cu-Ni

Sn-0.7Cu

Sn-58Bi

221

Melting point (℃) Solid Liquid 265217

Melting point (℃) Solid Liquid 227227

Melting point (℃) Solid Liquid 141139

Line-up of various sizes ranging from φ 30μm to φ 100μm

Standard lead-free material

M705

Excellent TCT reliability

M60Simultaneously realizes high thermal fatigue resistance and drop impact reliability

M770

Silver/Lead-free soft solder

M200

Low melting point lead-free solder

L20

Micro Solder BallRealizes fine-pitch packaging with high reliability

Features

Specifications

TaiSemi14-13E