fault isolation through thermal isolation featuring the icarus 2001, infra red spot-heat device

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where information lives Page. 1 Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot- Heat Device Brian D. Palmer, Sr. Engineer/GroupLeader EMC 2 Corporation, EQA, ESS Engineering 10 Avenue E, Hopkinton, MA 01748

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Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device. Brian D. Palmer, Sr. Engineer/GroupLeader EMC 2 Corporation, EQA, ESS Engineering 10 Avenue E, Hopkinton, MA 01748. EMC 2 Takes HALT/HASS Seriously. Memory/Director Debug Fixture. - PowerPoint PPT Presentation

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Page 1: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

where information lives

Page. 1

Fault Isolation Through Thermal Isolation

Featuring the ICARUS 2001, Infra Red Spot-Heat Device

Brian D. Palmer, Sr. Engineer/GroupLeader

EMC2 Corporation, EQA, ESS Engineering10 Avenue E, Hopkinton, MA 01748

Page 2: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

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EMC2 Takes HALT/HASS Seriously

Page 3: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

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Memory/Director Debug Fixture

Page 4: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

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EPO Debug Fixture

Page 5: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

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CommBoard Debug Fixture

Page 6: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

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36th Annual Spring Reliability Symposium Reference IEEE Paper,

April 23 1998Accelerated Test Techniques (HALT/HASS): Reduce product development cycle-time, reduce infant

mortality, and improve long-term reliability. Produces failures. However, troubleshooting,

debugging and failure analysis of complex electronic hardware is anything but fast.

Requires accelerated means of isolating the failure mode to the component level.

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Page. 7

36th Annual Spring Reliability Symposium Reference IEEE

Paper, April 23 1998

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Discrete Heater Application

-60

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Time

Deg

C

Chamber SetpointProduct Control (PCBA Surface)U1 - ProcessorU25 w ith Discrete Heater

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Taking The Failure Out of the Chamber

IEEE paper dealt with working inside the chamber.

If you can get the failure out of the chamber, it will be much simpler and practical to troubleshoot, debug and analyze.

Introducing the ICARUS “2001” Infrared Spot-Heat Device, by GDAT Ltd.

Page 10: Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device

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ICARUS “2001” - Infrared Technology

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Why Not Just Use A Heatgun? Topic ICARUS “2001” HeatgunTemperature stability on targetedcomponent

+/- 2ºC indefinitely Operator dependant (+/-10ºC at best?)

Temperature accuracy +/-5ºCAlignment required

No feedback, requiresthermocouple attachment

Thermal spot-heat diameter 4mm @ 20mm awayRequires no airflow

Blast effect – operator dependant– airflow based.

Number of persons to debug one One to hold heatgun (unless thestand is used)One to take signal measurements

Safety Reflective lens stays comfortableto touch

Heats everything – end of gunreaches scolding temperatures

Ability to isolate failure down tospecific component

Capable of heating a singlesurfacemount diode to large 2”x 2” processor with minimaleffect on surroundingcomponents or sensitive testcabling

Difficult to get airflow to affectonly one component at a time. Toreach extremes, testcabling/probes would often besacrificed.

Heat source positioning Stiff gooseneck adjustable arm Adjustable platform on someExpense More Very littleAnticipated long term cost Very little Indeterminately high

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Demonstration of ICARUS “2001” Control and Thermal Isolation

CapabilitiesICARUS "2001" (Infrared Spot-Heating System)

Experiment Performed On The 68060 Processor

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68060

Air

CPUCON

Target Temperature +70C

Target Temperature +80C

Note that the air near the spot heated device is not affected.

Note that the CPUCON device located adjacent to the 68060 device is not affected.

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At a Tc of +90ºC, this debug/analysis effort would be impossible to perform inside a chamber environment given

test cable lengths and their thermal limits.

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ICARUS “2001” Heats Component As the IC would Naturally Heat Itself

K10_51Max 67.1

K10_51Max 67.1

*>52.8°C

*<18.9°C

20.0

25.0

30.0

35.0

40.0

45.0

50.0

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Safe and Effective While Reducing Time Between Fault Detection and

Corrective Action

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Closing Slide