fault isolation through thermal isolation featuring the icarus 2001, infra red spot-heat device
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Fault Isolation Through Thermal Isolation Featuring the ICARUS 2001, Infra Red Spot-Heat Device. Brian D. Palmer, Sr. Engineer/GroupLeader EMC 2 Corporation, EQA, ESS Engineering 10 Avenue E, Hopkinton, MA 01748. EMC 2 Takes HALT/HASS Seriously. Memory/Director Debug Fixture. - PowerPoint PPT PresentationTRANSCRIPT
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Fault Isolation Through Thermal Isolation
Featuring the ICARUS 2001, Infra Red Spot-Heat Device
Brian D. Palmer, Sr. Engineer/GroupLeader
EMC2 Corporation, EQA, ESS Engineering10 Avenue E, Hopkinton, MA 01748
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EMC2 Takes HALT/HASS Seriously
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Memory/Director Debug Fixture
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EPO Debug Fixture
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CommBoard Debug Fixture
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36th Annual Spring Reliability Symposium Reference IEEE Paper,
April 23 1998Accelerated Test Techniques (HALT/HASS): Reduce product development cycle-time, reduce infant
mortality, and improve long-term reliability. Produces failures. However, troubleshooting,
debugging and failure analysis of complex electronic hardware is anything but fast.
Requires accelerated means of isolating the failure mode to the component level.
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36th Annual Spring Reliability Symposium Reference IEEE
Paper, April 23 1998
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Discrete Heater Application
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Time
Deg
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Chamber SetpointProduct Control (PCBA Surface)U1 - ProcessorU25 w ith Discrete Heater
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Taking The Failure Out of the Chamber
IEEE paper dealt with working inside the chamber.
If you can get the failure out of the chamber, it will be much simpler and practical to troubleshoot, debug and analyze.
Introducing the ICARUS “2001” Infrared Spot-Heat Device, by GDAT Ltd.
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ICARUS “2001” - Infrared Technology
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Why Not Just Use A Heatgun? Topic ICARUS “2001” HeatgunTemperature stability on targetedcomponent
+/- 2ºC indefinitely Operator dependant (+/-10ºC at best?)
Temperature accuracy +/-5ºCAlignment required
No feedback, requiresthermocouple attachment
Thermal spot-heat diameter 4mm @ 20mm awayRequires no airflow
Blast effect – operator dependant– airflow based.
Number of persons to debug one One to hold heatgun (unless thestand is used)One to take signal measurements
Safety Reflective lens stays comfortableto touch
Heats everything – end of gunreaches scolding temperatures
Ability to isolate failure down tospecific component
Capable of heating a singlesurfacemount diode to large 2”x 2” processor with minimaleffect on surroundingcomponents or sensitive testcabling
Difficult to get airflow to affectonly one component at a time. Toreach extremes, testcabling/probes would often besacrificed.
Heat source positioning Stiff gooseneck adjustable arm Adjustable platform on someExpense More Very littleAnticipated long term cost Very little Indeterminately high
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Demonstration of ICARUS “2001” Control and Thermal Isolation
CapabilitiesICARUS "2001" (Infrared Spot-Heating System)
Experiment Performed On The 68060 Processor
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CPUCON
Target Temperature +70C
Target Temperature +80C
Note that the air near the spot heated device is not affected.
Note that the CPUCON device located adjacent to the 68060 device is not affected.
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At a Tc of +90ºC, this debug/analysis effort would be impossible to perform inside a chamber environment given
test cable lengths and their thermal limits.
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ICARUS “2001” Heats Component As the IC would Naturally Heat Itself
K10_51Max 67.1
K10_51Max 67.1
*>52.8°C
*<18.9°C
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Safe and Effective While Reducing Time Between Fault Detection and
Corrective Action
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Closing Slide